Clamping device for integrated circuit production
By designing positioning components and rubber clamping heads, the problems of damage to circuit boards and cumbersome operation caused by existing clamping devices are solved, achieving damage-free fixation and efficient clamping.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN SUN MOON CORE MICROELECTRONICS CO LTD
- Filing Date
- 2025-02-14
- Publication Date
- 2026-05-15
AI Technical Summary
Existing clamping devices used in integrated circuit manufacturing are prone to damaging circuit boards when fixing them due to improper control of the force applied to the rotating nut. Furthermore, they are cumbersome to operate and affect production efficiency.
The positioning components include a mounting base, connecting rod, movable plate, and threaded rod. The circuit board is fixed by pressing with a handle. Combined with a rubber clamping head and threaded connection, it can meet the clamping needs of circuit boards of different thicknesses.
It achieves non-destructive circuit board fixing, simplifies the operation process, and improves production efficiency and equipment applicability.
Smart Images

Figure CN224249932U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of integrated circuit technology, specifically to a clamping device for integrated circuit production. Background Technology
[0002] Circuit boards are named as follows: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed circuit board, etc.
[0003] When processing circuit boards, some electronic components need to be soldered onto the circuit board. In order to facilitate the soldering of circuit board components, tools are needed to clamp and limit them. To prevent the clamping tools from moving, they are usually fixed above the worktable.
[0004] Existing clamping devices for integrated circuit manufacturing typically use a nut rotation method to press and fix the circuit board by moving the clamping plate. When rotating the nut, the tightening force cannot be controlled. When the nut is rotated too many times, the clamping force is too large, which can easily damage the circuit board. At the same time, the nut fixing operation is cumbersome, resulting in low production efficiency during the mass production of circuit boards, which is not conducive to high-efficiency production.
[0005] In view of the above, this application is hereby submitted. Utility Model Content
[0006] The purpose of this invention is to provide a clamping device for integrated circuit manufacturing to solve the problems mentioned in the background art.
[0007] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a clamping device for integrated circuit production, wherein a positioning component for pressing and fixing a circuit board is provided on the support plate; the positioning component includes a mounting seat symmetrically fixedly installed on the top surface of the support plate, a connecting rod and a movable plate are rotatably connected to the top of the mounting seat, a handle is rotatably connected to the end of the connecting rod away from the mounting seat, one end of the handle is rotatably connected to the movable plate, a movable seat is fixedly installed at the end of the movable plate away from the handle, a threaded rod is threadedly connected inside the movable seat, and a pressing head is fixedly connected to the bottom end of the threaded rod.
[0008] Furthermore, both the top and bottom surfaces of the movable seat are provided with pads, and nuts are fixedly installed on the pads, with the threaded rod threadedly connected inside the nuts.
[0009] Furthermore, the pressure head has a conical structure and is made of rubber.
[0010] Furthermore, the top surface of the support plate is provided with a mounting plate, and the mounting base is fixedly mounted on the mounting plate. There are two mounting plates, and the two mounting plates are symmetrically arranged at both ends of the top surface of the support plate.
[0011] Furthermore, the mounting base consists of two mutually symmetrical support plates, with a gap formed between the two support plates, and the connecting rod and the movable plate are rotatably connected within the gap.
[0012] Furthermore, an anti-slip sleeve is fixedly installed at the end of the grip away from the movable plate, and the outer surface of the anti-slip sleeve is integrally formed with anti-slip texture.
[0013] Compared with the prior art, the beneficial effects of this utility model are: it allows employees to fix integrated circuits without touching the integrated circuit board; the silicone pad prevents damage to the integrated circuit board; the handle presses down to fix the circuit board, reducing the time required to fix the circuit board and facilitating the operation of workers; at the same time, it can quickly clamp and fix integrated circuit boards of different thicknesses and sizes, improving the practicality of the device. Attached Figure Description
[0014] Figure 1 This is a front view structural diagram of the present utility model;
[0015] Figure 2 This is a schematic diagram of the positioning component in this utility model;
[0016] Figure 3 This is a side view of the structure of this utility model;
[0017] Figure 4 This is a top view of the structure of this utility model.
[0018] In the picture:
[0019] 1. Bearing plate; 2. Mounting plate; 3. Mounting seat; 4. Connecting rod; 5. Handle; 6. Anti-slip sleeve; 7. Movable plate; 8. Movable seat; 9. Threaded rod; 10. Nut; 11. Washer plate; 12. Pressure head. Detailed Implementation
[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0021] Please see Figure 1-4This utility model provides a technical solution: a clamping device for integrated circuit production, including a support plate 1, a mounting plate 2 fixedly mounted on the top surface of the support plate 1, a mounting base 3 fixedly mounted on the top center of the mounting plate 2, a connecting rod 4 and a movable plate 7 rotatably connected to the top of the mounting base 3, a handle 5 rotatably connected to the end of the connecting rod 4 away from the mounting base 3, an anti-slip sleeve 6 fixedly mounted on one end of the handle 5, and the movable plate 7 rotatably connected to the other end. Moving the anti-slip sleeve 6 downwards causes the handle 5 to move downwards, reducing the time for fixing the circuit board and facilitating the worker's operation. The movable plate 7 is located away from the mounting base 3 and the handle 5. One end of the device is fixedly installed with a movable seat 8. The handle 5 drives the connecting rod 4 and the movable plate 7 to rotate and move. The movable seat 8 is moved downward, thereby causing the pressure head 12 to move downward. The movable seat 8 is threadedly connected to the threaded rod 9 inside by the pad 11 and the nut 10. The threaded rod 9 can be adjusted up and down by the nut 10, so that the device can adapt to circuit boards of different thicknesses and can quickly clamp and fix integrated circuit boards of different thicknesses and sizes. The threaded rod 9 is fixedly connected to the pressure head 12. The bottom of the pressure head 12 is fitted with a rubber pad. The contact between the silicone pad and the integrated circuit board will not cause damage to the integrated circuit board.
[0022] See Figure 2 The top and bottom surfaces of the movable seat 8 are provided with pads 11, and nuts 10 are fixedly installed on the pads 11. The threaded rod 9 is threadedly connected to the inside of the nut 10.
[0023] The use of a threaded connection allows the threaded rod 9 to move vertically on the movable seat 8, thereby enabling adaptive adjustment according to the thickness of the circuit board and increasing the applicability of the clamping device.
[0024] See Figure 2 The pressing head 12 has a conical structure and is made of rubber.
[0025] The rubber clamping head 12 can prevent damage caused by hard contact between the clamping parts and the circuit board during the clamping process.
[0026] See Figure 1 The top surface of the bearing plate 1 is provided with a mounting plate 2, and the mounting base 3 is fixedly installed on the mounting plate 2. There are two mounting plates 2, and the two mounting plates 2 are symmetrically arranged at both ends of the top surface of the bearing plate 1.
[0027] The mounting plate 2 serves as a limit to prevent the circuit board placed on the support plate 1 from shifting left or right.
[0028] See Figure 2 The mounting base 3 consists of two mutually symmetrical support plates, and a gap is formed between the two support plates. The connecting rod 4 and the movable plate 7 are rotatably connected in the gap.
[0029] By rotating the connecting rod 4 and the movable plate 7 within the gap, the stability of their rotation can be improved, while providing clearance for the rotation of the connecting rod 4 and the movable plate 7.
[0030] See Figure 2 An anti-slip sleeve 6 is fixedly installed at the end of the grip 5 away from the movable plate 7, and the outer surface of the anti-slip sleeve 6 is integrally formed with anti-slip texture.
[0031] The anti-slip sleeve 6 increases the friction between the operator's palm and the handle 5, thereby achieving an anti-slip effect and improving the operator's grip stability.
[0032] Working principle: The operator places the integrated circuit board to be processed on the carrier plate 1 and presses down on the handle 5. As the handle 5 moves, it drives the connecting rod 4 and the movable plate 7 to rotate. As the movable plate 7 rotates, it drives the movable seat 8 to swing downward, thereby causing the threaded rod 9 and the pressing head 12 to rotate and move. As the handle 5 continues to press down, the pressing head 12 moves downward, allowing the pressing head 12 to press and hold the integrated circuit board placed on the carrier plate 1. The integrated circuit board is fixed by pressing. The structure is simple and easy to operate. At the same time, it can avoid damage to the integrated circuit board caused by excessive pressing force and improve the fixing efficiency of the integrated circuit board.
Claims
1. A clamping device for integrated circuit manufacturing, comprising a carrier plate (1), characterized in that: The support plate (1) is provided with a positioning component for pressing and fixing the circuit board; The positioning assembly includes a mounting base (3) symmetrically fixedly installed on the top surface of the support plate (1). The top of the mounting base (3) is rotatably connected to a connecting rod (4) and a movable plate (7). The end of the connecting rod (4) away from the mounting base (3) is rotatably connected to a handle (5). One end of the handle (5) is rotatably connected to the movable plate (7). The end of the movable plate (7) away from the handle (5) is fixedly installed with a movable seat (8). The movable seat (8) is internally threaded with a threaded rod (9). The bottom end of the threaded rod (9) is fixedly connected with a pressure head (12).
2. The clamping device for integrated circuit manufacturing as described in claim 1, characterized in that: The top and bottom surfaces of the movable seat (8) are provided with pads (11), and nuts (10) are fixedly installed on the pads (11). The threaded rod (9) is threadedly connected to the inside of the nut (10).
3. The clamping device for integrated circuit manufacturing as described in claim 1, characterized in that: The pressure head (12) has a conical structure and is made of rubber.
4. The clamping device for integrated circuit manufacturing as described in claim 1, characterized in that: The top surface of the support plate (1) is provided with an mounting plate (2), and the mounting base (3) is fixedly installed on the mounting plate (2). There are two mounting plates (2), and the two mounting plates (2) are symmetrically arranged at both ends of the top surface of the support plate (1).
5. The clamping device for integrated circuit manufacturing as described in claim 1, characterized in that: The mounting base (3) consists of two mutually symmetrical support plates, and a gap is formed between the two support plates. The connecting rod (4) and the movable plate (7) are rotatably connected in the gap.
6. The clamping device for integrated circuit manufacturing as described in claim 1, characterized in that: The grip (5) is fixedly installed with an anti-slip sleeve (6) at the end away from the movable plate (7), and the outer surface of the anti-slip sleeve (6) is integrally formed with anti-slip texture.