Backlight module
By setting a heat insulation layer and a diffusion film between the quantum dot device and the light-emitting element, the problem of shortened lifespan of quantum dot materials under high temperature environment is solved, and the color gamut of the backlight module and the display quality are improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUIZHOU VISION NEW TECH CO LTD
- Filing Date
- 2025-04-08
- Publication Date
- 2026-05-12
AI Technical Summary
量子点材料在LED光源的高温环境下使用寿命缩短，影响显示设备的可靠性。
A heat insulation layer, such as aerogel, is placed between the quantum dot device and the light-emitting element to reduce the impact of heat, and a diffusion film is used to improve the uniformity of light.
It extends the lifespan of quantum dot devices, improves the color gamut of backlight modules and the display quality and reliability of display devices, and reduces production costs.
Smart Images
Figure CN224234099U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display, and in particular to a light-emitting device and a backlight module. Background Technology
[0002] Currently, with the rapid development of technology, from small calculators, monitors, and home LCD TVs to various advertising machines and large splicing displays, display devices are needed in more and more occasions in people's lives. Display devices with high brightness, high brightness uniformity, high reliability, and high color gamut are what users need, especially those users in advertising and film and television displays who have special requirements for image quality. This is also the goal that enterprises must continuously achieve in order to meet user needs.
[0003] Quantum dot materials, with their broad excitation spectrum, narrow emission spectrum, high color purity, and good photostability, are used in display devices to effectively improve the color gamut and make the display more vibrant and appealing. However, because quantum dot materials are placed close to the LED light source, the temperature of the LED light source will rise during the use of the display device. High temperatures can affect the lifespan of the quantum dot materials, leading to a decrease in the reliability of the display device. Utility Model Content
[0004] Based on this, embodiments of this application provide a light-emitting device and a backlight module.
[0005] In a first aspect, embodiments of this application provide a light-emitting device, including a first support, a first light-emitting element, a heat insulation layer, and a quantum dot device. The first light-emitting element is mounted on the first support, and the heat insulation layer is disposed between the first light-emitting element and the quantum dot device.
[0006] In some embodiments, the material of the insulation layer is aerogel; and / or,
[0007] The upper and / or lower surfaces of the heat insulation layer are provided with an uneven structure to diffuse light; and / or,
[0008] A first diffusion film is provided between the quantum dot device and the heat insulation layer; and / or,
[0009] The quantum dot device has a second diffusion film on the side opposite to the heat insulation layer.
[0010] In some embodiments, the quantum dot device includes a first cover plate and a second cover plate disposed opposite to each other, and a quantum dot adhesive layer disposed between the first cover plate and the second cover plate; and / or,
[0011] The first bracket includes a first base plate and a first side plate connected together, the first base plate and the first side plate together enclosing a first accommodating space, the light-emitting device is disposed in the first accommodating space, the heat insulation layer is disposed on the light-emitting device and the first side plate, and the heat insulation layer covers the upper surface of the light-emitting device.
[0012] In some embodiments, the first light-emitting element is an LED chip; and / or,
[0013] The first light-emitting element includes a first body and a first pin and a second pin connected to the first body. The first bracket is provided with a first connector and a second connector spaced apart. The first pin and the first connector are electrically connected, and the second pin and the second connector are electrically connected.
[0014] Secondly, embodiments of this application provide a backlight module, including the light-emitting device described above.
[0015] In some embodiments, the backlight module further includes a second light-emitting component, the second light-emitting component including a second bracket, a second light-emitting element and a fluorescent adhesive layer, the second light-emitting element being mounted on the second bracket, and the fluorescent adhesive layer being disposed on the light-emitting side of the second light-emitting element.
[0016] In some embodiments, the second light-emitting element is an LED chip; and / or,
[0017] The second light-emitting element includes a second body and a third pin and a fourth pin connected to the second body. The first bracket is provided with a third connector and a fourth connector spaced apart. The third pin and the third connector are electrically connected, and the fourth pin and the fourth connector are electrically connected.
[0018] In some embodiments, the second bracket includes a second base plate and a second side plate connected together, the second base plate and the second side plate together enclosing a second accommodating space, the fluorescent adhesive layer and the second light-emitting component are both disposed in the second accommodating space, and the upper surface of the fluorescent adhesive layer is flush with or lower than the top surface of the second side plate.
[0019] In some embodiments, a third diffusion film is provided between the fluorescent adhesive layer and the second light-emitting element; and / or,
[0020] The fluorescent adhesive layer has a fourth diffusion film on the side opposite to the second light-emitting element.
[0021] In some embodiments, the backlight module further includes a support plate, and the light-emitting device and the second light-emitting component are both disposed on the support plate;
[0022] The backlight module contains multiple light-emitting devices and multiple second light-emitting components. The multiple light-emitting devices and multiple second light-emitting components are arranged in several rows in a first direction and in several columns in a second direction on the support plate. In each row, the light-emitting devices and the second light-emitting components are alternately arranged, and in each column, the light-emitting devices and the second light-emitting components are alternately arranged.
[0023] The light-emitting device provided in this application embodiment, by setting a heat insulation layer between the first light-emitting element and the quantum dot device, can use the heat insulation layer to isolate or reduce the impact of the heat generated by the first light-emitting element on the quantum dot device, thereby extending the service life of the quantum dot device. Therefore, it can improve the color gamut and service life of the backlight module containing the light-emitting device, thereby improving the display quality and reliability of the display device. Attached Figure Description
[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below.
[0025] Figure 1 This is a schematic diagram of the structure of the light-emitting device provided in the embodiments of this application.
[0026] Figure 2 This is a schematic diagram of the structure of the second light-emitting component provided in an embodiment of this application.
[0027] Figure 3 This is a top view of the backlight module provided in an embodiment of this application.
[0028] Component symbol explanation:
[0029] 100. Backlight module; 20. Light-emitting device; 21. First bracket; 211. First base plate; 212. First side plate; 213. First accommodating space; 22. First light-emitting element; 221. First body; 222. First pin; 223. Second pin; 23. Heat insulation layer; 24. Quantum dot device; 30. Second light-emitting component; 31. Second bracket; 311. Second base plate; 312. Second side plate; 313. Second accommodating space; 32. Second light-emitting element; 321. Second body; 322. Third pin; 323. Fourth pin; 33. Phosphor adhesive layer; 40. Support plate; X, first direction; Y, second direction. Detailed Implementation
[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.
[0031] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0032] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0033] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0034] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0035] Please see Figure 1 This application provides a light-emitting device 20, including a first support 21, a first light-emitting element 22, a heat insulation layer 23, and a quantum dot device 24. The first light-emitting element 22 is mounted on the first support 21, and the heat insulation layer 23 is disposed between the first light-emitting element 22 and the quantum dot device 24.
[0036] For example, the light emitted by the first light-emitting element 22 is blue light, and the quantum dot device 24 includes red quantum dots and green quantum dots. After the light emitted by the first light-emitting element 22 passes through the quantum dot device 24, the blue light mixes with the red and green light emitted by the quantum dot device 24 to form white light, that is, the emitted light of the light-emitting device 20 is white light.
[0037] The light-emitting device 20 provided in this application embodiment can isolate or reduce the impact of the heat generated by the first light-emitting element 22 on the quantum dot device 24 by providing a heat insulation layer 23 between the first light-emitting element 22 and the quantum dot device 24, thereby extending the service life of the quantum dot device 24. Therefore, the color gamut and service life of the backlight module 100 containing the light-emitting device 20 can be improved, thereby improving the display quality and reliability of the display device.
[0038] For example, the material of the heat insulation layer 23 is aerogel.
[0039] As can be understood, aerogel is a lightweight nanomaterial composed of colloidal particles or polymer molecules aggregated into a nanoporous network structure, with gaseous dispersion medium filling the pores. It has unique properties such as extremely low density, high specific surface area, and low thermal conductivity.
[0040] For example, the aerogel is an inorganic aerogel, an organic aerogel, or an organic-inorganic hybrid aerogel.
[0041] For example, the inorganic aerogel may be an oxide aerogel or an elemental aerogel.
[0042] For example, the oxide aerogel is SiO2 aerogel, Al2O3 aerogel, TiO2 aerogel or ZrO2 aerogel.
[0043] For example, the elemental aerogel is a carbon aerogel, a graphene aerogel, or a metal aerogel, and the metal in the metal aerogel can be gold or copper.
[0044] For example, the sulfide aerogel may be a sulfide metal compound aerogel.
[0045] For example, the organic aerogel may be a phenolic aerogel, resorcinol-formaldehyde aerogel, cellulose aerogel, or polystyrene aerogel.
[0046] For example, the organic-inorganic hybrid aerogel may be a silica-phenolic hybrid aerogel, a titanium dioxide-cellulose hybrid aerogel, a zinc oxide-resorcinol-formaldehyde hybrid aerogel, or a montmorillonite-polystyrene hybrid aerogel.
[0047] In some embodiments, the upper and / or lower surfaces of the heat insulation layer 23 are provided with an uneven structure (not shown) to diffuse light and improve the light emission uniformity of the backlight module 100.
[0048] In some embodiments, a first diffusion film (not shown) is provided between the quantum dot device 24 and the heat insulation layer 23, and / or a second diffusion film (not shown) is provided on the side of the quantum dot device 24 away from the heat insulation layer 23, so as to diffuse the light and improve the light output uniformity of the backlight module 100.
[0049] For example, both the first and second diffusion films include a base layer, a diffusion layer, and a protective layer stacked sequentially. The base layer is a supporting structure that provides mechanical properties; the diffusion layer is the core component, containing multiple tiny scattering particles or having special optical structures, such as micron-sized columnar structures or spherical particles. These scattering particles or optical structures enable light to be scattered multiple times within the diffusion film, thereby achieving uniform light diffusion; the protective layer is used to protect the surface of the diffusion film, preventing scratches, contamination, etc., and improving the durability of the film.
[0050] For example, the quantum dot device 24 includes a first cover plate and a second cover plate disposed opposite to each other, and a quantum dot adhesive layer disposed between the first cover plate and the second cover plate.
[0051] For example, both the first cover plate and the second cover plate can be glass plates. The first cover plate and the second cover plate can be encapsulated by welding to seal the quantum dot adhesive layer. Alternatively, the first cover plate and the second cover plate can be encapsulated by a frame adhesive, with the quantum dot adhesive layer disposed inside the frame adhesive. The frame adhesive is made of water and oxygen barrier adhesive.
[0052] In other embodiments, both the first cover plate and the second cover plate may be plastic sheets, and the material of the plastic sheets may be PET (polyethylene terephthalate), PS (polystyrene), PMMA (acrylic resin) or MS (polymer synthesized from polymethyl methacrylate and styrene as the main raw materials).
[0053] For example, the first light-emitting element 22 is an LED (Light Emitting Diode) chip. For example, the LED chip can be a standard chip, a flip chip, or a vertical chip.
[0054] Please see Figure 1 The first light-emitting element 22 includes a first body 221 and a first pin 222 and a second pin 223 connected to the first body 221. The first bracket 21 is provided with a first connector (not shown) and a second connector (not shown) spaced apart. The first pin 222 and the first connector are electrically connected, and the second pin 223 and the second connector are electrically connected.
[0055] For example, one of the first pin 222 and the second pin 223 is a positive pin and the other is a negative pin.
[0056] For example, both the first connector and the second connector can be solder pads.
[0057] Please see Figure 1 The first bracket 21 includes a first base plate 211 and a first side plate 212 connected together. The first base plate 211 and the first side plate 212 together enclose a first accommodating space 213. The light-emitting device 20 is disposed in the first accommodating space 213. The heat insulation layer 23 is disposed on the light-emitting device 20 and the first side plate 212, and the heat insulation layer 23 covers the upper surface of the light-emitting device 20.
[0058] Please see Figure 1 and Figure 3 This application embodiment also provides a backlight module 100, including the light-emitting device 20 as described above.
[0059] For example, the backlight module 100 can be a direct-lit backlight module or an edge-lit backlight module.
[0060] Please see Figure 2 and Figure 3 The backlight module 100 further includes a second light-emitting component 30, which includes a second bracket 31, a second light-emitting element 32, and a fluorescent adhesive layer 33. The second light-emitting element 32 is mounted on the second bracket 31, and the fluorescent adhesive layer 33 is disposed on the light-emitting side of the second light-emitting element 32.
[0061] For example, the fluorescent adhesive layer 33 is made of a mixture of fluorescent powder and adhesive.
[0062] For example, the light emitted by the second light-emitting element 32 is blue light, and the fluorescent adhesive layer 33 contains red phosphor and green phosphor, or the fluorescent adhesive layer 33 contains yellow phosphor. After the light emitted by the second light-emitting element 32 passes through the fluorescent adhesive layer 33, the blue light mixes with the red and green light emitted by the fluorescent adhesive layer 33 to form white light, or the blue light mixes with the yellow light emitted by the fluorescent adhesive layer 33 to form white light, that is, the emitted light of the second light-emitting component 30 is white light.
[0063] It is understood that the light-emitting device 20 is a quantum dot LED, and the second light-emitting component 30 is a phosphor-converting LED. This application combines quantum dot LEDs and phosphor-converting LEDs. When the display device displays a low-brightness image, the light-emitting device 20 can be selectively used, thereby utilizing the high color gamut performance of quantum dots to improve the display quality of the display device. In addition, the LED current is relatively small at this time, which will not cause the LED temperature to be too high, thus reducing the risk of QD failure. When the display device displays a high-brightness image, the second light-emitting component 30 can be selectively used. At this time, the LED current is larger, and the LED temperature is relatively higher. Since the light-emitting device 20 (quantum dot LED) is not activated at this time, the risk of QD failure can be avoided.
[0064] Furthermore, by combining quantum dot LEDs and phosphor-converted LEDs, the amount of quantum dot material used in the backlight module can be reduced by more than 50%, thereby significantly reducing the production cost of the backlight module.
[0065] For example, the second light-emitting element 32 is an LED chip. For example, the LED chip can be a standard chip, a flip chip, or a vertical chip.
[0066] Please see Figure 2 The second light-emitting element 32 includes a second body 321 and a third pin 322 and a fourth pin 323 connected to the second body 321. The second bracket 31 is provided with a third connector (not shown) and a fourth connector (not shown) spaced apart. The third pin 322 and the third connector are electrically connected, and the fourth pin 323 and the fourth connector are electrically connected.
[0067] For example, one of the third pin 322 and the fourth pin 323 is a positive pin and the other is a negative pin.
[0068] For example, both the third and fourth connectors can be solder pads.
[0069] Please see Figure 2The second bracket 31 includes a second base plate 311 and a second side plate 312 connected together. The second base plate 311 and the second side plate 312 together enclose a second accommodating space 313. The fluorescent adhesive layer 33 and the second light-emitting component 30 are both disposed in the second accommodating space 313. The upper surface of the fluorescent adhesive layer 33 is flush with or lower than the top surface of the second side plate 312.
[0070] In some embodiments, a third diffusion film (not shown) is provided between the fluorescent adhesive layer 33 and the second light-emitting element 32, and / or a fourth diffusion film (not shown) is provided on the side of the fluorescent adhesive layer 33 away from the second light-emitting element 32, so as to diffuse the light and improve the light emission uniformity of the backlight module 100.
[0071] For example, both the third and fourth diffusion films include a base layer, a diffusion layer, and a protective layer stacked sequentially. The base layer is a supporting structure that provides mechanical properties; the diffusion layer is the core component, containing multiple tiny scattering particles or having special optical structures, such as micron-sized columnar structures or spherical particles. These scattering particles or optical structures enable light to be scattered multiple times within the diffusion film, thereby achieving uniform light diffusion; the protective layer is used to protect the surface of the diffusion film, preventing scratches, contamination, etc., and improving the durability of the film.
[0072] Please see Figure 3 The backlight module 100 also includes a support plate 40, and the light-emitting device 20 and the second light-emitting component 30 are both disposed on the support plate 40.
[0073] For example, the support plate 40 is a circuit board, such as a PCB board.
[0074] Please see Figure 3 In the backlight module 100, there are multiple light-emitting devices 20 and multiple second light-emitting components 30. The multiple light-emitting devices 20 and multiple second light-emitting components 30 are arranged in rows in the first direction X and in columns in the second direction Y on the support plate 40. In each row, the light-emitting devices 20 and the second light-emitting components 30 are alternately arranged. In each column, the light-emitting devices 20 and the second light-emitting components 30 are alternately arranged.
[0075] It is understood that the first direction X and the second direction Y are not parallel; in some embodiments, the first direction X and the second direction Y are perpendicular to each other.
[0076] It is understandable that by alternating the arrangement of the light-emitting device 20 and the second light-emitting component 30 in both the first direction X and the second direction Y, that is, by uniformly distributing the light-emitting device 20 and the second light-emitting component 30 on the support plate 40, the backlight module 100 can have good light emission uniformity when selectively using the light-emitting device 20 or the second light-emitting component 30 to emit light.
[0077] This application also provides a display device, including the backlight module 100 in any of the above embodiments.
[0078] For example, the display device can be a terminal such as a television, computer monitor, mobile phone, or tablet computer, or it can be a device with a display screen such as a gaming device, augmented reality (AR) device, virtual reality (VR) device, data storage device, audio playback device, video playback device, or wearable device. Wearable devices can be smart bracelets, smart glasses, smartwatches, smart decorations, etc.
[0079] The light-emitting device and backlight module provided in the embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.
Claims
1. A backlight module, characterized in that, include: A light-emitting device, comprising a first support, a first light-emitting element, a heat insulation layer, and a quantum dot device, wherein the first light-emitting element is mounted on the first support, and the heat insulation layer is disposed between the first light-emitting element and the quantum dot device; The second light-emitting component includes a second bracket, a second light-emitting element, and a fluorescent adhesive layer. The second light-emitting element is mounted on the second bracket, and the fluorescent adhesive layer is disposed on the light-emitting side of the second light-emitting element. The light-emitting device is used to display a low-brightness image, and the second light-emitting component is used to display a high-brightness image.
2. The backlight module according to claim 1, characterized in that, The insulation layer is made of aerogel; and / or, The upper and / or lower surfaces of the heat insulation layer are provided with an uneven structure to diffuse light; and / or, A first diffusion film is provided between the quantum dot device and the heat insulation layer; and / or, The quantum dot device has a second diffusion film on the side opposite to the heat insulation layer.
3. The backlight module according to claim 1, characterized in that, The quantum dot device includes a first cover plate and a second cover plate disposed opposite to each other, and a quantum dot adhesive layer disposed between the first cover plate and the second cover plate; and / or, The first bracket includes a first base plate and a first side plate connected together, the first base plate and the first side plate together enclosing a first accommodating space, the light-emitting device is disposed in the first accommodating space, the heat insulation layer is disposed on the light-emitting device and the first side plate, and the heat insulation layer covers the upper surface of the light-emitting device.
4. The backlight module according to claim 1, characterized in that, The first light-emitting element is an LED chip; and / or, The first light-emitting element includes a first body and a first pin and a second pin connected to the first body. The first bracket is provided with a first connector and a second connector spaced apart. The first pin and the first connector are electrically connected, and the second pin and the second connector are electrically connected.
5. The backlight module according to claim 1, characterized in that, The second light-emitting element is an LED chip; and / or, The second light-emitting element includes a second body and a third pin and a fourth pin connected to the second body. The first bracket is provided with a third connector and a fourth connector spaced apart. The third pin and the third connector are electrically connected, and the fourth pin and the fourth connector are electrically connected.
6. The backlight module according to claim 5, characterized in that, The second bracket includes a second base plate and a second side plate connected together. The second base plate and the second side plate together enclose a second accommodating space. The fluorescent adhesive layer and the second light-emitting component are both disposed in the second accommodating space. The upper surface of the fluorescent adhesive layer is flush with or lower than the top surface of the second side plate.
7. The backlight module according to claim 5, characterized in that, A third diffusion film is provided between the fluorescent adhesive layer and the second light-emitting element; and / or, The fluorescent adhesive layer has a fourth diffusion film on the side opposite to the second light-emitting element.
8. The backlight module according to claim 5, characterized in that, The backlight module also includes a support plate, and the light-emitting device and the second light-emitting component are both disposed on the support plate; The backlight module contains multiple light-emitting devices and multiple second light-emitting components. The multiple light-emitting devices and multiple second light-emitting components are arranged in several rows in a first direction and in several columns in a second direction on the support plate. In each row, the light-emitting devices and the second light-emitting components are alternately arranged, and in each column, the light-emitting devices and the second light-emitting components are alternately arranged.