Temperature control table for measuring thermal resistance of chip

Abstract

The utility model discloses a temperature control table for measuring thermal resistance of a chip. The temperature control table comprises a base, a placement table and a semiconductor refrigeration part. The placing table is fixedly connected with the base; a placing surface for placing a chip is formed on the upper surface of the placing table, and the placing table is a metal piece; the semiconductor refrigeration piece is clamped between the base and the placing table and abuts against the lower surface of the placing table. According to the temperature control table, the base, the placement table and the semiconductor refrigeration piece are combined, so that the temperature of the bottom surface of the chip is accurately controlled and stably maintained. Wherein the placing table is a metal piece, has good thermal conductivity, and can quickly transfer the temperature of the semiconductor refrigeration piece to the chip to ensure the uniformity of the temperature of the bottom surface of the chip. And the semiconductor refrigeration piece is clamped between the base and the placement table, so that the dual functions of refrigeration and heating can be realized, and the temperature can be flexibly adjusted according to the heating condition of the chip in the measurement process.

Description

Technical Field

[0001] This utility model belongs to the field of thermal resistance measurement technology for chips, specifically relating to a temperature control stage for measuring the thermal resistance of chips. Background Technology

[0002] Chip thermal resistance measurement plays a crucial role in electronic component thermal management technology, primarily due to the following reasons: 1. Ensuring chip performance: Excessively high temperatures can lead to performance degradation and even malfunctions. Thermal resistance measurement allows for the assessment of a chip's heat dissipation performance under specific conditions, ensuring effective heat dissipation within the designed power range and maintaining optimal performance. 2. Extending chip lifespan: Prolonged operation at high temperatures accelerates chip aging and shortens its lifespan. Proper thermal resistance design and management help reduce the chip's operating temperature, thereby extending its service life. 3. Optimizing product design: Thermal resistance measurement results provide important references for the design of chip packaging structures, heat dissipation solutions, and more.

[0003] The thermal resistance is determined by the ratio of the temperature difference between the upper and lower surfaces of the chip to the input power. Because the internal structure of a chip is extremely small, traditional methods of temperature measurement using resistance temperature detectors (RTDs) and thermocouples cannot be used to measure the temperature of the chip's internal regions. Therefore, current methods for measuring the temperature of internal chip regions primarily employ infrared microscopy. This involves measuring the infrared light emitted by the chip, and after emissivity correction, obtaining the accurate temperature value of the chip's heating region. However, emissivity correction requires heating the chip to a certain temperature so that its infrared emission becomes dominant; therefore, a temperature control stage is an essential component.

[0004] Current temperature control stations mainly use heating elements for heating and temperature control. During the thermal resistance measurement process, the chip generates a lot of heat after being powered on, which causes the temperature of the temperature control station to change. This change causes the temperature of the bottom surface of the chip (the surface temperature of the temperature control station) to rise, affecting the calculation of the chip's thermal resistance. Summary of the Invention

[0005] The purpose of this invention is to provide a temperature control stage for measuring the thermal resistance of chips, which can solve at least some of the above-mentioned technical problems.

[0006] The first aspect of this utility model provides a temperature control stage for measuring the thermal resistance of a chip, the temperature control stage comprising:

[0007] Base

[0008] A placement platform is fixedly connected to the base; the upper surface of the placement platform forms a placement surface for placing the chip, and the placement platform is a metal component;

[0009] A semiconductor cooling device is sandwiched between the base and the placement stage, and abuts against the lower surface of the placement stage.

[0010] The main technical effect achieved by this embodiment of the invention is that the temperature control stage, through the combination of a base, a placement stage, and a semiconductor cooling device, achieves precise control and stable maintenance of the chip's bottom surface temperature. The placement stage, made of metal, has excellent thermal conductivity, enabling rapid transfer of the semiconductor cooling device's temperature to the chip, ensuring uniformity of the chip's bottom surface temperature. The semiconductor cooling device, sandwiched between the base and the placement stage, not only provides both cooling and heating functions but also allows for flexible temperature adjustment based on the chip's heat generation during measurement. When the chip is powered on, it generates heat, which may cause the temperature control stage's surface temperature to rise, affecting the accuracy of thermal resistance measurement. The cooling function of the semiconductor cooling device effectively counteracts the chip's own heat generation, maintaining the stage's surface temperature at the set value and avoiding measurement errors caused by temperature fluctuations. This cooling function allows the temperature control stage to maintain a stable temperature environment when measuring high-power chips, significantly improving the accuracy of thermal resistance measurement.

[0011] Optionally, the lower surface of the placement stage is provided with a first positioning groove, the shape of the first positioning groove is adapted to the shape of the semiconductor cooling element and is positioned and engaged with the semiconductor cooling element, and the upper surface of the semiconductor cooling element abuts against the bottom surface of the first positioning groove.

[0012] The main technical effect achieved by this embodiment of the invention is that the first positioning groove on the lower surface of the placement stage cooperates with the positioning of the semiconductor cooling component, ensuring close contact between the semiconductor cooling component and the placement stage and reducing contact thermal resistance. This structure allows heat to be transferred to the chip more efficiently, while ensuring the uniformity of temperature distribution and further improving the accuracy of thermal resistance measurement.

[0013] Optionally, the temperature control platform further includes a fastener, a through hole disposed in one of the base and the placement platform, and a threaded hole disposed in the other of the base and the placement platform. The fastener passes through the through hole and engages with the threaded hole to fix the placement platform on the base.

[0014] The main technical effect achieved by this embodiment of the invention is that by fixing the placement stage to the base with fasteners, the overall structural stability of the temperature control stage is enhanced. This fixing method can prevent structural loosening due to vibration or external force during the measurement process, thereby avoiding temperature fluctuations, ensuring the stability of the chip bottom surface temperature, providing more reliable temperature conditions for thermal resistance measurement, and improving the accuracy of the measurement.

[0015] Optionally, the temperature control platform further includes a cooler, which is sandwiched between the semiconductor cooling element and the base and abuts against the semiconductor.

[0016] The main technical effect achieved by this embodiment of the invention is that by fixing the placement stage to the base with fasteners, the overall structural stability of the temperature control stage is enhanced. This fixing method can prevent structural loosening due to vibration or external force during the measurement process, thereby avoiding temperature fluctuations, ensuring the stability of the chip bottom surface temperature, providing more reliable temperature conditions for thermal resistance measurement, and improving the accuracy of the measurement.

[0017] Optionally, the upper surface of the base is provided with a second positioning groove, the shape of which is adapted to the shape of the cooler and is positioned and engaged with the cooler.

[0018] The main technical effect achieved by this embodiment of the invention is that by fixing the placement stage to the base with fasteners, the overall structural stability of the temperature control stage is enhanced. This fixing method can prevent structural loosening due to vibration or external force during the measurement process, thereby avoiding temperature fluctuations, ensuring the stability of the chip bottom surface temperature, providing more reliable temperature conditions for thermal resistance measurement, and improving the accuracy of the measurement.

[0019] Optionally, the cooler includes a copper water-cooled block.

[0020] The main technical effect achieved by this embodiment of the invention is that by fixing the placement stage to the base with fasteners, the overall structural stability of the temperature control stage is enhanced. This fixing method can prevent structural loosening due to vibration or external force during the measurement process, thereby avoiding temperature fluctuations, ensuring the stability of the chip bottom surface temperature, providing more reliable temperature conditions for thermal resistance measurement, and improving the accuracy of the measurement.

[0021] Optionally, the copper water-cooled block includes a block body and an inlet pipe, an outlet pipe, and a cooling pipe connected to the inlet pipe and the outlet pipe disposed on the block body; the inlet pipe and the outlet pipe are located on the side of the block body, and the cooling pipe is located inside the block body.

[0022] The main technical effect achieved by this embodiment of the invention is that by fixing the placement stage to the base with fasteners, the overall structural stability of the temperature control stage is enhanced. This fixing method can prevent structural loosening due to vibration or external force during the measurement process, thereby avoiding temperature fluctuations, ensuring the stability of the chip bottom surface temperature, providing more reliable temperature conditions for thermal resistance measurement, and improving the accuracy of the measurement.

[0023] Optionally, the inlet pipe and the outlet pipe are located on the same side of the block body; the base is provided with a first notch; the first notch is used to avoid the inlet pipe; the base is provided with a second notch; the second notch is used to avoid the outlet pipe.

[0024] The main technical effects achieved by this embodiment are as follows: the inlet and outlet water pipes are located on the same side of the block body, facilitating the entry and exit of cooling water and simplifying the layout of the cooling system. This design reduces the length and bends of the cooling pipes, lowers water flow resistance, and improves cooling efficiency, thereby more effectively maintaining the stability of the surface temperature of the temperature control platform and improving the accuracy of thermal resistance measurement. The first notch on the base is used to avoid the inlet water pipe, preventing interference between the cooling pipe and the base and ensuring that cooling water can smoothly enter the copper water-cooled block. This design ensures the normal operation of the cooling system, improves the temperature control stability of the temperature control platform, and provides more reliable temperature conditions for thermal resistance measurement. The second notch on the base is used to avoid the outlet water pipe, similarly preventing interference between the cooling pipe and the base and ensuring that cooling water can smoothly exit. This design ensures the integrity and efficiency of the cooling system, further improving the temperature control accuracy of the temperature control platform and providing more precise temperature control for thermal resistance measurement.

[0025] Optionally, the cooler is coated with thermally conductive silicone grease for contact with the semiconductor cooling element.

[0026] The main technical effect achieved by this embodiment of the invention is that thermally conductive silicone grease is applied to the cooler for contact with the semiconductor cooling component. Thermally conductive silicone grease is a highly thermally conductive filler material that can effectively fill the tiny gaps between the cooler and the semiconductor cooling component, reducing contact thermal resistance.

[0027] Optionally, the semiconductor cooling element is coated with thermally conductive silicone grease for contact with the placement stage.

[0028] The main technical effect achieved by this embodiment of the invention is that thermally conductive grease is applied to the semiconductor cooling component for contact with the placement stage. The thermally conductive grease can also fill the tiny gaps between the semiconductor cooling component and the placement stage, reducing contact thermal resistance and improving heat transfer efficiency. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of a temperature control stage for measuring the thermal resistance of a chip, according to one embodiment of the present invention.

[0030] Figure 2 This is a schematic diagram of the structure of a base in one embodiment of the present utility model;

[0031] Figure 3 This is a schematic diagram of the structure of a placement platform in one embodiment of the present invention.

[0032] Explanation of reference numerals in the attached drawings: 1. Base; 2. Placement platform; 3. Semiconductor cooling component; 4. Cooler; 11. First positioning groove; 21. Second positioning groove; 41. Water inlet pipe; 42. Water outlet pipe. Detailed Implementation

[0033] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The manner described in the following exemplary embodiments does not represent all manner consistent with this invention. Rather, they are merely examples of apparatuses consistent with some aspects of this invention as detailed in the appended claims.

[0034] The terminology used in this invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. Unless otherwise defined, the technical or scientific terms used in this invention should be understood in their ordinary sense by one of ordinary skill in the art to which this invention pertains. The terms "first," "second," and similar words used in this specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, "a" or "one," and similar words do not indicate a quantity limitation, but rather indicate the presence of at least one, which will be separately stated if referring only to "a." "A plurality" or "several" indicates two or more. Unless otherwise stated, "front," "rear," "lower," and / or "upper," and similar words are for ease of description only and are not limited to a location or spatial orientation. The terms "comprising" or "including," and similar words mean that the elements or objects preceding "comprising" or "including" encompass the elements or objects listed following "comprising" or "including" and their equivalents, but do not exclude other elements or objects. The terms “connection” or “link” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The singular forms “a,” “the,” and “the” used in this specification and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0035] like Figure 1 As shown, a first aspect of this utility model embodiment provides a temperature control stage for measuring chip thermal resistance, the temperature control stage including as follows Figure 2 Base 1 as shown Figure 3The diagram shows a placement stage 2 and a thermoelectric cooler 3. The placement stage 2 is fixedly connected to the base 1; the upper surface of the placement stage 2 forms a placement surface for the chip, and the placement stage 2 is made of metal; the thermoelectric cooler 3 is sandwiched between the base 1 and the placement stage 2, and abuts against the lower surface of the placement stage 2. The temperature control stage, through the combination of the base 1, the placement stage 2, and the thermoelectric cooler 3, achieves precise control and stable maintenance of the chip's bottom surface temperature. The placement stage 2, being made of metal, has good thermal conductivity, enabling rapid transfer of the temperature from the thermoelectric cooler 3 to the chip, ensuring uniform temperature on the chip's bottom surface. The thermoelectric cooler 3, sandwiched between the base 1 and the placement stage 2, not only provides both cooling and heating functions but also allows for flexible temperature adjustment based on the chip's heat generation during measurement. When the chip is powered on, it generates heat, which may cause the surface temperature of the temperature control stage to rise, affecting the accuracy of thermal resistance measurement. The cooling function of the thermoelectric cooler 3 effectively counteracts the effect of the chip's own heat generation on the temperature of the temperature control stage, maintaining the surface temperature of the temperature control stage at the set value and avoiding measurement errors caused by temperature fluctuations. This cooling function enables the temperature control station to maintain a stable temperature environment when measuring high-power chips, thereby significantly improving the accuracy of thermal resistance measurement.

[0036] As an optional implementation, the lower surface of the placement stage 2 is provided with a first positioning groove 11. The shape of the first positioning groove 11 is adapted to the shape of the semiconductor cooler 3 and is positioned and engaged with the semiconductor cooler 3. The upper surface of the semiconductor cooler 3 abuts against the bottom surface of the first positioning groove 11. The positioning and engagement of the first positioning groove 11 on the lower surface of the placement stage 2 with the semiconductor cooler 3 ensures close contact between the semiconductor cooler 3 and the placement stage 2, reducing contact thermal resistance. This structure allows heat to be transferred to the chip more efficiently, while ensuring uniform temperature distribution and further improving the accuracy of thermal resistance measurement.

[0037] As an optional implementation, the temperature control stage also includes fasteners, a through hole in one of the base 1 and the placement stage 2, and a threaded hole in the other of the base 1 and the placement stage 2. The fastener passes through the through hole and engages with the threaded hole to fix the placement stage 2 to the base 1. Fixing the placement stage 2 to the base 1 with fasteners enhances the overall structural stability of the temperature control stage. This fixing method prevents structural loosening due to vibration or external forces during measurement, thereby avoiding temperature fluctuations, ensuring the stability of the chip's bottom surface temperature, providing more reliable temperature conditions for thermal resistance measurement, and improving measurement accuracy.

[0038] As an optional implementation, the temperature control stage also includes a cooler 4, which is sandwiched between the semiconductor cooling element 3 and the base 1 and abuts against the semiconductor. The placement stage 2 is fixed to the base 1 with fasteners, enhancing the overall structural stability of the temperature control stage. This fixing method prevents structural loosening due to vibration or external forces during measurement, thereby avoiding temperature fluctuations, ensuring the stability of the chip's bottom surface temperature, providing more reliable temperature conditions for thermal resistance measurement, and improving measurement accuracy.

[0039] As an optional implementation, the upper surface of the base 1 is provided with a second positioning groove 21, the shape of which is adapted to the shape of the cooler 4 and positions and engages with the cooler 4. The placement stage 2 is fixed to the base 1 with fasteners, enhancing the overall structural stability of the temperature control stage. This fixing method prevents structural loosening due to vibration or external force during measurement, thereby avoiding temperature fluctuations, ensuring the stability of the chip's bottom surface temperature, providing more reliable temperature conditions for thermal resistance measurement, and improving measurement accuracy.

[0040] As an optional implementation, the cooler 4 includes a copper water-cooling block. The placement stage 2 is fixed to the base 1 with fasteners, enhancing the overall structural stability of the temperature control stage. This fixing method prevents structural loosening due to vibration or external forces during measurement, thereby avoiding temperature fluctuations, ensuring the stability of the chip's bottom surface temperature, providing more reliable temperature conditions for thermal resistance measurement, and improving measurement accuracy.

[0041] As an optional implementation, the copper water-cooled block includes a block body and an inlet pipe 41, an outlet pipe 42, and a cooling pipe communicating with the inlet pipe 41 and the outlet pipe 42, all disposed on the block body. The inlet pipe 41 and the outlet pipe 42 are located on the side of the block body, while the cooling pipe is located inside the block body. Fasteners are used to fix the placement stage 2 to the base 1, enhancing the overall structural stability of the temperature control stage. This fixing method prevents structural loosening due to vibration or external force during measurement, thereby avoiding temperature fluctuations, ensuring the stability of the chip's bottom surface temperature, providing more reliable temperature conditions for thermal resistance measurement, and improving measurement accuracy.

[0042] As an optional implementation, the inlet pipe 41 and the outlet pipe 42 are located on the same side of the block body; the base 1 has a first notch to avoid the inlet pipe 41; the base 1 has a second notch to avoid the outlet pipe 42. The inlet pipe 41 and the outlet pipe 42 being located on the same side of the block body facilitates the entry and exit of cooling water and simplifies the layout of the cooling system. This design reduces the length and bends of the cooling pipes, lowers water flow resistance, and improves cooling efficiency, thereby more effectively maintaining the stability of the surface temperature of the temperature control platform and improving the accuracy of thermal resistance measurement. The first notch on the base 1 avoids the inlet pipe 41, preventing interference between the cooling pipe and the base 1 and ensuring that cooling water can smoothly enter the copper water-cooled block. This design ensures the normal operation of the cooling system, improves the temperature control stability of the temperature control platform, and provides more reliable temperature conditions for thermal resistance measurement. The second notch on the base 1 avoids the outlet pipe 42, similarly preventing interference between the cooling pipe and the base 1 and ensuring that cooling water can smoothly exit. This design ensures the integrity and efficiency of the cooling system, further improves the temperature control accuracy of the temperature control station, and provides more precise temperature control for thermal resistance measurement.

[0043] As an optional implementation, the cooler 4 is coated with thermally conductive silicone grease for contact with the thermoelectric cooler 3. Thermally conductive silicone grease is a highly thermally conductive filler material that effectively fills the tiny gaps between the cooler 4 and the thermoelectric cooler 3, reducing contact thermal resistance.

[0044] As an optional implementation, the thermoelectric cooler 3 is coated with thermally conductive silicone grease for contact with the placement stage 2. Applying thermally conductive silicone grease to the thermoelectric cooler 3 for contact with the placement stage 2 also fills the tiny gaps between the thermoelectric cooler 3 and the placement stage 2, reducing contact thermal resistance and improving heat transfer efficiency.

[0045] The installation steps for the temperature control panel are as follows:

[0046] The first step is to place the copper water-cooling block on base 1;

[0047] The second step is to apply thermal grease to the copper water-cooled block and place the four semiconductor cooling components 3 on the copper water-cooled block in sequence, ensuring that the hot side is in close contact with the copper water-cooled block.

[0048] The third step is to apply thermal grease to the cold surface of the semiconductor cooling component 3 and then place the top metal mounting platform 2 tightly against the semiconductor cooling component 3.

[0049] The fourth step is to tighten the screws at the four corners to clamp the semiconductor cooling component 3 and the copper water cooling block in the middle.

[0050] Fifth step, connect the water chiller to the copper water cooling block and turn on the water chiller to allow the cooling water to circulate in the water cooling block;

[0051] The sixth step is to power on the semiconductor cooling device 3 to perform cooling or heating.

[0052] This temperature control stage can both cool and heat, and even when the sample is generating significant heat, it can maintain a relatively high surface temperature by using a cooling mode. The specific usage method of the temperature control stage is as follows:

[0053] The sample is placed on the top stage 2, and the top of the semiconductor cooler 3 is heated by passing a reverse current.

[0054] Once the heating temperature has stabilized, the emissivity of the infrared image should be corrected. This step requires the temperature control station to maintain a stable temperature.

[0055] Next, the sample is powered on. At this time, some areas of the sample begin to heat up. For devices with lower power, the temperature control stage can reduce the heating power to ensure the stability of the surface temperature of the temperature control stage. For devices with higher power, it is necessary to pass a positive current to the semiconductor cooling device 3 so that the upper surface begins to cool. In the cooling mode, the surface temperature is maintained at the previous temperature.

[0056] At this point, the infrared microscopy system can measure the temperature of the chip's surface. By measuring the constant temperature of the hot stage surface and the power of the input device, the thermal resistance of the chip can be calculated.

[0057] The aforementioned temperature control stage is characterized by its ability to cool the surface when current is passed in the forward direction and heat the surface when current is passed in the reverse direction. When measuring high-power devices, it is necessary to maintain the high temperature of the surface in the cooling mode in order to avoid the temperature of the temperature control stage surface being raised by the sample itself and affecting the final thermal resistance measurement result.

[0058] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the scope of protection of the present utility model.

Claims

1. A temperature control stage for measuring the thermal resistance of a chip, characterized in that, The temperature control platform includes: Base (1), A placement platform (2) is fixedly connected to the base (1); the upper surface of the placement platform (2) forms a placement surface for placing the chip, and the placement platform (2) is a metal part; The semiconductor cooling element (3) is sandwiched between the base (1) and the placement stage (2) and abuts against the lower surface of the placement stage (2).

2. The temperature control stage for measuring chip thermal resistance according to claim 1, characterized in that, The lower surface of the placement platform (2) is provided with a first positioning groove (11). The shape of the first positioning groove (11) is adapted to the shape of the semiconductor cooling element (3) and is positioned and engaged with the semiconductor cooling element (3). The upper surface of the semiconductor cooling element (3) abuts against the bottom surface of the first positioning groove (11).

3. The temperature control stage for measuring chip thermal resistance according to claim 1, characterized in that, The temperature control platform also includes a fastener, a through hole provided in one of the base (1) and the placement platform (2), and a threaded hole provided in the other of the base (1) and the placement platform (2). The fastener passes through the through hole and engages with the threaded hole to fix the placement platform (2) on the base (1).

4. The temperature control stage for measuring chip thermal resistance according to claim 1, characterized in that, The temperature control platform also includes a cooler (4), which is sandwiched between the semiconductor cooling element (3) and the base (1) and abuts against the semiconductor.

5. A temperature control stage for measuring chip thermal resistance according to claim 4, characterized in that, The upper surface of the base (1) is provided with a second positioning groove (21), the shape of the second positioning groove (21) is adapted to the shape of the cooler (4) and is positioned and engaged with the cooler (4).

6. A temperature control stage for measuring chip thermal resistance according to claim 4, characterized in that, The cooler (4) includes a copper water-cooled block.

7. A temperature control stage for measuring chip thermal resistance according to claim 6, characterized in that, The copper water-cooled block includes a block body and an inlet pipe (41), an outlet pipe (42), and a cooling pipe connected to the inlet pipe (41) and the outlet pipe (42) disposed on the block body; the inlet pipe (41) and the outlet pipe (42) are located on the side of the block body, and the cooling pipe is located inside the block body.

8. A temperature control stage for measuring chip thermal resistance according to claim 7, characterized in that, The inlet pipe (41) and the outlet pipe (42) are located on the same side of the block body; the base (1) is provided with a first notch; the first notch is used to avoid the inlet pipe (41); the base (1) is provided with a second notch; the second notch is used to avoid the outlet pipe (42).

9. A temperature control stage for measuring chip thermal resistance according to claim 4, characterized in that, The cooler (4) is coated with thermally conductive silicone grease for contact with the semiconductor cooling element (3).

10. A temperature control stage for measuring chip thermal resistance according to claim 1, characterized in that, The semiconductor cooling element (3) is coated with thermally conductive silicone grease for contact with the placement stage (2).

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