Bonding apparatus
By sensing the position information of the fiber optic connector and optical chip through a sensing device, and using a six-axis robotic arm to perform precise alignment and confirm the position of maximum optical power, the problem of long alignment time for fiber optic connectors and optical chips is solved, thereby improving production efficiency and capacity.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SILICONWARE PRECISION IND CO LTD
- Filing Date
- 2025-05-30
- Publication Date
- 2026-05-12
AI Technical Summary
In existing technologies, the alignment process between fiber optic connectors and optical chips takes too long, resulting in low production line capacity.
The sensor device detects the position information of the fiber optic connector and optical chip, and the pick-and-place device, such as a six-axis robotic arm, performs precise alignment and engagement. The light-emitting unit is used to confirm the position of maximum optical power.
提高了光耦合效率和对位接合的工作效率，显著提升了生产产能。
Smart Images
Figure CN224232010U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a bonding device, and more particularly to a bonding device for a semiconductor device. Background Technology
[0002] With the booming development of portable electronic products in recent years, the development of various related products is also trending towards high density, high performance, and lightweight, thin, short, and small designs. Simultaneously, semiconductor devices are gradually moving towards heterogeneous integration, leading to the rise of 3D multi-chip packaging technology. To improve signal transmission speed between the increasing number of chips and components within semiconductor devices, as well as between semiconductor devices and external circuits or components, optical communication technology has been introduced, using optical fibers as the signal propagation medium in critical signal paths. Among these technologies, co-packaged optics (CPO) technology has become a key technology that the industry has been vigorously developing in recent years.
[0003] In existing manufacturing processes, when attaching a fiber optic connector to an optical chip, the process involves first roughly locating the chip and then searching for the first light-receiving position in the light-inlet area using a spiral or carpet-like method. Next, the position with the highest optical power is precisely searched, and then the fiber optic connector is glued and fixed to the predetermined installation position illuminated by the light beam.
[0004] However, the aforementioned spiral or carpet-like search for the first light-receiving position often takes too much time, making the alignment operation extremely inefficient and severely dragging down the capacity of the entire production line.
[0005] Therefore, overcoming the various problems of the existing technologies has become a pressing issue that the industry urgently needs to address. Utility Model Content
[0006] In view of the various deficiencies of the prior art, this application provides a bonding device, including: a sensing device for sensing and acquiring position information of the fiber optic connector and the optical chip; and a pick-and-place device for aligning and bonding the fiber optic connector to the optical chip according to the position information.
[0007] This application further provides a bonding method, comprising: providing a bonding device including a sensing device and a pick-and-place device, wherein the sensing device is used to sense and acquire position information of the fiber optic connector and the optical wafer; and the pick-and-place device aligns and bonds the fiber optic connector to the optical wafer according to the position information.
[0008] In the aforementioned bonding device and method, the sensing device includes a plurality of sensing units and at least one processing unit.
[0009] In the aforementioned bonding device and method, the plurality of sensing units are used to sense and acquire position information of at least three surfaces of the fiber optic connector and the optical wafer, respectively.
[0010] In the aforementioned bonding device and method, the processing unit is used to process the position information of the fiber optic connector and the optical chip obtained by the sensing unit, to calculate and obtain the offset angle of the surface of the fiber optic connector to be bonded to the optical chip relative to the horizontal plane, and the offset angle of the surface of the optical chip to be bonded to the fiber optic connector relative to the horizontal plane, and to provide it to the pick-and-place device as alignment information for bonding the fiber optic connector and the optical chip.
[0011] In the aforementioned bonding device and method, the pick-and-place device displaces the fiber optic connector toward the direction of the optical wafer, so that the offset angle of the fiber optic connector is aligned with the offset angle of the optical wafer.
[0012] In the aforementioned joining equipment and method, the pick-and-place device is a six-axis robotic arm.
[0013] In the aforementioned bonding device and method, the pick-and-place device includes a light-emitting unit for emitting a light beam to the optical wafer to determine the position of maximum optical power of the optical wafer.
[0014] In the aforementioned bonding device and method, the light-emitting unit of the pick-and-place device emits a light beam through the fiber optic connector to the optical wafer to confirm the position of maximum optical power of the optical wafer, and the pick-and-place device accordingly bonds the fiber optic connector to the optical wafer.
[0015] As can be seen from the above, this application uses a sensing device to sense the position information of the fiber optic connector and the optical chip respectively, so that the pick-and-place device can quickly and initially position the fiber optic connector to the optical chip based on the position information provided by the sensing device. Then, the light-emitting unit is used to confirm the position of the optical chip with the maximum optical power, so that the pick-and-place device can accurately connect the fiber optic connector to the optical chip, thereby improving the optical coupling efficiency. This can significantly improve the working efficiency of alignment and bonding, and effectively increase production capacity. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the joining device of this application.
[0017] Figure 2 This is a flowchart illustrating the joining method of this application.
[0018] Figure 3 This is a schematic diagram illustrating the implementation of the joining device in this application.
[0019] Explanation of reference numerals in the attached figures
[0020] 1. Joining equipment
[0021] 11. Sensing Device
[0022] 111 Sensing Units
[0023] 112 Processing Units
[0024] 12 Pick-up and Placement Device
[0025] 120 light-emitting units
[0026] 2 Fiber Optic Connectors
[0027] 3. Optical wafer
[0028] 30 gratings
[0029] b beam
[0030] Steps S1 to S3. Detailed Implementation
[0031] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.
[0032] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, terms such as "above," "below," "one," "first," and "second" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.
[0033] Please see Figure 1 This is a schematic diagram of the bonding device 1 of this application. The bonding device includes a sensing device 11 and a pick-and-place device 12 for aligning and bonding the fiber optic connector 2 to the optical wafer 3. The optical wafer 3 is, for example, an optical engine die (OE die) or a photonic integrated circuit (PIC), and the fiber optic connector 2 is, for example, a fiber optic array unit (FAU).
[0034] The sensing device 11 is used to sense the fiber optic connector 2 and the optical chip 3, and obtain relevant position information of the fiber optic connector 2 and the optical chip 3 in space. For example, the picking and placing device 12 connects the fiber optic connector 2 to the optical chip 3 according to the position information obtained by the sensing device 11. That is, the position information of the fiber optic connector 2 and the optical chip 3 detected by the sensing device 11 is used to move the fiber optic connector 2 so that the fiber optic connector 2 can be accurately aligned and connected with the optical chip 3, thereby improving the optical coupling efficiency.
[0035] In this embodiment, the sensing device 11 includes a plurality of sensing units 111 and at least one processing unit 112.
[0036] The sensing unit 111 is, for example, a laser sensor, used to sense and acquire multiple position information of the fiber optic connector 2, such as sensing and acquiring position information of at least three surfaces of the fiber optic connector 2 (e.g., position information of the upper surface, lower surface and side surface), and sensing and acquiring multiple position information of the optical wafer 3, such as sensing and acquiring position information of at least three surfaces of the optical wafer 3 (e.g., position information of the upper surface, lower surface and side surface).
[0037] The processing unit 112 is used to process the position information of the fiber optic connector 2 and the optical wafer 3 obtained by the sensing unit 111, such as calculating and obtaining the offset angle of the surface of the fiber optic connector 2 to be joined to the optical wafer 3 relative to the horizontal plane, and the offset angle of the surface of the optical wafer 3 to be joined to the fiber optic connector 2 relative to the horizontal plane, and providing it to the pick-and-place device 12 as alignment information for joining the fiber optic connector 2 and the optical wafer 3.
[0038] The pick-and-place device 12 is, for example, a six-axis robotic arm that can translate and rotate on three mutually perpendicular coordinate axes: the longitudinal axis (front and back), the transverse axis (left and right), and the vertical axis (up and down).
[0039] Furthermore, the pick-and-place device 12 includes a light-emitting unit 120 (e.g., a laser light source) to determine the position of maximum optical power of the optical chip 3. When the pick-and-place device 12 picks up the fiber optic connector 2, the light-emitting unit 120 emits a light beam to the optical chip 3 to determine the position of maximum optical power of the optical chip 3, that is, the position of the corresponding grating in the optical chip 3.
[0040] Please refer to the following at the same time. Figure 2 This is a flowchart of the joining method of this application. The joining method includes steps S1 to S3.
[0041] In step S1, the position information of the optical chip 3 and the optical fiber connector 2 is sensed by the multiple sensing units 111 (such as multiple laser sensors) of the sensing device 11, and the processing unit 112 of the sensing device 11 obtains the offset angle of the optical chip 3 relative to the horizontal position (as a positioning reference) and the offset angle of the optical fiber connector 2 relative to the horizontal position, and other related alignment information, based on the position information.
[0042] In step S2, preliminary positioning is performed. Based on the alignment information of the optical chip 3 and the optical fiber connector 2 obtained by the sensing device 11, the pick-and-place device 12 moves the optical fiber connector 2 toward the direction of the optical chip 3, so that the offset angle of the optical fiber connector 2 is aligned with the offset angle of the optical chip 3, thereby initially positioning the optical fiber connector 2 and the optical chip 3.
[0043] In step S3, detailed positioning and joining operations are performed. Please refer to the following document for further information. Figure 3 The light-emitting unit 120 of the pick-and-place device 12 emits a light beam b (e.g., a laser beam) through the fiber optic connector 2 to the optical chip 3 (the fiber optic connector 2 is made of a light-transmitting material) to confirm the position of maximum optical power of the optical chip 3 (the position of the grating 30). Then, the pick-and-place device 12 connects the fiber optic connector 2 to the optical chip 3 accordingly, and the fiber optic connector 2 can be fixed to the optical chip 3 through an adhesive layer (e.g., UV adhesive).
[0044] In summary, this application uses a sensing device to sense the position information of the fiber optic connector and the optical chip respectively, so that the pick-and-place device can quickly and initially position the fiber optic connector to the optical chip based on the position information provided by the sensing device. Then, the light-emitting unit is used to confirm the position of the optical chip with the maximum optical power, so that the pick-and-place device can accurately connect the fiber optic connector to the optical chip, thereby improving the optical coupling efficiency. This can significantly improve the efficiency of alignment and bonding and effectively increase production capacity.
[0045] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.
Claims
1. A bonding device for bonding fiber optic connectors to an optical wafer, characterized in that, include: A sensing device for sensing and acquiring position information of the fiber optic connector and the optical chip; as well as A pick-and-place device is used to align and attach the fiber optic connector to the optical wafer based on the position information.
2. The joining device as claimed in claim 1, characterized in that, The sensing device includes multiple sensing units and at least one processing unit.
3. The joining device as described in claim 2, characterized in that, The multiple sensing units are used to sense and acquire position information of at least three surfaces of the fiber optic connector and the optical wafer, respectively.
4. The joining device as described in claim 3, characterized in that, The processing unit is used to process the position information of the fiber optic connector and the optical chip obtained by the sensing unit, to calculate and obtain the offset angle of the surface of the fiber optic connector to be joined to the optical chip relative to the horizontal plane, and the offset angle of the surface of the optical chip to be joined to the fiber optic connector relative to the horizontal plane, thereby providing the pick-and-place device as alignment information for joining the fiber optic connector and the optical chip.
5. The joining device as claimed in claim 1, characterized in that, The pick-and-place device is a six-axis robotic arm.
6. The joining device as claimed in claim 1, characterized in that, The pick-and-place device includes a light-emitting unit for emitting a light beam to the optical chip to determine the position of maximum optical power of the optical chip.