Anti-deformation supporting frame for integrated circuit board

By designing an anti-deformation support frame for integrated circuit boards, and utilizing the buffer silicone and support components of the upper and lower frames, the deformation problem caused by physical impact during transportation of integrated circuit boards was solved, achieving a better protection effect.

CN224218669UActive Publication Date: 2026-05-08DONGGUAN NANCAI ELECTRONIC TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DONGGUAN NANCAI ELECTRONIC TECHNOLOGY CO LTD
Filing Date
2025-05-25
Publication Date
2026-05-08

AI Technical Summary

Technical Problem

Integrated circuit boards are easily deformed by physical impacts during transportation.

Method used

An anti-deformation support frame for an integrated circuit board is designed, comprising an upper frame and a lower frame, which form an accommodating space for the integrated circuit board. Protection is provided by buffer silicone and support members, the support members being made of silicone or plastic and the protective members being made of silicone or airbags to enhance the buffering capacity.

Benefits of technology

It effectively reduces the deformation of integrated circuit boards caused by physical impact during transportation, and improves the protection effect during transportation.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224218669U_ABST
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Abstract

The utility model is applied to the field of integrated circuit boards, in particular to an integrated circuit board anti-deformation supporting frame which comprises an upper frame, a lower frame is arranged at the lower end of the upper frame, a first placing groove is formed in the lower end of the upper frame, and a second placing groove is formed in the upper end of the lower frame. An integrated circuit board body is clamped between the first placing groove and the second placing groove, and a first containing groove and a second containing groove are formed in the position, located in the center of the first placing groove, of the upper frame and the position, located in the center of the second placing groove, of the lower frame respectively. The containing space used for containing the integrated circuit board body is formed between the first containing groove and the second containing groove, and deformation of the integrated circuit board body caused by physical impact damage in the transportation process is reduced through the protection effect of the upper frame and the lower frame on the integrated circuit board body.
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Description

Technical Field

[0001] This utility model relates to the field of integrated circuit board technology, specifically to an anti-deformation support frame for integrated circuit boards. Background Technology

[0002] An integrated circuit (IC) is a miniature electronic device or component. Using specific processes, transistors, resistors, capacitors, inductors, and other components required for a circuit, along with interconnecting wiring, are fabricated on one or several small pieces of semiconductor wafer or dielectric substrate. These are then packaged in a casing, forming a miniature structure with the desired circuit function. All components are structurally integrated, representing a significant step forward in the miniaturization, low power consumption, intelligence, and high reliability of electronic components. Integrated circuits, also known as ICs, can be classified into three main categories based on their function and structure: analog integrated circuits, digital integrated circuits, and mixed-signal integrated circuits.

[0003] Currently, integrated circuit chips and integrated circuit boards on the market are easily damaged by physical impacts during transportation, causing deformation of the integrated circuit board. Utility Model Content

[0004] The purpose of this invention is to provide an anti-deformation support frame for integrated circuit boards to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an anti-deformation support frame for an integrated circuit board, comprising an upper frame, a lower frame at the lower end of the upper frame, a first placement groove at the lower end of the upper frame, and a second placement groove at the upper end of the lower frame. An integrated circuit board body is sandwiched between the first placement groove and the second placement groove. A first receiving groove and a second receiving groove are respectively provided at the center of the first placement groove on the upper frame and at the center of the second placement groove on the lower frame. A receiving space for receiving the integrated circuit board body is formed between the first receiving groove and the second receiving groove.

[0006] Preferably, the bottom end of the first placement groove and the top end of the second placement groove are bonded with buffer silicone for cushioning and protecting the integrated circuit board body.

[0007] Preferably, the upper frame has a first mounting platform protruding from the bottom end of the first receiving groove, and the first mounting platform has a first mounting groove. The lower frame has a second mounting platform protruding from the top end of the second receiving groove, and the second mounting platform has a second mounting groove. The first and second mounting grooves are detachably fitted with support members for supporting the integrated circuit board body.

[0008] Preferably, the support is made of silicone or plastic.

[0009] Preferably, the top of the upper frame is provided with a first protective member for buffering and protecting the upper frame, and the bottom of the lower frame is provided with a second protective member for buffering and protecting the lower frame.

[0010] Preferably, the first and second protective components are made of silicone or airbags.

[0011] Preferably, the top of the upper frame is provided with a connecting hole, and the top of the lower frame is provided with a connecting pin for engaging with the connecting hole.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. An anti-deformation support frame for an integrated circuit board, comprising an upper frame, a lower frame at the lower end of the upper frame, a first placement groove at the lower end of the upper frame, a second placement groove at the upper end of the lower frame, an integrated circuit board body sandwiched between the first placement groove and the second placement groove, a first receiving groove and a second receiving groove respectively formed at the center of the first placement groove on the upper frame and at the center of the second placement groove on the lower frame, forming a receiving space for receiving the integrated circuit board body, thereby reducing deformation of the integrated circuit board body caused by physical impact during transportation through the protective effect of the upper and lower frames. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the overall structure of the upper frame described in this utility model;

[0016] Figure 3 This is a schematic diagram of the overall structure of the lower frame described in this utility model;

[0017] In the figure: upper frame 1, first receiving groove 11, first mounting platform 12, first mounting groove 121, first placement groove 13, connecting hole 14, lower frame 2, second receiving groove 21, second mounting platform 22, second mounting groove 221, second placement groove 23, connecting pin 24, support member 3, buffer silicone 4, integrated circuit board body 5, first protective member 6, second protective member 7. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the appendix. Figure 1 The orientations or positional relationships shown are for the convenience of describing this utility model and simplifying the description only, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] like Figures 1 to 3 As shown in the figure, this embodiment provides an anti-deformation support frame for an integrated circuit board, including an upper frame 1 and a lower frame 2 at the lower end of the upper frame 1. The lower end of the upper frame 1 has a first placement groove 13, and the upper end of the lower frame 2 has a second placement groove 23. An integrated circuit board body 5 is sandwiched between the first placement groove 13 and the second placement groove 23. The upper frame 1 and the lower frame 2 have a first receiving groove 11 and a second receiving groove 21 respectively located at the center of the first placement groove 13 and the center of the second placement groove 23. The first receiving groove 11 and the second receiving groove 21 form a receiving space for receiving the integrated circuit board body 5. Through the protective effect of the upper frame 1 and the lower frame 2 on the integrated circuit board body 5, the deformation of the integrated circuit board body 5 caused by physical impact during transportation is reduced.

[0022] Furthermore, the bottom end of the first placement groove 13 and the top end of the second placement groove 23 are bonded with buffer silicone 4 for buffering and protecting the integrated circuit board body 5. The elasticity of the buffer silicone 4 improves the buffering and protection of the integrated circuit board body 5 sandwiched between the upper frame 1 and the lower frame 2 of this utility model.

[0023] Furthermore, the upper frame 1 has a first mounting platform 12 protruding from the bottom end of the first receiving groove 11, and the first mounting platform 12 has a first mounting groove 121. The lower frame 2 has a second mounting platform 22 protruding from the top end of the second receiving groove 21, and the second mounting platform 22 has a second mounting groove 221. The first mounting groove 121 and the second mounting groove 221 are detachably mounted with a support member 3 for supporting the integrated circuit board body 5. The support member 3 is made of silicone or plastic. Through the support and elasticity of the silicone or plastic itself, the support member 3 provides support force and buffer protection for the integrated circuit board body 5. Furthermore, the support member 3 is detachably mounted on the first mounting groove 121 and the second mounting groove 221. Users can replace the support member 3 with different specifications according to the thickness of the integrated circuit board, thereby realizing that the support member 3 of this utility model provides support force and buffer protection for integrated circuit board bodies 5 of different specifications.

[0024] Furthermore, the top of the upper frame 1 is provided with a first protective member 6 for buffering protection of the upper frame 1, and the bottom of the lower frame 2 is provided with a second protective member 7 for buffering protection of the lower frame 2. The first protective member 6 and the second protective member 7 are made of silicone or airbags. Through the buffering protection of the first protective member 6 and the second protective member 7, the buffering protection capability of the upper frame 1 and the lower frame 2 of this utility model against physical impact is improved.

[0025] Furthermore, the top of the upper frame 1 is provided with a connecting hole 14, and the top of the lower frame 2 is provided with a connecting pin 24 for engaging with the connecting hole 14. The upper frame 1 and the lower frame 2 are connected by a pin, which improves the ease of assembly of the upper frame 1 and the lower frame 2 of this utility model.

[0026] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A deformation-resistant support frame for integrated circuit boards, characterized in that: The system includes an upper frame (1), a lower frame (2) at the lower end of the upper frame (1), a first placement groove (13) at the lower end of the upper frame (1), a second placement groove (23) at the upper end of the lower frame (2), an integrated circuit board body (5) sandwiched between the first placement groove (13) and the second placement groove (23), a first receiving groove (11) and a second receiving groove (21) respectively at the center of the first placement groove (13) of the upper frame (1) and at the center of the second placement groove (23) of the lower frame (2), and a receiving space for receiving the integrated circuit board body (5) is formed between the first receiving groove (11) and the second receiving groove (21).

2. The integrated circuit board anti-deformation support frame according to claim 1, characterized in that: The bottom end of the first placement groove (13) and the top end of the second placement groove (23) are bonded with buffer silicone (4) for buffering and protecting the integrated circuit board body (5).

3. The integrated circuit board anti-deformation support frame according to claim 1, characterized in that: The upper frame (1) has a first mounting platform (12) protruding from the bottom end of the first receiving groove (11), and the first mounting platform (12) has a first mounting groove (121). The lower frame (2) has a second mounting platform (22) protruding from the top end of the second receiving groove (21), and the second mounting platform has a second mounting groove (221). The first mounting groove (121) and the second mounting groove (221) are detachably equipped with support members (3) for supporting the integrated circuit board body (5).

4. The integrated circuit board anti-deformation support frame according to claim 3, characterized in that: The support member (3) is made of silicone or plastic.

5. The integrated circuit board anti-deformation support frame according to claim 1, characterized in that: The top of the upper frame (1) is provided with a first protective member (6) for buffer protection of the upper frame, and the bottom of the lower frame (2) is provided with a second protective member (7) for buffer protection of the lower frame.

6. The anti-deformation support frame for integrated circuit boards according to claim 5, characterized in that: The first protective element (6) and the second protective element (7) are made of silicone or airbags.

7. The integrated circuit board anti-deformation support frame according to claim 1, characterized in that: The upper frame (1) has a connecting hole (14) at its top end, and the lower frame (2) has a connecting pin (24) protruding from its top end for engaging with the connecting hole.