Optical fiber connector

By using ABS resin plates and a detachable snap-fit ​​structure in the fiber optic connector, the problem of being unable to repair damaged optical fibers has been solved, achieving detachable fixing of optical fibers and high-efficiency production.

CN224232009UActive Publication Date: 2026-05-12SILICONWARE PRECISION IND CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SILICONWARE PRECISION IND CO LTD
Filing Date
2025-05-29
Publication Date
2026-05-12

AI Technical Summary

Technical Problem

现有技术在光纤连接至光晶片时,存在光纤损坏后无法维修导致整体结构报废的问题,同时光纤定位耗时过长导致产量低和成本高。

Method used

The design employs a carrier component and a connector. The carrier component is made of ABS resin sheet, on which the optical fiber is fixed in parallel. The connector is a detachable ABS resin snap-fit ​​structure, which, combined with the groove of the optical fiber wafer, enables the detachable fixing of the optical fiber.

Benefits of technology

实现了光纤的可拆卸维修,提升了每小时产量并降低了成本。

✦ Generated by Eureka AI based on patent content.

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  • Figure CN224232009U_ABST
    Figure CN224232009U_ABST
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Abstract

An optical fiber connector comprises a bearing piece and a connecting piece arranged on the bearing piece, so that a plurality of optical fibers are fixed on the bearing piece, a plurality of grooves are formed in an optical wafer, and then the optical fiber connector can be detachably fixed on the optical wafer through the connecting piece. And meanwhile, the plurality of optical fibers can be positioned in the grooves of the optical wafer in a self-aligning manner, so that the optical fibers can be detached and maintained, and the yield per hour is effectively improved.
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Description

Technical Field

[0001] This application relates to an optical fiber connector, and more particularly to an optical fiber connector used in optical wafers. Background Technology

[0002] With the booming development of portable electronic products in recent years, the development of various related products is also trending towards high density, high performance, and lightweight, thin, short, and small designs. Simultaneously, semiconductor devices are gradually moving towards heterogeneous integration, leading to the rise of 3D multi-chip packaging technology. To improve signal transmission speed between the increasing number of chips and components within semiconductor devices, as well as between semiconductor devices and external circuits or components, optical communication technology has been introduced, using optical fibers as the signal propagation medium in critical signal paths. Among these technologies, co-packaged optics (CPO) technology has become a key technology that the industry has been vigorously developing in recent years.

[0003] Please see Figure 1 In existing manufacturing processes, to bond optical fibers 12 to optical wafers 11, multiple grooves 110 are first formed on the optical wafers 11, and multiple optical fibers 12 are aligned and fixed to the optical wafers 11 by corresponding to the multiple grooves 110. Although this method has a high output per hour, if the optical fiber is damaged, it cannot be replaced and repaired, resulting in the scrapping of the entire structure.

[0004] Please see Figure 2 To address this, the industry has developed another method: integrating multiple optical fibers 22 into a fiber array unit (FAU) 23, then assembling the fiber array unit 23 into a connector 24, using an optical coupler to locate the maximum optical signal value of the optical chip 21, and finally aligning the connector 24 with a laser and securing it to the optical chip 21 with an adhesive layer. While this method allows for fiber replacement and repair by disassembling the fiber array unit when the fiber is damaged, the time spent precisely searching for the position of maximum optical power when positioning the fiber on the optical chip results in extremely low hourly output. Furthermore, the need for a connector to position the fiber on the optical chip increases costs.

[0005] Therefore, how to overcome the various problems of the existing technologies mentioned above has become a pressing issue that the industry urgently needs to address. Utility Model Content

[0006] In view of the various deficiencies of the prior art, this application provides an optical fiber connector that integrates multiple optical fibers to be positioned on an optical wafer, comprising: a carrier, opposing first and second surfaces for fixing the multiple optical fibers to the first surface; and a connector that detachably connects the carrier and the optical wafer, thereby positioning the multiple optical fibers on the optical wafer.

[0007] In the aforementioned fiber optic connector, the carrier is a plate for the plurality of optical fibers to be arranged parallel to each other and fixed on the first surface of the carrier.

[0008] In the aforementioned fiber optic connector, the connector is disposed on the first surface of the carrier.

[0009] In the aforementioned fiber optic connector, the connector includes a first connection component coupled to the first surface of the carrier and a second connection component coupled to the optical wafer.

[0010] In the aforementioned fiber optic connector, the first connecting component and the second connecting component are interlocking concave-convex structures.

[0011] In the aforementioned fiber optic connector, the working surface of the optical chip has a recess for accommodating the second connecting component.

[0012] In the aforementioned fiber optic connector, the working surface of the optical chip has multiple grooves for positioning the multiple optical fibers. These multiple grooves are multiple V-shaped grooves.

[0013] In the aforementioned fiber optic connector, the carrier is an acrylonitrile-butadiene-styrene copolymer (ABS) resin sheet.

[0014] In the aforementioned fiber optic connector, the connector is an acrylonitrile-butadiene-styrene copolymer (ABS) resin snap-fit ​​structure.

[0015] As can be seen from the above, the fiber optic connector of this application includes a carrier and a connector connected to the carrier, so that multiple optical fibers are pre-fixed on the carrier and multiple grooves are pre-formed on the optical wafer. Subsequently, the fiber optic connector can be fixed to the optical wafer in a detachable manner through the connector, and the multiple optical fibers can be self-aligned and positioned in the grooves of the optical wafer without the need for laser alignment through the connector, so as to achieve the purpose of detachable maintenance of optical fibers and effectively increase the production per hour (UPH). Attached Figure Description

[0016] Figure 1 This is a schematic diagram of an existing embodiment of positioning an optical fiber on an optical wafer.

[0017] Figure 2 This is a schematic diagram of another existing embodiment of positioning optical fibers on an optical wafer.

[0018] Figure 3A and Figure 3B This is a planar and cross-sectional schematic diagram of the fiber optic connector of this application.

[0019] Figure 4 This is a schematic diagram illustrating the application of the fiber optic connector in this application.

[0020] Explanation of reference numerals in the attached figures

[0021] 11 Optical chips

[0022] 110 Groove

[0023] 12 optical fibers

[0024] 21 Optical Chips

[0025] 22 optical fibers

[0026] 23 Fiber optic array units

[0027] 24 connectors

[0028] 3 Fiber Optic Connectors

[0029] 31 Load-bearing components

[0030] 31a First Surface

[0031] 31b Second Surface

[0032] 32 Connectors

[0033] 321 First connecting component

[0034] 322 Second connection component

[0035] 4 optical fibers

[0036] 5. Optical wafers

[0037] 5a Working surface

[0038] 50 grooves

[0039] 51 recess

[0040] 61, 62 Adhesive layer. Detailed Implementation

[0041] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0042] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0043] Please see Figure 3A and Figure 3B This is a planar and cross-sectional schematic diagram of the fiber optic connector 3 of this application.

[0044] Please refer to the following at the same time. Figure 4 This is a schematic diagram of the application of the fiber optic connector 3 of this application. The fiber optic connector 3 is used to integrate multiple optical fibers 4 and is detachably positioned on the optical chip 5.

[0045] The fiber optic connector 3 includes a carrier 31 and a connector 32.

[0046] The carrier 31 is, for example, a plate having opposing first surfaces 31a and second surfaces 31b, and the carrier 31 may be made of, for example, ABS (Acrylonitrile Butadiene Styrene) resin plastic material, so that multiple optical fibers 4 can be arranged in parallel and fixed on the first surface 31a of the carrier 31.

[0047] The connector 32 detachably connects the carrier 31 and the optical wafer 5. The connector 32 may be disposed on the first surface 31a of the carrier 31, for example, the connector is an acrylonitrile-butadiene-styrene copolymer (ABS) resin snap-fit ​​structure, for detachably fixing the carrier 31 to the optical wafer 5.

[0048] In this embodiment, the connector 32 includes a first connecting component 321 and a second connecting component 322. The first connecting component 321 and the second connecting component 322 may be interlocking concave-convex structures. The first connecting component 321 (e.g., through an adhesive layer 61) is bonded to the first surface 31a of the carrier 31, and the second connecting component 322 (e.g., through an adhesive layer 62) is bonded to the recess 51 of the optical wafer 5, so that the fiber optic connector 3 can be detachably engaged and fixed to the second connecting component 322 of the optical wafer 5 through the first connecting component 321 disposed on the carrier 31.

[0049] In practical applications, a plurality of V-shaped grooves 50 are pre-formed on one end of the working surface 5a of the optical chip 5, and a recess 51 is provided on the working surface 5a to accommodate the second connecting component 322.

[0050] Multiple optical fibers 4 are provided and fixed to the carrier 31 of the optical fiber connector 3.

[0051] Next, the fiber optic connector 3 is attached to the second connection component 322 of the optical chip 5 using the first connection component 321, and the plurality of optical fibers 4 located on the carrier 31 are respectively self-aligned and positioned in each of the V-shaped grooves 50 of the optical chip 5.

[0052] If any fiber 4 is damaged in the future, the fiber optic connector 3 can be removed from the optical chip 5, and after the damaged fiber 4 is replaced, the fiber optic connector 3 can be reattached to the optical chip 5, and the multiple fibers 4 can be positioned in the V-shaped groove 50 of the optical chip 5.

[0053] In summary, the fiber optic connector of this application includes a carrier and a connector attached to the carrier, so that multiple optical fibers are pre-fixed on the carrier and multiple grooves are pre-formed on the optical wafer. Subsequently, the fiber optic connector can be detachably fixed to the optical wafer through the connector, and the multiple optical fibers can be self-aligned and positioned in the grooves of the optical wafer without the need for laser alignment through the connector, thereby achieving the purpose of detachable maintenance of optical fibers and effectively increasing the production per hour (UPH).

[0054] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.

Claims

1. A fiber optic connector integrating multiple optical fibers for positioning on an optical wafer, characterized in that, include: The carrier has opposing first and second surfaces for fixing the plurality of optical fibers to the first surface; as well as A connector is used to detachably connect the carrier and the optical chip, thereby positioning the multiple optical fibers on the optical chip.

2. The fiber optic connector as described in claim 1, characterized in that, The carrier is a plate for the plurality of optical fibers to be arranged in parallel with each other and fixed on the first surface of the carrier.

3. The fiber optic connector as described in claim 1, characterized in that, The connector is located on the first surface of the carrier.

4. The fiber optic connector as described in claim 1, characterized in that, The connector includes a first connection component attached to the first surface of the carrier and a second connection component attached to the optical wafer.

5. The fiber optic connector as described in claim 4, characterized in that, The first connecting component and the second connecting component are interlocking concave-convex structures.

6. The fiber optic connector as described in claim 4, characterized in that, The working surface of the optical chip has a recess for accommodating the second connecting component.

7. The fiber optic connector as described in claim 1, characterized in that, The working surface of the optical chip has multiple grooves for positioning the multiple optical fibers.

8. The fiber optic connector as described in claim 7, characterized in that, These multiple grooves are multiple V-shaped grooves.

9. The fiber optic connector as described in claim 1, characterized in that, The support component is an acrylonitrile-butadiene-styrene copolymer (ABS) resin sheet.

10. The fiber optic connector as claimed in claim 1, characterized in that, The connector is an acrylonitrile-butadiene-styrene copolymer (ABS) resin interlocking structure.