Wafer cleaning device

Abstract

The utility model relates to a cleaning device, belongs to the technical field of wafer production, and particularly relates to a wafer cleaning device which comprises a washing frame, a moving block is slidably connected to the inner wall of the washing frame, a washing plate is fixedly connected to the bottom of the moving block, the wafer cleaning device further comprises a placing table, the placing table is located below the washing plate, and a placing frame is arranged on the placing table. The placing frame comprises a plurality of clamping plates which are connected with one another, and rotating wheels are rotationally connected into the clamping plates; the auxiliary plate is fixedly connected to the inner wall of the flushing frame, the inner wall of the auxiliary plate is rotationally connected with an auxiliary cleaning roller, one side of the auxiliary plate is fixedly connected with an auxiliary motor, and the output end of the auxiliary motor and the auxiliary cleaning roller are coaxially fixed; the fixing piece is located in the placing frame, and part of the fixing piece is attached to the placing frame; according to the utility model, the two surfaces and the side edges of the wafer can be cleaned, so that a better cleaning effect is achieved; the problems that an existing cleaning device is not comprehensive in cleaning and poor in cleaning effect are solved.

Description

Technical Field

[0001] This utility model relates to the field of wafer manufacturing technology, and in particular to a wafer cleaning device. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits. After being ground, polished, and sliced, a silicon crystal rod is formed into a silicon wafer. To ensure the quality of the wafer, the surface of the wafer needs to be cleaned.

[0003] In the prior art, such as the wafer cleaning and fixing device disclosed in Chinese Patent No. CN112967996A, a base plate, a limiting mechanism, and a fixing mechanism are included. The base plate has hollow columns at both ends of its upper surface, with rectangular openings in the middle of the outer arc surface of each column. Hollow blocks are located on the upper end faces of the hollow columns. Rotating columns are rotatably connected to the opposing inner surfaces of the two hollow blocks via bearings. Support plates are located at the opposing inner ends of the two rotating columns, with strip-shaped openings in the middle of each support plate. The limiting mechanisms are respectively located inside the hollow columns, with their upper ends fixedly connected to the outer ends of the rotating columns on the same side, and their middle parts slidably connected to the rectangular openings on the same side. The fixing mechanisms are respectively located on the front end face of the support plate, with their rear ends slidably connected to the strip-shaped openings on the same side. This wafer cleaning and fixing device is suitable for clamping and fixing wafers of different diameters, facilitating wafer flipping and ensuring the cleaning quality of the device.

[0004] However, this patent still has shortcomings. The patent uses a fixing device to clamp the wafer, and the cleaning fluid does not flow well on the wafer during rinsing. At the same time, because the wafer is clamped, the side edges of the wafer are difficult to clean effectively. Therefore, a wafer cleaning device is proposed to solve the above problems. Utility Model Content

[0005] To address the aforementioned technical problems, this invention proposes a wafer cleaning device that cleans both sides and the side edges of a wafer, achieving a better cleaning effect.

[0006] The technical solution to achieve the purpose of this utility model is: a wafer cleaning device, including a rinsing rack, a movable block slidably connected to the inner wall of the rinsing rack, a rinsing plate fixedly connected to the bottom of the movable block, and further comprising;

[0007] A placement platform is located below the rinsing plate. A placement rack is provided on the placement platform. The placement rack includes multiple interconnected plates, and a rotating wheel is rotatably connected inside each plate.

[0008] An auxiliary plate is fixedly connected to the inner wall of the rinsing rack. An auxiliary cleaning roller is rotatably connected to the inner wall of the auxiliary plate. An auxiliary motor is fixedly connected to one side of the auxiliary plate, and the output end of the auxiliary motor is coaxially fixed with the auxiliary cleaning roller.

[0009] A fastener is located inside the placement platform, and part of the fastener is attached to the placement rack.

[0010] In some embodiments, the lower surface of the rinsing plate is provided with a plurality of atomizing nozzles, the inner cavity of the rinsing plate is hollow and connected to the atomizing nozzles, and the rinsing plate is connected to external equipment through a pipe.

[0011] In some embodiments, a movable screw is rotatably connected to the inner wall of one side of the rinsing rack, and a movable motor is fixedly connected to one side of the same side of the rinsing rack. The output end of the movable motor is coaxially fixed with the movable screw, and the movable block is screwed to the movable screw.

[0012] In some embodiments, a movable optical rod is fixedly connected to the inner wall of the rinsing rack on the other side, and the movable block is slidably connected to the movable optical rod.

[0013] In some embodiments, the fastener includes a stabilizing bidirectional screw rotatably connected to the inner wall of the placement platform, a stabilizing knob rotatably connected to one side of the placement platform and coaxially fixed to the stabilizing bidirectional screw, and a stabilizing rod fixedly connected to the inner wall of the placement platform.

[0014] In some embodiments, the fixing member further includes two stabilizing plates slidably connected to the inner wall of the placement platform, both stabilizing plates being screwed to a stabilizing bidirectional screw, and both stabilizing plates being slidably connected to a stabilizing smooth rod.

[0015] Compared with existing technologies, the significant advantages of this invention are:

[0016] This invention, through the setting of a cleaning frame and auxiliary cleaning roller, connects the rinsing plate pipe to external equipment during the cleaning process, and then starts the auxiliary motor and the moving motor respectively. The moving motor drives the moving screw to rotate, thereby allowing the moving block to move the rinsing plate back and forth, so as to better rinse the wafer and achieve a larger rinsing range. At the same time, the auxiliary motor drives the auxiliary cleaning roller to rotate, which allows the wafer in the clamping plate to rotate, so that all aspects of the wafer can come into full contact with the sprayed cleaning liquid, and can also achieve a cleaning effect on the edges of the wafer.

[0017] This solves the problem that existing cleaning devices do not clean thoroughly and have poor cleaning results. Attached Figure Description

[0018] The present invention will be further explained below with reference to the accompanying drawings and embodiments:

[0019] Figure 1 This is a schematic diagram of the main structure provided in one embodiment of the present invention;

[0020] Figure 2 This is a schematic diagram of the rinsing rack structure provided in one embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the placement rack (sectional view) structure provided in one embodiment of the present invention;

[0022] Figure 4 This is a schematic diagram of the fastener structure provided in one embodiment of the present invention.

[0023] Explanation of reference numerals in the attached figures:

[0024] 1. Rinsing rack; 2. Moving block; 3. Rinsing plate; 4. Placement platform; 5. Placement rack; 501. Card plate; 502. Rotary wheel; 6. Auxiliary plate; 7. Auxiliary cleaning roller; 8. Auxiliary motor; 9. Fixing component; 901. Stabilizing double-sided screw; 902. Stabilizing button; 903. Stabilizing guide rod; 904. Stabilizing plate; 10. Atomizing nozzle; 11. Moving screw; 12. Moving motor; 13. Moving guide rod. Detailed Implementation

[0025] The present invention will now be described in detail, and the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present invention.

[0026] This utility model provides an improved wafer cleaning device. The technical solution of this utility model is as follows:

[0027] like Figure 1 and Figure 3 As shown, a wafer cleaning apparatus includes a rinsing rack 1, a movable block 2 slidably connected to the inner wall of the rinsing rack 1, a rinsing plate 3 fixedly connected to the bottom of the movable block 2, and two movable blocks 2 located at both ends of the rinsing plate 3, and also includes;

[0028] Placement platform 4 is located below rinsing plate 3. Placement rack 5 is provided on placement platform 4. Placement rack 5 is divided into left and right sides. Placement rack 5 includes multiple interconnected clamping plates 501. Rotary wheels 502 are rotatably connected inside the clamping plates 501. During cleaning, the edge of the wafer contacts the rotary wheel 502, which can assist the rotation of the wafer.

[0029] Auxiliary plate 6 is fixedly connected to the inner wall of the rinsing rack 1. An auxiliary cleaning roller 7 is rotatably connected to the inner wall of the auxiliary plate 6. The auxiliary cleaning roller 7 only contacts the side of the wafer and needs to be made of porous ceramic material to remove the residue on the edge. An auxiliary motor 8 is fixedly connected to one side of the auxiliary plate 6. The output end of the auxiliary motor 8 is coaxially fixed with the auxiliary cleaning roller 7.

[0030] To prevent displacement and shaking during the cleaning process, a fixing element 9 is provided to assist in fixing the entire placement rack 5. The fixing element 9 is located inside the placement platform 4, and part of the fixing element 9 is in contact with the placement rack 5.

[0031] like Figure 2 As shown, in one embodiment, the lower surface of the rinsing plate 3 is provided with a plurality of atomizing nozzles 10, the inner cavity of the rinsing plate 3 is hollow and connected to the atomizing nozzles 10, and the rinsing plate 3 is connected to an external device through a pipe, the external device being used to supply rinsing fluid.

[0032] like Figure 2 As shown, in one embodiment, a movable screw 11 is rotatably connected to the inner wall of one side of the rinsing rack 1, and a movable motor 12 is fixedly connected to one side of the same side of the rinsing rack 1. The movable motor 12 drives the movable screw 11 to rotate, thereby allowing the movable block 2 to drive the rinsing plate 3 to move back and forth, so as to better rinse the wafer and achieve a larger rinsing range. The output end of the movable motor 12 is coaxially fixed with the movable screw 11, and the movable block 2 is screwed to the movable screw 11.

[0033] In one embodiment, a movable light rod 13 is fixedly connected to the inner wall of the other side of the rinsing rack 1, and the movable block 2 is slidably connected to the movable light rod 13.

[0034] like Figure 4 As shown, in one embodiment, the fixing member 9 includes a stabilizing bidirectional screw 901 rotatably connected to the inner wall of the placement platform 4, a stabilizing button 902 rotatably connected to one side of the placement platform 4 and coaxially fixed to the stabilizing bidirectional screw 901, and a stabilizing rod 903 fixedly connected to the inner wall of the placement platform 4, which drives the stabilizing bidirectional screw 901 to rotate, so that the two stabilizing plates 904 gradually approach the placement rack 5, thereby fixing the entire placement rack 5 and preventing displacement during rinsing.

[0035] In one embodiment, the fixing member 9 further includes two stabilizing plates 904 that are slidably connected to the inner wall of the placement platform 4. Both stabilizing plates 904 are screwed to the stabilizing bidirectional screw 901. The two stabilizing plates 904 are respectively threaded to the threads in different directions of the stabilizing bidirectional screw 901. Both stabilizing plates 904 are slidably connected to the stabilizing smooth rod 903.

[0036] The specific working method is as follows: When the wafer cleaning device is used, firstly, each wafer is placed into its respective tray 501, allowing the wafer to contact the rotating wheel 502. Then, the stabilizing knob 902 is rotated, driving the stabilizing bidirectional screw 901 to rotate, allowing the two stabilizing plates 904 to gradually approach the placement rack 5, fixing the entire placement rack 5 and preventing displacement during rinsing. Then, the rinsing plate 3 pipe is connected to external equipment, and the auxiliary motor 8 and the moving motor 12 are started respectively. The moving motor 12 drives the moving screw 11 to rotate, allowing the moving block 2 to move the rinsing plate 3 back and forth, rinsing the wafer better and achieving a larger rinsing range. At the same time, the auxiliary motor 8 drives the auxiliary cleaning roller 7 to rotate. The rotation of the auxiliary cleaning roller 7 allows the wafer in the tray 501 to rotate, allowing all aspects of the wafer to come into full contact with the sprayed cleaning liquid, and also achieving a cleaning effect on the edges of the wafer.

[0037] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0038] The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.

[0039] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer cleaning apparatus, comprising a rinsing rack (1), characterized in that: The inner wall of the rinsing rack (1) is slidably connected to a moving block (2), and the bottom of the moving block (2) is fixedly connected to a rinsing plate (3), and also includes; Placement platform (4), the placement platform (4) is located below the rinsing plate (3), the placement platform (4) is provided with a placement rack (5), the placement rack (5) includes a plurality of interconnected card plates (501), and a rotating wheel (502) is rotatably connected inside the card plate (501); An auxiliary plate (6) is fixedly connected to the inner wall of the rinsing rack (1). An auxiliary cleaning roller (7) is rotatably connected to the inner wall of the auxiliary plate (6). An auxiliary motor (8) is fixedly connected to one side of the auxiliary plate (6). The output end of the auxiliary motor (8) is coaxially fixed with the auxiliary cleaning roller (7). Fixing member (9) is located inside the placement platform (4), and part of the fixing member (9) is attached to the placement rack (5).

2. The wafer cleaning apparatus according to claim 1, characterized in that: The lower surface of the rinsing plate (3) is provided with a plurality of atomizing nozzles (10). The inner cavity of the rinsing plate (3) is hollow and connected to the atomizing nozzles (10). The rinsing plate (3) is connected to external equipment through a pipe.

3. The wafer cleaning apparatus according to claim 1, characterized in that: A movable screw (11) is rotatably connected to the inner wall of the rinsing rack (1) on one side, and a movable motor (12) is fixedly connected to one side of the rinsing rack (1) on the same side. The output end of the movable motor (12) is coaxially fixed with the movable screw (11), and the movable block (2) is screwed to the movable screw (11).

4. The wafer cleaning apparatus according to claim 1, characterized in that: On the other side, the inner wall of the rinsing rack (1) is fixedly connected to a movable light rod (13), and the movable block (2) is slidably connected to the movable light rod (13).

5. A wafer cleaning apparatus according to claim 1, characterized in that: The fastener (9) includes a stabilizing bidirectional screw (901) rotatably connected to the inner wall of the placement platform (4), a stabilizing button (902) rotatably connected to one side of the placement platform (4) and coaxially fixed to the stabilizing bidirectional screw (901), and a stabilizing rod (903) fixedly connected to the inner wall of the placement platform (4).

6. A wafer cleaning apparatus according to claim 5, characterized in that: The fixing member (9) also includes two stabilizing plates (904) that are slidably connected to the inner wall of the placement platform (4). Both stabilizing plates (904) are screwed to the stabilizing bidirectional screw (901), and both stabilizing plates (904) are slidably connected to the stabilizing smooth rod (903).

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