Shell assembly and inverter

Abstract

The utility model provides a shell assembly and an inverter. The shell assembly comprises a bottom plate; the surrounding frame is distributed in the circumferential direction of the bottom plate, a containing cavity is defined between the bottom plate and the surrounding frame, and the first electronic device is arranged in the containing cavity; the heat dissipation piece is arranged on the face, away from the containing cavity, of the bottom plate; wherein the enclosure frame is provided with a heat resistance wall, a gap is reserved between the heat resistance wall and the heat dissipation piece, the bottom plate is provided with a heat insulation part, the heat insulation part is arranged between the heat resistance wall and the heat dissipation piece, and the heat insulation part is used for slowing down heat conduction from the bottom plate to the heat resistance wall. Most heat conducted to the bottom plate by the first electronic device can be conducted to the heat dissipation piece for heat dissipation, only a small part of heat can be conducted to the heat resistance wall, the temperature of the heat resistance wall is prevented from being too high, a user is prevented from being scalded when making contact with the heat resistance wall, and the user experience is improved.

Description

Technical Field

[0001] This application relates to the field of inverter technology, and in particular to a housing assembly and an inverter. Background Technology

[0002] Inverters are a crucial component of photovoltaic energy storage systems. They typically consist of a housing and various electronic devices housed within it. The housing is usually made of metal, with heat dissipation fins on its outer surface. During operation, heat generated by the electronic devices inside the housing is conducted to the heat dissipation fins for cooling. However, other areas of the housing that are easily touched by the user, such as the top and sides, can also heat up. Excessive temperature can cause burns and negatively impact the user experience. Utility Model Content

[0003] In view of the above, it is necessary to provide a housing assembly and an inverter to solve the above-mentioned defects.

[0004] The first aspect of this application provides a housing assembly for use in an inverter. The inverter includes a first electronic device. The housing assembly includes: a base plate; a frame distributed circumferentially along the base plate, with the base plate and the frame forming an accommodating cavity, and the first electronic device disposed within the accommodating cavity; and a heat sink disposed on the side of the base plate away from the accommodating cavity. The frame has a heat-insulating wall, with a gap between the heat-insulating wall and the heat sink. The base plate has a heat-insulating portion disposed between the heat-insulating wall and the heat sink, and the heat-insulating portion is used to reduce heat conduction from the base plate to the heat-insulating wall.

[0005] In some embodiments, the heat insulation portion is a heat insulation groove, which is recessed from the surface of the base plate.

[0006] In some embodiments, the heat insulation portion is a heat insulation protrusion, which protrudes from the side of the base plate away from the receiving cavity and is recessed on the side of the base plate facing the receiving cavity to form a groove.

[0007] In some embodiments, the heat insulation part is a heat insulation hole that penetrates both sides of the base plate.

[0008] In some embodiments, the base plate is also provided with a sealing strip, which blocks the heat insulation holes.

[0009] In some embodiments, the thickness of the sealing strip is less than the thickness of the base plate.

[0010] In some embodiments, the thermal conductivity of the sealing strip is less than that of the base plate.

[0011] In some embodiments, a sealing ring is provided between the sealing strip and the base plate, and the sealing ring is distributed around the heat insulation hole.

[0012] In some embodiments, the length direction of the heat insulation portion forms an angle with the heat flow direction corresponding to the heat-insulating wall, and the heat flow direction is the direction in which the heat emitted by the first electronic device is conducted from the base plate to the heat-insulating wall.

[0013] A second aspect of this application provides an inverter, including a first electronic device and a housing assembly provided in the first aspect; the first electronic device is disposed within a receiving cavity.

[0014] The housing assembly and inverter provided in this application allow for the placement of a heat insulation section on the base plate between the heat-resistant wall and the heat sink. This heat insulation section spans the heat conduction path between the first electronic device and the heat-resistant wall, hindering the conduction of heat from the first electronic device from the base plate to the heat-resistant wall. Consequently, most of the heat conducted from the first electronic device to the base plate can be conducted to the heat sink for dissipation, with only a small portion being conducted to the heat-resistant wall. This prevents the heat-resistant wall from overheating, avoiding burns to the user upon contact and improving the user experience. Attached Figure Description

[0015] Figure 1 A schematic diagram of the inverter provided in this application.

[0016] Figure 2 This is a schematic diagram of the layout of the underlying space within the inverter provided in this application.

[0017] Figure 3 This is a schematic diagram of the layout of the top-level space inside the inverter provided in this application.

[0018] Figure 4 A front view of the first embodiment of the housing assembly provided in this application.

[0019] Figure 5 A schematic diagram of the first electronic device and the heat-insulating wall provided in this application using a first layout.

[0020] Figure 6 A schematic diagram of the second layout of the first electronic device and the heat-insulating wall provided in this application.

[0021] Figure 7 A schematic diagram of the first electronic device and the heat-insulating wall provided in this application using a third layout.

[0022] Figure 8 This is a cross-sectional schematic diagram of a first embodiment of the housing assembly provided in this application.

[0023] Figure 9 A front view of a second embodiment of the housing assembly provided in this application.

[0024] Figure 10 A rear view of a second embodiment of the housing assembly provided in this application.

[0025] Figure 11 This is a cross-sectional schematic diagram of a second embodiment of the housing assembly provided in this application.

[0026] Figure 12 A front view of a third embodiment of the housing assembly provided in this application.

[0027] Figure 13 An exploded view of the back side of a third embodiment of the housing assembly provided in this application.

[0028] Figure 14 A cross-sectional schematic diagram of a third embodiment of the housing assembly provided in this application.

[0029] Figure 15 A schematic diagram of the heat conduction path for a first embodiment of the housing assembly provided in this application.

[0030] Figure 16 A schematic diagram of the heat conduction path for a second embodiment of the housing assembly provided in this application.

[0031] Figure 17 A schematic diagram of the heat conduction path for a third embodiment of the housing assembly provided in this application.

[0032] Explanation of main component symbols

[0033] 100. Housing assembly;

[0034] 10. Base plate; 11. Receiving cavity; 12. Receiving slot;

[0035] 20. Enclosure frame; 21. Heat-insulating wall;

[0036] 30. Heat sink components;

[0037] 40. Shell cover;

[0038] 50. Insulation section; 51. Insulation groove; 52. Insulation protrusion; 521. Groove section; 53. Insulation hole; 531. Sealing strip; 532. Sealing ring;

[0039] 200. First electronic device;

[0040] 300. Second electronic device; 301. Bus capacitor; 302. Relay; 303. Control chip; 304. Display screen;

[0041] 400. Motherboard;

[0042] 500. Cooling fan;

[0043] 600, power inductor. Detailed Implementation

[0044] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments.

[0045] In the description of the embodiments in this application, the words "exemplary" or "for example" are used to indicate that they are examples, illustrations, or descriptions. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design options. Specifically, the use of the words "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0046] In related technologies, inverters typically employ a die-cast, one-piece metal housing, with the housing, heat sink fins, and other features integrated into a single structural component, forming a homogeneous whole. The housing houses high-heat-generating electronic components such as transistors. The heat from these components is conducted through the housing to the heat sink fins, where it is dissipated more quickly.

[0047] However, when electronic components that generate a lot of heat, such as transistors, are placed near the edge of the casing, some of their heat will be conducted to the sides of the casing, causing the inverter's side temperature to become too high. Since the sides of the inverter are easily touched during use, excessively high temperatures in this area can cause burns or even scalds.

[0048] To address the aforementioned issues, existing products typically employ the following improvements: 1. Increasing the inverter's casing size to enlarge the heat exchange area; 2. Adding a fan to the casing for auxiliary cooling; 3. Using more and higher-specification transistors to reduce heat loss. However, these measures lead to increased size, weight, cost, and noise, leaving considerable room for improvement.

[0049] Therefore, this application first provides a housing assembly and an inverter, which have the technical effects of reducing the risk of burns to the human body and improving the user experience.

[0050] Figure 1 A schematic diagram of the inverter provided in this application. Figure 2 This is a schematic diagram of the layout of the underlying space within the inverter provided in this application. Figure 3 This is a schematic diagram of the layout of the top-level space inside the inverter provided in this application.

[0051] like Figures 1 to 3As shown, this application embodiment first provides a housing assembly 100, which is applied to an inverter. The inverter includes a first electronic device 200, a second electronic device 300, and the housing assembly 100. The housing assembly 100 has an internal accommodating cavity 11, in which the first electronic device 200 and the second electronic device 300 are both disposed. The accommodating cavity 11 has a top space and a bottom space along its depth direction (i.e., the Y-axis direction in the figure). The top space is close to the opening of the accommodating cavity 11, and the bottom space is close to the bottom of the accommodating cavity 11. The first electronic device 200 is disposed in the bottom space, and the second electronic device 300 is disposed in the top space.

[0052] In the example of this application, the inverter also includes a motherboard 400 and a cooling fan 500, both of which are connected to the motherboard 400. The motherboard 400 is disposed within the accommodating cavity 11 and is fixedly connected to the housing assembly 100. The motherboard 400 is located at the boundary between the top and bottom layers.

[0053] In the example of this application, the first electronic device 200 can be a transistor or other device, and the first electronic device 200 mainly dissipates heat through heat conduction by the housing assembly 100. The second electronic device 300 can be a bus capacitor 301, a relay 302, a control chip 303, a display screen 304, etc., and the second electronic device 300 mainly dissipates heat through a cooling fan 500.

[0054] Figure 4 A front view of the first embodiment of the housing assembly provided in this application.

[0055] Please refer to the following: Figure 4 In this embodiment, the housing assembly 100 includes a base plate 10, a frame 20, a heat sink 30, and a cover 40. The frame 20 is distributed circumferentially along the base plate 10, and the base plate 10 and the frame 20 enclose a cavity 11. The cover 40 covers the opening of the cavity 11 and is detachably connected to the frame 20. The heat sink 30 is disposed on the side of the base plate 10 facing away from the cavity 11. A first electronic device 200 is disposed within the cavity 11, and the first electronic device 200 is close to or connected to the base plate 10 so that the heat emitted by the first electronic device 200 can be conducted to the base plate 10 and then to the heat sink 30.

[0056] The frame 20 includes a heat-insulating wall 21, with a gap between the heat-insulating wall 21 and the heat sink 30. The heat-insulating wall 21 is the side wall of the frame 20 that is closest to the first electronic device 200. The base plate 10 is provided with a heat-insulating part 50, which is disposed between the heat-insulating wall 21 and the heat sink 30. The heat-insulating part 50 is used to reduce the heat conduction from the base plate 10 to the heat-insulating wall 21.

[0057] It is understandable that by placing the heat insulation part 50 on the base plate 10 between the heat-insulating wall 21 and the heat sink 30, the heat insulation part 50 spans the heat conduction path between the first electronic device 200 and the heat-insulating wall 21, thus hindering the conduction of heat from the first electronic device 200 from the base plate 10 to the heat-insulating wall 21. In this way, most of the heat conducted from the first electronic device 200 to the base plate 10 can be conducted to the heat sink 30 for heat dissipation, and only a small portion of the heat can be conducted to the heat-insulating wall 21, preventing the heat-insulating wall 21 from becoming too hot and avoiding burns to the user when touching it, thereby improving the user experience.

[0058] In the example of this application, the inverter can be installed with the base plate 10 set vertically, and the inverter fixed to a fixed object such as a wall by means of a heat sink 30 mounted against its back. The frame 20 has an upper side wall, a lower side wall, a left side wall, and a right side wall. The specific position of the heat-insulating wall 21 can be adjusted according to the relative position of the first electronic device 200 and the frame 20.

[0059] Figures 5 to 7 Schematic diagrams showing different layouts of the first electronic device and the heat-insulating wall provided in this application.

[0060] Please refer to the following: Figures 5 to 7 For example, when the first electronic device 200 is integrally arranged on the upper part of the base plate 10 (e.g.) Figure 5 As shown), the distance between the first electronic device 200 and the upper side wall of the frame 20 is relatively close, so the upper side wall is a heat-insulating wall 21A, and a heat-insulating part 50A is provided on the upper part of the base plate 10.

[0061] For example, when the first electronic device 200 is integrally arranged in the middle of the base plate 10 and close to the side (e.g.) Figure 6 As shown), the distance between the first electronic device 200 and the left side wall of the frame 20 is relatively close, so the left side wall is a heat-insulating wall 21B, and a heat-insulating part 50B is provided on the left side of the base plate 10.

[0062] For example, when the first electronic device 200 is integrally arranged on the upper part of the base plate 10 and close to the side (e.g.) Figure 7 As shown), the distance between the first electronic device 200 and the upper side wall and the left side wall of the frame 20 is relatively close, so the upper side wall and the left side wall are heat-insulating walls 21A and 21B respectively, and the upper part and the left side of the base plate 10 are respectively provided with corresponding heat-insulating parts 50A and 50B.

[0063] In some embodiments, the base plate 10 is generally rectangular and can be die-cast from a material such as aluminum or aluminum alloy that combines good heat dissipation performance and mechanical hardness. The base plate 10 has a first region and a second region, with the first electronic device 200 located in the first region. The second region is recessed towards the heat sink 30 to form a receiving groove 12, in which a power inductor 600 can be installed. The frame 20 is rectangularly distributed along the periphery of the base plate 10. The frame 20 and the base plate 10 are integrally die-cast, and the cover 40 is bolted to the frame 20.

[0064] In other embodiments, the base plate 10 may also take the shape of other shapes such as circles or waist shapes. The specific design can be made according to actual needs, and the shape of the frame 20 can also be adjusted adaptively. This application does not limit this.

[0065] In some embodiments, the heat sink 30 can be a finned heat sink. The heat sink 30 has a plurality of heat sink fins, which are spaced apart along a first direction, and each heat sink fin extends along a second direction. There is an angle between the first direction and the second direction, wherein the first direction is exemplified by the X-axis direction in the figure, and the second direction is exemplified by the Z-axis direction in the figure.

[0066] In some embodiments, the heat sink 30 and the base plate 10 are integrally die-cast to improve processing efficiency and reduce production costs. In other embodiments, the heat sink 30 can also be fixed to the base plate 10 by other means such as bonding or bolting, and this application does not impose any restrictions on this.

[0067] In some embodiments, the length direction of the heat insulation part 50 is at an angle to the heat flow direction corresponding to the heat-insulating wall 21 (i.e., the h direction in the figure), wherein the heat flow direction is the direction in which the heat emitted by the first electronic device 200 is conducted from the base plate 10 to the heat-insulating wall 21, that is, the extension direction of the shortest heat conduction path from the first electronic device 200 to the heat-insulating wall 21.

[0068] For example, the length direction of the heat insulation portion 50 is parallel to the length direction of the adjacent heat-insulating wall 21, so that the heat insulation portion 50 and the heat flow direction of the heat-insulating wall 21 are perpendicular to each other, ensuring that the heat insulation portion 50 can block the heat from the base plate 10 to the heat-insulating wall 21 along the heat flow direction.

[0069] The heat flow direction of the heat-insulating wall 21 can be configured according to the relative position of the first electronic device 200 and the frame 20. For example, when the upper side wall of the frame 20 is a heat-insulating wall 21A, a heat insulation part 50A corresponding to the heat-insulating wall 21A is provided on the upper part of the base plate 10. The heat emitted by the first electronic device 200 is mainly conducted from the base plate 10 to the heat-insulating wall 21A along the second direction, that is, the heat flow direction of the heat-insulating wall 21A is the second direction. Then, the heat insulation part 50A extends along the first direction so that the heat insulation part 50A is perpendicular to the heat flow direction corresponding to the heat-insulating wall 21A.

[0070] For example, if the left side wall of the frame 20 is a heat-insulating wall 21B, a heat-insulating part 50B corresponding to the heat-insulating wall 21B is provided on the left side of the base plate 10. The heat emitted by the first electronic device 200 is mainly conducted from the base plate 10 to the heat-insulating wall 21B along the first direction, that is, the heat flow direction of the heat-insulating wall 21B is the first direction. Then the heat-insulating part 50B is extended along the second direction so that the heat-insulating part 50B is perpendicular to the heat flow direction corresponding to the heat-insulating wall 21B.

[0071] Figure 8 This is a cross-sectional schematic diagram of a first embodiment of the housing assembly provided in this application.

[0072] Please refer to the following: Figure 8 In this embodiment, the heat insulation portion 50 is a heat insulation groove 51, which is recessed from the surface of the base plate 10. For example, the heat insulation groove 51 is located on the side of the base plate 10 facing the receiving cavity 11, and is formed by thinning a portion of the base plate 10. The heat insulation groove 51 is generally elongated and straight, and its extending direction is perpendicular to the heat flow direction of the corresponding heat-insulating wall 21.

[0073] By setting the heat insulation groove 51 between the first electronic device 200 and the heat-insulating wall 21, the thermal cross-sectional area of ​​the local area on the heat conduction path from the first electronic device 200 to the heat-insulating wall 21 can be reduced, thereby increasing the thermal resistance, slowing down the conduction of heat from the first electronic device 200 from the base plate 10 to the heat-insulating wall 21, and reducing the temperature of the heat-insulating wall 21.

[0074] It is worth noting that the heat insulation groove 51 in this embodiment is an example of a long straight line. In other embodiments, the heat insulation groove 51 can also take the form of a long curved line, a combination of multiple line segments, etc., as long as it can achieve the effect of slowing down the conduction of heat from the first electronic device 200 from the base plate 10 to the heat-insulating wall 21. This application does not limit this.

[0075] Figure 9 A front view of a second embodiment of the housing assembly provided in this application. Figure 10 A rear view of a second embodiment of the housing assembly provided in this application. Figure 11This is a cross-sectional schematic diagram of a second embodiment of the housing assembly provided in this application.

[0076] Please refer to the following: Figures 9 to 11 In the second embodiment, the heat insulation portion 50 is a heat insulation protrusion 52. The heat insulation protrusion 52 protrudes from the side of the base plate 10 away from the receiving cavity 11 and is recessed on the side of the base plate 10 facing the receiving cavity 11 to form a groove portion 521. Exemplarily, the heat insulation protrusion 52 is integrally die-cast with the base plate 10. The heat insulation protrusion 52 protrudes outward from the outer side of the base plate 10 and is recessed inward from the inner side of the base plate 10. The heat insulation protrusion 52 is generally long and straight, and the extending direction of the groove portion 521 is perpendicular to the heat flow direction of the corresponding heat-insulating wall 21.

[0077] By setting the heat-insulating protrusion 52 between the first electronic device 200 and the heat-insulating wall 21, the heat conduction path from the first electronic device 200 to the heat-insulating wall 21 can be extended, thereby increasing the thermal resistance, slowing down the conduction of heat from the first electronic device 200 from the base plate 10 to the heat-insulating wall 21, and reducing the temperature of the heat-insulating wall 21.

[0078] It is worth noting that the heat-insulating protrusion 52 in this embodiment is an example of a long straight line. In other embodiments, the groove 521 can also take the form of a long curved line, a combination of multiple line segments, etc., as long as it can achieve the effect of slowing down the conduction of heat from the first electronic device 200 from the base plate 10 to the heat-insulating wall 21. This application does not limit this.

[0079] Figure 12 A front view of a third embodiment of the housing assembly provided in this application. Figure 13 An exploded view of the back side of a third embodiment of the housing assembly provided in this application. Figure 14 A cross-sectional schematic diagram of a third embodiment of the housing assembly provided in this application.

[0080] Please refer to the following: Figures 12 to 14 In the third embodiment, the heat insulation part 50 is a heat insulation hole 53, which penetrates both sides of the base plate 10. For example, the heat insulation hole 53 is generally a long straight line, and its extension direction is perpendicular to the heat flow direction of the corresponding heat-resistant wall 21. By placing the heat insulation hole 53 between the first electronic device 200 and the heat-resistant wall 21, the thermal conductivity cross-sectional area of ​​the local area on the heat conduction path from the first electronic device 200 to the heat-resistant wall 21 can be reduced, thereby increasing the thermal resistance, slowing down the conduction of heat from the first electronic device 200 from the base plate 10 to the heat-resistant wall 21, and reducing the temperature of the heat-resistant wall 21.

[0081] Specifically, the base plate 10 is also provided with a sealing strip 531, which seals the heat insulation hole 53. For example, the thermal conductivity of the sealing strip 53 is lower than that of the base plate 10, and the sealing strip 531 is made of a low thermal conductivity material such as plastic or stainless steel. The thickness of the sealing strip 531 is less than the thickness of the base plate 10. A sealing ring 532 is provided between the sealing strip 531 and the base plate 10, distributed around the heat insulation hole 53, and the sealing ring 532 is made of a low thermal conductivity material such as rubber. The sealing ring 532 is embedded in the base plate 10, and the sealing strip 531 covers the sealing ring 532 and is bonded and fixed to the base plate 10.

[0082] By setting the sealing strip 531 in the heat insulation hole 53, on the one hand, it can prevent external debris from entering the base plate 10 through the heat insulation hole 53. On the other hand, it can replace the cast aluminum material used in the base plate 10 with a material with low thermal conductivity at the heat insulation hole 53, increase the thermal resistance, slow down the conduction of heat from the first electronic device 200 from the base plate 10 to the heat insulation wall 21, and reduce the temperature of the heat insulation wall 21.

[0083] It is worth noting that the heat insulation hole 53 in this embodiment is an example of a long straight line. In other embodiments, the heat insulation hole 53 can also take the form of a long curved line, a combination of multiple line segments, etc. The sealing strip 531 can be configured according to the shape of the heat insulation protrusion 52. This application does not limit this.

[0084] The implementation principle of the housing assembly 100 provided in this application will be explained below.

[0085] The temperature rise of the housing assembly 100 is mainly caused by the heat generated by the first electronic device 200, which is conducted through the integral die-cast base plate 10. The heat conduction process of the first electronic device 200 can be approximated as a one-dimensional heat conduction path for analysis. The thermal resistance of the conduction can be obtained by Fourier's law of thermal conduction and follows the following formula (1).

[0086] (1)

[0087] When there are inconsistent structural features along the same heat conduction path, it can be divided into multiple paths, and the thermal resistance of each path can be calculated separately. The total thermal resistance of the path is derived from the thermal resistance series formula, which is given by formula (2).

[0088] (2)

[0089] The temperature difference between the first electronic device 200 and the heat-resistant wall 21 can be described by formula (3).

[0090] (3)

[0091] in, The temperature of the base plate 10 corresponding to the first electronic device 200; The temperature of the heat-insulating wall 21; The heat transfer from the first electronic device 200 to the heat-insulating wall 21 through the base plate 10.

[0092] Since the above measures do not significantly affect the total heat dissipation area and are not located at the core of the heat source, they will not significantly affect the heat dissipation effect of the housing assembly 100 on the first electronic device 200, and the temperature of the first electronic device 200 after reaching thermal stability will remain stable. There won't be any major changes.

[0093] For each path segment, it can be increased by adding , reduce or To increase thermal resistance .when When unchanged, It will be because It increases with the increase of; when When there are no significant changes, It will be because It decreases as it increases.

[0094] Figure 15 A schematic diagram of the heat conduction path for a first embodiment of the housing assembly provided in this application.

[0095] Please refer to the following: Figure 15 For the first embodiment, the heat conduction path can be defined as three segments, namely 1-1, 1-2, and 1-3, with corresponding thermal resistances of respectively. , ,and Paths 1-2 reduce the thickness of the base plate by thinning it out in certain areas. ,so Compared to the original thickness, the thermal resistance of this path section has increased, thus reducing the temperature of the heat-resistant wall 21.

[0096] Figure 16 A schematic diagram of the heat conduction path for a second embodiment of the housing assembly provided in this application.

[0097] Please refer to the following: Figure 16 For the second embodiment, the heat conduction path can be defined as three segments, namely 2-1, 2-2, and 2-3, with corresponding thermal resistances of respectively. , ,and Path 2-2 has an increased path length, meaning it increases... ,so Compared to the original thickness, the thermal resistance of this path section has increased, thus reducing the temperature of the heat-resistant wall 21.

[0098] Figure 17 A schematic diagram of the heat conduction path for a third embodiment of the housing assembly provided in this application.

[0099] Please refer to the following: Figure 17 For the third embodiment, the heat conduction path can be defined as three segments, namely 3-1, 3-2, and 3-3, with corresponding thermal resistances of respectively. , ,and Path 3-2 replaces the die-cast aluminum in the original path with a material with lower thermal conductivity, and the sealing strip 531 is thinner, thus significantly reducing... At the same time, additional contact thermal resistance will be generated at the contact area between the base plate 10 and the sealing strip 531. and .so Compared to the original thickness, the thermal resistance of this path section has increased significantly, thus reducing the temperature of the heat-resistant wall 21.

[0100] This application embodiment also provides an inverter, which includes a first electronic device 200, a second electronic device 300 and a housing assembly 100 as described in any of the above embodiments. The housing assembly 100 has an accommodating cavity 11 inside, and the first electronic device 200 and the second electronic device 300 are both disposed in the accommodating cavity 11, and the first electronic device 200 is disposed on the base plate 10.

[0101] The working principle and beneficial effects of the inverter provided in this application can be seen in the relevant descriptions in the foregoing embodiments, and will not be repeated here.

[0102] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments described above should be considered exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this application.

Claims

1. A housing assembly, characterized in that, Applied to an inverter, the inverter including a first electronic device, the housing assembly including: Base plate; A frame is distributed around the base plate, and the base plate and the frame enclose a cavity to which the first electronic device is disposed; A heat dissipation component is disposed on the side of the base plate opposite to the receiving cavity; The frame has a heat-insulating wall with a gap between it and the heat dissipation component. The base plate has a heat-insulating part between it and the heat dissipation component. The heat-insulating part is used to slow down the heat conduction from the base plate to the heat-insulating wall.

2. The housing assembly as claimed in claim 1, characterized in that, The heat insulation part is a heat insulation groove, which is recessed from the surface of the base plate.

3. The housing assembly as claimed in claim 1, characterized in that, The heat insulation part is a heat insulation protrusion, which protrudes from the side of the base plate away from the receiving cavity and is recessed on the side of the base plate facing the receiving cavity to form a groove.

4. The housing assembly as claimed in claim 1, characterized in that, The heat insulation part is a heat insulation hole, which penetrates both sides of the base plate.

5. The housing assembly as claimed in claim 4, characterized in that, The base plate is also provided with a sealing strip, which blocks the heat insulation hole.

6. The housing assembly as claimed in claim 5, characterized in that, The thickness of the sealing strip is less than the thickness of the base plate.

7. The housing assembly as claimed in claim 5, characterized in that, The thermal conductivity of the sealing strip is less than that of the base plate.

8. The housing assembly as claimed in claim 5, characterized in that, A sealing ring is provided between the sealing strip and the base plate, and the sealing ring is distributed around the heat insulation hole.

9. The housing assembly as claimed in any one of claims 1-8, characterized in that, The length direction of the heat insulation part forms an angle with the heat flow direction corresponding to the heat-insulating wall, and the heat flow direction is the direction in which the heat emitted by the first electronic device is conducted from the base plate to the heat-insulating wall.

10. An inverter, characterized in that, It includes a first electronic device and a housing assembly as described in any one of claims 1 to 9; the first electronic device is disposed within the accommodating cavity.

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