Circuit board assembly and electronic equipment

Abstract

The utility model provides a circuit board assembly and electronic equipment, the circuit board assembly comprises a first circuit board, a second circuit board and a first frame plate, the first circuit board and the second circuit board are stacked, and the first frame plate is arranged between the first circuit board and the second circuit board. A first cavity is defined by the first circuit board, the first frame plate and the second circuit board, and the first cavity is filled with a first heat conduction material; the first heat dissipation device is arranged on the side, away from the second circuit board, of the first circuit board; the first heating device is connected with the second circuit board; one end of the heat conduction block is in heat conduction connection with the first heat dissipation device, a first through hole is formed in the first circuit board, at least part of the heat conduction block penetrates through the first through hole to make contact with the first heat conduction material, and a gap is formed between the heat conduction block and the second circuit board. According to the circuit board assembly and the electronic equipment provided by the invention, high heat conduction efficiency can be realized.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and more specifically, to a circuit board assembly and an electronic device. Background Technology

[0002] In electronic devices, components such as systems-on-chips (SoCs), cameras, and radio frequency chips release a significant amount of heat during operation, which can affect the normal functioning of the device and the user's grip. To promote effective heat dissipation in electronic devices, active cooling devices such as air-cooling and liquid-cooling structures are typically incorporated. However, the prerequisite for these cooling devices to achieve efficient heat dissipation is that the heat from the heat-generating components can be efficiently conducted to the cooling devices.

[0003] Using a thermal interface material (TIM) between heat dissipation and heat dissipation devices is a common heat conduction method. TIMs reduce the contact thermal resistance between the two devices, transferring heat released from the heat dissipation device to the heat dissipation device. However, in scenarios where the distance between the heat dissipation and heat dissipation devices is large, using TIMs alone results in low thermal conductivity and poor heat dissipation. Utility Model Content

[0004] This application provides a circuit board assembly and an electronic device that can achieve high thermal conductivity.

[0005] In a first aspect, a circuit board assembly is provided, comprising: a first circuit board, a second circuit board, and a first frame plate, wherein the first circuit board and the second circuit board are stacked, the first frame plate is disposed between the first circuit board and the second circuit board, the first circuit board, the first frame plate, and the second circuit board form a first cavity, the first cavity being filled with a first thermally conductive material; a first heat dissipation device disposed on the side of the first circuit board away from the second circuit board; a first heating device connected to the second circuit board; and a thermally conductive block, one end of which is thermally connected to the first heat dissipation device. The first circuit board has a first through hole, at least a portion of the thermally conductive block passes through the first through hole and contacts the first thermally conductive material, and a gap exists between the thermally conductive block and the second circuit board.

[0006] In the embodiments provided in this application, one end of the heat-conducting block is thermally connected to the first heat dissipation device. At least a portion of the heat-conducting block passes through the first through-hole and contacts the first heat-conducting material. The heat generated by the first heating device can be transferred through the first circuit board to the first heat-conducting material, then to the heat-conducting block, and finally to the first heat dissipation device for heat dissipation. The heat-conducting block has high thermal conductivity, which can improve the heat dissipation efficiency of the first heating device and optimize heat dissipation performance when the distance between the first heating device and the first heat dissipation device is far. A first cavity is formed between the first circuit board and the second circuit board, which can improve the utilization rate of the board surface of the first circuit board and the second circuit board, so as to facilitate the placement of more components. There is a gap between the heat-conducting block and the second circuit board, which can alleviate the problem of stress on the first heat dissipation device being transferred to the second circuit board, causing damage to the second circuit board or the solder joints of the second circuit board.

[0007] In conjunction with the first aspect, in some implementations of the first aspect, the heat-conducting block includes a main body portion and an extension portion. The main body portion is disposed between the first circuit board and the first heat dissipation device, and at least a portion of the extension portion passes through the first through hole and contacts the first heat-conducting material. On a plane perpendicular to the stacking direction of the first circuit board and the second circuit board, the cross-sectional area of ​​the main body portion is larger than the cross-sectional area of ​​the first through hole.

[0008] In the embodiments provided in this application, the heat-conducting block includes a main body and an extension. On a plane perpendicular to the stacking direction of the first and second circuit boards, the cross-sectional area of ​​the main body is larger than the cross-sectional area of ​​the first through-hole. This increases the contact area between the heat-conducting block and the first heat-dissipating device, reduces the contact thermal resistance between them, and improves the thermal conductivity. Furthermore, the main body also provides structural support for the first heat-dissipating device, improving the structural strength of the circuit board assembly.

[0009] In conjunction with the first aspect, in some implementations of the first aspect, the main body and the extension are a single structure.

[0010] In the embodiments provided in this application, the main body and the extension are an integral structure, which can improve the structural strength of the circuit board assembly.

[0011] In conjunction with the first aspect, in some implementations of the first aspect, the main body and the extension are separate structures, and a thermal interface material is provided between the main body and the extension.

[0012] In the embodiments provided in this application, the main body and the extension are separate structures, which can improve the flexibility of device layout in the circuit board assembly and make the circuit board assembly easy to assemble.

[0013] In conjunction with the first aspect, in some implementations of the first aspect, there are multiple extension portions, and the multiple extension portions extend into the first cavity and come into contact with the first thermally conductive material.

[0014] In the embodiments provided in this application, there are multiple extension portions, which extend into the first cavity and contact the first thermally conductive material, thereby increasing the thermally conductive area and further improving the thermal conductivity.

[0015] In conjunction with the first aspect, in some implementations of the first aspect, the projection of the extension portion along a first direction overlaps at least partially with the first heating device, the first direction being the stacking direction of the first circuit board and the second circuit board.

[0016] In the embodiments provided in this application, the projection of the extended portion along the first direction overlaps with at least a portion of the first heating device, which can shorten the heat conduction path between the heat conduction block and the first heating device, and further improve the heat conduction efficiency and heat dissipation performance of the circuit board assembly.

[0017] In conjunction with the first aspect, in some implementations of the first aspect, the first heating device is disposed on the side of the second circuit board away from the first circuit board; the circuit board assembly further includes a second heating device disposed in the first cavity and in contact with the first thermally conductive material.

[0018] In the embodiments provided in this application, devices are provided on both the front and back sides of the second circuit board, which can improve the utilization rate of the circuit board surface space. The second heating device is in contact with the first thermally conductive material, so that the second heating device is also thermally connected to the thermally conductive block, thereby enabling the thermally conductive block to conduct heat to multiple heating devices at the same time, which can further improve the heat dissipation performance of the circuit board assembly.

[0019] In conjunction with the first aspect, in some implementations of the first aspect, the projection of the heat-conducting block along a first direction overlaps at least partially with the second heat-generating device, the first direction being the stacking direction of the first circuit board and the second circuit board.

[0020] In the embodiments provided in this application, the projection of the heat-conducting block along the first direction overlaps with at least a portion of the second heating device, which can shorten the heat conduction path between the heat-conducting block and the second heating device, further improve the heat conduction efficiency between the heat-conducting block and the second heating device, and improve the heat dissipation performance.

[0021] In conjunction with the first aspect, in some implementations of the first aspect, the circuit board assembly further includes a third heating device and a shield. The third heating device is disposed on the side of the second circuit board close to the first circuit board and located outside the first cavity. The third heating device is covered below the shield. A second thermally conductive material is filled between the third heating device and the shield. The shield and the thermally conductive block are thermally connected through a thermal interface material.

[0022] In the embodiments provided in this application, the heat generated by the third heating device can be transferred sequentially through the second thermally conductive material, the shielding cover, and the thermal interface material to the thermally conductive block, and then to the first heat dissipation device, thereby achieving heat dissipation of the third heating device and further improving the heat dissipation efficiency of the circuit board assembly.

[0023] In conjunction with the first aspect, in some implementations of the first aspect, the first frame plate includes a metallized hole extending from one end of the first frame plate near the first circuit board to one end of the first frame plate near the second circuit board.

[0024] In the embodiments provided in this application, part of the heat generated by the first heating device can be transferred to the first heat dissipation device through the path of the first frame plate. The first frame plate includes metallized holes, and the metallized holes extend from one end of the first frame plate near the first circuit board to one end of the first frame plate near the second circuit board. This can improve the heat transfer efficiency on the first frame plate, thereby further improving the thermal conductivity and heat dissipation performance of the circuit board assembly.

[0025] In conjunction with the first aspect, in some implementations of the first aspect, the first frame plate further includes a metal plating layer applied to the side of the first frame plate near the first circuit board, and / or, the metal plating layer applied to the side of the first frame plate near the second circuit board.

[0026] In the embodiments provided in this application, the first frame plate includes a metal plating layer, which can improve the heat transfer efficiency on the first frame plate and further enhance the thermal conductivity and heat dissipation performance of the circuit board assembly.

[0027] In conjunction with the first aspect, in some implementations of the first aspect, where the first frame plate includes the metallized hole and the first frame plate includes the metal plating, the metal plating communicates with the metallized hole.

[0028] In the embodiments provided in this application, the metallized holes are connected to the metal plating layer, which can further improve the heat transfer efficiency on the first frame plate and improve the thermal conductivity and heat dissipation performance of the circuit board assembly.

[0029] In conjunction with the first aspect, in some implementations of the first aspect, the circuit board assembly further includes a second heat dissipation device, which is disposed on the side of the first heat-generating device away from the second circuit board, and the second heat dissipation device is thermally connected to the first heat-generating device.

[0030] In the embodiments provided in this application, the circuit board assembly includes a second heat dissipation device, and the second heat dissipation device is disposed on the side of the first heat-generating device away from the second circuit board. The second heat dissipation device can also dissipate heat from the first heat-generating device, thereby further improving the thermal conductivity and heat dissipation performance of the circuit board assembly.

[0031] In a second aspect, an electronic device is provided, including the circuit board assembly described in the first aspect or any possible implementation thereof. Attached Figure Description

[0032] Figures 1 to 14 This is a schematic cross-sectional view of the circuit board assembly provided in an embodiment of this application. Detailed Implementation

[0033] The technical solutions in this application will now be described with reference to the accompanying drawings.

[0034] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized.

[0035] In the various embodiments of this application, the terms "first," "second," etc., are merely to indicate that multiple objects are different. For example, "first circuit board" and "second circuit board" are simply to indicate different circuit boards. They should not have any impact on the circuit boards themselves or their number, and the aforementioned "first," "second," etc., should not impose any limitations on the embodiments of this application.

[0036] The terms “including,” “comprising,” “having,” and variations thereof all mean “including but not limited to,” unless otherwise specifically emphasized.

[0037] As mentioned above, when the heat-generating device and the heat-dissipating device are far apart, using only TIM for heat conduction results in low thermal conductivity. Therefore, this application provides a solution to achieve high thermal conductivity.

[0038] Figure 1This is a cross-sectional structural diagram of a circuit board assembly provided in an embodiment of this application, as shown below. Figure 1 As shown, the circuit board assembly may include a first circuit board 201, a second circuit board 202, a first frame plate 203, a heat-conducting block 205, a first heat dissipation device 206, and a first heat-generating device 207.

[0039] The first circuit board 201 and the second circuit board 202 can be stacked, for example, they can be stacked along the Z-axis direction shown in the figure. The first frame plate 203 can be disposed between the first circuit board 201 and the second circuit board 202, and the first circuit board 201, the first frame plate 203 and the second circuit board 202 can form a first cavity, which can be filled with a first thermally conductive material 204.

[0040] The first heat dissipation device 206 can be disposed on the side of the first circuit board 201 away from the second circuit board 202, and the first heat-generating device 207 can be connected to the second circuit board 202.

[0041] The first circuit board 201 may have a first through hole 2011. One end of the heat-conducting block 205 may be thermally connected to the first heat dissipation device 206, and at least a portion of the heat-conducting block 205 may pass through the first through hole 2011 and contact the first heat-conducting material 204. There may be a gap between the heat-conducting block 205 and the second circuit board 202. That is, the heat-conducting block 205 and the second circuit board 202 may not be in contact with each other.

[0042] In the embodiments provided in this application, the first circuit board 201 includes a first through hole 2011. A heat-conducting block 205 passes through the first through hole 2011 and contacts the first heat-conducting material 204. The heat generated by the first heating device 207 can be transferred through the first circuit board 201 to the first heat-conducting material 204, and then through the first heat-conducting material 204 to the heat-conducting block 205, and further to the first heat dissipation device 206. The heat is then transferred to the cold area by the first heat dissipation device 206, thereby achieving heat dissipation for the first heating device 207. Since the heat-conducting block 205 penetrates the first circuit board 201 and contacts the first heat-conducting material 204, and the heat conduction effect of the heat-conducting block 205 is better than that of the first circuit board 201, the system thermal resistance can be reduced, the heat conduction efficiency can be improved, and the heat dissipation effect can be optimized.

[0043] In addition, there is a gap between the heat-conducting block 205 and the second circuit board 202, so that the stress on the first heat dissipation device 206 is not easily transmitted to the second circuit board 202 through the heat-conducting block 205, thereby preventing damage to the second circuit board 202 or the solder joints of the second circuit board 202.

[0044] Furthermore, a first frame plate 203 is provided between the first circuit board 201 and the second circuit board 202, so that the first circuit board 201, the second circuit board 202 and the first frame plate 203 form a first cavity, which can improve the space utilization of the circuit board assembly and facilitate the placement of more electronic devices on the surface of the circuit board, so that the circuit board assembly can meet the various performance requirements of electronic devices.

[0045] It should be understood that the connection between the first heating element 207 and the second circuit board 202 can refer to a mechanical connection between the first heating element 207 and the second circuit board 202. For example, the first heating element 207 can be connected to the second circuit board 202 by means of screwing, bonding, or other methods. The first heating element 207 can be connected to the side of the second circuit board 202 away from the first circuit board 201, or it can be connected to the side of the second circuit board 202 closer to the first circuit board (the accompanying drawings use the example of the first heating element 207 being connected to the side of the second circuit board 202 away from the first circuit board 201 as an example).

[0046] The first heating device 207 can be electrically connected to the second circuit board 202 or to the first circuit board 201, for example, by connecting to the first circuit board 201 via an FPC. This application does not limit this connection.

[0047] For example, the first circuit board 201 and the second circuit board 202 can be printed circuit boards (PCBs). The substrate of the PCB can be a polymer material, and the PCB can be provided with metal traces to facilitate electrical connection with other electronic components.

[0048] For example, the first heating device 207 can be a System-on-a-Chip (SOC). The first heating device 207 can also be a memory chip, a camera module chip, an RF power chip, etc. This application does not limit the specific type of the first heating device 207.

[0049] In some embodiments, the first frame plate 203 can not only serve as a support structure for the first circuit board 201, forming a first cavity, but also as an electrical connection structure to realize the electrical connection between the first circuit board 201 and the second circuit board 202. For example, electrical connection lines can be provided inside or on the surface of the first frame plate 203 to realize the electrical connection between the first circuit board 201 and the second circuit board 202.

[0050] The first frame plate 203 can be connected to the first circuit board 201 and the second circuit board 202 by means of bonding, screwing, welding, etc., thereby improving the structural stability of the circuit board assembly.

[0051] For example, Figure 1The size of the first circuit board 201 shown is smaller than the size of the second circuit board 202. In this example, the first frame plate 203 can be arranged along the circumferential direction of the first circuit board 201, such that the first frame plate 203, the first circuit board 201, and the second circuit board 202 form a closed cavity. Alternatively, the first frame plate 203 can also be arranged in a portion of the circumferential direction of the first circuit board 201, such that the first frame plate 203, the first circuit board 201, and the second circuit board 202 form an open cavity.

[0052] The size of the first circuit board 201 can also be larger than the size of the second circuit board 202. In this case, the arrangement of the first frame plate 203 can be similar to the example above, and will not be repeated here.

[0053] In some embodiments, the material of the heat-conducting block 205 may include metallic materials such as copper, silver, aluminum, tungsten, and platinum, or non-metallic materials such as graphite. The thermal conductivity of the heat-conducting block 205 may be greater than that of the first circuit board 201, thereby improving the thermal conductivity efficiency of the circuit board assembly and optimizing its heat dissipation performance.

[0054] In some embodiments, the first heat dissipation device 206 can be an air-cooled device. The air-cooled device may include a fan and heat dissipation fins, and the number of heat dissipation fins can be multiple, forming multiple heat dissipation channels. When the air-cooled device is working, the fan rotates at high speed, driving airflow and transferring heat to the cold area through the heat dissipation channels, thus achieving heat dissipation.

[0055] When the first heat dissipation device 206 is an air-cooled device, the heat-conducting block 205 can be thermally connected to the multiple heat dissipation channels formed by the heat dissipation fins. That is, the projection of the multiple heat dissipation fins along the Z-axis can overlap with the heat-conducting block 205. The projection of the fan along the Z-axis can overlap with the heat-conducting block 205 or not. For example, the fan can be positioned on one side of the heat-conducting block 205 along the Y-axis as shown in the figure.

[0056] In some embodiments, the first heat dissipation device 206 may also be a liquid cooling device. This liquid cooling device may be, for example, a vapor chamber (VC), a heat pipe, a liquid cooling system, etc.

[0057] The heat pipe may include a shell, a wick, and a working fluid. The shell may be a metal material with good thermal conductivity, such as copper or aluminum. The wick may be located inside the heat pipe and may be made of metal or fiber. The wick may form a capillary structure to help the working fluid return from the condenser end to the evaporator end. The working fluid may be a liquid such as water or ethanol. This working fluid absorbs heat in the evaporation zone and turns into vapor, and releases heat in the condensation zone before turning back into liquid. When one end of the heat pipe is heated, the working fluid inside the heat pipe evaporates into vapor and quickly moves to the cooler end, cools, and recondenses into liquid. It then flows back to the evaporator end through the wick, forming a cycle to achieve heat dissipation.

[0058] The vapor chamber may include upper and lower cover plates, a capillary structure, and a working fluid. The upper and lower cover plates can be made of a metal with good thermal conductivity, such as copper, and form a sealed cavity. The capillary structure can be disposed within this sealed cavity and distributed on its inner surface to facilitate fluid reflux. The working principle of the vapor chamber can be similar to that of a heat pipe, but the vapor chamber is flatter and has a larger contact area compared to a heat pipe structure.

[0059] The liquid cooling system may include a liquid cooling pump, piping, a cold plate, a radiator or condenser, and a receiver. The liquid cooling pump drives the circulation of coolant throughout the system. The piping connects the various components of the system and transports the coolant. The cold plate can be mounted on components requiring heat dissipation; in this example, it may be mounted on a heat-conducting block, where the coolant absorbs heat as it flows. After absorbing heat, the coolant flows to the radiator or condenser, where it dissipates the heat. The receiver holds the coolant and also buffers pressure changes within the system.

[0060] In some embodiments, the first heat dissipation device 206 may also be a heat dissipation structure such as graphene, graphite sheet, or metal sheet. This application does not limit the type of the first heat dissipation device 206.

[0061] When the first heat dissipation device 206 is an electrically driven device such as an air-cooled device or a liquid-cooled system, the first heat dissipation device 206 can be electrically connected to the first circuit board 201, or the first heat dissipation device 206 can also be electrically connected to the second circuit board 202. When the first heat dissipation device 206 is electrically connected to the second circuit board 202, the first heat dissipation device 206 can be connected to the second circuit board 202 via a flexible printed circuit (FPC).

[0062] For example, the first thermally conductive material 204 can be a TIM, such as thermal grease, thermal pad, phase change material, graphite sheet, etc.

[0063] The first cavity formed by the first circuit board 201, the second circuit board 202, and the first frame is filled with a first thermally conductive material 204. This means the first thermally conductive material 204 is disposed in at least a portion of the spatial structure of the first cavity, and can contact the second circuit board 202, thus forming a heat dissipation path of "second circuit board 202 – first thermally conductive material 204 – thermally conductive block 205 – first heat dissipation device 206". The first thermally conductive material 204 can also contact the first circuit board 201, and heat from the first circuit board 201 can be transferred to the first thermally conductive material 204, and then to the thermally conductive block 205 and the first heat dissipation device 206.

[0064] In some embodiments, when the first heating device 207 is disposed on the side of the second circuit board 202 away from the first circuit board 201, the metal traces on the second circuit board 202 can serve as a heat conduction path from the first heating device 207 to the first thermally conductive material 204, or the polymer substrate of the second circuit board 202 can also serve as a heat conduction channel of the second circuit board 202.

[0065] In other embodiments, a heat-conducting structure may also be provided on the second circuit board 202. The heat-conducting structure may extend from the side of the second circuit board 202 near the first heat-generating device 207 to the side of the second circuit board 202 near the first circuit board 201, so as to further improve the heat conduction efficiency of the circuit board assembly.

[0066] For example, see Figure 2 The structure shown can be a thermally conductive structure, which can be a dielectric hole 2021. The dielectric hole 2021 can extend from the side of the second circuit board 202 near the first heating device 207 to the side of the second circuit board 202 near the first circuit board 201. The dielectric hole 2021 can be filled with a thermally conductive medium, which can be a metal or a non-metallic material such as graphite. There can be one or more dielectric holes 2021.

[0067] In this example, the heat generated by the first heating device 207 can be transferred through the thermally conductive structure to the first thermally conductive material 204, then to the thermally conductive block 205, and finally to the first heat dissipation device 206.

[0068] In some embodiments, see continue to see Figure 1 or Figure 2 In the structure shown, the projection of the heat-conducting block 205 in a first direction can at least partially overlap with the first heating device 207. The first direction can be the stacking direction of the first circuit board 201 and the second circuit board 202, and the first direction can be the Z-axis direction shown in the figure.

[0069] At least a portion of the projection of the heat-conducting block 205 in the first direction overlaps with the first heat-generating device 207, which can shorten the heat conduction path and more efficiently transfer the heat generated by the first heat-generating device 207 to the first heat-dissipating device 206, thereby improving the heat dissipation effect.

[0070] Figure 1 and Figure 2 In the circuit board assembly shown, the heat-conducting block 205 has a rectangular cross-sectional shape on the YZ plane. The heat-conducting block 205 can also have other structural shapes, such as T-shaped shapes.

[0071] See Figure 3 The circuit board assembly shown includes a heat-conducting block 205 that may include a main body portion 2051 and an extension portion 2052. The main body portion 2051 is disposed between the first circuit board 201 and the first heat dissipation device 206. At least a portion of the structure of the extension portion 2052 is disposed in the first through hole 2011, and at least a portion of the structure of the extension portion 2052 is in contact with the first thermally conductive material 204. On a plane perpendicular to the first direction, the cross-sectional area of ​​the main body portion 2051 is larger than the cross-sectional area of ​​the first through hole 2011. This plane perpendicular to the first direction can be the XY plane shown in the figure, thereby making the cross-sectional shape of the heat-conducting block 205 on the YZ plane T-shaped.

[0072] The main body 2051 is disposed between the first circuit board 201 and the first heat sink 206. On a plane perpendicular to the first direction, the cross-sectional area of ​​the main body 2051 is larger than the cross-sectional area of ​​the first through hole 2011. This allows for a larger contact area between the heat-conducting block 205 and the first heat sink 206, thereby reducing the thermal resistance between them, improving heat conduction efficiency, and optimizing heat dissipation performance. Furthermore, the main body 2051 is supported on the side of the first circuit board 201 away from the second circuit board 202, providing structural support for the first heat sink 206 and making the circuit board assembly more stable.

[0073] When the heat-conducting block 205 includes a main body portion 2051 and an extension portion 2052, the projection of the extension portion 2052 in the first direction can overlap with at least a portion of the first heat-generating device 207 to further shorten the heat conduction path and improve heat conduction efficiency and heat dissipation performance.

[0074] See also Figure 3In some embodiments of the structure shown, a thermal interface material (TIM) 208 may be provided between the heat-conducting block 205 and the first heat-dissipating device 206. The TIM 208 between the heat-conducting block 205 and the first heat-dissipating device 206 increases the thermal contact area between them, reduces the contact thermal resistance, and further improves the thermal conductivity and heat dissipation performance of the circuit board assembly.

[0075] It should be understood that Figure 3 In the structure shown, when the heat-conducting block 205 is a T-shaped structure, a TIM is provided between the heat-conducting block 205 and the first heat dissipation device 206. Figure 1 or Figure 2 In the case of the block structure shown, a heat-conducting block 205 and the first heat dissipation device 206 can also be provided with a TIM to increase the heat conduction area between the heat-conducting block 205 and the first heat dissipation device 206. The heat-conducting block 205 can also be other shapes, such as irregular shapes, etc., and this application does not limit it in this regard.

[0076] Figures 1 to 3 In the circuit board assembly shown, the heat-conducting block 205 connects a heat-generating device and a heat-dissipating device to efficiently dissipate heat from the first heat-generating device 207. The heat-conducting block 205 can also be placed on the heat conduction path of multiple heat-generating devices to dissipate heat from multiple heat-generating devices together.

[0077] In some embodiments, see Figure 4 The circuit board assembly shown may further include a second heating element 2022, which and the first heating element 207 may be respectively disposed on two surfaces of the second circuit board 202.

[0078] For example, the first heating device 207 can be disposed on the side of the second circuit board 202 away from the first circuit board 201, the first heating device 207 can be disposed on the side of the second circuit board 202 close to the first circuit board 201, and can be disposed in the first cavity.

[0079] In this example, the second heating device 2022 can be in contact with the first thermally conductive material 204. The heat generated by the second heating device 2022 can be transferred to the first thermally conductive material 204, and then to the thermally conductive block 205, and finally to the first heat dissipation device 206, thereby achieving heat dissipation for the second heating device 2022.

[0080] When a second heating element 2022 is provided in the first cavity, the second heating element 2022 may or may not be in contact with the heat-conducting block 205. When the second heating element 2022 is in contact with the heat-conducting block 205, the heat generated by the second heating element 2022 can be directly transferred to the first heat dissipation device 206 through the heat-conducting block 205.

[0081] When the second heating element 2022 is in contact with the heat-conducting block 205, the second heating element 2022 may also be in contact with the end of the extension portion 2052, meaning that the projection of the extension portion 2052 in the first direction may overlap with at least a portion of the second heating element 2022. Alternatively, the second heating element 2022 may also be in contact with the sidewall of the extension portion 2052, meaning that the projection of the extension portion 2052 in the first direction may not overlap with the second heating element 2022.

[0082] When the second heating element 2022 is not in contact with the heat-conducting block 205, the projection of the extension portion 2052 in the first direction may or may not overlap with the second heating element 2022, and this application does not limit this.

[0083] The number of the second heating element 2022 can be one or more. Multiple second heating elements 2022 can be disposed in the first cavity and in contact with the first thermally conductive material 204.

[0084] When the circuit board assembly includes a second heating element 2022, and the second heating element 2022 is disposed in the first cavity, the second heating element 2022 can be electrically connected to the first circuit board 201, or the second heating element 2022 can also be electrically connected to the second circuit board 202. When there are multiple second heating elements 2022, all of the multiple second heating elements 2022 can be electrically connected to the first circuit board 201, or all of them can be electrically connected to the second circuit board 202, or some of the second heating elements 2022 can be electrically connected to the first circuit board 201 and some of the second heating elements 2022 can be electrically connected to the second circuit board 202. This application does not limit this.

[0085] In some embodiments, the circuit board assembly may further include a third heating device 2023, which may be disposed on the side of the second circuit board 202 near the first circuit board 201 and may be disposed outside the first cavity.

[0086] As an example, see Figure 5As shown in the diagram, the circuit board assembly may also include a shield 209, in which the third heating device 2023 may be housed, and a second thermally conductive material 211 may be filled between the third heating device 2023 and the shield 209.

[0087] The projection of the main body portion 2051 along the Z-axis direction may overlap with at least a portion of the shield 209, or the projection of the main body portion 2051 along the Z-axis direction may overlap with at least a portion of the third heating device 2023.

[0088] In this example, the heat generated by the third heating device 2023 can be transferred to the shield 209 through the second thermally conductive material 211, then to the thermally conductive block 205, and finally to the first heat dissipation device 206, thereby achieving heat dissipation of the third heating device 2023.

[0089] In this example, the third heat-generating device 2023 can be a memory chip, a camera module chip, an RF chip, etc.

[0090] For example, the second thermally conductive material 211 can be TIM. The second thermally conductive material 211 and the first thermally conductive material 204 can be the same material or different materials.

[0091] In some embodiments, a TIM 208 may be provided between the shielding cover 209 and the heat-conducting block 205 to increase the heat-conducting area between the shielding cover 209 and the heat-conducting block 205. The heat generated by the third heating device 2023 can be transferred to the first heat dissipation device 206 through the second heat-conducting material 211, the shielding cover 209, the TIM 208, and the heat-conducting block 205.

[0092] As another example, see Figure 6 In the structure shown, the third heating element 2023 may not be enclosed in a shield. A TIM 208 may be provided between the third heating element 2023 and the heat-conducting block 205, and the heat generated by the third heating element 2023 can be transferred to the heat-conducting block 205 through the TIM 208.

[0093] Alternatively, the third heating device 2023 can be in direct contact with the heat-conducting block 205, and the heat generated by the third heating device 2023 can be directly transferred to the heat-conducting block 205, and then to the first heat dissipation device 206.

[0094] In this example, the projection of the heat-conducting block 205 along the Z-axis direction can overlap with at least a portion of the third heating device 2023, or in other words, the projection of the main body portion 2051 of the heat-conducting block 205 along the Z-axis direction can overlap with at least a portion of the third heating device 2023.

[0095] In this example, the third heating device 2023 can be a memory chip, a capacitor chip, etc.

[0096] The number of the third heating element 2023 can be one or more.

[0097] Figures 2 to 6 In the circuit board assembly shown, the number of extension portions 2052 of the heat-conducting block 205 is one, or the number of extension portions 2052 may be multiple.

[0098] For example, see Figure 7 The circuit board assembly shown is consistent with... Figure 6 Similar to the structure shown, the circuit board assembly may include a third heating element 2023, which is not encased in a shield. The third heating element 2023 has a smaller dimension in the Z-axis direction and is spaced from the main body 2051. In this case, the number of extensions 2052 may be two, for example, including extensions 2052A and 2052B as illustrated. The structure of extension 2052A can be similar to that described above. Figures 2 to 6 The structure of the extension portion 2052 is similar to that of the first cavity. The extension portion 2052A can be disposed in the first through hole 2011, and at least a portion of the extension portion 2052A is in contact with the first thermally conductive material 204. The extension portion 2052B is located outside the first cavity, and the projection of the extension portion 2052B along the first direction can overlap with at least a portion of the third heating device 2023.

[0099] The extension portion 2052B can be in contact with the third heating element 2023, or a TIM 208 can be provided between the extension portion 2052B and the third heating element 2023.

[0100] The heat-conducting block 205 is provided with an extension portion 2052B, which is connected to the third heating device 2023 through the extension portion 2052B. This can reduce the thermal resistance between the third heating device 2023 and the first heat dissipation device 206. For example, when the thickness of the third heating device 2023 is relatively thin, the heat dissipation efficiency of the third heating device 2023 can be improved.

[0101] It should be understood that the above example is only an illustration of the structure when there are multiple extension portions 2052. The number of extension portions 2052 can also be greater than two. The heat-conducting block 205 can be used to conduct heat to more heat-generating devices. This application does not limit the number of extension portions 2052 of the heat-conducting block 205.

[0102] It should be understood that the above Figures 1 to 7In the described structure, the heating device is connected to the second circuit board 202 and is disposed on the side of the second circuit board 202 away from the first circuit board 201, or disposed between the first circuit board 201 and the second circuit board 202. In this application, the heating device can also be connected to the first circuit board 201. For example, the heating device can be disposed in the first cavity and connected to the first circuit board 201. This application does not limit this.

[0103] In some embodiments, the number of extension portions 2052 of the heat-conducting block 205 extending into the first cavity can be multiple, such as... Figure 8 As shown in the structure, the heat-conducting block 205 may include multiple extension portions 2052A. Correspondingly, the first circuit board 201 may be provided with multiple first through holes 2011, and the positions of the multiple first through holes 2011 may correspond to the positions of the multiple extension portions 2052A, so that the multiple extension portions 2052A can respectively pass through the multiple first through holes 2011 and extend into the first cavity.

[0104] Among the multiple extensions 2052A extending into the first cavity, at least a portion of the extensions 2052A can have their projections in the Z-axis direction overlap with the first heating device 207, thereby further improving the thermal conductivity of the circuit board assembly.

[0105] In some embodiments, the cross-sectional area of ​​the extension portion 2052 on the XY plane can be 10 mm². 2 ~20mm 2 For example, the cross-sectional area of ​​the extension portion 2052 in the XY plane can be 11 mm². 2 12mm 2 13mm 2 14mm 2 15mm 2 16mm 2 17mm 2 18mm 2 19mm 2 Equal values.

[0106] It should be understood that when there are multiple extensions 2052 of the heat-conducting block 205, the cross-sectional area of ​​the extension 2052 on the XY plane is 10 mm². 2 ~20mm 2 This can refer to the fact that, among the multiple extension portions 2052, the cross-sectional area of ​​a single extension portion 2052 on the XY plane is 10 mm². 2 ~20mm 2 .

[0107] It should be understood that the attached figure shows the cross-sectional structure of the circuit board assembly on the YZ plane. The multiple extensions 2052 of the heat-conducting block 205 are arranged in the Y-axis direction. The multiple extensions 2052 of the heat-conducting block 205 can also be arranged in the X-axis direction, or they can be arranged irregularly. This application does not limit this.

[0108] Figures 2 to 8 In the circuit board assembly shown, the main body 2051 and the extension 2052 of the heat-conducting block 205 are an integral structure, which can improve the structural strength of the circuit board assembly. In this application, the main body 2051 and the extension 2052 can also be separate structures, and the two can be two independent structures.

[0109] See Figure 9 In some embodiments of the circuit board assembly shown, the main body portion 2051 and the extension portion 2052 can be separated from each other, and a TIM 208 can be provided between the main body portion 2051 and the extension portion 2052.

[0110] The main body 2051 and the extension 2052 are separate from each other, which allows for a more flexible structural design of the circuit board assembly and facilitates its assembly. For example, during assembly, after assembling the heating element and circuit board, the heat-conducting block 205 can be set according to the position of the heating element and the location of the through hole, without having to process the heat-conducting block 205 according to the location of the through hole and the device placement before assembly.

[0111] When the main body 2051 and the extension 2052 are separate structures, the projection of the main body 2051 in the Z-axis direction can cover the extension 2052.

[0112] In this example, when there are multiple extension portions 2052, each extension portion 2052 and the main body portion 2051 can be a separate structure, or some of the structures in the multiple extension portions 2052 can be separate structures from the main body portion 2051. This application does not limit this.

[0113] It should be understood that in the structure shown in the attached figure, when the extension portion 2052 and the main body portion 2051 are separate structures, the third heating device 2023 is covered under the shield 209. In this example, the third heating device 2023 may not be covered under the shield 209. The solutions described in this application can be combined and configured, and this application does not limit them.

[0114] Figures 1 to 9In the circuit board assembly shown, the first heat dissipation device 207 is cooled by the first heat dissipation device 206, and the heat generated by the first heat dissipation device 207 can also be cooled by other heat dissipation devices.

[0115] See Figure 10 In some embodiments, the circuit board assembly shown may further include a second heat dissipation device 210, which may be disposed on the side of the first heat-generating device 207 away from the second circuit board 202, and the second heat dissipation device 210 may be in contact with the first heat-generating device 207.

[0116] In this example, the heat generated by the first heating device 207 can also be directly transferred to the second heat dissipation device 210 for heat dissipation.

[0117] In some embodiments, see continue to see Figure 10 In the structure shown, a TIM 208 can also be provided between the first heating device 207 and the second heat dissipation device 210 to further reduce the contact thermal resistance between the first heating device 207 and the second heat dissipation device 210 and improve the thermal conductivity.

[0118] It should be understood that in this application, TIM 208 can be provided in multiple locations, such as between the first heat dissipation device 206 and the heat conduction block 205, between the main body portion 2051 and the extension portion 2052 of the heat conduction block 205, and between the heat conduction block 205 and the third heat-generating device 2023. The TIM provided in multiple locations can be made of the same material or different materials, and this application does not limit this.

[0119] Figure 10 The size of the second heat dissipation device 210 is larger than the size of the first heat dissipation device 207. In this embodiment, the size of the second heat dissipation device 210 may also be smaller than or equal to the size of the first heat dissipation device 207. This application does not limit this.

[0120] Similar to the first heat dissipation device 206 described above, the second heat dissipation device 210 can be a liquid-cooled device, an air-cooled device, or a graphite sheet, graphene, or metal sheet, etc. Liquid-cooled devices can be, for example, VC (cooling valve), heat pipes, liquid cooling systems, etc. This application does not limit the type of the second heat dissipation device 210. The type of the first heat dissipation device 206 and the type of the second heat dissipation device 210 can be the same or different.

[0121] To further improve the heat dissipation performance of the circuit board assembly, a heat-conducting structure can also be provided on the first frame plate 203 to improve the heat conduction performance of the first frame plate 203.

[0122] See Figure 11 In some embodiments of the circuit board assembly shown, the first frame plate 203 may include a metallized hole 2031, which may extend from one end of the first frame plate 203 near the first circuit board 201 to one end of the first frame plate 203 near the second circuit board 202.

[0123] The metallized hole 2031 is an opening made in the first frame plate 203, and the opening is filled with metal.

[0124] The first frame plate 203 includes a metallized hole 2031. The thermal conductivity of the metallized hole 2031 is higher than that of the first frame plate 203 itself, which can more efficiently transfer the heat generated by the first heat-generating device 207 to the first heat-dissipating device 206, thereby improving the heat dissipation performance of the circuit board assembly.

[0125] The number of metallized holes 2031 can be multiple, and multiple metallized holes 2031 can extend from one end of the first frame plate 203 near the first circuit board 201 to one end of the first frame plate 203 near the second circuit board 202.

[0126] See Figure 12 In some embodiments of the circuit board assembly shown, the first frame plate 203 may further include a metal plating layer 2032, which may be applied to the side of the first frame plate 203 near the first circuit board 201, and / or, the metal plating layer 2032 may be applied to the side of the first frame plate 203 near the second circuit board 202.

[0127] When the metal plating layer 2032 is applied to the side of the first frame plate 203 near the first circuit board 201, the metal plating layer 2032 can be applied to the entire surface of the first frame plate 203 near the first circuit board 201, or it can be applied to at least a portion of the surface.

[0128] When the first frame plate 203 includes a metallized hole 2031, the metal plating layer 2032 can communicate with the metallized hole 2031 to form a continuous heat conduction path, so as to transfer heat from the first heat-generating device 207 to the first heat-dissipating device 206 more efficiently.

[0129] When the second circuit board 202 is provided with a heat-conducting structure, the metal plating layer 2032 can also be connected to the heat-conducting structure on the second circuit board 202. For example, the metal plating layer 2032 can be connected to the dielectric hole 2021 on the second circuit board 202.

[0130] When the metal plating layer 2032 is applied to the side of the first frame plate 203 near the second circuit board 202, the arrangement of the metal plating layer 2032 is similar to that when it is applied to the side near the first circuit board 201, and will not be described again here.

[0131] Figures 1 to 12 The described circuit board assembly consists of two circuit boards, but it can also include more circuit boards to provide space for more electronic components and a control center. For example... Figure 13 As shown in the diagram, the circuit board assembly may further include a third circuit board 212, which may be disposed between the first heat sink 206 and the first circuit board 201, and may be in contact with the first circuit board 201. Alternatively, there may be a gap between the third circuit board 212 and the first circuit board 201, and a frame plate may be provided between the third circuit board 212 and the first circuit board 201 to form a cavity structure (not shown in the figure). Accordingly, a second through hole 2121 may be provided on the third circuit board 212, through which the heat-conducting block 205 may pass in sequence through the second through hole 2121 and the first through hole 2011 to contact the first heat-conducting material 204.

[0132] Figures 1 to 13 In the described circuit board assembly, the end of the heat-conducting block 205 furthest from the first heat dissipation device 206 does not contact the second circuit board 202, but the end of the heat-conducting block 205 furthest from the first heat dissipation device 206 can also contact the second circuit board 202, such as... Figure 14 As shown. That is to say, the extension portion 2052 of the heat-conducting block 205 can contact the second circuit board 202.

[0133] When the heat-conducting block 205 is not in contact with the second circuit board 202, the stress on the first heat dissipation device 206 is not easily transmitted to the second circuit board 202, thus preventing damage to the second circuit board 202 or its solder joints. However, when the heat-conducting block 205 is in contact with the second circuit board 202, the heat on the second circuit board 202 can be transferred to the first heat dissipation device 206 more efficiently, improving heat dissipation performance.

[0134] When the heat-conducting block 205 includes a main body portion 2051 and an extension portion 2052, and the main body portion 2051 and the extension portion 2052 are not an integral structure, the heat-conducting block 205 is in contact with the second circuit board 202, and the second circuit board 202 can provide structural support for the heat-conducting block 205. If the heat-conducting block 205 is not in contact with the second circuit board 202, the extension portion 2052 can be fixedly connected to the first circuit board 201 by means of adhesive bonding or other methods to provide structural support for the heat-conducting block 205.

[0135] This application also provides an electronic device that may include... Figures 1 to 14 Any of the circuit board assemblies described herein. Exemplarily, the electronic device can be a mobile phone, tablet computer, laptop computer, television, headphones, watch, or other electronic products; this application does not limit the specific type of electronic device.

[0136] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A circuit board assembly, characterized in that, include: A first circuit board (201), a second circuit board (202), and a first frame plate (203) are arranged in a stacked manner. The first circuit board (201) and the second circuit board (202) are disposed between the first circuit board (201) and the second circuit board (202). The first circuit board (201), the first frame plate (203), and the second circuit board (202) form a first cavity, which is filled with a first thermally conductive material (204). The first heat dissipation device (206) is disposed on the side of the first circuit board (201) away from the second circuit board (202); The first heating element (207) is connected to the second circuit board (202); A heat-conducting block (205) is provided, one end of which is thermally connected to the first heat dissipation device (206). The first circuit board (201) is provided with a first through hole (2011). At least a portion of the heat-conducting block (205) passes through the first through hole (2011) and contacts the first heat-conducting material (204). There is a gap between the heat-conducting block (205) and the second circuit board (202).

2. The circuit board assembly according to claim 1, characterized in that, The heat-conducting block (205) includes a main body (2051) and an extension (2052). The main body (2051) is disposed between the first circuit board (201) and the first heat dissipation device (206). At least a portion of the extension (2052) passes through the first through hole (2011) and contacts the first heat-conducting material (204). On a plane perpendicular to the first direction, the cross-sectional area of ​​the main body (2051) is greater than the cross-sectional area of ​​the first through hole (2011), and the first direction is the stacking direction of the first circuit board (201) and the second circuit board (202).

3. The circuit board assembly according to claim 2, characterized in that, The main body (2051) and the extension (2052) are an integral structure.

4. The circuit board assembly according to claim 2, characterized in that, The main body (2051) and the extension (2052) are separate structures, and a thermal interface material is provided between the main body (2051) and the extension (2052).

5. The circuit board assembly according to any one of claims 2 to 4, characterized in that, The number of the extension portions (2052) is multiple, and the multiple extension portions (2052) extend into the first cavity and come into contact with the first thermally conductive material (204).

6. The circuit board assembly according to any one of claims 2 to 4, characterized in that, The projection of the extension portion (2052) along the first direction overlaps with at least a portion of the first heating device (207).

7. The circuit board assembly according to any one of claims 1 to 4, characterized in that, The first heating element (207) is disposed on the side of the second circuit board (202) away from the first circuit board (201); The circuit board assembly further includes a second heating device (2022), which is disposed in the first cavity and is in contact with the first thermally conductive material (204).

8. The circuit board assembly according to claim 7, characterized in that, The projection of the heat-conducting block (205) along the first direction overlaps at least partially with that of the second heating device (2022).

9. The circuit board assembly according to any one of claims 1 to 4, characterized in that, The circuit board assembly further includes a third heating element (2023) and a shield (209). The third heating element (2023) is disposed on the side of the second circuit board (202) near the first circuit board (201) and located outside the first cavity. The third heating element (2023) is covered under the shield (209). A second thermally conductive material (211) is filled between the third heating element (2023) and the shield (209). The shield (209) and the thermally conductive block (205) are thermally connected through a thermal interface material.

10. The circuit board assembly according to any one of claims 1 to 4, characterized in that, The first frame plate (203) includes a metallized hole (2031) extending from one end of the first frame plate (203) near the first circuit board (201) to one end of the first frame plate (203) near the second circuit board (202).

11. The circuit board assembly according to claim 10, characterized in that, The first frame plate (203) further includes a metal plating layer (2032), which is applied to the side of the first frame plate (203) near the first circuit board (201), and / or, the metal plating layer (2032) is applied to the side of the first frame plate (203) near the second circuit board (202).

12. The circuit board assembly according to claim 11, characterized in that, When the first frame plate (203) includes the metallized hole (2031) and the first frame plate (203) includes the metal plating layer (2032), the metal plating layer (2032) communicates with the metallized hole (2031).

13. The circuit board assembly according to any one of claims 1 to 4, characterized in that, The circuit board assembly further includes a second heat dissipation device (210), which is disposed on the side of the first heat-generating device (207) away from the second circuit board (202) and is thermally connected to the first heat-generating device (207).

14. An electronic device, characterized in that, Includes the circuit board assembly as described in any one of claims 1 to 13.

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