Radiator capable of improving heat dissipation efficiency
By employing a V-shaped fin structure with composite coil sections and a copper-aluminum coil design in the heat pipe radiator, the problem of insufficient performance of existing heat pipe radiators is solved, achieving efficient heat transfer and structural strength, making it suitable for high-end electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN XIANGRONG PRECISION HARDWARE CO LTD
- Filing Date
- 2025-04-08
- Publication Date
- 2026-05-12
AI Technical Summary
Existing heat pipe radiators have low heat dissipation efficiency and cannot meet the needs of high-end electronic devices.
The V-shaped fin structure of the composite coil section is adopted, with a thickness ratio of 3:7 for copper coil layer and aluminum coil layer. By utilizing the high thermal conductivity of copper and the high heat dissipation of aluminum, combined with the design of heat pipe, heat dissipation plate and heat dissipation fins, a highly efficient heat transfer cycle is formed.
It improves heat dissipation efficiency, enhances structural strength and heat transfer performance, and reduces the impact of heat sources on ambient temperature in a small range, making it suitable for high-end products.
Smart Images

Figure CN224234021U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of radiators, and more particularly to a radiator that improves heat dissipation efficiency. Background Technology
[0002] Heat sinks are widely used in electronic devices to dissipate heat, reduce the temperature of electronic devices, and maintain their normal operation. Common heat sinks include air-cooled heat sinks, heat pipe heat sinks, and water-cooled heat sinks. Among them, heat pipe heat sinks are heat transfer elements with extremely high thermal conductivity. They transfer heat through the evaporation and condensation of liquid in a fully enclosed vacuum tube, combining the advantages of air cooling and heat pipes, and have extremely high heat dissipation performance. However, conventional heat pipe heat sinks have low heat dissipation efficiency and cannot meet the needs of current electronic devices. Utility Model Content
[0003] One objective of this utility model is to provide a radiator that improves heat dissipation efficiency, increases heat dissipation capacity, enhances efficiency, provides an option for high-end products, and has promotional value.
[0004] To achieve this objective, the present invention adopts the following technical solution:
[0005] A heat sink with improved heat dissipation efficiency includes a heat pipe, a heat spreader, and heat dissipation fins. The heat dissipation fins are provided with a first V-shaped fin and a second V-shaped fin, both of which have a V-shaped airflow guide shape. The second V-shaped fin is provided with a composite coil section, which is provided with an aluminum coil layer and a copper coil layer. The copper coil layer is attached to the heat pipe, and the aluminum coil layer is located on the side of the copper coil layer away from the heat pipe. The heat pipe connects the heat spreader and the heat dissipation fins. The lower end of the heat spreader is provided with a boss, which is attached to a heat source.
[0006] As a preferred technical solution, the thickness ratio of the copper layer to the aluminum layer is 3:7.
[0007] As a preferred technical solution, stainless steel columns are pre-embedded inside both the first V-shaped fin and the second V-shaped fin.
[0008] As a preferred technical solution, the heat pipe includes a shell, an inner wick, and a working fluid. The wick is installed inside the shell, and the working fluid flows on the wick.
[0009] As a preferred technical solution, the upper end of the heat spreader is provided with a rectangular boss and a limiting groove, the rectangular boss and the limiting groove are spaced apart, the middle part of the heat pipe is fitted into the rectangular boss or the limiting groove, and the end of the heat pipe passes through the first V-shaped fin or the second V-shaped fin.
[0010] As a preferred technical solution, the heat spreader includes a copper column, a top cover, a bottom cover, and an inner liquid absorbent core. The edge of the top cover is in close contact with the edge of the bottom cover, the inner liquid absorbent core is located inside the space between the top cover and the bottom cover, and the copper column passes through the inner liquid absorbent core.
[0011] As a preferred technical solution, a base plate is provided below the heat spreader, and the boss on the plate is located in the middle of the base plate.
[0012] The beneficial effects of this utility model are as follows: It provides a heat sink with improved heat dissipation efficiency. The heat sink with improved heat dissipation efficiency includes heat pipes, heat spreaders, fins with composite coil sections and V-shaped air guide structures. The combined structure improves heat dissipation capacity, has better heat transfer performance, ensures structural strength and performance, makes full use of the physical characteristics of heat dissipation, reduces the impact of heat sources on small-scale ambient temperatures, and provides an optimal solution for high-end products. Attached Figure Description
[0013] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.
[0014] Figure 1 This is a schematic diagram of the overall structure of a heat sink for improving heat dissipation efficiency as described in the embodiment.
[0015] Figure 2 This is an exploded view of a heat sink with improved heat dissipation efficiency as described in the embodiment.
[0016] Figure 3 This is a diagram showing the placement of the heat pipes, heat spreader, stainless steel columns, and base plate as described in the embodiment.
[0017] Figure 4 This is a three-dimensional structural diagram of the heat spreader described in the embodiment;
[0018] Figure 5 This is an exploded view of the heat spreader described in the embodiment;
[0019] Figure 6 This is a cross-sectional view of the heat spreader described in the embodiment.
[0020] Figures 1 to 6 middle:
[0021] 1. Heat pipe; 2. Heat spreader; 3. First V-shaped fin; 4. Second V-shaped fin; 5. Boss on plate; 6. Stainless steel column; 7. Rectangular boss; 8. Limiting groove; 9. Copper column; 10. Top cover; 11. Bottom cover; 12. Liquid absorbent core inside the plate; 13. Base plate. Detailed Implementation
[0022] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.
[0023] like Figures 1 to 6 As shown in this embodiment, a heat sink for improving heat dissipation efficiency includes a heat pipe 1, a heat spreader 2, and heat dissipation fins. The heat dissipation fins are provided with a first V-shaped fin 3 and a second V-shaped fin 4. Both the first V-shaped fin 3 and the second V-shaped fin 4 have a V-shaped air guiding shape. The second V-shaped fin 4 is provided with a composite coil section, which is provided with an aluminum coil layer and a copper coil layer. The copper coil layer is attached to the heat pipe 1, and the aluminum coil layer is located on the side of the copper coil layer away from the heat pipe 1. The heat pipe 1 connects the heat spreader 2 and the heat dissipation fins. The lower end of the heat spreader 2 is provided with a boss 5 on the plate, which is attached to a heat source.
[0024] The material is made of aluminum and copper coils rolled together, with a thickness ratio of 3:7. This fully utilizes the high thermal conductivity of copper and the high heat dissipation properties of aluminum. The side in contact with heat pipe 1 is copper, and the other side is aluminum, resulting in higher heat dissipation efficiency than pure copper or pure aluminum. In addition, the V-shaped heat dissipation fins guide the hot airflow along the top of the V, keeping the hot airflow away from the central heat source and reducing the impact on the ambient temperature of the heat source. The fins are spread out at a distance from the heat source, and the spread is longer at a distance from the heat source, allowing more material to efficiently dissipate heat in the first instance, which helps to reduce the heat flux density of the heat source.
[0025] Both the first V-shaped fin 3 and the second V-shaped fin 4 have stainless steel pillars 6 pre-set inside. The servo cylinder controls the punching and bending to ensure that the holes of the inclined heat pipe 1 are on the same straight line. The inner wall of the heat pipe 1 hole of the heat dissipation fin is made of copper, which quickly conducts the heat energy of the heat pipe 1 to the aluminum plate and further locations.
[0026] Heat pipe 1 includes a shell, an inner wick, and a working fluid. The wick is installed inside the shell, and the working fluid flows on the wick. One end of heat pipe 1 is the evaporation section, and the other end is the condensation section. When one end of heat pipe 1 is heated, the working fluid evaporates and vaporizes within the capillary structure of the wick. The vapor flows to the other end of heat pipe 1 under a small pressure difference, releasing heat and being discharged through the heat dissipation fins. At the same time, the liquid condenses back inside heat pipe 1 and flows back to the evaporation section through the capillary structure of the porous material. This cycle continues to dissipate heat.
[0027] The upper end of the heat spreader 2 is provided with a rectangular boss 7 and a limiting groove 8. The rectangular boss 7 and the limiting groove 8 are distributed at intervals. The middle part of the heat pipe 1 is fitted on the rectangular boss 7 or in the limiting groove 8. The end of the heat pipe 1 passes through the first V-shaped fin 3 or the second V-shaped fin 4. Half of the heat pipe 1 is fitted with the heat spreader 2 in the form of a circular tube, which does not require flattening, reduces damage inside the heat pipe 1, and improves heat transfer performance. The intermediate spaced plane is less difficult to form than the continuous semi-circular tube, which helps to ensure manufacturability and yield. At the same time, it provides a stable plane for the copper pillars 9 to be arranged inside the heat spreader 2, ensuring the strength and performance of the heat spreader 2.
[0028] The heat spreader 2 includes a copper column 9, a top cover 10, a bottom cover 11, and an internal liquid absorber 12. The edges of the top cover 10 and the bottom cover 11 are tightly sealed. The internal liquid absorber 12 is located inside between the top cover 10 and the bottom cover 11. The copper column 9 passes through the internal liquid absorber 12. The internal space between the top cover 10 and the bottom cover 11 is supported by the copper column 9. The capillary structure of the internal liquid absorber 12, formed by sintering several layers of copper mesh, allows pure water to be injected to form a two-phase fluid device. Heat energy enters the heat spreader 2 by conduction. The water cup at the heat source absorbs heat and vaporizes into steam, carrying away the heat energy. Utilizing the latent heat of water vapor, it diffuses from the high-pressure area to the low-pressure area. After contacting the low-temperature inner wall, it condenses back into liquid and releases heat energy. The condensed water flows back to the heat source by the capillary action of the internal liquid absorber 12, forming a heat transfer cycle.
[0029] A base plate 13 is provided below the heat spreader 2. A boss 5 on the plate is located in the middle of the base plate 13. The boss 5 on the plate is in contact with the heat source, and it is easier to ensure flatness in a small area.
[0030] During soldering, the contact surfaces are pre-applied with solder paste evenly. The base plate 13 is placed into the positioning slot of the soldering fixture, and then the heat pipe 1 with heat dissipation fins is placed on the heat spreader 2 on the top. The heat pipes are then soldered into a whole.
[0031] It should be stated that the above specific embodiments are merely preferred embodiments of this utility model and the technical principles used therein. Within the scope of the technology disclosed in this utility model, any changes or substitutions that are easily conceived by those skilled in the art should be covered within the protection scope of this utility model.
Claims
1. A radiator for improving heat dissipation efficiency, characterized in that, The device includes a heat pipe, a heat spreader, and heat dissipation fins. The heat dissipation fins are provided with a first V-shaped fin and a second V-shaped fin, both of which have a V-shaped airflow guide shape. The second V-shaped fin is provided with a composite coil section, which is provided with an aluminum coil layer and a copper coil layer. The copper coil layer is attached to the heat pipe, and the aluminum coil layer is located on the side of the copper coil layer away from the heat pipe. The heat pipe connects the heat spreader and the heat dissipation fins. The lower end of the heat spreader is provided with a boss, which is attached to a heat source.
2. The radiator for improving heat dissipation efficiency according to claim 1, characterized in that, The thickness ratio of the copper layer to the aluminum layer is 3:
7.
3. A radiator for improving heat dissipation efficiency according to claim 1, characterized in that, Both the first V-shaped fin and the second V-shaped fin have pre-embedded stainless steel pillars inside.
4. A radiator for improving heat dissipation efficiency according to claim 1, characterized in that, The heat pipe includes a shell, an inner wick, and a working fluid. The wick is installed inside the shell, and the working fluid flows on the wick.
5. A radiator for improving heat dissipation efficiency according to claim 1, characterized in that, The upper end of the heat spreader is provided with a rectangular boss and a limiting groove. The rectangular boss and the limiting groove are spaced apart. The middle part of the heat pipe fits into the rectangular boss or the limiting groove. The end of the heat pipe passes through the first V-shaped fin or the second V-shaped fin.
6. A radiator for improving heat dissipation efficiency according to claim 1, characterized in that, The heat spreader includes a copper column, a top cover, a bottom cover, and an internal liquid absorption core. The edge of the top cover is in close contact with the edge of the bottom cover. The internal liquid absorption core is located inside the space between the top cover and the bottom cover. The copper column passes through the internal liquid absorption core.
7. A radiator for improving heat dissipation efficiency according to claim 1, characterized in that, A base plate is provided below the heat spreader, and a boss on the plate is located in the middle of the base plate.