Half-bridge IPM packaging lead frame and half-bridge IPM packaging module

Abstract

A half-bridge IPM packaging lead frame and a half-bridge IPM packaging module are provided. A frame packaging unit of the frame is internally provided with a first base island arranged in a long strip shape, a second base island and a third base island, the second base island and the third base island are located on one side of the first base island at an interval and sequentially arranged in the length direction of the first base island, and the second base island and the third base island are arranged at an interval; one side of the frame packaging unit is sequentially provided with a plurality of pins spaced from the other side of the first base island, and the other side of the frame packaging unit is sequentially provided with a pin spaced from the second base island, two pins connected with the second base island and a pin connected with the third base island. The first base island is used for arranging a driving IC chip and a diode chip which are arranged at an interval, the second base island is used for arranging a first MOS chip, and the third base island is used for arranging a second MOS chip. The packaging module is packaged through the half-bridge IPM packaging lead frame, a half-bridge circuit is integrated in an SOP16W packaging mode, the packaging size is small, and the batch packaging effect is good.

Description

Technical Field

[0001] This application belongs to the field of integrated circuit packaging technology, specifically relating to a half-bridge IPM packaging lead frame and a half-bridge IPM packaging module. Background Technology

[0002] Compared to discrete devices, integrating multiple chips into a single package to achieve module functionality is a growing trend in electronics manufacturing. This approach not only reduces parasitic impedance but also lowers parasitic inductance in the lines between devices. Half-bridge IPMs (Intelligent Power Modules) are widely used in the electronics industry. To further meet the demands of downstream applications for functional integration and miniaturization, integrated circuit packaging has gradually emerged as a method for achieving this. How to achieve integration in different packaging formats involves research and improvement of packaging technologies such as lead frame structure, chip layout, and bonding methods. This application is proposed to meet the requirement of integrating half-bridge IPMs (Intelligent Power Modules) in an SOP16W package. Utility Model Content

[0003] To address the shortcomings of the aforementioned prior art, this application provides a half-bridge IPM package lead frame and a half-bridge IPM package module. The three spaced base islands are rationally arranged for IC driver chips, diode chips, MOS chips, etc., during packaging. The pin structure is improved to integrate a half-bridge circuit in an SOP16W package, resulting in a small package size and good mass production packaging performance.

[0004] To achieve the above objectives, the present invention employs the following technology:

[0005] A half-bridge IPM package lead frame includes an array of frame package units formed on the frame body;

[0006] The frame encapsulation unit is provided with a first base island arranged in a long strip shape and a second base island and a third base island arranged sequentially along its length and located on one side of the first base island, with the second base island and the third base island being spaced apart.

[0007] On one side of the frame package unit, there are a number of pins that are spaced apart from the other side of the first base island. On the other side of the frame package unit, there is a pin spaced apart from the second base island, two pins connected to the second base island, and one pin connected to the third base island.

[0008] Furthermore, on the other side of the frame packaging unit, there are sequentially arranged first pins, second pins, third pins, and fourth pins spaced apart from each other. The first pin is spaced apart from the second base island, the second pin and the third pin are connected to the second base island, and the fourth pin is connected to the third base island.

[0009] The frame package unit has eleventh, tenth, ninth, eighth, seventh, sixth and fifth pins that are spaced apart from each other on one side.

[0010] Furthermore, the first, second, and third base islands are all connected with connecting ribs, which are connected to the frame body. Connecting ribs are connected to both ends of the first base island along its length, and a connecting rib located between the eighth and seventh pins is connected to one side of the first base island. The second base island is connected to a connecting rib located at one end of the frame packaging unit, and the third base island is connected to a connecting rib located at the other end of the frame packaging unit.

[0011] Furthermore, at least one pin and / or at least one of the first, second, and third base islands is provided with a locking hole.

[0012] Furthermore, the widths of the second, third, and fourth pins are greater than the widths of the other pins.

[0013] Furthermore, the first base island is used to house IC driver chips and diode chips arranged at intervals, the second base island is used to house the first MOS chip, and the third base island is used to house the second MOS chip.

[0014] A half-bridge IPM package module includes an injection molded body and a half-bridge IPM package lead frame encapsulated within the injection molded body.

[0015] The beneficial effects of this utility model are as follows:

[0016] 1. The three spaced base islands are rationally arranged to accommodate IC driver chips, diode chips, MOS chips, etc. during packaging. The pin structure is improved to integrate a half-bridge circuit in an SOP16W package, resulting in a small package size and good mass production packaging effect.

[0017] 2. Widened pins improve current carrying capacity and heat dissipation performance;

[0018] 3. Improve packaging stability by adding connecting ribs and locking holes. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the lead frame structure of the half-bridge IPM package according to an embodiment of this application.

[0020] Figure 2 This is a schematic diagram of the framework encapsulation unit structure according to an embodiment of this application.

[0021] Figure 3 This is a schematic diagram of the structure of the chip when the half-bridge IPM package lead frame is set up according to an embodiment of this application. Detailed Implementation

[0022] To make the objectives, technical solutions and advantages of the present utility model clearer, the implementation methods of the present utility model will be described in detail below with reference to the accompanying drawings. However, the embodiments described in the present utility model are only some embodiments of the present utility model, and not all embodiments.

[0023] This application provides a half-bridge IPM package lead frame, such as Figure 1 As shown, it includes a frame encapsulation unit 2 arrayed on the frame body 1, specifically as such Figure 1 The optional example shown has an array with 6 rows and multiple columns of frame encapsulation units 2.

[0024] Specifically, such as Figure 2 As shown, the frame encapsulation unit 2 includes a first base island B1 arranged in a long strip shape, and a second base island B2 and a third base island B3 arranged sequentially along its length and located on one side of the first base island B1. The second base island B2 and the third base island B3 are spaced apart. Figure 2 As can be seen, the length of the first base island B1 is roughly equivalent to the combined length of the second base island B2 and the third base island B3 arranged sequentially.

[0025] The frame packaging unit 2 has a plurality of pins on one side, each spaced apart from the other side of the first base island B1. Specifically, from Figure 2 Starting from the left end, it includes the eleventh pin A11, the tenth pin A10, the ninth pin A9, the eighth pin A8, the seventh pin A7, the sixth pin A6, and the fifth pin A5, which are spaced apart from each other in sequence.

[0026] On the other side of frame package unit 2, there is sequentially one pin spaced from the second base island B2, two pins connected to the second base island B2, and one pin connected to the third base island B3. Specifically, from... Figure 2 Starting from the left end, it includes a first pin A1, a second pin A2, a third pin A3, and a fourth pin A4 that are spaced apart from each other in sequence. The first pin A1 is spaced apart from the second base island B2. The second pin A2 and the third pin A3 are connected to the second base island B2, and the fourth pin A4 is connected to the third base island B3.

[0027] To improve the stability of the base island layout, the first base island B1, the second base island B2, and the third base island B3 are all connected by connecting ribs 4, which are connected to the main frame 1. Specifically, as shown... Figure 2 As shown, the first base island B1 has connecting ribs 4 at both ends along its length, and one side of the first base island B1 is connected to a connecting rib 4 located between the eighth pin A8 and the seventh pin A7. The second base island B2 is connected to a connecting rib 4 located at one end of the frame packaging unit 2, and the third base island B3 is connected to a connecting rib 4 located at the other end of the frame packaging unit 2. The connection ribs 4 improve the stability of the connection between each base island and the frame body 1.

[0028] Furthermore, to improve stability after molding, locking holes 3 can be provided on some pins and base islands, specifically, as shown below. Figure 2 As shown, each pin on one side of the frame packaging unit 2 is provided with a locking hole 3, and each base island is also provided with at least one locking hole 3. This can prevent delamination during the packaging process, effectively reduce stress concentration between the lead frame and the packaging resin, and improve the overall reliability and service life of the product.

[0029] In this example, as another preferred example, such as Figure 2 As shown, the second pin A2, the third pin A3, and the fourth pin A4 have been widened. The width of these pins is significantly larger than that of the other pins, which all use the standard pin width in the SOP16W package. By widening the pins, the heat dissipation capacity of the chips on the second base island B2 and the third base island B3 can be improved, and the cross-sectional area can be increased to reduce resistance and heat loss, ensuring stability and reliability when there is a large current transmission.

[0030] like Figure 3 As shown, in one application, the first base island B1 is used to house the IC driver chip 5 and the diode chip 6 arranged at intervals, the second base island B2 is used to house the first MOS chip 7, and the third base island B3 is used to house the second MOS chip 8. The elongated shape of the first base island B1 provides ample space for the IC driver chip 5 and the diode chip 6 to be arranged at intervals, and also facilitates the corresponding pin bonding connection.

[0031] This application also provides a half-bridge IPM packaging module, including an injection molded body and a half-bridge IPM packaging lead frame as described in the previous embodiments, encapsulated within the injection molded body. The internal components of this packaging module can employ, for example... Figure 3 The package is constructed as shown. An IC driver chip 5 and a diode chip 6 are bonded to the first base island B1. A first MOS chip 7 is bonded to the second base island B2. A second MOS chip 8 is bonded to the third base island B3. The IC driver chip 5 is then connected to pins A11, A10, A9, A8, A7, and A5 via bonding wires. The IC driver chip 5 is also connected to the first MOS chip 7 and the second MOS chip 8 via bonding wires. The diode chip 6 is connected to pin A5 via bonding wires. The first MOS chip 7 and the second MOS chip 8 are connected via bonding wires. The first MOS chip 7 is connected to pin A1 via bonding wires.

[0032] The packaging module in this example can integrate leadframe-style multi-chip components, which can greatly reduce the area of ​​the printed circuit board on the device terminal compared to discrete devices.

[0033] The above description is only a preferred embodiment of this application and is not intended to limit this application. Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application.

Claims

1. A half-bridge IPM package lead frame, comprising frame package units (2) arrayed on a frame body (1), characterized in that: The frame encapsulation unit (2) is provided with a first base island (B1) arranged in a long strip shape and a second base island (B2) and a third base island (B3) arranged sequentially along its length on one side of the first base island (B1). The second base island (B2) and the third base island (B3) are spaced apart. On one side of the frame package unit (2), there are a number of pins that are spaced apart from the other side of the first base island (B1). On the other side of the frame package unit (2), there is a pin that is spaced apart from the second base island (B2), two pins that are connected to the second base island (B2), and one pin that is connected to the third base island (B3). On the other side of the frame packaging unit (2), there are a first pin (A1), a second pin (A2), a third pin (A3), and a fourth pin (A4) spaced apart from each other. The first pin (A1) is spaced apart from the second base island (B2). The second pin (A2) and the third pin (A3) are connected to the second base island (B2), and the fourth pin (A4) is connected to the third base island (B3).

2. The half-bridge IPM package lead frame according to claim 1, characterized in that, The frame package unit (2) has eleventh pin (A11), tenth pin (A10), ninth pin (A9), eighth pin (A8), seventh pin (A7), sixth pin (A6) and fifth pin (A5) spaced apart from each other on one side.

3. The half-bridge IPM package lead frame according to claim 2, characterized in that, The first base island (B1), the second base island (B2), and the third base island (B3) are all connected by connecting bars (4), which are connected to the main frame (1).

4. The half-bridge IPM package lead frame according to claim 3, characterized in that, The first base island (B1) has connecting ribs (4) at both ends along its length, and a connecting rib (4) located between the eighth pin (A8) and the seventh pin (A7) is connected to one side of the first base island (B1).

5. The half-bridge IPM package lead frame according to claim 3, characterized in that, The second base island (B2) is connected to a connecting rib (4) located at one end of the frame packaging unit (2), and the third base island (B3) is connected to a connecting rib (4) located at the other end of the frame packaging unit (2).

6. The half-bridge IPM package lead frame according to claim 1, characterized in that, The width of the second pin (A2), the third pin (A3), and the fourth pin (A4) is greater than the width of the other pins.

7. The half-bridge IPM package lead frame according to claim 1, characterized in that, The frame encapsulation unit (2) is arrayed in 6 rows and multiple columns on the frame body (1).

8. The half-bridge IPM package lead frame according to claim 1, characterized in that, The first base island (B1) is used to set up the IC driver chip (5) and diode chip (6) arranged at intervals, the second base island (B2) is used to set up the first MOS chip (7), and the third base island (B3) is used to set up the second MOS chip (8).

9. A half-bridge IPM packaged module, characterized in that, Includes an injection molded body and a half-bridge IPM package lead frame as described in any one of claims 1-8, encapsulated within the injection molded body.

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