Magnetron sputtering cathode structure for vacuum coating
By introducing a second anode and baffle design into the magnetron sputtering cathode structure for vacuum coating, the problem of discharge arcing was solved, and stable cathode discharge and reliability of the coating process were achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HANGZHOU LONGWAY TECH CO LTD
- Filing Date
- 2025-06-27
- Publication Date
- 2026-05-19
AI Technical Summary
Existing magnetron sputtering cathodes for vacuum coating are prone to discharge and arcing under certain operating conditions, making it impossible to maintain stable discharge operation.
A magnetron sputtering cathode structure for vacuum coating was designed, including a flange plate, a cathode, a first anode, an insulating component, and a second anode. By applying a positive potential of ≥0 volts to ground on the second anode and setting a baffle around the anode to absorb the charge, the charge accumulation on the target material is prevented, thus avoiding arcing.
Stable discharge operation of the magnetron sputtering cathode for vacuum coating has been achieved, preventing discharge arcing and ensuring the stability and reliability of the coating process.
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Figure CN224258760U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of coating equipment, specifically a magnetron sputtering cathode structure for vacuum coating. Background Technology
[0002] Existing magnetron sputtering cathodes for vacuum coating consist of a cathode that mounts the target and other components, and an anode placed around it. The two form a discharge circuit. Under certain operating conditions, the magnetron sputtering cathode for vacuum coating or the workpiece fixing device used to place the workpiece may produce discharge arcing, causing the magnetron sputtering cathode for vacuum coating to be unable to maintain stable discharge operation.
[0003] Therefore, a magnetron sputtering cathode structure for vacuum coating is proposed to address the above problems. Utility Model Content
[0004] To address the problem that, under certain operating conditions, the magnetron sputtering cathode used for vacuum coating or the workpiece fixing device used to place the workpiece will experience discharge arcing, causing the magnetron sputtering cathode used for vacuum coating to be unable to maintain stable discharge operation, this utility model proposes a magnetron sputtering cathode structure for vacuum coating.
[0005] The technical solution adopted by this utility model to solve its technical problem is: a magnetron sputtering cathode structure for vacuum coating, including a flange plate, a cathode is fixedly connected to the upper part of the flange plate, a first anode is fixedly connected to the side of the cathode, an insulating component is fixedly connected to the side of the first anode, and a second anode is fixedly connected to the upper part of the insulating component.
[0006] Preferably, the first anode further includes a baffle, and the upper part of the first anode is fixedly connected to the end of the baffle.
[0007] Preferably, the second anode includes: a second anode electrode and a baffle plate 2, with the second anode electrode fixedly connected to the front side of the second anode and the upper part of the second anode fixedly connected to the end of the baffle plate 2;
[0008] Preferably, the second baffle further includes: a clamping block and a third baffle, wherein the upper part of the second baffle is fixedly connected to the bottom of the clamping block, and the upper part of the clamping block is fixedly connected to the end of the third baffle;
[0009] Preferably, the second anode also includes a second anode water cooling tank, which is provided on the front side of the frame of the second anode water cooling tank for storing water and cooling.
[0010] The advantages of this utility model are:
[0011] 1. This utility model, through the gradual narrowing of the width of the plate body from baffle one to baffle two to baffle three, and the gradual reduction of the opening, can effectively block and thus better absorb the charge. The function of baffle one and baffle two is to prevent the accumulation of charge while preventing the charge from pouring onto the target material, and to avoid the situation of arcing due to insufficient charge absorption and inability to process electrons in time.
[0012] 2. This utility model places the second anode around the anode of the original magnetron sputtering cathode for vacuum coating or around the workpiece fixing device for placing the workpiece, and applies a positive potential of ≥ volts to ground on it to ensure stable discharge operation of the magnetron sputtering cathode for vacuum coating, and prevents the workpiece fixing structure for placing the workpiece from experiencing discharge arcing, thereby enabling the magnetron sputtering cathode for vacuum coating to operate stably. Attached Figure Description
[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0014] Figure 1 This is a schematic diagram of the front three-dimensional structure of this utility model;
[0015] Figure 2 This is a top-view three-dimensional structural diagram of the present invention;
[0016] Figure 3 This is a schematic diagram of the structure of Example 2.
[0017] In the picture:
[0018] 1. Flange plate; 2. Cathode; 3. First anode; 31. Baffle one; 4. Second anode; 40. Second anode water cooling tank; 41. Second anode electrode; 42. Baffle two; 421. Clamping block; 422. Baffle three; 5. Target material; 6. Insulating component. Detailed Implementation
[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.
[0020] The following is in conjunction with the appendix Figure 1-2 This application will be described in further detail.
[0021] Embodiment 1 of this application discloses a magnetron sputtering cathode structure for vacuum coating, including a flange plate 1, a cathode 2 fixedly connected to the upper part of the flange plate 1, a first anode 3 fixedly connected to the side of the cathode 2, an insulating member 6 fixedly connected to the side of the first anode 3, and a second anode 4 fixedly connected to the upper part of the insulating member 6.
[0022] The first anode 3 also includes a baffle 31, and the upper part of the first anode 3 is fixedly connected to the end of the baffle 31;
[0023] The second anode 4 includes: a second anode electrode 41 and a second baffle 42. The second anode electrode 41 is fixedly connected to the front side of the second anode 4, and the upper part of the second anode 4 is fixedly connected to the end of the second baffle 42.
[0024] The second baffle 42 further includes: a clamping block 421 and a third baffle 422. The upper part of the second baffle 42 is fixedly connected to the bottom of the clamping block 421, and the upper part of the clamping block 421 is fixedly connected to the end of the third baffle 422.
[0025] The second anode 4 also includes a second anode water cooling tank 40, which is opened on the front side of the frame of the second anode water cooling tank 40 for storing water and cooling.
[0026] Working Principle: When using this device to coat the target 5, the negative terminal of the power supply is connected to the cathode 2, and the positive terminal is connected to the first anode 3, forming a circuit. Then, the second anode electrode 41 is grounded to provide a positive potential of ≥0 volts to ground. The target 5 is then placed at the edge of the first baffle 31 and secured. From the first baffle 31 to the second baffle 42 to the third baffle 422, the width of the plates gradually narrows, and the openings gradually decrease, effectively shielding the target and improving charge absorption. The function of the first baffle 31 and the second baffle 42 is to prevent charge accumulation while avoiding charge flowing onto the target 5, thus preventing insufficient charge absorption. If arcing occurs due to the inability to process electrons in time, baffle 31 and baffle 42 can also be regarded as part of the anode. On the basis of the conventional magnetron sputtering cathode for vacuum coating, a second anode 4 is set up, which is independent of the anode of the original magnetron sputtering cathode for vacuum coating. The second anode 4 is placed around the anode of the original magnetron sputtering cathode for vacuum coating or the workpiece fixing device used to place the workpiece, and a positive potential of ≥0 volts to ground is applied to it to ensure that the magnetron sputtering cathode for vacuum coating performs stable discharge operation and prevents the workpiece fixing structure from experiencing arcing due to discharge, thereby enabling the magnetron sputtering cathode for vacuum coating to perform stable discharge operation.
[0027] The discharge operation of this magnetron sputtering cathode for vacuum coating can be driven by DC, intermediate frequency, radio frequency or pulse power supply. The resistance between the second anode 4 and the cathode of the magnetron sputtering cathode for vacuum coating is ≥5000 ohms. This magnetron sputtering cathode for vacuum coating can be applied to structures including but not limited to planar magnetron sputtering cathodes, rotating magnetron sputtering cathodes, circular magnetron sputtering cathodes, etc. The positive potential of ≥0 volts applied to the second anode 4 relative to ground can be provided by DC, low frequency, intermediate frequency, radio frequency or pulse power supply, or it can be directly grounded and the ground maintains the 0 volt potential. The second anode 4 can be partially or entirely made of conductive material. The second anode 4 may or may not have a second anode water cooling tank 40. The second anode water cooling tank 40 is used to cool down the water in the second anode 4 in time when the temperature rises due to charge accumulation.
[0028] Example 2: (with) Figure 3 (Based on the standard) This structure can be applied to a rotating sputtering target 5. Specifically, the cathode 2 is a cylindrical structure. A motor is installed on the rear side of the flange plate 1 to drive the cathode 2 to rotate. First anodes 3 are set on both sides of the cathode 2. Then, a second anode 4 is set on the outside of the first anode 3. Insulating parts 6 are set at the connection between the first anode 3 and the second anode 4 and the flange plate 1. The coating process is as follows: the rotating cathode 2 rotates, and the process gas is introduced into the working area through the gas outlet of the gas circuit plate, so that the process gas forms plasma and generates ion bombardment on the surface of the target 5. Under the action of a magnetic field, the ion bombardment on the surface of the target 5 will cause the molecules on the surface of the target 5 to be released outward. The released molecules diffuse freely to the substrate and form a thin film on the surface of the substrate.
[0029] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.
Claims
1. A magnetron sputtering cathode structure for vacuum coating, comprising a flange plate (1), characterized in that: A cathode (2) is fixedly connected to the upper part of the flange plate (1), a first anode (3) is fixedly connected to the side of the cathode (2), an insulating component (6) is fixedly connected to the side of the first anode (3), and a second anode (4) is fixedly connected to the upper part of the insulating component (6).
2. The magnetron sputtering cathode structure for vacuum coating according to claim 1, characterized in that: The first anode (3) also includes a baffle (31), and the upper part of the first anode (3) is fixedly connected to the end of the baffle (31).
3. The magnetron sputtering cathode structure for vacuum coating according to claim 1, characterized in that: The second anode (4) includes: a second anode electrode (41) and a baffle (42). The second anode electrode (41) is fixedly connected to the front side of the second anode (4), and the upper part of the second anode (4) is fixedly connected to the end of the baffle (42).
4. The magnetron sputtering cathode structure for vacuum coating according to claim 3, characterized in that: The second baffle (42) further includes: a clamping block (421) and a third baffle (422). The upper part of the second baffle (42) is fixedly connected to the bottom of the clamping block (421), and the upper part of the clamping block (421) is fixedly connected to the end of the third baffle (422).
5. The magnetron sputtering cathode structure for vacuum coating according to claim 3, characterized in that: The second anode (4) also includes a second anode water cooling tank (40), which is opened on the front side of the frame of the second anode water cooling tank (40) for storing water and cooling.