Double-sided grinding equipment for semiconductor silicon wafer

Abstract

The utility model discloses double-sided grinding equipment for semiconductor silicon wafers, which comprises a bottom plate, the upper surface of the bottom plate is fixedly connected with a fixing frame, a grinding mechanism is mounted in the fixing frame, the grinding mechanism comprises a through hole, an air cylinder is mounted on the upper surface of the fixing frame, a pressure sensor is mounted at the output end of the air cylinder, and the pressure sensor is connected with the through hole. The bottom face of the pressure sensor is fixedly connected with a fixing plate, the bottom face of the fixing plate is fixedly connected with buffer springs arranged at equal intervals, the bottom face of the fixing plate is fixedly connected with a damper, and the bottom ends of the buffer springs are jointly and fixedly connected with a first grinding motor. And an upper grinding disc is mounted at the output end of the first grinding motor. According to the device, through cooperation of the buffer spring and the damper, the upper grinding disc can be buffered, the grinding pressure can be monitored in real time through the pressure sensor, excessive grinding of the silicon wafer is avoided, and the machining quality of the semiconductor silicon wafer is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor silicon wafer processing, and in particular to a double-sided grinding device for semiconductor silicon wafers. Background Technology

[0002] Silicon materials that meet the quality requirements of semiconductor devices are called semiconductor silicon wafers. Semiconductor silicon wafers include polycrystalline silicon, monocrystalline silicon, silicon wafers, epitaxial wafers, amorphous silicon thin films, microcrystalline silicon thin films, etc. Silicon wafer grinding equipment is widely used for single-sided grinding and polishing of various materials such as silicon wafer grinding, silicon wafer polishing, zinc alloy grinding and polishing, optical connectors, stainless steel plane polishing, LED sapphire substrates, optical glass wafers, quartz wafers, various wafers, molds, light guide plates, etc.

[0003] Chinese Patent CN217071952U discloses a double-sided grinding device for semiconductor silicon wafers, including a base, a lower grinding disc fixed on the upper surface of the base, and a silicon wafer placed on the upper surface of the lower grinding disc. A first adjusting screw is connected through the outer wall of the base, and a slider is threadedly connected to the outer wall of the first adjusting screw. A groove is formed on the outer surface of the base, and the slider is slidably connected inside the groove. A lead screw slide is fixed at the upper end of the slider. However, the double-sided grinding device for semiconductor silicon wafers in the above patent is relatively cumbersome to operate and cannot control the grinding pressure, which can easily cause over-grinding of the silicon wafer and affect the processing quality of the semiconductor silicon wafer. Therefore, we propose a double-sided grinding device for semiconductor silicon wafers to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a double-sided polishing device for semiconductor silicon wafers to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A double-sided polishing device for semiconductor silicon wafers includes a base plate, a mounting frame fixedly connected to the upper surface of the base plate, a polishing mechanism installed inside the mounting frame, the polishing mechanism including a through hole, a cylinder mounted on the upper surface of the mounting frame, a pressure sensor mounted on the output end of the cylinder, a mounting plate fixedly connected to the bottom surface of the pressure sensor, buffer springs arranged at equal intervals fixedly connected to the bottom surface of the mounting plate, a damper fixedly connected to the bottom surface of the mounting plate, a first polishing motor fixedly connected to the bottom end of each buffer spring, and an upper polishing disc mounted on the output end of the first polishing motor.

[0007] In a further embodiment, a second grinding motor is mounted on the upper surface of the base plate, and a lower grinding disc is mounted on the output end of the second grinding motor.

[0008] In a further embodiment, the upper surface of the base plate is fixedly connected with support rods arranged at equal intervals, and the top of each support rod is fixedly connected with a limiting frame, the upper surface of which is provided with grooves arranged at equal intervals.

[0009] In a further embodiment, a controller is mounted on the front of the mounting bracket, and a display screen is provided on the front of the controller.

[0010] In a further embodiment, the bottom surface of the base plate is fixedly connected to symmetrical support legs, and the bottom surface of each support leg is fixedly connected to an anti-slip seat.

[0011] In a further embodiment, a fixing cover is fixedly connected to the bottom surface of the base plate, and a storage battery is installed inside the fixing cover.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] This device uses a cylinder to move the upper grinding disc up and down. A buffer spring and damper work together to cushion the upper grinding disc. A pressure sensor monitors the grinding pressure in real time to prevent over-grinding of the silicon wafer and improve the processing quality. The first grinding motor and the upper grinding disc work together to grind the upper surface of the silicon wafer, while the second grinding motor and the lower grinding disc work together to grind the bottom surface. The first and second grinding motors rotate in opposite directions, achieving simultaneous grinding of both sides of the silicon wafer. A support rod and a limiting frame work together to limit the movement of the silicon wafer and prevent it from slipping. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of a double-sided grinding equipment for semiconductor silicon wafers.

[0015] Figure 2 This is a cross-sectional view of the fixture in a double-sided grinding machine for semiconductor silicon wafers.

[0016] Figure 3 This is a bottom view of the fixing plate in a double-sided grinding machine for semiconductor silicon wafers.

[0017] Figure 4 This is a top view of the limiting frame in a double-sided grinding equipment for semiconductor silicon wafers.

[0018] In the diagram: 1. Base plate; 2. Grinding mechanism; 201. Through hole; 202. Cylinder; 203. Pressure sensor; 204. Fixing plate; 205. Buffer spring; 206. First grinding motor; 207. Upper grinding disc; 208. Damper; 3. Fixing frame; 4. Second grinding motor; 5. Lower grinding disc; 6. Controller; 7. Display screen; 8. Support leg; 9. Anti-slip seat; 10. Fixing cover; 11. Battery; 12. Support rod; 13. Limiting frame; 14. Groove. Detailed Implementation

[0019] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-4In this utility model, a double-sided grinding device for semiconductor silicon wafers includes a base plate 1. A fixing frame 3 is fixedly connected to the upper surface of the base plate 1. A grinding mechanism 2 is installed inside the fixing frame 3. The grinding mechanism 2 includes a through hole 201. A cylinder 202 is installed on the upper surface of the fixing frame 3. A pressure sensor 203 is installed at the output end of the cylinder 202. A fixing plate 204 is fixedly connected to the bottom surface of the pressure sensor 203. Equally spaced buffer springs 205 are fixedly connected to the bottom surface of the fixing plate 204. A resistance... The damper 208 and the bottom of each buffer spring 205 are fixedly connected to the first grinding motor 206. The output end of the first grinding motor 206 is equipped with an upper grinding disk 207. The cylinder 202 can drive the upper grinding disk 207 to move up and down. Through the cooperation of the buffer spring 205 and the damper 208, the upper grinding disk 207 can be buffered. The pressure sensor 203 can monitor the grinding pressure in real time. Through the cooperation of the first grinding motor 206 and the upper grinding disk 207, the upper surface of the silicon wafer can be ground.

[0023] A second grinding motor 4 is mounted on the upper surface of the base plate 1. A lower grinding disc 5 is mounted on the output end of the second grinding motor 4. Support rods 12 arranged at equal intervals are fixedly connected to the upper surface of the base plate 1. A limit frame 13 is fixedly connected to the top of each support rod 12. The upper surface of the limit frame 13 is provided with grooves 14 arranged at equal intervals. A controller 6 is mounted on the front of the mounting bracket 3. A display screen 7 is provided on the front of the controller 6. Through the cooperation of the second grinding motor 4 and the lower grinding disc 5, the bottom surface of the semiconductor silicon wafer can be ground. By using the cooperation of the support rods 12 and the limit frame 13, the semiconductor silicon wafer can be limited to prevent it from slipping. Through the cooperation of the controller 6 and the display screen 7, it is convenient for the operator to control the device.

[0024] The bottom surface of the base plate 1 is fixedly connected to symmetrical support legs 8. Each support leg 8 is fixedly connected to an anti-slip seat 9. The bottom surface of the base plate 1 is fixedly connected to a fixing cover 10. A storage battery 11 is installed inside the fixing cover 10. Through the cooperation of the support legs 8 and the anti-slip seat 9, the device can be stably placed to prevent the device from sliding. The storage battery 11 can provide power to the device.

[0025] The working principle of this utility model is as follows:

[0026] In use, first connect the device to the corresponding power supply. Then, with the cooperation of the support leg 8 and the anti-slip seat 9, the device is stably placed in a suitable position. Next, place the corresponding silicon wafer on the upper surface of the lower grinding disc 5. Then, with the cooperation of the controller 6 and the display screen 7, the device can be easily controlled by the operator. The cylinder 202 can drive the upper grinding disc 207 to move up and down. With the cooperation of the buffer spring 205 and the damper 208, the upper grinding disc 207 can be buffered. The pressure sensor 203 can monitor the grinding pressure in real time. With the cooperation of the first grinding motor 206 and the upper grinding disc 207, the upper surface of the silicon wafer can be ground. With the cooperation of the second grinding motor 4 and the lower grinding disc 5, the bottom surface of the semiconductor silicon wafer can be ground. At the same time, the rotation directions of the first grinding motor 206 and the second grinding motor 4 are opposite, achieving the effect of grinding both sides of the silicon wafer at the same time. With the cooperation of the support rod 12 and the limiting frame 13, the semiconductor silicon wafer can be limited to prevent it from slipping.

[0027] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0028] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A double-sided polishing apparatus for semiconductor silicon wafers, characterized in that: The system includes a base plate (1), a fixed frame (3) is fixedly connected to the upper surface of the base plate (1), a grinding mechanism (2) is installed inside the fixed frame (3), the grinding mechanism (2) includes a through hole (201), a cylinder (202) is installed on the upper surface of the fixed frame (3), a pressure sensor (203) is installed at the output end of the cylinder (202), a fixed plate (204) is fixedly connected to the bottom surface of the pressure sensor (203), a buffer spring (205) is fixedly connected to the bottom surface of the fixed plate (204), a damper (208) is fixedly connected to the bottom surface of the fixed plate (204), a first grinding motor (206) is fixedly connected to the bottom end of each buffer spring (205), and an upper grinding disc (207) is installed at the output end of the first grinding motor (206).

2. The double-sided polishing equipment for semiconductor silicon wafers according to claim 1, characterized in that: The upper surface of the base plate (1) is equipped with a second grinding motor (4), and the output end of the second grinding motor (4) is equipped with a lower grinding disc (5).

3. The double-sided polishing equipment for semiconductor silicon wafers according to claim 1, characterized in that: The upper surface of the base plate (1) is fixedly connected with support rods (12) arranged at equal intervals. The top of each support rod (12) is fixedly connected with a limiting frame (13). The upper surface of the limiting frame (13) is provided with grooves (14) arranged at equal intervals.

4. The double-sided polishing equipment for semiconductor silicon wafers according to claim 1, characterized in that: The front of the mounting bracket (3) is equipped with a controller (6), and the front of the controller (6) is provided with a display screen (7).

5. The double-sided polishing equipment for semiconductor silicon wafers according to claim 1, characterized in that: The bottom surface of the base plate (1) is fixedly connected to symmetrical support legs (8), and the bottom surface of each support leg (8) is fixedly connected to an anti-slip seat (9).

6. The double-sided polishing equipment for semiconductor silicon wafers according to claim 1, characterized in that: A fixed cover (10) is fixedly connected to the bottom surface of the base plate (1), and a storage battery (11) is installed inside the fixed cover (10).

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