Integrated circuit chip aggregation device

Abstract

The utility model discloses an integrated circuit chip aggregation device, and particularly relates to the technical field of chip aggregation devices, the integrated circuit chip aggregation device comprises a processing table and a test device, the test device is used for testing integrated circuit chips, the top of the processing table is provided with an installation groove, and two conveyor belts are fixedly arranged in the installation groove. A plurality of partition plates distributed at equal intervals are fixedly arranged on the surfaces of the outer walls of the two conveying belts, integrated circuit chips are placed between every two adjacent partition plates, a discharging groove is formed in one side of the top of the machining table, a baffle is arranged at the top of the discharging groove, and connecting plates are fixedly arranged on the outer walls of the front side and the rear side of the baffle. Two integrated circuit chips are synchronously conveyed through the two conveying belts, the two feeding plates are used for pushing the chips to conduct polymerization operation, the polymerization efficiency of the integrated circuit chips can be effectively improved, the chips are limited and fixed through the baffles and the discharging plates, positioning deviation of the two chips in the polymerization process can be effectively avoided, and the polymerization efficiency of the integrated circuit chips is improved. And thus, the aggregation precision and effect of the chip are remarkably improved.

Description

Technical Field

[0001] This utility model relates to the field of chip aggregation device technology, and more specifically to an integrated circuit chip aggregation device. Background Technology

[0002] Integrated circuit chips are the core and foundation of modern electronic technology, integrating multiple electronic components in a miniaturized manner onto a silicon wafer or other semiconductor material. An integrated circuit chip comprises an electronic component including a silicon substrate, at least one circuit, a fixed sealing ring, a grounding ring, and at least one guard ring. This integration makes the circuit's functionality richer and more complex, while reducing its size, improving reliability, and lowering cost. With the rapid development of integrated circuit design and manufacturing processes, the requirements for multi-chip integrated circuits are becoming increasingly stringent. In actual integrated circuit chip production, sometimes two types of integrated circuit chips need to be used in combination, which necessitates inter-chip interconnection testing of paired integrated circuit chips.

[0003] For example, an integrated circuit chip aggregation device with prior art publication number CN217158145U uses a first aggregation cylinder and a second aggregation cylinder to aggregate two integrated circuit chips onto the test position on an integrated circuit chip test bench, thereby facilitating subsequent testing of the two integrated circuit chips using integrated circuit chip test equipment and significantly improving the efficiency of interconnection testing of a pair of integrated circuit chips.

[0004] However, the existing technology described above still has the following problems in use: when the integrated circuit chip is transported into the testing channel, due to the lack of obstructions inside the feeding channel, the integrated circuit chip is prone to deviation within the feeding channel, which in turn affects the subsequent polymerization effect and the testing process. Based on this, the present invention provides an integrated circuit chip polymerization device with accurate positioning. Utility Model Content

[0005] To overcome the aforementioned deficiencies in the prior art, this utility model provides an integrated circuit chip aggregation device. This device synchronously transports two integrated circuit chips via two conveyor belts and uses two feeding plates to push the chips for aggregation, effectively improving the aggregation efficiency of the integrated circuit chips. Furthermore, by using baffles and a feeding plate to limit and fix the chips, positioning deviations between the two chips during aggregation are effectively avoided, thereby significantly improving the aggregation accuracy and effect, thus solving the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an integrated circuit chip aggregation device, comprising a processing table and a testing device for testing integrated circuit chips. The processing table has a mounting groove on its top, and two conveyor belts are fixedly installed inside the mounting groove. Multiple equally spaced partitions are fixedly installed on the outer wall surfaces of the two conveyor belts. Integrated circuit chips are placed between two adjacent partitions. A feeding trough is provided on one side of the top of the processing table, and a baffle is provided on the top of the feeding trough. Connecting plates are fixedly installed on the front and rear outer walls of the baffle. A first electric push rod is fixedly installed at the bottom end of each of the two connecting plates. A feeding mechanism is provided on the top of the processing table.

[0007] In a preferred embodiment, the processing table has fixing slots on both the front and rear sides of its top, and two first electric push rods are fixed in the two fixing slots respectively. The fixing slots are used to install the first electric push rods, thereby improving the stability of the first electric push rods.

[0008] In a preferred embodiment, the feeding mechanism includes a feeding plate and two feeding plates. The outer walls of the feeding plate and the two feeding plates are all connected to second electric push rods. Multiple second electric push rods can be detachably installed on the top of the processing table. The feeding plate and the feeding plates are automatically moved by the second electric push rods, thereby improving the polymerization and testing efficiency of integrated circuit chips.

[0009] In a preferred embodiment, a bracket is detachably fixed to the top of the processing table, and a third electric push rod is fixedly inserted through the top of the bracket. The bottom end of the piston rod of the third electric push rod is connected to the testing equipment, and the testing equipment is automatically raised and lowered by the third electric push rod, thereby realizing the automatic adjustment of the height of the testing equipment.

[0010] In a preferred embodiment, positioning rods are fixedly provided on both the front and rear sides of the top of the feeding trough, and positioning holes corresponding to the positioning rods are opened at the bottom of the baffle. The top of the positioning rod passes through the positioning hole. By cooperating with the positioning hole, the positioning rod can play a positioning role when the baffle is raised or lowered, so as to avoid the baffle from shifting and affecting subsequent normal use.

[0011] In a preferred embodiment, a drive roller and a driven roller are rotatably mounted inside the mounting groove. Two conveyor belts are fitted onto the drive roller and the driven roller. A motor is fixedly mounted at the rear end of the processing table. The motor is connected to the rear end of the drive roller via a coupling. The motor drives the drive roller to rotate, and the drive roller and the driven roller cooperate to drive the conveyor belt to operate, thereby completing the automatic delivery of integrated circuit chips and further improving work efficiency.

[0012] The technical effects and advantages of this utility model are as follows:

[0013] 1. This utility model uses two conveyor belts to simultaneously transport two integrated circuit chips and two feeding plates to push the chips for aggregation, which can effectively improve the aggregation efficiency of integrated circuit chips. By using baffles and unloading plates to limit and fix the chips, positioning deviations between the two chips during aggregation can be effectively avoided, thereby significantly improving the aggregation accuracy and effect of the chips.

[0014] 2. The baffle is raised and lowered by the first electric push rod, which can automatically adjust the height of the baffle to avoid the baffle from affecting the feeding of integrated circuit chips. The positioning rod and positioning hole cooperate to play a positioning role when the baffle is raised and lowered, so as to prevent the baffle from shifting and affecting subsequent normal use. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a partial structural schematic diagram of the present invention;

[0017] Figure 3 for Figure 2 Top view;

[0018] Figure 4 This is a schematic diagram of the baffle and the first electric push rod of this utility model;

[0019] Figure 5 This is a top view of the processing table of this utility model.

[0020] The attached figures are labeled as follows: 1. Processing table; 2. Testing equipment; 3. Mounting groove; 4. Conveyor belt; 5. Partition plate; 6. Discharge chute; 7. Baffle plate; 8. Connecting plate; 9. First electric push rod; 10. Feeding mechanism; 11. Fixing groove; 12. Bracket; 13. Third electric push rod; 14. Positioning rod; 15. Positioning hole; 16. Driving roller; 17. Driven roller; 18. Motor;

[0021] 101. Feeding plate; 102. Feeding plate; 103. Second electric push rod. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Refer to the instruction manual appendix Figures 1-5This utility model provides an integrated circuit chip aggregation device, including a processing table 1 and a testing device 2, for testing integrated circuit chips. A bracket 12 is detachably fixed to the top of the processing table 1, and a third electric push rod 13 is fixedly inserted through the top of the bracket 12. The bottom end of the piston rod of the third electric push rod 13 is connected to the testing device 2. The third electric push rod 13 drives the testing device 2 to automatically lift and lower, thereby realizing the automatic adjustment of the height of the testing device 2.

[0024] The processing table 1 has an installation groove 3 on its top. Two conveyor belts 4 are fixed inside the installation groove 3 by bearings. Multiple equally spaced partitions 5 are fixed on the outer wall surface of the two conveyor belts 4. Integrated circuit chips are placed between two adjacent partitions 5. A material unloading groove 6 is provided on one side of the top of the processing table 1. A baffle 7 is provided on the top of the material unloading groove 6. Connecting plates 8 are fixed on the front and rear outer walls of the baffle 7. The bottom ends of the two connecting plates 8 are fixed with first electric push rods 9 by bolts. Fixing grooves 11 are provided on the front and rear sides of the top of the processing table 1. The two first electric push rods 9 are fixed in the two fixing grooves 11 respectively.

[0025] The processing table 1 is equipped with a feeding mechanism 10 on its top. Specifically, the feeding mechanism 10 includes a feeding plate 101 and two feeding plates 102. The outer walls of the feeding plate 101 and the two feeding plates 102 are all connected to second electric push rods 103. Multiple second electric push rods 103 can be detachably installed on the top of the processing table 1. The feeding plate 101 and the feeding plates 102 are automatically moved by the second electric push rods 103, thereby improving the polymerization and testing efficiency of integrated circuit chips.

[0026] In practical use, two conveyor belts 4 are used to transport two integrated circuit chips respectively. When the two integrated circuit chips move to the feeding plate 102, two second electric push rods 103 drive the two feeding plates 102 to move towards the baffle 7, so that the integrated circuit chips on the two conveyor belts 4 are close together. Under the limitation of the baffle 7 and the unloading plate 101, the two integrated circuit chips are brought together. Then, the third electric push rod 13 can be used to drive the testing equipment 2 to move down, and the testing head on the testing equipment 2 tests the two integrated circuit chips (e.g., Figure 1 (As shown). After the test is completed, the two first electric push rods 9 are extended synchronously. The first electric push rods 9 drive the baffle 7 to rise through the connecting plate 8. After moving away from the side of the integrated circuit chip, the second electric push rod 103 can be extended to drive the unloading plate 101 to move. The unloading plate 101 pushes the two polymer integrated circuit chips into the unloading groove 6 for unloading.

[0027] Refer to the instruction manual appendix Figure 2 and Figure 4The top front and rear sides of the feeding trough 6 are fixedly provided with positioning rods 14, and the bottom of the baffle 7 is provided with positioning holes 15 corresponding to the positioning rods 14. The top of the positioning rods 14 passes through the positioning holes 15. By cooperating with the positioning rods 14 and the positioning holes 15, the positioning rods 14 can play a positioning role when the baffle 7 is raised and lowered, so as to avoid the baffle 7 from shifting and affecting the subsequent normal use.

[0028] The mounting groove 3 is equipped with a drive roller 16 and a driven roller 17 that rotate inside. Two conveyor belts 4 are both sleeved on the drive roller 16 and the driven roller 17. The rear end of the processing table 1 is fixed with a motor 18 by bolts. The motor 18 is connected to the rear end of the drive roller 16 through a coupling. The motor 18 drives the drive roller 16 to rotate. The drive roller 16 and the driven roller 17 cooperate to drive the conveyor belt 4 to rotate, thereby completing the automatic transport of integrated circuit chips and further improving the efficiency of integrated circuit chips.

[0029] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An integrated circuit chip aggregation apparatus, comprising a processing table (1) and a testing device (2), for testing integrated circuit chips, characterized in that: The processing table (1) has an installation groove (3) on its top. Two conveyor belts (4) are fixed inside the installation groove (3). Multiple partitions (5) are fixed on the outer wall surfaces of the two conveyor belts (4) at equal intervals. The integrated circuit chip is placed between two adjacent partitions (5). The processing table (1) has a feeding trough (6) on one side of the top, a baffle (7) on the top of the feeding trough (6), and connecting plates (8) fixed on the front and rear outer walls of the baffle (7). The bottom ends of the two connecting plates (8) are fixed with first electric push rods (9). The processing table (1) has a feeding mechanism (10) on the top.

2. The integrated circuit chip aggregation device according to claim 1, characterized in that: The processing table (1) has fixed slots (11) on both the front and rear sides of the top, and two first electric push rods (9) are fixed in the two fixed slots (11) respectively.

3. The integrated circuit chip aggregation device according to claim 1, characterized in that: The feeding mechanism (10) includes a feeding plate (101) and two feeding plates (102). The outer walls of the feeding plate (101) and the two feeding plates (102) are all connected to second electric push rods (103). Multiple second electric push rods (103) can be detachably installed on the top of the processing table (1).

4. The integrated circuit chip aggregation device according to claim 1, characterized in that: The processing table (1) is detachably fixed with a bracket (12) on the top. A third electric push rod (13) is fixedly inserted through the top of the bracket (12). The bottom end of the piston rod of the third electric push rod (13) is connected to the test equipment (2).

5. The integrated circuit chip aggregation apparatus according to claim 1, characterized in that: The top of the feeding trough (6) is fixed with positioning rods (14) on both the front and rear sides. The bottom of the baffle (7) is provided with positioning holes (15) corresponding to the positioning rods (14). The top of the positioning rods (14) passes through the positioning holes (15).

6. The integrated circuit chip aggregation apparatus according to claim 1, characterized in that: The mounting groove (3) is equipped with a drive roller (16) and a driven roller (17) that rotate inside. Two conveyor belts (4) are both sleeved on the drive roller (16) and the driven roller (17). The processing table (1) is fixedly equipped with a motor (18) at the rear end. The motor (18) is connected to the rear end of the drive roller (16) through a coupling.

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