Device for testing performance of semiconductor vacuum valve

Abstract

The utility model discloses a device for testing the performance of a semiconductor vacuum valve. The device comprises a CDA controller and a vacuum gauge. The vacuum pumping structure is electrically connected with the CDA controller; the rack and the vacuumizing structure are arranged at an interval; the main body is connected to the rack and connected with the vacuum gauge, and the main body is communicated with the vacuumizing structure and used for being connected with at least one tested valve; the middle position of the main body is provided with a hollow space, the side wall is provided with at least two first valve external interfaces and at least one nitrogen interface, the first valve external interfaces are used for connecting a tested valve, and the nitrogen interface is used for introducing nitrogen into the hollow space; the structures of the two first valve external connectors are the same or different; therefore, the technical problems of low valve performance test efficiency and poor equipment use flexibility are solved, and high efficiency and intensification of the test equipment are realized.

Description

Technical Field

[0001] This utility model relates to the field of valve performance testing technology, specifically to a device for testing the performance of semiconductor vacuum valves. Background Technology

[0002] Vacuum valves are core components in semiconductor vacuum systems, serving functions such as opening and closing, controlling flow / direction, and regulating pressure. There are many types, including angle valves, ball valves, swing valves, butterfly valves, transfer valves, rectangular valves, diaphragm valves, and so on.

[0003] The performance of vacuum valves affects the reliability of semiconductor vacuum systems or fluid systems. In order to ensure the performance of vacuum valves, it is generally necessary to conduct performance tests on them. The tests usually include: sealing performance, leakage rate, switching life, and high temperature resistance.

[0004] Traditional performance testing equipment, due to interface limitations, can only test one type of vacuum valve, resulting in poor flexibility and relatively low testing efficiency. Utility Model Content

[0005] In view of the above-mentioned shortcomings in the related technologies, the purpose is to provide a device for testing the performance of semiconductor vacuum valves, so as to solve the technical problems of relatively low testing efficiency and relatively poor flexibility of use in the related technologies.

[0006] The technical solution to achieve the objective is: a device for testing the performance of semiconductor vacuum valves, comprising: a CDA controller and a vacuum gauge; and further comprising:

[0007] A vacuum-drawing structure is electrically connected to the CDA controller;

[0008] The frame is spaced apart from the vacuuming structure;

[0009] The main body is connected to the frame and the vacuum gauge is connected to it. The main body is in communication with the vacuuming structure and is used to connect at least one valve to be tested.

[0010] The main body has a hollow space in the middle, and at least two first valve external interfaces and at least one nitrogen interface on the side wall. The first valve external interfaces are used to connect the valve under test, and the nitrogen interface is used to introduce nitrogen into the hollow space.

[0011] The structures of the two external interfaces of the first valves may be the same or different.

[0012] Furthermore, the vacuuming structure includes: a dry pump; a first corrugated expansion joint, one end of which is connected to the dry pump; a pipeline, one end of which is connected to the first corrugated expansion joint and the other end extending towards the main body; a second corrugated expansion joint, connected to the pipeline and spaced apart from the first corrugated expansion joint; a first angle valve, connected to the pipeline and connected to the second corrugated expansion joint; a butterfly valve, connected to the pipeline and spaced apart from the first angle valve; and a second angle valve, connected to the pipeline and connected to the main body.

[0013] Furthermore: the frame includes: a frame body, with the main body connected to the top; and four casters, spaced apart and connected to the bottom of the frame body.

[0014] Furthermore: the main body includes: a cavity with a square shape, a hollow space in the middle, an open top, a through hole at the bottom, and an external interface of the first valve and a nitrogen interface on the side wall; a side-opening door assembly connected to one side wall of the cavity and positioned opposite the second angle valve for opening or closing the hollow space; a top cover connected to the top of the cavity to close the hollow space; a transition flange connected to the bottom of the cavity and surrounding the through hole; and a sealing plate connected to the transition flange to close the through hole.

[0015] Furthermore: the number of external interfaces of the first valve is four, which are set between the side-opening door assembly and the second angle valve, two in a group, and the groups are arranged opposite each other. One group of external interfaces of the first valve is set on one side wall of the cavity.

[0016] Furthermore, the number of nitrogen gas ports is three, which are located on one side of the second angle valve and spaced apart from the second angle valve.

[0017] Furthermore: the side-opening door assembly includes: a door body, one end of which is connected to the cavity via a hinge; and a plurality of horizontal elbow clamps connected to the cavity, which press the door body together when it contacts the cavity, thereby closing the hollow space.

[0018] Furthermore: the upper cover has several external interfaces for second valves, which are arranged in two rows with parallel intervals between the rows.

[0019] Furthermore, the obstruction plate has an elliptical shape and is connected to the transition flange by bolts.

[0020] Furthermore, it also includes a heating belt, connected to the main body, for heating the main body to increase its temperature.

[0021] The above technical solution has the following beneficial effects: An apparatus for testing the performance of semiconductor vacuum valves, compared with related technologies, includes a CDA controller, a vacuum gauge, a vacuum pumping structure, a frame, and a main body. The frame forms a reliable support structure, facilitating connection to the main body. The valve under test is connected to the external interface of the first valve, and is in a closed state. The CDA controller controls the vacuum pumping structure to evacuate the hollow space on the main body, introducing nitrogen into the hollow space through a nitrogen port. When the pressure in the hollow space reaches the target pressure, the vacuum pumping structure is closed. The leakage rate of the valve under test is obtained through the vacuum gauge reading for sealing testing. Furthermore, the CDA controller can control the valve under test to continuously open and close for switching life testing, making operation relatively convenient.

[0022] Because it has at least two external interfaces for the first valve, it can test at least two types of valves at the same time, which makes the testing efficiency relatively high and the usage flexibility relatively good.

[0023] This overcomes the technical problems of relatively low testing efficiency and relatively poor usage flexibility, achieving a technical effect of relatively high testing efficiency and relatively good usage flexibility, and is practical. Attached Figure Description

[0024] Figure 1 Front view of final assembly;

[0025] Figure 2 This is a top view of the final assembly.

[0026] Figure 3 This is a bottom view of the final assembly.

[0027] Figure 4 Right view of the final assembly;

[0028] Figure 5 Left view of the final assembly;

[0029] Figure 6 This is the rear view of the final assembly.

[0030] In the diagram: 10. Vacuuming structure, 11. Dry pump, 12. First corrugated expansion joint, 13. Piping, 14. Second corrugated expansion joint, 15. First angle valve, 16. Butterfly valve, 17. Second angle valve, 20. Frame, 21. Body, 22. Casters, 30. Main body, 31. First valve external interface, 32. Nitrogen interface, 33. Cavity, 34. Side-opening door assembly, 34-1. Door, 34-2. Horizontal elbow clamp, 35. Top cover, 35-1. Second valve external interface, 36. Adapter flange, 37. Obstruction plate, 100. Valve under test. Detailed Implementation

[0031] To make the content easier to understand, the following detailed description is provided with reference to specific embodiments and accompanying drawings;

[0032] An apparatus for testing the performance of semiconductor vacuum valves solves the technical problems of relatively low testing efficiency and poor flexibility in use in related technologies. It is manufactureable and usable, achieving relatively high testing efficiency and good flexibility in use. The overall concept is as follows:

[0033] Implementation

[0034] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 As shown; an apparatus for performance testing of semiconductor vacuum valves, comprising: a CDA controller and a vacuum gauge; and further comprising:

[0035] The vacuum structure 10 is electrically connected to the CDA controller;

[0036] The frame 20 is spaced apart from the vacuum structure 10;

[0037] The main body 30 is connected to the frame 20 and the vacuum gauge is connected to it. The main body 30 is connected to the vacuum structure 10 and is used to connect at least one valve 100 to be tested.

[0038] The main body 30 has a hollow space in the middle and at least two first valve external interfaces 31 and at least one nitrogen interface 32 on the side wall. The first valve external interfaces 31 are used to connect the valve under test 100, and the nitrogen interface 32 is used to introduce nitrogen into the hollow space.

[0039] The structures of the two external interfaces 31 of the first valve are the same or different;

[0040] Specifically, during implementation, a CDA controller, a vacuum gauge, a vacuuming structure 10, a frame 20, and a main body 30 are provided. The frame 20 forms a reliable support structure, which is beneficial for connecting the main body 30. The valve under test 100 is connected to the first valve external interface 31. The valve under test 100 is in the closed state. The CDA controller controls the vacuuming structure 10 to evacuate the hollow space on the main body 30. Nitrogen gas is introduced into the hollow space through the nitrogen interface 32. When the gas pressure in the hollow space reaches the target pressure, the vacuuming structure 10 is closed. The leakage rate of the valve under test 100 is obtained by reading the vacuum gauge, and a sealing test is performed. The CDA controller can also control the valve under test 100 to open and close continuously for switching life testing. The operation is relatively convenient.

[0041] Because it is equipped with at least two external interfaces 31 for the first valve, it can test at least two types of valves 100 at the same time, which makes the testing efficiency relatively high and the usage flexibility relatively good.

[0042] Another implementation method:

[0043] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 As shown; in implementation, the vacuum structure 10 includes: a dry pump 11; a first corrugated expansion joint 12, one end of which is connected to the dry pump 11; a pipeline 13, one end of which is connected to the first corrugated expansion joint 12, and the other end extending towards the main body 30; a second corrugated expansion joint 14, connected to the pipeline 13 and spaced apart from the first corrugated expansion joint 12; a first angle valve 15, connected to the pipeline 13 and connected to the second corrugated expansion joint 14; a butterfly valve 16, connected to the pipeline 13 and spaced apart from the first angle valve 15; and a second angle valve 17, connected to the pipeline 13 and connected to the main body 30.

[0044] The dry pump 11 is a common structure in the prior art, such as a dry vacuum pump used for vacuuming. To improve the operational reliability of the dry pump 11, a water cooling system is provided on the dry pump 11 (for example, a coil is connected to the outer wall of the dry pump 11, and circulating cooling water is introduced into the coil to exchange heat with the dry pump 11). Those skilled in the art can directly and without doubt know how to set up the water cooling system after seeing the disclosed content, without needing to make any creative effort or conduct excessive experiments.

[0045] The first corrugated expansion joint 12 and the second corrugated expansion joint 14 are commonly used structures in the prior art, used to compensate for the thermal expansion of pipelines, improve reliability, and also have a shock absorption function.

[0046] The first angle valve 15, the butterfly valve 16, and the second angle valve 17 are common structures in the prior art, used to regulate the on / off state of pipeline 13.

[0047] Another implementation method:

[0048] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 As shown; in practice, the frame 20 includes: a frame body 21, with the main body 30 connected to the top; and four casters 22, spaced apart and connected to the bottom of the frame body 21;

[0049] The frame 21 is a frame structure welded from square tubes. The top is connected to the main body 30 by bolts, forming a reliable support structure that is easy to install and disassemble.

[0050] The caster wheel 22 is a common structure in the prior art. It is connected to the bottom of the frame 21 by bolts, which facilitates movement along the ground and makes it relatively convenient to use.

[0051] Another implementation method:

[0052] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 As shown; in implementation, the main body 30 includes: a cavity 33, which has a square shape, a hollow space in the middle, an open top, a through hole at the bottom, and an external interface 31 for the first valve and a nitrogen interface 32 on the side wall; a side-opening door assembly 34, connected to one side wall of the cavity 33 and positioned opposite the second angle valve 17, for opening or closing the hollow space; a top cover 35, connected to the top of the cavity 33, to close the hollow space; a transition flange 36, connected to the bottom of the cavity 33, surrounding the through hole; and a sealing plate 37, connected to the transition flange 36, to close the through hole;

[0053] There are four first valve external interfaces 31, which are set between the side-opening door assembly 34 and the second angle valve 17, in pairs, and the groups are arranged opposite each other. One group of first valve external interfaces 31 is set on one side wall of the cavity 33; for example, the first valve external interface 31 is a circular flange or a square flange; according to the shape of the connection of the valve 100 under test, the corresponding first valve external interface 31 is equipped so that the first valve external interface 31 can reliably connect with the valve 100 under test, and four types of valves 100 under test can be tested at the same time. The testing efficiency is relatively high and the flexibility of use is relatively good.

[0054] There are three nitrogen gas inlets 32, which are located on one side of the second angle valve 17 and spaced apart from the second angle valve 17. The nitrogen gas inlets 32 are provided, for example, gas nozzle connectors, for introducing nitrogen into the hollow space (the nitrogen is generated by a nitrogen generator in the prior art, which is common knowledge).

[0055] The cavity 33 has a square shape and is made of welded plates. Its regular shape makes it relatively easy to process and manufacture.

[0056] The side-opening door assembly 34 includes: a door body 34-1, one end of which is connected to the cavity 33 via a hinge; and a plurality of horizontal elbow clamps 34-2, which are connected to the cavity 33 and press the door body 34-1 when it contacts the cavity 33, thereby closing the hollow space. The door body 34-1 is a rectangular plate structure; the horizontal elbow clamps 34-2 are common structures in the prior art. The door body 34-1 facilitates cleaning of the hollow space, provides relatively good flexibility in use, and can close the hollow space when not in use.

[0057] The upper cover 35 has seven second valve external interfaces 35-1, arranged in two rows with parallel intervals between them. The upper cover 35 is connected to the cavity 33 by bolts, making installation and disassembly convenient. The second valve external interfaces 35-1 can be circular flanges, square flanges, etc., and are equipped with corresponding second valve external interfaces 35-1 according to the shape of the connection of the valve 100 under test. This allows the second valve external interfaces 35-1 to reliably connect with the valve 100 under test, enabling simultaneous testing of multiple valves 100 under test, resulting in relatively high testing efficiency and good flexibility in use.

[0058] The transition flange 36 is a common structure in the prior art. It is welded to the cavity 33 and is used to connect the obstruction plate 37.

[0059] The obstruction plate 37 has an elliptical shape and is connected to the transition flange 36 by bolts. When the obstruction plate 37 is connected to the transition flange 36, it can close the through hole and open the through hole to clear the hollow space, which provides relatively good flexibility in use.

[0060] Another implementation method:

[0061] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 As shown; in practice, it also includes: a heating belt, connected to the main body 30, for heating the main body to raise its temperature;

[0062] The heating band is a common structure in existing technology. It achieves constant temperature through temperature controllers, etc. The heating band is set on the outer wall of cavity 33 to heat the cavity 33 and conduct high temperature resistance tests.

[0063] Regarding the existing structure: The CDA controller and vacuum gauge are commonly used structures in the existing technology. The leakage rate of the valve under test 100 is obtained by reading the vacuum gauge, and the sealing performance test is performed. The CDA controller can also control the valve under test 100 to open and close continuously for switching life test, which is relatively convenient to operate.

[0064] The working principle is as follows:

[0065] Room temperature low pressure test: The valve under test 100 is connected to the first valve external interface 31 and / or the second valve external interface 35-1. The valve under test 100 is in the closed state. The CDA controller controls the vacuum structure 10 to evacuate the hollow space on the main body 30 (evacuate to 1.0E-4Pa~1.0E-6Pa). Nitrogen gas is introduced into the hollow space through the nitrogen interface 32. When the gas pressure in the hollow space reaches the target pressure, the vacuum structure 10 is closed. The leakage rate of the valve under test 100 is obtained by reading the vacuum gauge to perform a sealing test. The valve under test 100 can also be continuously opened and closed by the CDA controller to perform an on / off life test. If the set number of normal on / off cycles (e.g., 100,000 times) is reached, it is considered qualified.

[0066] Normal temperature and pressure test: With the vacuum structure 10 closed, the valve under test 100 is connected to the first valve external interface 31 and / or the second valve external interface 35-1. The valve under test 100 is in the closed state. Nitrogen is introduced into the hollow space through the nitrogen interface 32. When the gas pressure in the hollow space reaches the target pressure, the leakage rate of the valve under test 100 is obtained by reading the vacuum gauge. A sealing test is performed. The valve under test 100 is continuously opened and closed by the CDA controller to perform a switching life test. If the set number of normal opening and closing cycles (e.g., 100,000 times) is reached, it is considered qualified.

[0067] High temperature resistance test: With the vacuum structure 10 closed, the valve under test 100 is connected to the first valve external interface 31 and / or the second valve external interface 35-1. The valve under test 100 is in the closed state. The temperature at the cavity 33 is set to 150℃ through the heating belt, with a maximum of 200℃. The valve under test 100 is continuously opened and closed by the CDA controller to perform a high temperature resistance test. If the valve under test 100 can continuously open and close normally at the set temperature and reach the set number of normal opening and closing cycles (e.g., 100,000 times), it is considered qualified.

[0068] In the above implementation, the leakage rate of the valve under test is obtained by a vacuum gauge. Alternatively, helium gas can be introduced and the valve under test can be scanned with a helium detector. If an abnormality is found, it proves that the valve is leaking; otherwise, it is fine.

[0069] In the description, it should be understood that the terms "up", "down", "left", "right", "front", "back", etc., indicate the orientation or positional relationship based on the positional relationship shown in the accompanying drawings, and are only for the convenience or simplification of the description, rather than indicating a specific orientation that must be present; the operation process described in the embodiments is not an absolute usage step, and corresponding adjustments can be made in actual use;

[0070] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art; the words “first,” “second,” and similar terms used in the specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components, and similarly, the words “a” or “a” and similar terms do not determine a quantity limitation, but rather indicate the presence of at least one, as determined by the content of the embodiments;

[0071] The above description is only a preferred embodiment, but the scope of protection is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the disclosed technology, based on the technical solution and inventive concept, should be included within the scope of protection.

Claims

1. An apparatus for testing the performance of semiconductor vacuum valves, comprising: CDA controller and vacuum gauge; characterized in that it further includes: The vacuum structure (10) is electrically connected to the CDA controller; The frame (20) is spaced apart from the vacuum structure (10); The main body (30) is connected to the frame (20) and the vacuum gauge is connected. The main body (30) is connected to the vacuum structure (10) and is used to connect at least one valve (100) to be tested. The main body (30) has a hollow space in the middle position, and at least two first valve external interfaces (31) and at least one nitrogen interface (32) on the side wall. The first valve external interfaces (31) are used to connect the valve under test (100), and the nitrogen interface (32) is used to introduce nitrogen into the hollow space. The structures of the two external interfaces (31) of the first valve are the same or different.

2. The device for testing the performance of semiconductor vacuum valves according to claim 1, characterized in that: The vacuum structure (10) includes: a dry pump (11); a first corrugated expansion joint (12), one end of which is connected to the dry pump (11); a pipeline (13), one end of which is connected to the first corrugated expansion joint (12), and the other end of which extends toward the main body (30); a second corrugated expansion joint (14), which is connected to the pipeline (13) and spaced apart from the first corrugated expansion joint (12); a first angle valve (15), which is connected to the pipeline (13) and connected to the second corrugated expansion joint (14); a butterfly valve (16), which is connected to the pipeline (13) and spaced apart from the first angle valve (15); and a second angle valve (17), which is connected to the pipeline (13) and connected to the main body (30).

3. The device for testing the performance of semiconductor vacuum valves according to claim 2, characterized in that: The frame (20) includes: a frame (21) connected to the top of the main body (30); and four casters (22) spaced apart and connected to the bottom of the frame (21).

4. The apparatus for testing the performance of semiconductor vacuum valves according to claim 2, characterized in that: The main body (30) includes: a cavity (33) with a square shape, a hollow space in the middle, an open top, a through hole at the bottom, and an external interface (31) for the first valve and a nitrogen interface (32) on the side wall; a side-opening door assembly (34) connected to one side wall of the cavity (33) and opposite to the second angle valve (17) for opening or closing the hollow space; a top cover (35) connected to the top of the cavity (33) to close the hollow space; a transition flange (36) connected to the bottom of the cavity (33) and surrounding the through hole; and a sealing plate (37) connected to the transition flange (36) to close the through hole.

5. The apparatus for testing the performance of semiconductor vacuum valves according to claim 4, characterized in that: The number of the first valve external interface (31) is four, which are set between the side opening assembly (34) and the second angle valve (17). Two are set as a group, and the groups are set opposite each other. One group of the first valve external interface (31) is set on one side wall of the cavity (33).

6. The apparatus for testing the performance of semiconductor vacuum valves according to claim 5, characterized in that: The number of nitrogen ports (32) is three, which are located on one side of the second angle valve (17) and spaced apart from the second angle valve (17).

7. The apparatus for testing the performance of semiconductor vacuum valves according to claim 6, characterized in that: The side-opening door assembly (34) includes: a door body (34-1), one end of which is connected to the cavity (33) via a hinge; and a plurality of horizontal elbow clamps (34-2), which are connected to the cavity (33) and press the door body (34-1) together when the door body (34-1) contacts the cavity (33), thereby closing the hollow space.

8. The apparatus for testing the performance of semiconductor vacuum valves according to claim 7, characterized in that: The upper cover (35) has several second valve external interfaces (35-1), which are arranged in two rows with parallel intervals between the rows.

9. The apparatus for testing the performance of semiconductor vacuum valves according to claim 4, characterized in that: The obstruction plate (37) has an elliptical shape and is connected to the transition flange (36) by bolts.

10. An apparatus for testing the performance of semiconductor vacuum valves according to any one of claims 1 or 9, characterized in that: Also includes: A heating band is attached to the main body (30) and is used to heat the main body (30) to increase its temperature.

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