Power device module

Abstract

The utility model relates to a power device module. The power device module comprises a circuit board; the power device comprises a packaging body and a pin extending from the end part of the packaging body; the packaging body comprises a shell, and at least part of the pins are located in the shell; the pins are bent towards the top surface of the shell into first sections, second sections and third sections, the first sections are connected with the packaging body, the second sections are connected with the first sections and the third sections, the first sections are parallel to the third sections, and the third sections are used for being connected with a circuit board in an attached mode; by locking the circuit board and the radiator, the radiator is connected with the bottom surface of the shell in an attached mode and used for dissipating heat of the power device, the use requirement of a large-current environment can be met, the plug-in type power device can be connected to the circuit board in an attached mode through the surface mounting technology, and therefore automatic production of the plug-in type power device is achieved; the circuit board or the copper columns on the circuit board abut against the radiator to be connected with the bottom face of the shell in an attached mode, the power devices in the circuit board can be rapidly installed on the radiator, and automatic assembly is achieved.

Description

Technical Field

[0001] This utility model relates to the field of power device packaging technology, and specifically to a power device module. Background Technology

[0002] Power semiconductor devices are widely used in high-voltage, high-current applications, such as frequency converters, inverters, electric vehicle drives, and power supply equipment. Traditionally, power semiconductor devices operating under high-current, high-voltage conditions are mostly packaged in through-hole packages, such as TO-220 and TO-247 packages. These devices typically require the use of heat sinks to meet heat dissipation requirements.

[0003] However, the assembly process of power semiconductor devices in the existing technology is cumbersome, has low production efficiency, and cannot achieve automated production and assembly.

[0004] Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects. Utility Model Content

[0005] In view of this, embodiments of this application provide a power device module to solve at least one problem existing in the prior art, comprising:

[0006] Circuit board;

[0007] A power device includes a package and pins extending from an end of the package; the package includes a housing, at least a portion of the pins being located within the housing; the pins are bent toward a top surface of the housing into a first segment, a second segment, and a third segment, the first segment being connected to the package, the second segment connecting the first segment and the third segment, the first segment being parallel to the third segment, and the third segment being used for bonding with a circuit board;

[0008] A heat sink is attached to the bottom surface of the housing and is used to dissipate heat from the power device.

[0009] Optionally, in the above-mentioned power device module, the third segment is flush with the top surface of the housing, the third segment is attached to the circuit board, and the circuit board presses against the top surface of the housing in the direction of the heat sink to press the power device and the heat sink together.

[0010] Optionally, in the power device module described above, the third segment is higher than the top surface of the housing in the height direction;

[0011] The power device module also includes copper pillars disposed on the circuit board. The third segment is attached to the circuit board and the copper pillars press against the top surface of the housing in the direction of the heat sink to press the power device and the heat sink together.

[0012] Optionally, in the power device module described above, the package body is provided with screw holes;

[0013] The copper pillar includes a connecting part and a pressing part connected to the circuit board, as well as an extension part. When the copper pillar presses against the power device, the pressing part abuts against the top surface of the package, and the extension part is located inside the screw hole.

[0014] Optionally, in the power device module described above, an insulating and thermally conductive layer is further provided between the package and the heat sink.

[0015] Optionally, in the power device module described above, a conductive layer is provided on the circuit board, the conductive layer being used to connect with the third segment, and the conductive layer being teardrop-shaped.

[0016] Optionally, in the power device module described above, a conductive layer is provided on the circuit board, and a copper strip is connected to the conductive layer, the copper strip being used to connect with the third segment.

[0017] Compared with the prior art, this application has the following advantages: by bending the pins of the plug-in power device into a first segment, a second segment, and a third segment, and using the third segment for bonding with the circuit board, it can not only meet the usage requirements of high current environment, but also bond the plug-in power device to the circuit board using surface mount technology (SMT), thereby realizing the automated production of plug-in power devices. On the other hand, the heat sink is bonded to the bottom surface of the housing, ensuring that the power device can also achieve good heat dissipation when operating under high voltage and high current. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the power device shown in this embodiment;

[0019] Figure 2 This is a schematic diagram of the structure of one embodiment of the installation of multiple power devices shown in this embodiment;

[0020] Figure 3 yes Figure 2 A sectional view;

[0021] Figure 4 This is a schematic diagram of another embodiment of the installation of multiple power devices shown in this embodiment;

[0022] Figure 5 yes Figure 4 A sectional view;

[0023] Figure 6 yes Figure 5 A magnified view of a portion of the image.

[0024] Figure description: Circuit board 1, copper pillar 11, connecting part 111, pressing part 112, extension part 113, power device 2, package 21, housing 211, screw hole 212, pin 22, first segment 221, second segment 222, third segment 223, heat sink 3. Detailed Implementation

[0025] The exemplary embodiments disclosed in this application will now be described in more detail. Numerous specific details are set forth in the following description to provide a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without one or more of these details. In other instances, to avoid confusion with this application, some technical features well-known in the art have not been described; that is, not all features of actual embodiments are described herein, nor are well-known functions and structures described in detail.

[0026] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this application, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And the discussion of a second element, component, area, layer, or portion does not imply that the first element, component, area, layer, or portion necessarily exists in this application.

[0027] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used here for convenience to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of devices in use and operation.

[0028] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. When used herein, the singular forms “a,” “an,” and “ / the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “compose” and / or “comprising,” when used in this specification, identify the presence of features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0029] To fully understand this application, detailed steps and structures will be presented in the following description to illustrate the technical solution of this application. Preferred embodiments of this application are described in detail below; however, in addition to these detailed descriptions, this application may have other implementation methods.

[0030] Please refer to Figures 1-6 As shown in the preferred embodiment of this application, a power device module includes a circuit board 1, a power device 2, and a heat sink 3. The power device 2 includes a package 21 and pins 22 extending from the end of the package 21. The package 21 includes a housing 211, with at least a portion of the pins 22 located within the housing 211. The pins 22 are bent towards the top surface of the housing into a first segment 221, a second segment 222, and a third segment 223. The first segment 221 is connected to the package 21, the second segment 222 connects the first segment 221 and the third segment 223, the first segment 221 and the third segment 223 are parallel, and the third segment 223 is used for contact connection with the circuit board 1. The heat sink 3 is contacted with the bottom surface of the housing 211 for heat dissipation of the power device 2. It should be noted that in this embodiment, the power device 2 is a plug-in power device.

[0031] Understandably, by bending the pins 22 of the plug-in power device into a first segment 221, a second segment 222, and a third segment 223, the third segment 223 can be bonded to the circuit board 1, and the bottom surface of the housing 211 is bonded to the heat sink 3. This satisfies the high current and high voltage operating requirements of the plug-in power device and enables effective heat dissipation of the power device in the high current and high voltage operating environment. Furthermore, bending the pins 22 of the plug-in power device allows it to be bonded to the circuit board 1 using surface mount technology (SMT), eliminating the need for complex assembly steps and enabling automated production of the plug-in power device, thereby improving production efficiency, reducing labor costs, and ensuring production quality.

[0032] It should be noted that in practical applications, the number of power devices 2 can be designed according to different circuits, such as... Figures 2-5As shown, in this embodiment, three power devices 2 are spaced apart along the longitudinal direction of the heat sink 3. The three power devices 2 can be directly or indirectly fixed by screws or structural components, so that after the power device 2's leads are bent and attached to the circuit board 1, it can be attached to the heat sink 3. In other embodiments, the number of power devices 2 is not specifically limited.

[0033] In one embodiment, reference Figure 2 and Figure 3 As shown, the third segment 223 is flush with the top surface of the housing 211. The third segment 223 is attached to the circuit board 1, and the circuit board 1 presses against the top surface of the housing 211 in the direction of the heat sink 3 to press the power device 2 and the heat sink 3 together.

[0034] In another embodiment, reference Figures 4-6 As shown, the third segment 223 is higher than the top surface of the housing 211 in the height direction. In this embodiment, the power device module also includes a copper pillar 11 disposed on the circuit board 1. The third segment 223 is attached to the circuit board 1, and the copper pillar 11 presses against the top surface of the housing 211 in the direction of the heat sink 3 to press the power device and the heat sink 3 together.

[0035] Specifically, in this embodiment, the package 21 of the plug-in power device is provided with screw holes 212, such as TO-247 package; the copper pillar 11 includes a connecting part 111 connected to the circuit board 1, a pressing part 112 and an extension part 113. When the copper pillar 11 presses against the power device 2, the pressing part 112 abuts against the top surface of the package 21, and the extension part 113 is located in the screw hole 212.

[0036] Understandably, the screw hole 212 provides precise positioning for the copper pillar 11, ensuring that the copper pillar 11 can accurately act on the top surface of the package 21 during the pressing process. This avoids problems such as poor contact or uneven stress that may be caused by the misalignment of the copper pillar 11, further improving product quality. In this embodiment, the screw hole 212 is located in the middle area of ​​the package 21 to make the pressing force of the copper pillar 11 on the package 21 more evenly distributed. In other embodiments, the position of the screw hole 212 is not specifically limited, but depends on the actual situation, as long as it can correspond to the copper pillar 11 to achieve the above effect.

[0037] It should be noted that in another embodiment, when the power device 2 does not have screw holes 212 on its surface, such as in the TO-247PLUS-3 package, the pin 22 can be bent so that the third segment 223 is higher than the top surface of the housing 211 in the height direction. Then, by soldering the copper pillar 11 to the circuit board 1, when the circuit board 1 is connected to the third segment 223 of the power device 2, one end of the copper pillar 11 is soldered to the circuit board 1, and the other end directly presses against the surface of the housing 211, which can also achieve the above effect.

[0038] It is worth noting that an insulating and thermally conductive layer is also provided between the package 21 and the heat sink 3. In one case, the package 21 is made of an insulating and thermally conductive material, and the package 21 serves as the insulating and thermally conductive layer; in another case, an insulating and thermally conductive layer is provided separately between the package 21 and the heat sink 3, so as to transfer the heat on the power device 2 to the heat sink 3.

[0039] As is well known, the current carrying capacity of the same material is related to the cross-sectional area of ​​the material. The bent pin 22 of the power device 2 is soldered to the surface of the circuit board 1. The current can only pass through a single layer of copper foil on the surface of the circuit board 1. Due to the size limitation of the circuit board 1, the current carrying capacity cannot be met by increasing the width of the copper foil.

[0040] Therefore, in an optional embodiment, a conductive layer is provided on the circuit board 1 for connection with the third segment 223, and the conductive layer is teardrop-shaped. The advantage of this design is that the teardrop-shaped conductive layer gradually narrows in width, which can effectively reduce stress concentration and avoid damage or breakage of the conductive layer due to excessive stress, thereby improving the reliability of the electrical connection and ensuring the stable operation of the power device 2 during long-term use.

[0041] In an alternative embodiment, a conductive layer is provided on the circuit board 1, and a copper strip is connected to the conductive layer. The copper strip is used to connect with the third segment 223. Since the cross-sectional area of ​​the copper strip is much larger than that of the copper foil on the circuit board 1, the conductor resistance is reduced. In high current scenarios, heat generation and voltage drop can be reduced, and the current conduction capability of the power device 2 is improved to meet the needs of high power applications.

[0042] The above is only one specific implementation of this application, and any other improvements made based on the concept of this application shall be considered within the scope of protection of this application.

Claims

1. A power device module, characterized in that, include: Circuit board; A power device includes a package and pins extending from an end of the package; the package includes a housing, at least a portion of the pins being located within the housing; the pins are bent toward a top surface of the housing into a first segment, a second segment, and a third segment, the first segment being connected to the package, the second segment connecting the first segment and the third segment, the first segment being parallel to the third segment, and the third segment being used for bonding with a circuit board; A heat sink is fitted and connected to the bottom surface of the housing to dissipate heat from the power device. The third segment is higher than the top surface of the shell in the height direction; The power device module also includes copper pillars disposed on the circuit board. The third segment is attached to the circuit board and the copper pillars press against the top surface of the housing in the direction of the heat sink to press the power device and the heat sink together. The power device is a plug-in power device. The package body is provided with screw holes; the copper pillar includes a connecting part and a pressing part connected to the circuit board, as well as an extension part. When the copper pillar presses against the power device, the pressing part abuts against the top surface of the package body, and the extension part is located inside the screw holes.

2. The power device module according to claim 1, characterized in that, The third segment is flush with the top surface of the housing and is attached to the circuit board. The circuit board presses against the top surface of the housing in the direction of the heat sink to press the power device and the heat sink together.

3. The power device module according to claim 1, characterized in that, An insulating and thermally conductive layer is also provided between the package and the heat sink.

4. The power device module according to claim 1, characterized in that, A conductive layer is provided on the circuit board, which is used to connect with the third segment, and the conductive layer is teardrop-shaped.

5. The power device module according to claim 1, characterized in that, A conductive layer is provided on the circuit board, and a copper strip is connected to the conductive layer. The copper strip is used to connect to the third segment.

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