Etching device for removing impurities from copper foil

Abstract

The utility model provides an etching device for removing copper foil impurities, and belongs to the technical field of etching. The etching device for removing the copper foil impurities comprises an etching machine body, a spraying assembly installed at the top in the etching machine body and a filtering assembly installed in the etching machine body, and is characterized in that a window is formed in the outer side wall of the etching machine body, a driving mechanism is fixed to the outer side wall of the etching machine body through bolts, and a left clamp mechanism and a right clamp mechanism are installed on the two sides of the inner wall of the etching machine body respectively; the output end of the driving mechanism is horizontally aligned with the shaft ends of the left clamp mechanism and the right clamp mechanism, the PCB positioned and clamped by the left clamp mechanism and the right clamp mechanism is overturned through the driving mechanism, and double-sided impurity removal treatment can be carried out on the PCB through the spraying assembly.

Description

Technical Field

[0001] This application relates to the field of etching technology, and more specifically, to an etching apparatus for removing impurities from copper foil. Background Technology

[0002] With the rapid development of electronic information technology, printed circuit boards (PCBs), as an indispensable basic component in electronic devices, face increasingly stringent requirements for manufacturing processes and performance. Copper foil, as the main conductive layer of a PCB, directly affects the conductivity of the circuit, signal transmission efficiency, and long-term reliability of the product due to its surface purity. During the manufacturing process of HDIPCBs, various impurities such as oxide layers, organic contaminants, and microparticles may adhere to the copper foil surface. These impurities not only increase circuit resistance and reduce signal transmission speed but may also cause serious quality problems such as short circuits and open circuits. Therefore, efficiently and accurately removing impurities from the copper foil surface is a crucial prerequisite for ensuring the quality of HDIPCBs.

[0003] Currently, various etching devices exist on the market for removing impurities from copper foil. Most of these devices are based on chemical etching or physical cleaning principles, using specific etching solutions or cleaning media to react or physically interact with the copper foil surface to remove impurities. However, for high-precision, high-density products like HDIPCBs, existing etching devices face numerous technical challenges in handling copper foil impurities: existing etching devices for removing copper foil impurities are not suitable for removing impurities from both sides of the copper foil of certain high-precision or high-density interconnect (HDI) PCBs. Utility Model Content

[0004] To overcome the above deficiencies, this application provides an etching apparatus for removing impurities from copper foil, thereby solving the problems mentioned in the background art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model to solve its technical problem is as follows:

[0006] An etching apparatus for removing impurities from copper foil includes an etching machine body and a spray assembly installed on the top of the etching machine body, and a filter assembly installed inside. The etching machine body has a window on its outer side wall and a drive mechanism is bolted thereon. A left clamping mechanism and a right clamping mechanism are respectively installed on both sides of the inner wall of the etching machine body. The output end of the drive mechanism is horizontally aligned with the shaft ends of the left clamping mechanism and the right clamping mechanism.

[0007] Furthermore, the driving mechanism includes a drive motor, a threaded hole, a positioning block, and a locking bolt. The fixed end of the drive motor is bolted to the outer wall of the etching machine body, and the output end has the threaded hole, which passes through the inside of the window and is inserted into the inside of the left clamping mechanism. One end of the positioning block is in contact with the surface of the left clamping mechanism, and its inner wall is axially connected to the outer wall of the locking bolt. The bottom end of the locking bolt is threaded to the inner wall of the threaded hole.

[0008] Furthermore, the left clamping mechanism includes a fixed plate, a left fixed frame, two notches I, several grooves I, several springs I, and several balls I. The inner wall of the fixed plate is bolted to the inner side wall of the etching machine body. The inner wall of the left fixed frame is in contact with the surface of the fixed plate, and two notches I are respectively opened at both ends of the outer wall and are in contact with the inner side wall of the positioning block. Several grooves I are equally spaced on the inner surface of the two notches I, and the grooves I are narrower at the top and wider at the bottom. Several springs I are respectively placed inside several grooves I. Several balls I are respectively embedded in the top of several grooves I and elastically in contact with the top of several springs I.

[0009] Furthermore, the right clamping mechanism includes a bearing, a right fixed frame, two notches II, several grooves II, several springs II, and several balls II. The bearing is embedded in the other side of the inner wall of the etching machine body. The inner end of the right fixed frame is fixedly connected to the inner ring of the bearing. Two notches II are respectively opened at both ends of the outer wall. Several grooves II are equally spaced on the inner surface of the two notches II. The grooves II are narrower at the top and wider at the bottom. Several springs II are respectively placed inside the grooves II. Several balls II are respectively embedded in the top of the grooves II and elastically fit with the top of the springs II.

[0010] Furthermore, the etching machine body includes a housing, a double door, and four support legs. The spray assembly is installed on the top of the housing, and the window is opened on one side of the inner wall, while the bearing is embedded on the other side. The filter assembly is installed inside the housing, and the double door is hinged to the outer wall. The tops of the four support legs are fixedly connected to the four corners of the bottom of the housing.

[0011] Furthermore, the spray assembly includes a water pump, an etching liquid pipe, a spray frame, and several spray heads. The water pump's pumping end is connected to the flange on the outer wall of the housing. The two ends of the etching liquid pipe are respectively fixedly connected to the water pump's draining end and the top of the spray frame. The tops of the several spray heads are threadedly fixed to the bottom of the spray frame at equal intervals.

[0012] Furthermore, the filter assembly includes four corner blocks, a frame, and a filter screen. The four corner blocks are integrally formed with the four corners of the inner wall of the box. The filter screen is embedded inside the frame, and the four bottom corners are respectively attached to the surfaces of the four corner blocks and to the inner side wall of the box.

[0013] This utility model has the following beneficial effects:

[0014] 1. The left and right clamping mechanisms of this utility model are located on both sides of the inner wall of the etching machine body and are driven synchronously by a drive mechanism. This design allows the PCB to be clamped by the two clamping mechanisms at the same time and pass through the spray area of ​​the spray assembly, thereby achieving simultaneous etching of both sides of the copper foil.

[0015] 2. The spray nozzles of this utility model are evenly distributed on the spray frame to ensure that the etching solution can be sprayed evenly onto the copper foil surface of the PCB. Combined with double-sided synchronous drive, it can effectively avoid the problem of over-etching or under-etching on one side, significantly improve the uniformity and consistency of etching, and meet the requirements of HDI and PCB for high-precision circuits. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the etching apparatus for removing impurities from copper foil provided in the embodiments of this application;

[0018] Figure 2 A schematic diagram of the internal structure of the etching machine body provided in the embodiments of this application;

[0019] Figure 3 An exploded view of the drive mechanism, left clamping mechanism, and right clamping mechanism provided for embodiments of this application;

[0020] Figure 4 A schematic diagram of the spray assembly structure provided in the embodiments of this application;

[0021] Figure 5 Provided for the implementation of this application Figure 3 Enlarged structural diagram at point A in the middle.

[0022] In the diagram: 1-Etching machine body; 2-Spray assembly; 3-Filter assembly; 4-Window; 5-Drive mechanism; 6-Left clamping mechanism; 7-Right clamping mechanism; 51-Drive motor; 52-Threaded hole; 53-Positioning block; 54-Locking bolt; 61-Fixing plate; 62-Left fixing frame; 63-Notch I; 64-Groove I; 65-Spring I; 66-Ball I; 71-Bearing; 72-Right fixing frame; 73-Notch II; 74-Groove II; 75-Spring II; 76-Ball II; 11-Box; 12-Double door; 13-Support leg; 21-Water pump; 22-Etching liquid pipe; 23-Spray frame; 24-Spray head; 31-Corner block; 32-Frame; 33-Filter screen. Detailed Implementation

[0023] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0024] Example:

[0025] Please see Figure 1 , Figure 2 , Figure 4 An etching apparatus for removing impurities from copper foil includes an etching machine body 1 and a spray assembly 2 installed on the top of the etching machine body 1, and a filter assembly 3 installed inside the body 1. The etching machine body 1 includes a housing 11, a double door 12 and four support legs 13. The spray assembly 2 includes a water pump 21, an etching liquid pipe 22, a spray frame 23 and several spray heads 24. The filter assembly 3 includes four corner blocks 31, a frame 32 and a filter screen 33.

[0026] The etching machine body 1 forms the main frame of the entire device, with a box-like structure providing a closed space for the etching process. The box 11 is the core component of the etching machine body 1, made of corrosion-resistant material to resist the corrosive effects of the etching solution. The box 11 is rectangular in shape, with its specific dimensions designed according to actual production needs to ensure sufficient space to accommodate the spray assembly 2, filter assembly 3, and enough room for the PCB to pass through and be etched. A double door 12 is hinged to the front of the outer wall of the box 11. The double door 12 is made of the same corrosion-resistant material as the box 11, and its dimensions match the opening size on the front of the box 11. The double door 12 facilitates the insertion and removal of PCBs into and out of the etching machine body 1, and allows for maintenance and repair of internal components when necessary. An observation window can be installed on the double door 12 for easy observation of the internal etching process. Four support legs 13 are fixedly connected to the four corners of the bottom of the box 11. The support legs 13 are made of sturdy and stable material, and their height can be adjusted as needed to ensure the etching machine body 1 is placed stably. Anti-slip pads can be installed at the bottom of the support leg 13 to enhance the stability of the device.

[0027] The spray assembly 2 is installed at the top inside the etching machine body 1 to evenly spray the etching solution onto the copper foil surface of the PCB. The water pump 21 is the power source for the spray assembly 2, responsible for drawing and pressurizing the etching solution from the bottom of the housing 11 and delivering it to the spray frame 23. The water pump 21 is made of corrosion-resistant material to resist the corrosion of the etching solution. Its suction end is connected to the flange interface on the outer wall of the housing 11 via a flange to ensure a good seal and prevent etching solution leakage. The drain end of the water pump 21 is connected to the spray frame 23 via an etching solution pipe 22. The etching solution pipe 22 is made of corrosion-resistant and pressure-resistant material. Its two ends are fixedly connected to the drain end of the water pump 21 and the top of the spray frame 23, respectively. The function of the etching solution pipe 22 is to transport the etching solution; its length and diameter are designed according to actual needs to ensure smooth flow of the etching solution. The spray frame 23 is installed at the top inside the etching machine body 1 to support and fix the spray heads 24. The spray frame 23 is made of corrosion-resistant materials, such as stainless steel or engineering plastics. Its shape and size are designed according to the internal space of the etching machine body 1 and the number and arrangement of the spray heads 24. The top of the spray frame 23 is fixedly connected to the etching solution pipe 22, and the bottom has several threaded holes for installing the spray heads 24. Several spray heads 24 are evenly installed at the bottom of the spray frame 23. The number and arrangement of the spray heads 24 are designed according to the size of the PCB and etching requirements to ensure that the etching solution can evenly cover the copper foil surface of the PCB. The spray heads 24 are made of corrosion-resistant materials, and their tops are connected to the threaded holes at the bottom of the spray frame 23 via threads, ensuring a firm connection and good sealing. The outlet of the spray head 24 is designed with a specific shape and size to control the spray angle and flow rate of the etching solution, achieving uniform spraying.

[0028] The filter assembly 3 is installed inside the etching machine body 1 to filter impurities in the etching solution and maintain its cleanliness. Corner blocks 31, made of corrosion-resistant material, are located at the four corners of the inner wall of the housing 11 and are integrally formed with the inner wall to ensure structural stability and facilitate the installation and fixation of the frame 32. The frame 32 is also made of corrosion-resistant material and has internal mounting grooves for securing the filter screen 33. The four bottom corners of the frame 32 are respectively attached to the surfaces of the four corner blocks 31 to ensure the overall stability of the filter assembly 3. The filter screen 33 is made of high-precision, corrosion-resistant filter material, and its pore size is selected according to actual needs to ensure effective filtration of impurities in the etching solution.

[0029] Please see Figure 1 , Figure 2 , Figure 3 , Figure 5An etching apparatus for removing impurities from copper foil includes an etching machine body 1 with a window 4 on the outer wall and a drive mechanism 5 bolted thereon. A left clamping mechanism 6 and a right clamping mechanism 7 are respectively installed on both sides of the inner wall of the etching machine body 1. The output end of the drive mechanism 5 is horizontally aligned with the shaft ends of the left clamping mechanism 6 and the right clamping mechanism 7. The drive mechanism 5 includes a drive motor 51, a threaded hole 52, a positioning block 53 and a locking bolt 54. The left clamping mechanism 6 includes a fixed plate 61, a left fixed frame 62, two notches I 63, several grooves I 64, several springs I 65 and several balls I 66. The right clamping mechanism 7 includes a bearing 71, a right fixed frame 72, two notches II 73, several grooves II 74, several springs II 75 and several balls II 76.

[0030] The design of window 4 is ingenious and practical, greatly facilitating the installation of the drive mechanism 5. Located on the outer wall of the etching machine body 1, window 4's size and position are carefully considered to ensure easy assembly and fixation of the drive mechanism 5 to the body 1. Window 4 also provides a channel for the output of the drive motor 51 to enter the housing 11. This design not only simplifies the installation process but also allows the output of the drive motor 51 to connect smoothly to the shaft of the left clamping mechanism 6, achieving precise power transmission. Through the rational design of window 4, the entire etching device has a more compact structure, operates more efficiently, and also facilitates future maintenance and repair.

[0031] The drive mechanism 5 is a key component of this etching apparatus, providing power to drive the synchronous movement of the left clamping mechanism 6 and the right clamping mechanism 7. The drive motor 51 is the core component of the drive mechanism 5, providing rotational power. The fixed end of the drive motor 51 is bolted to the outer wall of the etching machine body 1, ensuring a secure and reliable installation. The output end of the drive motor 51 has a threaded hole 52 for connecting to the left clamping mechanism 6. The threaded hole 52, located at the output end of the drive motor 51, has internal threads for mating with the locking bolt 54. The size and thread specifications of the threaded hole 52 are designed according to the size and specifications of the locking bolt 54 to ensure a secure and reliable connection. One end of the positioning block 53 is in contact with the surface of the left clamping mechanism 6 to determine its precise position. The inner wall of the positioning block 53 is hinged to the outer wall of the locking bolt 54. The locking bolt 54 is made of high-strength material. The outer wall of the locking bolt 54 is axially connected to the inner wall of the positioning block 53, that is, the locking bolt 54 is threadedly fixed to the inner wall of the threaded hole 52, and the rotational power of the drive motor 51 is transmitted to the left clamping mechanism 6.

[0032] The left clamping mechanism 6 and the right clamping mechanism 7 are key components in this etching apparatus for clamping and positioning the PCB. They are respectively installed on both sides of the inner wall of the etching machine body 1, and are driven by the drive mechanism 5 to achieve synchronous opening and closing movements, thereby achieving precise clamping, positioning, and flipping of the PCB. The left clamping mechanism 6 and the right clamping mechanism 7 have ingenious structural designs and work in perfect harmony, effectively ensuring the stability and accuracy of the PCB during the etching process. The fixing plate 61 is the base of the left clamping mechanism 6, and its inner wall is fixed to the inner side wall of the etching machine body 1 by bolts, ensuring a firm and reliable installation. The left fixing frame 62 is the main supporting component of the left clamping mechanism 6, and its inner wall is in contact with the surface of the fixing plate 61. Two notches I63 are respectively opened at both ends of the outer wall of the left fixing frame 62 for fixing the PCB. The two notches I63 are located at both ends of the outer wall of the left fixing frame 62, and their inner surfaces are respectively provided with several grooves I64 at equal intervals. Several grooves I64 are located on the inner surfaces of two notches I63, and are tapered at the top and thickened at the bottom, for embedding beads I66 and springs I65. Several springs I65 are placed inside the grooves I64 to provide elastic force. Several beads I66 are embedded in the inner top of the grooves I64 and elastically fit against the top of the springs I65. The function of the beads I66 is to reduce friction and ensure the smooth opening and closing movement of the left clamping mechanism 6. The bearing 71 is fixed to the other side of the inner wall of the etching machine body 1, providing support and rotational freedom for the right clamping mechanism 7. The right fixing frame 72 is the main supporting component of the right clamping mechanism 7, and its inner end is fixedly connected to the inner ring of the bearing 71. Two notches II73 are respectively opened at both ends of the outer wall of the right fixing frame 72. Several grooves II74 are equally spaced on the inner surface of the notches II73. Several grooves II74 are located on the inner surface of the two notches II73, and are tapered at the top and thickened at the bottom, for embedding beads II76 and springs II75. Several springs II75 are placed inside the grooves II74 to provide elastic force. Several beads II76 are embedded in the inner top of the grooves II74 and elastically fit against the top of the springs II75. The function of the beads II76 is to reduce friction and ensure the smooth opening and closing movement of the right clamping mechanism 7.

[0033] The left clamping mechanism 6 and the right clamping mechanism 7 are driven by the drive mechanism 5 to achieve synchronous opening and closing movements. When the output end of the drive motor 51 rotates, the locking bolt 54 limits the left fixed frame 62 through the positioning block 53, realizing the flipping of the left fixed frame 62. At this time, the right fixed frame 72 will rotate around the bearing 71, realizing synchronous movement with the left clamping mechanism 6.

[0034] The above is a detailed description of a specific embodiment of the cooperative operation of the left clamping mechanism 6 and the right clamping mechanism 7. This embodiment is merely an example and does not constitute a limitation on the present invention. Those skilled in the art can make various modifications and improvements to this embodiment according to actual needs, such as changing the shape and size of groove I 64 and groove II 74, using different materials for spring I 65 and spring II 75, adjusting the type and parameters of the transmission mechanism, etc. As long as these modifications and improvements do not depart from the spirit and principles of the present invention, they all fall within the protection scope of the present invention.

[0035] in,

[0036] in,

[0037] In the specific implementation plan

[0038] The working principle of the etching device for removing impurities from copper foil is as follows: During operation, the two ends of the PCB are inserted into notches I 63 and II 73. At this time, beads I 66 and II 76 roll along grooves I 64 and II 74 respectively. Springs I 65 and II 75 provide elastic force to ensure smooth and stable movement. Through this coordinated operation, the left clamping mechanism 6 and the right clamping mechanism 7 can accurately clamp and position the PCB, ensuring the stability and accuracy of the PCB during the etching process. Then, the etching solution in the housing 11 is extracted and pressurized by the water pump 21 and transported to the spray frame 23 through the etching solution pipe 22. Under pressure, the etching solution is evenly sprayed onto the copper foil surface of the PCB through the spray frame 23 and the spray head 24. The design of the spray head 24 ensures that the etching solution can be sprayed onto the PCB at a specific angle and flow rate, thereby achieving the best etching effect. After spraying, the etching solution carrying impurities flows back to the bottom of the housing 11. When the etching solution passes through the filter assembly 3, the filter screen 33 effectively intercepts the impurities. The filtered cleaning etching solution re-enters the circulation system and continues to be used in the etching process. After the copper foil impurities on the front side of the PCB are removed, the drive motor 51 is started, and its output end begins to rotate, causing the left fixing frame 62, which is limited by the locking bolt 54 and the positioning block 53, to flip. At the same time, since the left clamping mechanism 6 and the right clamping mechanism 7 are connected through the PCB, the right fixing frame 72 will also flip synchronously, thereby achieving the purpose of removing copper foil impurities on the back side of the PCB.

[0039] It should be noted that the specific models and specifications of the spray head 24, drive motor 51, and water pump 21 need to be selected and determined according to the actual specifications of the device. The specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

[0040] The power supply and operating principle of the drive motor 51 and the water pump 21 are clear to those skilled in the art and will not be described in detail here.

[0041] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this application. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An etching apparatus for removing impurities from copper foil, comprising an etching machine body (1) and a spray assembly (2) installed on the top of the etching machine body (1), and a filter assembly (3) installed inside, characterized in that: The etching machine body (1) has a window (4) on its outer side wall and a drive mechanism (5) is bolted thereon. The inner walls of the etching machine body (1) are respectively equipped with a left clamping mechanism (6) and a right clamping mechanism (7). The output end of the drive mechanism (5) is horizontally aligned with the shaft ends of the left clamping mechanism (6) and the right clamping mechanism (7).

2. The etching apparatus for removing impurities from copper foil according to claim 1, characterized in that, The drive mechanism (5) includes a drive motor (51), a threaded hole (52), a positioning block (53), and a locking bolt (54). The fixed end of the drive motor (51) is bolted to the outer wall of the etching machine body (1), and the output end is provided with the threaded hole (52), which passes through the inside of the window (4) and is inserted into the inside of the left clamping mechanism (6). One end of the positioning block (53) is in contact with the surface of the left clamping mechanism (6), and the inner wall is axially connected to the outer wall of the locking bolt (54). The bottom end of the locking bolt (54) is threaded to the inner wall of the threaded hole (52).

3. The etching apparatus for removing impurities from copper foil according to claim 2, characterized in that, The left clamping mechanism (6) includes a fixed plate (61), a left fixed frame (62), two notches I (63), several grooves I (64), several springs I (65), and several balls I (66). The inner wall of the fixed plate (61) is bolted to the inner side wall of the etching machine body (1). The inner wall of the left fixed frame (62) is in contact with the surface of the fixed plate (61), and two notches I (63) are opened at both ends of the outer wall, which are in contact with the inner side wall of the positioning block (53). Several grooves I (64) are opened at equal intervals on the inner surface of the two notches I (63), and the grooves I (64) are thinner at the top and thicker at the bottom. Several springs I (65) are placed inside several grooves I (64), and several balls I (66) are embedded in the top of several grooves I (64) and elastically in contact with the top of several springs I (65).

4. The etching apparatus for removing impurities from copper foil according to claim 3, characterized in that, The right clamp mechanism (7) includes a bearing (71), a right fixing frame (72), two notches II (73), several grooves II (74), several springs II (75), and several balls II (76). The bearing (71) is embedded in the other side of the inner wall of the etching machine body (1). The inner end of the right fixing frame (72) is fixedly connected to the inner ring of the bearing (71), and two notches II (73) are opened at both ends of the outer wall. Several grooves II (74) are opened at equal intervals on the inner surface of the two notches II (73), and the grooves II (74) are thinner at the top and thicker at the bottom. Several springs II (75) are placed inside several grooves II (74), and several balls II (76) are embedded in the top of several grooves II (74) and elastically fit with the top of several springs II (75).

5. The etching apparatus for removing impurities from copper foil according to claim 4, characterized in that, The etching machine body (1) includes a box (11), a double door (12) and four support legs (13). The spray assembly (2) is installed on the top of the box (11), and the window (4) is opened on one side of the inner wall. The bearing (71) is embedded on the other side. The filter assembly (3) is installed inside the box (11), and the double door (12) is hinged to the outer wall. The tops of the four support legs (13) are fixedly connected to the four corners of the bottom of the box (11).

6. The etching apparatus for removing impurities from copper foil according to claim 5, characterized in that, The spray assembly (2) includes a water pump (21), an etching liquid pipe (22), a spray frame (23), and several spray heads (24). The water pump (21) is connected to the outer flange of the housing (11). The two ends of the etching liquid pipe (22) are fixedly connected to the drain end of the water pump (21) and the top of the spray frame (23), respectively. The tops of the several spray heads (24) are threaded to the bottom of the spray frame (23) at equal intervals.

7. The etching apparatus for removing impurities from copper foil according to claim 6, characterized in that, The filter assembly (3) includes four corner blocks (31), a frame (32) and a filter screen (33). The four corner blocks (31) are integrally formed with the four corners of the inner wall of the box (11). The filter screen (33) is embedded inside the frame (32), and the four bottom corners are respectively attached to the surface of the four corner blocks (31) and attached to the inner side wall of the box (11).

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