Quartz crystal plate coating loading jig

Abstract

The utility model relates to the field of mask clamps, and discloses a quartz crystal plate coating loading jig which comprises a frame and a lower mask plate detachably connected with the frame, the surface of the lower mask plate is provided with electrode die holes which are uniformly arranged and are used for forming a lower electrode pattern, and the electrode die holes in the surface of the lower mask plate are deepened and are provided with crystal positioning grooves which are communicated with the electrode die holes in a stepped manner. According to the utility model, the crystal positioning groove is directly deepened at the electrode die hole of the lower mask plate, so that a product can be directly placed on the lower mask plate to replace a central plate, and the production cost is greatly reduced.

Description

Technical Field

[0001] This utility model relates to the field of mask fixtures, and more particularly to a quartz crystal wafer coating loading fixture. Background Technology

[0002] The silver plating technology for quartz crystal wafers encompasses key aspects such as the directional processing of quartz crystals, surface electrode patterning, and optimization of the silver plating process. Quartz crystals, with their excellent piezoelectric effect, serve as the core carrier for electronic components such as oscillators and filters. Silver plating is a crucial step in endowing them with electrical signal conversion capabilities, directly determining the frequency stability, reliability, and environmental adaptability of the devices.

[0003] In the silver plating process on the surface of quartz crystal wafers, a silver plating fixture is generally used. In the prior art, a complete silver plating fixture includes a frame for positioning, a lower mask and an upper mask with electrode mold holes on the surface for forming the lower electrode pattern, and a center plate with positioning grooves on the surface for positioning the wafer, which is sandwiched between the lower mask and the upper mask.

[0004] Among the above-mentioned silver-plated fixtures, the center plate is relatively thin (about 0.03mm) and needs to be frequently disassembled during daily production operations, which makes the center plate prone to deformation and damage, resulting in a significant increase in production costs.

[0005] In view of this, the present invention provides a quartz crystal wafer coating loading fixture to solve the above problems. Utility Model Content

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a quartz crystal wafer coating loading fixture, comprising a frame and a lower mask plate detachably connected to the frame;

[0007] The surface of the lower mask plate is provided with uniformly arranged electrode mold holes for forming the lower electrode pattern, and a crystal positioning groove is deepened and connected to the electrode mold holes on the surface of the lower mask plate to form a step.

[0008] As a further description of the above technical solution: the frame is provided with positioning posts that are oppositely arranged to the surface of the lower mask plate, and the surface of the lower mask plate is provided with positioning holes that cooperate with and connect to the positioning posts.

[0009] As a further description of the above technical solution: the lower mask is made of ferromagnetic material or the surface of the lower mask is coated with a magnetic layer.

[0010] As a further description of the above technical solution: the frame is provided with a number of grooves on the surface of the lower mask plate, and magnetic suction components for adsorbing the lower mask plate are embedded in the grooves.

[0011] This utility model has the following beneficial effects:

[0012] This invention allows the product to be placed directly on the lower mask by deepening the crystal positioning groove at the electrode die hole of the lower mask, thus replacing the use of the center plate and significantly reducing production costs. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the frame structure of this utility model;

[0014] Figure 2 This is a schematic diagram of the lower mask plate structure of this utility model;

[0015] Figure 3 This is a schematic diagram of the frame structure of the second embodiment of the present utility model;

[0016] Figure 4 This is a schematic diagram of the structure of placing a quartz crystal piece in the crystal positioning groove of this utility model.

[0017] Legend:

[0018] 1. Frame; 11. Clearance hole; 2. Lower mask plate; 21. Electrode mold hole; 22. Crystal positioning groove; 3. Positioning post; 4. Positioning hole; 5. Groove; 6. Magnetic suction component; 7. Quartz crystal plate. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example 1

[0021] This utility model relates to a quartz crystal wafer coating loading fixture, such as... Figures 1-2 As shown, it includes: a frame 1, and a lower mask plate 2 and an upper mask plate that are detachably connected to the frame 1.

[0022] The lower mask plate 2 has uniformly arranged electrode mold holes 21 for forming the lower electrode pattern on its surface. Crystal positioning grooves 22, forming a stepped connection, are formed at the electrode mold holes 21 on the surface of the lower mask plate 2. The frame 1 has through-holes 11 corresponding to the electrode mold holes 21. These through-holes 11 expose the electrode mold holes 21 when the lower mask plate 2 and frame 1 are fitted together, ensuring the formation of the lower electrode pattern. In this embodiment, based on the rectangular array arrangement of the electrode mold holes 21, the through-holes 11 are spaced squares. It should be noted that the shape of the through-holes 11 includes, but is not limited to, squares, and can be adaptively adjusted according to the arrangement of the electrode mold holes 21.

[0023] Furthermore, the frame 1 has positioning posts 3 positioned opposite to the surface of the lower mask plate 2, and the surface of the lower mask plate 2 has positioning holes 4 that mate with and connect to the positioning posts 3. In this embodiment, the positioning posts 3 are vertically located at the upper and lower ends of the upper surface of the frame 1, and are symmetrically distributed about the longitudinal midline of the frame 1; the positioning holes 4 are matched and correspond one-to-one with the positioning posts 3.

[0024] In use, hold the lower mask plate 2 and allow the positioning post 3 on the frame 1 to pass through the positioning hole 4. Continuously press down on the lower mask plate 2 until it is tightly fitted against the upper surface of the frame 1. The cooperation between the positioning post 3 and the positioning hole 4 effectively restricts the movement of the lower mask plate 2 in the radial direction of the positioning post 3. Then, place the quartz crystal piece 7 into the crystal positioning groove 22. Figure 4 As shown, the upper mask plate is finally installed to cooperate with the lower mask plate 2 to clamp the quartz crystal piece 7.

[0025] It should be noted that the shape, number, and position of the positioning pins 3 and positioning holes 4 can be adjusted adaptively according to actual positioning requirements; in addition, the upper mask plate is the same as the lower mask plate 2 in terms of structure and material, except that the crystal positioning groove 22 is not opened.

[0026] Figure 3 The second embodiment of this utility model is shown, differing from the first embodiment in that: several grooves 5 are further formed on the surface of the frame 1 relative to the lower mask plate 2, and magnetic attractors 6 are embedded in the grooves 5; simultaneously, the lower mask plate 2 and the upper mask plate are made of ferromagnetic materials, such as iron-based alloys, nickel-iron alloys, etc. Alternatively, a magnetic layer, such as a nickel plating layer or a cobalt plating layer, may be plated on the surface of the original lower mask plate 2. In this embodiment, the magnetic attractor 6 is a magnet.

[0027] In use, after the lower mask 2 and the upper mask are installed in sequence with the frame 1, the lower mask 2 and the upper mask can be attracted by the magnetic attraction of the magnetic attraction component 6, thereby further restricting the movement of the lower mask 2 and the upper mask, and improving the tightness of the installation between the frame 1, the lower mask 2 and the upper mask, so as to accurately define the silver plating area and ensure the uniformity of the plating layer.

[0028] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A quartz crystal wafer coating loading jig, characterized by comprising: include: Frame (1), and lower mask plate (2) detachably connected to said frame (1); The surface of the lower mask plate (2) is provided with uniformly arranged electrode mold holes (21) for forming the lower electrode pattern. Crystal positioning grooves (22) are deepened and connected to the electrode mold holes (21) on the surface of the lower mask plate (2) to form a step.

2. The quartz wafer coating loading fixture of claim 1, wherein: The frame (1) has positioning posts (3) arranged opposite to the surface of the lower mask plate (2), and the surface of the lower mask plate (2) has positioning holes (4) that cooperate with and connect with the positioning posts (3).

3. The quartz wafer coating loading fixture according to claim 1 or 2, wherein: The lower mask plate (2) is made of ferromagnetic material or the surface of the lower mask plate (2) is coated with a magnetic layer.

4. The quartz wafer coating loading fixture of claim 3, wherein: The frame (1) has several grooves (5) on its surface relative to the lower mask plate (2), and the grooves (5) are inlaid with magnetic suction components (6) for adsorbing the lower mask plate (2).

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