Mounting and fixing structure of Hall sensor

Abstract

The utility model discloses an installing and fixing structure of a Hall sensor, which comprises a non-magnetic chip module, a circuit board daughter board module, a circuit board mother board module, a pin module, a plastic part protection module, a tested part module and a driving power module, the nonmagnetic chip module is connected with the circuit board daughter board module; the circuit board daughter board module and the circuit board mother board module are vertically arranged and electrically connected, and the circuit board mother board module is connected with the driving power module. The Hall sensor is installed and fixed, miniaturization, low cost and high reliability are achieved through demagnetization, material simplification and layout liberalization, the structure advantage of the Hall sensor is especially suitable for scenes with sensitive space, harsh environment or high-density integration, and new energy electric control development is promoted.

Description

Technical Field

[0001] This utility model relates to the field of Hall sensors, specifically a mounting and fixing structure for a Hall sensor. Background Technology

[0002] A Hall sensor, also known as a Hall effect sensor, is a type of magnetic sensor that detects the strength and direction of a magnetic field generated by a permanent magnet or electromagnet. Its output changes proportionally to the strength of the detected magnetic field.

[0003] With the rapid development of new energy vehicles, there are increasingly more methods for sampling inverter current. Traditional Hall sensors with magnetic cores have the following shortcomings:

[0004] With its complex structure and bulky size, traditional magnetic Hall sensors require the integration of magnetic components such as magnets and magnetic rings to form a closed magnetic circuit, resulting in a complex internal structure and a large space occupation. This can no longer meet the requirements of high integration and high volume utilization of inverters.

[0005] The materials are expensive; the magnetic core and the magnetic ring require high-permeability materials (such as ferrite, permalloy, or nanocrystalline alloy), resulting in high raw material and processing costs. Therefore, to address these issues, a mounting and fixing structure for the Hall sensor is provided. Utility Model Content

[0006] The technical problem this invention aims to solve is that magnetic Hall sensors are complex to assemble and install, bulky, and difficult to adapt to the increasingly integrated and compact requirements of inverters. This invention provides a coreless Hall sensor mounting and fixing scheme that, while meeting the requirements for normal inverter current sampling, results in a smaller sensor structure, higher overall volume utilization, and a simpler installation method.

[0007] This utility model achieves the above-mentioned objectives through the following technical solution: a mounting and fixing structure for a Hall sensor, comprising a non-magnetic chip module, a circuit board sub-board module, a circuit board motherboard module, a device under test (DUT) module, and a driving power module. The driving power module is connected to the DUT module, and the non-magnetic chip module is connected to the circuit board sub-board module. The circuit board sub-board module and the motherboard module are vertically arranged and electrically connected, and the circuit board motherboard module is connected to the driving power module.

[0008] Preferably, the non-magnetic chip module is fixed to the circuit board sub-module by surface mount soldering.

[0009] Preferably, the device under test module is a copper busbar with an opening in its middle. The circuit board sub-module is vertically inserted into the opening of the device under test module, and the center of the non-magnetic chip module is on the same horizontal line as the cross-sectional center of the device under test module.

[0010] Preferably, the circuit board motherboard module is connected to the plastic component protection module.

[0011] Preferably, the circuit board sub-board module is provided with solder pad holes, the solder pad holes are soldered to one end of the pin module, and the other end of the pin module is soldered to the solder pad holes of the circuit board mother board module. The pin module uses L-shaped gold-plated copper alloy pins.

[0012] Preferably, the non-magnetic chip module is a Hall effect current sensor with pin-embedded surface-mount package, measuring 5mm × 5mm, and requires no magnetic core material.

[0013] Preferably, the plastic component protection module has a support foot at the bottom, and the circuit board motherboard module has a reserved positioning hole, through which the plastic component protection module is inserted into the positioning hole.

[0014] Preferably, the circuit board motherboard module integrates a control and drive unit.

[0015] Preferably, the circuit board sub-module is directly and vertically inserted into the opening of the test module, and the circuit board sub-module and the circuit board motherboard module are directly soldered through multi-segment insertion pads, and the surface of the circuit board sub-module is coated with conformal coating.

[0016] Compared with the prior art, the advantages of this utility model are:

[0017] This utility model's Hall sensor mounting and fixing structure utilizes a coreless chip module, eliminating the need for a magnetic core, magnetic ring, and supporting structure. Only the Hall element and its attached PCB board are retained, resulting in reduced size, weight, space savings, increased integration, and lower costs. Simultaneously, the manufacturing process is simplified to a standard surface mount soldering process, improving production yield. Installation is simple, requiring only soldering to the corresponding holes on the motherboard. This achieves miniaturization, low cost, and high reliability simultaneously, making its structural advantages particularly suitable for space-sensitive, harsh environments, or scenarios requiring high-density integration. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the circuit board sub-board module structure of this utility model;

[0021] Figure 3 This is a schematic diagram of the connection structure between the circuit board sub-module and the pin module of this utility model.

[0022] Figure 4 This is a schematic diagram of the connection structure between the circuit board sub-board module, the pin module, the plastic component protection module, and the circuit board motherboard module of this utility model.

[0023] Figure 5 This is a schematic diagram of the structure of the circuit board module, the plastic part protection module, and the module under test connected together in this utility model.

[0024] Figure 6 This is a schematic diagram showing the structure in which the circuit board motherboard module, the device under test module, and the drive power module of this utility model are connected.

[0025] In the diagram: 1. Non-magnetic chip module, 2. Circuit board daughterboard module, 3. Circuit board motherboard module, 4. Pin module, 5. Plastic component protection module, 6. Test device module, 7. Drive power module. Detailed Implementation

[0026] To make the objectives, features, and advantages of this utility model more apparent and understandable, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0027] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0028] In the description of this utility model, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Example

[0029] like Figure 1-6 As shown in the preferred embodiment of this utility model, a mounting and fixing structure for a Hall sensor includes a non-magnetic chip module 1, a circuit board sub-board module 2, a circuit board motherboard module 3, a pin module 4, a plastic component protection module 5, a device under test (DUT) module 6, and a drive power module 7. The drive power module 7 is connected to the DUT module 6 and is used to invert high-voltage DC into three-phase AC and output it through the DUT module 6. The non-magnetic chip module 1 is connected to the circuit board sub-board module 2 and is used to collect current signals. The circuit board sub-board module 2 is vertically arranged and electrically connected to the motherboard module. The circuit board motherboard module 3 is connected to the drive power module 7 and is used to receive the current signal from the non-magnetic chip module 1 and control the drive power module 7. The plastic component protection module 5 is connected to the circuit board motherboard module 3 and is used to wrap the circuit board sub-board module 2 and isolate it from debris.

[0030] In this embodiment, the non-magnetic chip module 1 is a pin-embedded surface-mount packaged chip, a high-precision, coreless Hall effect current sensor, only 5mm*5mm in size, suitable for space-constrained scenarios. It eliminates the need for magnetic core materials, thus eliminating hysteresis and providing a faster response speed. The current path requires a symmetrical design to suppress common-mode magnetic field interference. It is connected to the circuit board sub-board module 2, soldered onto the sub-board module, and connected to the pin module 4 via traces. The current signal is also transmitted back to the circuit board motherboard signal processing unit via the pins.

[0031] In this embodiment, the circuit board sub-board module 2 is a PCB board with reserved holes for soldering the pin module 4 on the top, and the non-magnetic chip module 1 needs to be mounted on the solder pads.

[0032] In this embodiment, the circuit board motherboard module 3 is a PCB board that integrates a signal processing module and a control module. The board has reserved holes for the pin module 4, which supplies power to the non-magnetic chip module 1 through the pins.

[0033] In this embodiment, the drive power module 7 is an IGBT module connected to the circuit board motherboard module 3. The circuit board motherboard module 3 provides corresponding PWM control signals to the drive power module 7 to invert high-voltage DC into three-phase AC.

[0034] In this embodiment, the drive power module 7 is connected to the device under test module 6, and the three-phase AC power generated by the inverter is output through the device under test module 6.

[0035] In this embodiment, a hole is reserved in the middle of the test module 6, and the circuit board sub-board module 2 is vertically inserted into the hole. The center of the test section and the center of the non-magnetic chip module 1 are on the same horizontal line, ensuring that the current flows through the center of the non-magnetic chip module 1.

[0036] In this embodiment, the plastic protective module 5 wraps around the circuit board sub-module 2, with two support feet extending from the bottom and inserted into the positioning holes reserved in the circuit board motherboard module 3, thereby achieving a fixed connection between the circuit board sub-module 2 and the circuit board motherboard module 3, and wrapping around the circuit board sub-module 2 to optimize electrical spacing.

[0037] In this embodiment, the pin module 4 is connected at one end to the circuit board daughterboard module 2 and at the other end to the circuit board motherboard module 3. The pin pins are fixed to the board end using wave soldering or reflow soldering, and are used to transmit power supply signals, ground signals, and three-phase current signals. The pin module is L-shaped to improve space utilization, and uses gold-plated copper alloy pins combined with low-temperature lead-free solder (Sn-Ag-Cu alloy) to ensure soldering strength and conductivity.

[0038] According to the above structure, during use, the non-magnetic chip module 1 is fixed to the circuit board sub-board module 2 by surface mount soldering; the pin module 4 is soldered to the circuit board sub-board module 2 and the circuit board motherboard module 3 respectively to achieve vertical electrical connection between the two; the circuit board sub-board module 2 is vertically inserted into the opening of the test module 6, ensuring that the center of the non-magnetic chip module 1 is aligned with the center of the cross section of the test module 6; the plastic protective module 5 is inserted into the positioning hole of the circuit board motherboard module 3 to wrap the circuit board sub-board module 2; the circuit board motherboard module 3 is connected to the drive power module 7 to complete the overall installation.

[0039] Compared with the existing technology, the difference is that the mounting and fixing structure of the Hall sensor of this utility model adopts a coreless chip module, which eliminates the magnetic core, magnetic ring and its supporting structure, and only retains the Hall element and its attached PCB board, which reduces the size and weight, saves space and improves the integration.

[0040] Costs are reduced by eliminating components such as magnetic cores and magnetic rings, consisting of only a small PCB board, pins, and a non-magnetic chip. The manufacturing process is also simplified to a standard surface mount soldering process, which improves production yield.

[0041] The installation method is simple. It is usually supplied as a whole, consisting of a small PCB board, a non-magnetic chip, and pins. You only need to install and solder them according to the corresponding holes on the motherboard.

[0042] With improved heat dissipation performance, the absence of a magnetic core hinders heat conduction, resulting in more direct thermal coupling between the sensor chip and the PCB conductor. Heat can also be quickly dissipated through heat dissipation vias in the copper layer of the PCB sub-board.

[0043] In summary, the installation and fixing method of the Hall sensor of this utility model achieves miniaturization, low cost and high reliability through coreless design, material simplification and layout freedom. Its structural advantages are particularly suitable for space-sensitive, harsh environment or high-density integration scenarios, which is also the trend of new energy electric control development. Example

[0044] like Figure 1 As shown, a mounting and fixing structure for a Hall sensor includes: a non-magnetic chip module 1, a circuit board sub-board module 2, a circuit board motherboard module 3, and a device under test (DUT) module 6. A drive power module 7 is connected to the DUT module 6 and is used to invert high-voltage DC into three-phase AC and output it through the DUT module 6. The non-magnetic chip module 1 is connected to the circuit board sub-board module 2 and is used to acquire current signals. The circuit board sub-board module 2 is vertically arranged and electrically connected to the motherboard module. The circuit board motherboard module 3 is connected to the drive power module 7 and is used to receive the current signal from the non-magnetic chip module 1 and control the drive power module 7.

[0045] In this embodiment, the circuit board sub-board module 2 is directly and vertically inserted into the opening of the test module 6, and the circuit board sub-board module 2 and the circuit board motherboard module 3 are directly soldered through multi-segment insertion pads. The surface of the circuit board sub-board module 2 is coated with conformal coating to achieve protection.

[0046] According to the above structure, the plastic part protection module 5 and the pin module 4 mentioned in this utility model can be deleted in appropriate scenarios. The circuit board sub-board can be directly perpendicular to the opening of the tested part. Correspondingly, the end of the board needs to be coated with conformal coating for protection. In addition, the pin module 4 can be omitted when space requirements are strict. The original reserved pin hole position on the circuit board sub-board can be changed to a multi-segment insertion pad. Correspondingly, the circuit board motherboard has reserved corresponding openings and windowed pads. The sub-board can be directly inserted into the motherboard and soldered, which saves more space.

[0047] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0048] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A mounting and fixing structure for a Hall sensor, characterized in that: It includes a non-magnetic chip module (1), a circuit board sub-board module (2), a circuit board motherboard module (3), a device under test module (6), and a driving power module (7). The driving power module (7) is connected to the device under test module (6), and the non-magnetic chip module (1) is connected to the circuit board sub-board module (2). The circuit board sub-board module (2) is perpendicular to and electrically connected to the motherboard module, and the circuit board motherboard module (3) is connected to the driving power module (7).

2. The mounting and fixing structure for a Hall sensor according to claim 1, characterized in that: The non-magnetic chip module (1) is fixed to the circuit board sub-board module (2) by surface mount soldering.

3. The mounting and fixing structure for a Hall sensor according to claim 1, characterized in that: The test module (6) is a copper busbar with an opening in its middle. The circuit board sub-board module (2) is vertically inserted into the opening of the test module (6), and the center of the non-magnetic chip module (1) and the center of the cross section of the test module (6) are on the same horizontal line.

4. The mounting and fixing structure for a Hall sensor according to claim 1, characterized in that: The circuit board motherboard module (3) is connected to the plastic component protection module (5).

5. The mounting and fixing structure for a Hall sensor according to claim 1, characterized in that: The circuit board sub-board module (2) is provided with solder pad holes. The solder pad holes are soldered to one end of the pin module (4), and the other end of the pin module (4) is soldered to the solder pad holes of the circuit board motherboard module (3). The pin module (4) adopts L-shaped gold-plated copper alloy pins.

6. The mounting and fixing structure for a Hall sensor according to claim 1, characterized in that: The non-magnetic chip module (1) is a Hall effect current sensor with pin-embedded surface-mount package, measuring 5mm×5mm, and requires no magnetic core material.

7. The mounting and fixing structure for a Hall sensor according to claim 4, characterized in that: The plastic component protection module (5) has a support foot at the bottom, and the circuit board motherboard module (3) has a reserved positioning hole. The plastic component protection module (5) is inserted into the positioning hole through the support foot.

8. The mounting and fixing structure for a Hall sensor according to claim 1, characterized in that: The circuit board motherboard module (3) integrates a control and drive unit.

9. The mounting and fixing structure for a Hall sensor according to claim 1, characterized in that: The circuit board sub-board module (2) is directly and vertically inserted into the opening of the test component module (6), and the circuit board sub-board module (2) and the circuit board motherboard module (3) are directly soldered through multi-segment insertion pads. The surface of the circuit board sub-board module (2) is coated with conformal coating.

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