Reversible workbench and die bonder

Abstract

The utility model relates to the technical field of die bonders, and discloses a reversible workbench and a die bonder, the reversible workbench is used for assisting the die bonder to complete wafer pasting of a tube socket in a material tray, the reversible workbench comprises a reversible clamping table, the reversible clamping table comprises bearing seats arranged on two sides of a bottom plate, the interiors of the bearing seats are connected with rotating shafts through bearings, the rotating shafts are externally provided with cushion blocks, and the cushion blocks are arranged on the bottom plate. A vacuum plate is arranged outside the cushion block, a connecting base is arranged on the same side of the end, away from the cushion block, of the vacuum plate, a rail and a third air cylinder are arranged on the bottom plate, a sliding block is arranged on the rail in a sliding mode, the pipe base is fixed through the workbench, the workbench can be turned over to enable the pipe base to incline, and the inclined face of the pipe base is made to be horizontal relative to the horizontal plane. And a chip is fixed on the inclined surface of the tube socket.

Description

Technical Field

[0001] This application belongs to the field of die bonder technology and relates to a flip-up worktable and a die bonder. Background Technology

[0002] In the semiconductor packaging manufacturing field, the die bonder, as one of the core pieces of equipment, is used to bond wafers to designated positions on the socket with high precision. Its positioning accuracy directly affects the electrical performance and reliability of the packaged device. With the development of packaging technology towards high density and three-dimensional integration, the complexity of the socket structure has significantly increased. For example, some sockets have specific inclined surfaces designed on their surfaces, which must be kept strictly horizontal during the die bonder process to avoid die bond misalignment or failure of subsequent packaging processes due to angular deviations. However, traditional worktables require frequent changes of custom fixtures or repeated calibrations based on operator experience, leading to extended equipment preparation time and reduced production efficiency.

[0003] Therefore, how to provide a flip-up worktable and die bonder that can fix the die holder and flip it to tilt the die holder to complete the die bonding has become a technical problem that urgently needs to be solved. Utility Model Content

[0004] To overcome the problems existing in the related technologies, this application aims to provide a flip-up worktable and die bonder that can fix the die holder and flip it to tilt the die holder to complete the die bonding.

[0005] This application is achieved through the following technical solution.

[0006] Firstly, this technical solution provides a flip-up worktable for assisting a die bonder in bonding wafers to the internal sockets of a tray. The worktable includes a flip-up clamping platform, comprising bearing seats on both sides of a base plate. A rotating shaft is connected inside the bearing seats via bearings. A pad is provided outside the rotating shaft. A vacuum plate is provided outside the pad. A connecting seat is provided on the same side of the vacuum plate away from the pad. A track and a third cylinder are provided on the base plate. A slider is slidably provided on the track. A connecting block is provided on the side of the slider closest to the vacuum plate. The connecting block and the connecting seat form a linkage pair via a connecting rod.

[0007] During wafer bonding, the third cylinder drives the connecting block to move the connecting seat, causing the vacuum plate to rotate via the rotating shaft, which in turn causes the inclined surface of the tube seat inside the tray to become parallel to the horizontal plane, thus completing the wafer bonding.

[0008] This technical solution uses a worktable to fix the tube socket. The worktable can be flipped to tilt the tube socket, making the tilted surface of the tube socket horizontal relative to the horizontal plane, and then fixing the chip on the tilted surface of the tube socket.

[0009] The present invention is further configured such that the two ends of the connecting rod are pivotally connected to the connecting block and the connecting seat respectively through pivot pins to form a hinge structure, so that the displacement of the connecting block can be converted into the synchronous displacement motion of the connecting seat.

[0010] The present invention is further configured to include:

[0011] A tilting block, which is mounted on the die bonder;

[0012] The XY axis module is located on the inclined surface of the inclined block and is used to drive the flipping clamp to perform a combined lateral and longitudinal displacement movement in the plane.

[0013] The present invention is further configured such that side baffles are provided on both sides of the vacuum plate, at least one side baffle is provided with a sliding groove, a first cylinder is installed on the same side of the vacuum plate, the output end of the first cylinder is provided with a top block, the top block is slidably connected to the inside of the sliding groove, and the top block is used to limit the material tray.

[0014] The present invention is further configured such that at least one second cylinder is provided on both sides of the vacuum plate, and a pressure block is provided at the output end of the second cylinder, the pressure block being used to limit the material tray.

[0015] The present invention is further configured such that a limiting block is provided on the side of the vacuum plate away from the inlet and outlet of the material tray, and at least one limiting block is provided for limiting the material tray.

[0016] The present invention is further configured such that the base plate is provided with adjustment blocks, and there are two adjustment blocks, which are used to limit the movement stroke of the connecting blocks.

[0017] The present invention is further configured such that the adjusting block is detachably connected to the base plate, and the moving stroke of the connecting block changes accordingly after the position of the adjusting block is adjusted.

[0018] The present invention is further configured such that the vacuum plate has an external interface for connecting an external negative pressure device.

[0019] In the first aspect, this technical solution provides a die bonder, including a loading and unloading mechanism, an auxiliary loading and unloading mechanism, a detection mechanism, a ejector pin mechanism, a die-taking worktable, a gantry frame, a die bond detection mechanism, a dispensing mechanism, a die-taking mechanism, a die-taking detection mechanism, and a flip-up worktable as described in the first aspect.

[0020] The loading and unloading mechanism is used to carry and adjust the position of the material tray;

[0021] The auxiliary loading and unloading mechanism is used to drive the material tray to feed in and out of the vacuum plate;

[0022] The testing agency is used to check whether the wafer position is accurate after the wafer is picked up by the wafer picking mechanism;

[0023] The ejector pin mechanism is used to adjust the position of the wafer;

[0024] The wafer pick-up stage is used to hold and adjust the position of the wafer;

[0025] The gantry crane is used to mount the die bonding and inspection mechanism, the dispensing mechanism, the die picking mechanism, and the die picking and inspection mechanism;

[0026] The die bonding inspection unit is used to check whether the wafer is accurately bonded to the socket;

[0027] The dispensing mechanism is used for dispensing adhesive onto the inclined surface of the tube seat;

[0028] The wafer picking mechanism is used to pick up wafers from the wafer picking stage;

[0029] The wafer picking inspection mechanism is used to check whether the wafer picking mechanism accurately picks up the wafer from the wafer picking worktable.

[0030] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0031] The above and other objects, features and advantages of this application will become more apparent from the more detailed description of exemplary embodiments thereof in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments thereof.

[0032] Figure 1 This is a schematic diagram of the structure shown in one embodiment of this application;

[0033] Figure 2 This is a schematic diagram of the workbench structure shown in one embodiment of this application;

[0034] Figure 3 This is a schematic diagram of a flipping clamp structure shown in one embodiment of this application;

[0035] Figure 4 This is a schematic diagram of the flipping clamp in one embodiment of this application;

[0036] Figure 5 This is a schematic diagram of a die bonder shown in one embodiment of this application;

[0037] Figure 6 This is a schematic diagram of a material tray shown in one embodiment of this application;

[0038] Figure 7 This is a partially enlarged schematic diagram of structure A shown in one embodiment of this application.

[0039] Reference numerals: 1. Inclined block; 2. XY axis module; 3. Tilting clamp; 31. Base plate; 311. Bearing seat; 312. Rotating shaft; 313. Pad block; 32. Vacuum plate; 321. Side baffle; 322. Slide groove; 323. First cylinder; 324. Top block; 325. Second cylinder; 326. Pressing block; 327. Limiting block; 33. Third cylinder; 34. Connecting block; 341. Connecting rod; 342. 35. Connecting seat; 36. Slider; 37. Track; 38. Adjusting block; 48. Interface; 59. Material tray; 40. Tube seat; 411. Inclined surface; 50. Loading and unloading mechanism; 60. Auxiliary loading and unloading mechanism; 70. Detection mechanism; 80. Ejector pin mechanism; 90. Crystal picking worktable; 100. Gantry frame; 110. Crystal bonding detection mechanism; 120. Dispensing mechanism; 130. Crystal picking mechanism; 140. Crystal picking detection mechanism. Detailed Implementation

[0040] The technical solutions of some embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0041] The technical solutions of the embodiments of this application are described in detail below with reference to the accompanying drawings.

[0042] In a first aspect, this embodiment discloses a flip-up worktable for assisting the die bonder in bonding wafers to the internal socket 41 of the tray 4, such as... Figures 1-7 As shown, it includes: a flipping clamping platform 3, which includes bearing seats 311 on both sides of the base plate 31. A rotating shaft 312 is connected inside the bearing seat 311 through a bearing. A pad 313 is provided outside the rotating shaft 312. A vacuum plate 32 is provided outside the pad 313. A connecting seat 342 is provided on the same side of the vacuum plate 32 away from the pad 313. A track 36 and a third cylinder 33 are provided on the base plate 31. A slider 35 is slidably provided on the track 36. A connecting block 34 is provided on the side of the slider 35 near the vacuum plate 32. The connecting block 34 and the connecting seat 342 form a linkage pair through a connecting rod 341.

[0043] During wafer bonding, the third cylinder 33 drives the connecting block 34 to move the connecting seat 342, causing the vacuum plate 32 to rotate through the rotating shaft 312, which in turn causes the inclined surface 411 of the tube seat 41 inside the tray 4 to be parallel to the horizontal plane, thus completing the wafer bonding.

[0044] like Figure 3 and Figure 4As shown, the two ends of the connecting rod 341 are pivotally connected to the connecting block 34 and the connecting seat 342 respectively through pivot pins, forming a hinge structure, so that the displacement of the connecting block 34 can be converted into the synchronous displacement motion of the connecting seat 342.

[0045] It should be noted that the vacuum plate 32 is used to place the material tray 4, and the connecting block 34 is driven by the third cylinder 33 to move through the track 36 and the slider 35. Then, the connecting rod 341 pulls the connecting seat 342, so that the vacuum plate 32 rotates through the rotating shaft 312, causing the material tray 4 and the tube seat 41 to rotate. This adjusts the angle of the inclined surface 411 of the tube seat 41 so that it is horizontal relative to the horizontal plane, which facilitates subsequent dispensing and wafer bonding operations.

[0046] like Figure 2 As shown, it also includes:

[0047] Tilting block 1, which is installed on the die bonder;

[0048] XY axis module 2, located on the inclined surface of inclined block 1, is used to drive the flipping clamp 3 to perform a combined lateral and longitudinal displacement movement in the plane.

[0049] It should be noted that the tilting block 1 itself has a tilting structure, which is used to adapt to the tilting surface 411 of the tube seat 41, and the XY axis module 2 is existing technology.

[0050] like Figure 3 and Figure 4 As shown, the vacuum plate 32 is provided with side baffles 321 on both sides, and at least one side baffle 321 is provided with a sliding groove 322. A first cylinder 323 is installed on the same side of the vacuum plate 32. The output end of the first cylinder 323 is provided with a top block 324. The top block 324 is slidably connected to the inside of the sliding groove 322. The top block 324 is used to limit the material tray 4.

[0051] It should be noted that the first cylinder 323 drives the top block 324 to squeeze the material tray 4, which can fix the position of the material tray 4.

[0052] like Figure 3 and Figure 4 As shown, at least one second cylinder 325 is provided on both sides of the vacuum plate 32, and a pressure block 326 is provided at the output end of the second cylinder 325. The pressure block 326 is used to limit the material tray 4.

[0053] It should be noted that the second cylinder 325 can drive the pressure block 326 to move, so as to avoid collision during the placement of the material tray 4. After the material tray 4 is placed, its position is restricted by pressing on the top of the material tray 4.

[0054] like Figure 3As shown, a limiting block 327 is provided on the side of the vacuum plate 32 away from the inlet and outlet of the material tray 4. At least one limiting block 327 is provided to limit the material tray 4.

[0055] It should be noted that during the placement of the material tray 4, it can abut against the limiting block 327 to complete the positioning of the material tray 4.

[0056] like Figure 3 and Figure 4 As shown, there are two adjustment blocks 361 on the base plate 31, which are used to limit the movement of the connecting block 34.

[0057] like Figures 1-4 As shown, the adjusting block 361 is detachably connected to the base plate 31. After the position of the adjusting block 361 is adjusted, the travel of the connecting block 34 changes accordingly.

[0058] It should be noted that the adjusting block 361 is used to limit the movement of the connecting block 34. After adjusting the position of the adjusting block 361, the movement of the connecting block 34 can be adjusted.

[0059] like Figures 1-7 As shown, the vacuum plate 32 has an external interface 37 for connecting external negative pressure equipment.

[0060] It should be noted that, with the help of a negative pressure device, the vacuum plate 32 can be used to adsorb the tube seat 41 inside the tray 4, so as to maintain the stability of the tube seat 41 during wafer bonding.

[0061] Secondly, this embodiment discloses a die bonder, such as... Figures 1-7 As shown, it includes a loading and unloading mechanism 50, an auxiliary loading and unloading mechanism 60, a detection mechanism 70, an ejector pin mechanism 80, a crystal picking worktable 90, a gantry frame 100, a die bonding detection mechanism 110, a dispensing mechanism 120, a crystal picking mechanism 130, a crystal picking detection mechanism 140, and a reversible worktable in the first aspect.

[0062] The loading and unloading mechanism 50 is used to carry and adjust the position of the material tray 4;

[0063] The auxiliary loading and unloading mechanism 60 is used to drive the material tray 4 to import and export the vacuum plate 32;

[0064] The testing unit 70 is used to test whether the wafer position is accurate after the wafer is removed by the wafer removal unit 130;

[0065] The ejector mechanism 80 is used to adjust the wafer position;

[0066] The wafer pick-up stage 90 is used to hold and adjust the position of the wafer;

[0067] The gantry 100 is used to mount the die bonding and inspection mechanism 110, the dispensing mechanism 120, the die picking mechanism 130, and the die picking and inspection mechanism 140.

[0068] The die bonding inspection mechanism 110 is used to check whether the position of the wafer bonded to the socket 41 is accurate;

[0069] The dispensing mechanism 120 is used for dispensing adhesive onto the inclined surface 411 of the tube seat 41;

[0070] The wafer picking mechanism 130 is used to pick up wafers from the wafer picking stage 90;

[0071] The wafer picking inspection mechanism 140 is used to inspect whether the wafer picking mechanism 130 accurately picks up the wafer from the wafer picking stage 90.

[0072] Working principle: The loading and unloading mechanism 50 carries and adjusts the position of the tray 4, and then the suction head of the auxiliary loading and unloading mechanism 60 drives the tray to be guided into the vacuum plate 32. Then, the first cylinder 323 and the second cylinder 325 drive the top block 324 and the pressure block 326 to restrict the position of the tray 4. At this time, the third cylinder 33 drives the connecting block 34 to move through the track 36 and the slider 35, and then the connecting rod 341 pulls the connecting seat 342, so that the vacuum plate 32 rotates through the rotating shaft 312, causing the tray 4 and the tube seat 41 to rotate. The angle of the inclined surface 411 of the tube seat 41 is adjusted so that it is horizontal relative to the horizontal plane, which facilitates the dispensing mechanism 120 to complete the dispensing. Then, the wafer is picked up from the wafer picking worktable 90 by the wafer picking mechanism 130. After multiple tests, it is attached to the inclined surface 411 of the tube seat 41. Then, the wafer bonding detection mechanism 110 is used to check whether the wafer bonding position is accurate, and the wafer bonding is completed.

[0073] The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A flip-up worktable for assisting a die bonder in bonding wafers to the internal sockets (41) of a die bonder (4), characterized in that, include: A flipping clamp (3) includes bearing seats (311) on both sides of a base plate (31). A rotating shaft (312) is connected inside the bearing seat (311) via a bearing. A pad (313) is provided outside the rotating shaft (312). A vacuum plate (32) is provided outside the pad (313). A connecting seat (342) is provided on the same side of the vacuum plate (32) away from the pad (313). A track (36) and a third cylinder (33) are provided on the base plate (31). A slider (35) is slidably provided on the track (36). A connecting block (34) is provided on the side of the slider (35) near the vacuum plate (32). The connecting block (34) and the connecting seat (342) are connected by a connecting rod (341) to form a linkage pair. During wafer bonding, the third cylinder (33) drives the connecting block (34) to move the connecting seat (342), causing the vacuum plate (32) to rotate through the rotating shaft (312), which in turn causes the inclined surface (411) of the tube seat (41) inside the tray (4) to be parallel to the horizontal plane, thus completing the wafer bonding.

2. The reversible worktable according to claim 1, characterized in that, The two ends of the connecting rod (341) are pivotally connected to the connecting block (34) and the connecting seat (342) respectively through pivot pins to form a hinge structure, so that the displacement of the connecting block (34) can be converted into the synchronous displacement motion of the connecting seat (342).

3. The reversible worktable according to claim 1, characterized in that, Also includes: Tilting block (1), the tilting block (1) is mounted on the die bonder; XY axis module (2), the XY axis module (2) is located on the inclined surface of the inclined block (1) and is used to drive the flipping clamp (3) to perform a composite displacement movement in the plane, both horizontally and vertically.

4. The reversible worktable according to claim 1, characterized in that, The vacuum plate (32) is provided with side baffles (321) on both sides, and at least one side baffle (321) is provided with a sliding groove (322). A first cylinder (323) is installed on the same side of the vacuum plate (32). The output end of the first cylinder (323) is provided with a top block (324). The top block (324) is slidably connected to the inside of the sliding groove (322). The top block (324) is used to limit the material tray (4).

5. The reversible worktable according to claim 1, characterized in that, At least one second cylinder (325) is provided on both sides of the vacuum plate (32), and a pressure block (326) is provided at the output end of the second cylinder (325). The pressure block (326) is used to limit the material tray (4).

6. The reversible worktable according to claim 1, characterized in that, The vacuum plate (32) is provided with a limiting block (327) on the side away from the inlet and outlet of the material tray (4). At least one limiting block (327) is provided for limiting the material tray (4).

7. The reversible worktable according to claim 1, characterized in that, The base plate (31) is provided with an adjustment block (361), and there are two adjustment blocks (361) for limiting the movement of the connecting block (34).

8. The flip-up worktable according to claim 7, characterized in that, The adjustment block (361) is detachably connected to the base plate (31). After the position of the adjustment block (361) is adjusted, the travel distance of the connecting block (34) changes accordingly.

9. The reversible worktable according to claim 1, characterized in that, The vacuum plate (32) has an external interface (37) for connecting to external negative pressure equipment.

10. A die bonder, characterized in that, It includes a loading and unloading mechanism (50), an auxiliary loading and unloading mechanism (60), a detection mechanism (70), an ejector pin mechanism (80), a crystal picking worktable (90), a gantry frame (100), a die bonding detection mechanism (110), a dispensing mechanism (120), a crystal picking mechanism (130), a crystal picking detection mechanism (140), and a flip-up worktable as described in any one of claims 1-9; The loading and unloading mechanism (50) is used to carry and adjust the position of the material tray (4); The auxiliary loading and unloading mechanism (60) is used to drive the material tray (4) to import and export the vacuum plate (32); The testing mechanism (70) is used to test whether the wafer position is accurate after the wafer is taken by the wafer-taking mechanism (130); The ejector mechanism (80) is used to adjust the wafer position; The wafer pick-up stage (90) is used to hold and adjust the position of the wafer; The gantry (100) is used to load the die bonding and inspection mechanism (110), the dispensing mechanism (120), the die taking mechanism (130), and the die taking and inspection mechanism (140). The die bonding inspection mechanism (110) is used to check whether the position of the wafer bonded to the socket (41) is accurate; The dispensing mechanism (120) is used for dispensing adhesive onto the inclined surface (411) of the tube seat (41); The wafer picking mechanism (130) is used to pick up wafers from the wafer picking stage (90); The wafer picking inspection mechanism (140) is used to inspect whether the wafer picking mechanism (130) picks up the wafer from the wafer picking table (90) accurately.

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