Voltage sampling piece and battery device

Abstract

The utility model relates to a voltage sampling piece and a battery device. The voltage sampling piece is used for being connected with an acquisition structure and an acquisition wire of the battery device. The voltage sampling piece comprises a first connecting part and a second connecting part; the first connecting part is used for connecting an acquisition structure; the second connecting part is connected to one side of the first connecting part in the first direction; the second connecting part is provided with a crimping wing, and the crimping wing is used for crimping and connecting a wire core of the collection wire. Through the structural design, the voltage acquisition sheet provided by the utility model utilizes the crimping wings to connect the wire core of the acquisition wire in a crimping manner, so that the connection between the acquisition structure and the acquisition wire through the voltage acquisition sheet is realized, the structural strength of the connection is effectively ensured, and the stability and the reliability are relatively high. In addition, connection in the form of locking the terminals through bolts is avoided, the reliability can be improved, the production efficiency can be improved, and the cost can be reduced.

Description

Technical Field

[0001] This disclosure relates to the field of battery technology, and in particular to a voltage sampling chip and a battery device. Background Technology

[0002] In order to acquire voltage data from the battery section (e.g., the busbar connected to the battery cell) or the high-voltage section (e.g., the high-voltage box) of the battery device, an existing solution is to use a sampling plate to connect the acquisition structure and the acquisition wire. The sampling plate and the acquisition structure are connected by bolts to the terminals, which has poor reliability, low production efficiency and high cost. Summary of the Invention

[0003] To overcome the problems existing in related technologies, this disclosure provides a voltage sampling chip and a battery device.

[0004] According to a first aspect of the present disclosure, a voltage sampling piece is provided for connecting a data acquisition structure and a data acquisition wire of a battery device; the voltage sampling piece includes a first connecting portion and a second connecting portion; the first connecting portion is used to connect the data acquisition structure; the second connecting portion is connected to one side of the first connecting portion in a first direction; the second connecting portion is provided with a crimping wing, the crimping wing being used to crimp the core of the data acquisition wire.

[0005] In some exemplary embodiments of this disclosure, the second connecting portion is provided with a plurality of crimping wings arranged at intervals along a second direction, the second direction intersecting the first direction, and the plurality of crimping wings are used to jointly crimp and connect the core of the acquisition wire.

[0006] In some exemplary embodiments of this disclosure, the second connecting portion is connected to the first connecting portion via a bend. When the first connecting portion is connected to the acquisition structure, there is a gap between the second connecting portion and the acquisition structure, and the acquisition wire is located on the side of the second connecting portion facing away from the acquisition structure.

[0007] In some exemplary embodiments of this disclosure, the second connecting portion further includes a crimping wing; the crimping wing is connected to one side of the first connecting portion in a first direction; the crimping wing is provided with an opening, and the crimping wing is connected to the crimping wing and located in the opening.

[0008] In some exemplary embodiments of this disclosure, the second connection portion further includes a crimping tail fin; the crimping tail fin is connected to the end of the crimping fin away from the first connection portion, and the crimping tail fin is used to constrain and limit the outer sheath of the acquisition wire.

[0009] In some exemplary embodiments of this disclosure, the voltage sampling piece further includes a pre-fixing part; the pre-fixing part is connected to the first connecting part; when the first connecting part is not connected to the acquisition structure, the pre-fixing part is used to pre-fix the voltage sampling piece to the acquisition structure.

[0010] In some exemplary embodiments of this disclosure, the pre-fixed portion and the second connecting portion are respectively connected to opposite ends of the first connecting portion in the first direction.

[0011] In some exemplary embodiments of this disclosure, the pre-fixing portion is provided with a protrusion, which is used to be accommodated in the recess provided by the acquisition structure.

[0012] In some exemplary embodiments of this disclosure, the pre-fixing part includes a through-slot structure that forms the protrusion; the through-slot structure has two slot walls spaced apart along a fourth direction, the two slot walls being inclined relative to each other, such that the width of the through-slot structure at the slot opening along the fourth direction is greater than the width at the slot bottom; wherein, along the fourth direction, the width of the recess is greater than or equal to the width at the slot bottom of the through-slot structure, and less than the width at the slot opening of the through-slot structure.

[0013] In some exemplary embodiments of this disclosure, the two groove walls are a first groove wall and a second groove wall, and the first groove wall is connected to the first connecting portion; wherein, the first groove wall is perpendicular to the first connecting portion.

[0014] According to a second aspect of the present disclosure, a battery device is provided, the battery device including the voltage sampling chip proposed in the present disclosure and described in the exemplary embodiments above.

[0015] In some exemplary embodiments of this disclosure, the crimping point between the crimping wing and the core of the acquisition wire is provided with a tin-plated structure.

[0016] In some exemplary embodiments of this disclosure, the acquisition structure is the busbar or high-voltage box of the battery device.

[0017] The technical solutions provided by the embodiments of this disclosure can include the following beneficial effects: The voltage sampling piece proposed in this disclosure is used to connect the acquisition structure and acquisition wire of a battery device; the voltage sampling piece includes a first connecting part and a second connecting part; the first connecting part is used to connect the acquisition structure; the second connecting part is connected to one side of the first connecting part in a first direction; the second connecting part is provided with a crimping wing, which is used to crimp the core of the acquisition wire. Through the above structural design, the voltage sampling piece proposed in this disclosure uses the crimping wing to connect the core of the acquisition wire in a crimping manner, thereby realizing the connection between the acquisition structure and the acquisition wire via the voltage sampling piece, effectively ensuring the structural strength of the connection, and having high stability and reliability. In addition, this disclosure avoids the connection by bolting the terminals, which can improve reliability and is conducive to improving production efficiency and reducing costs.

[0018] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0020] Figure 1 This is a schematic diagram of the voltage acquisition chip from one viewpoint, illustrating some exemplary embodiments of the present disclosure;

[0021] Figure 2 yes Figure 1 A schematic diagram of the voltage acquisition chip from another perspective;

[0022] Figure 3 yes Figure 1 A side view of the voltage acquisition chip is shown.

[0023] Figure 4 yes Figure 1 The diagram shows the assembly of the voltage acquisition chip and the acquisition structure.

[0024] Explanation of reference numerals in the attached figures:

[0025] 100. Voltage acquisition chip;

[0026] 110. First connecting part;

[0027] 111. First visual positioning structure;

[0028] 120. Second connecting part;

[0029] 121. Press-fit wing;

[0030] 122. Press-fit side wing;

[0031] 1221. Opening;

[0032] 123. Press-fit tail fin;

[0033] 130. Bending section;

[0034] 140. Pre-fixed part;

[0035] 141. Through-slot structure;

[0036] 1411. First tank wall;

[0037] 1412. Second tank wall;

[0038] 200. Acquisition Structure;

[0039] 210. Depression;

[0040] W1. Width;

[0041] W2. Width. Detailed Implementation

[0042] Some embodiments of this disclosure will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. Various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent upon understanding this disclosure. For example, the order of operations described herein is merely illustrative and is not limited to those orders set forth herein, but can be changed as will become apparent upon understanding this disclosure, except for operations that must be performed in a particular order. Furthermore, for clarity and brevity, descriptions of features known in the art may be omitted.

[0043] The embodiments described in the following examples of this disclosure are not representative of all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0044] See Figure 1 The illustration represents a schematic diagram of the voltage acquisition chip 100 from one perspective. In this exemplary embodiment, the voltage acquisition chip 100 of this disclosure is described using a busbar connected to a battery cell as an example. It will be readily understood by those skilled in the art that various modifications, additions, substitutions, deletions, or other changes may be made to the specific embodiments described below in order to apply the relevant designs of this disclosure to other scenarios, such as connecting a high-voltage box, etc., and these changes are still within the scope of the principles of the voltage acquisition chip 100 of this disclosure.

[0045] like Figure 1As shown, in one embodiment of this disclosure, the voltage acquisition chip 100 is used to connect the acquisition structure 200 of the battery device (e.g., the busbar of the battery section shown in the figure, or other components of the battery device such as the high-voltage box that need to acquire voltage signals) and the acquisition wires. See also... Figures 2 to 4 , Figure 2 The diagram shows a representative structural schematic of the voltage acquisition chip 100 from another perspective; Figure 3 A side view of the voltage acquisition chip 100 is shown in the figure. Figure 4 The figure shows a representative assembly diagram of the voltage acquisition chip 100 and the acquisition structure 200. The structure, connection method, and functional relationship of the main components of the voltage acquisition chip 100 proposed in this disclosure will be described in detail below with reference to the above figures.

[0046] like Figures 1 to 4 As shown, in one embodiment of this disclosure, the voltage sampling chip includes a first connecting portion 110 and a second connecting portion 120. The first connecting portion 110 is used to connect to the acquisition structure 200 of the battery device, for example, but not limited to, a fixed connection by welding. The second connecting portion 120 is connected to one side of the first connecting portion 110 in a first direction, which can be referred to as direction D1 shown in the figure. The second connecting portion 120 is provided with a crimping wing 121, which is used to crimp the core of the acquisition wire. For example, when it is necessary to connect the acquisition wire, a portion of the outer sheath of the acquisition wire can be stripped to expose the core, and then the core is placed at the crimping wing 121. The core is crimped and fixed to the second connecting portion 120 by bending the crimping wing 121. The crimping wing 121 can achieve crimping with the core of the acquisition wire. The position, shape, number, etc. of the crimping wing 121 can be adjusted according to the required crimp wire diameter, and its specific structure can be verified by crimping parameters. Based on this, since the first connecting part 110 is connected to the sampling structure, the wire core and the sampling structure are electrically connected via the voltage sampling plate. Through the above structural design, the voltage sampling plate 100 proposed in this disclosure uses the crimping wing 121 to connect the wire core of the acquisition wire in a crimping manner, thereby realizing the connection between the acquisition structure 200 and the acquisition wire via the voltage sampling plate 100, effectively ensuring the structural strength of the connection and having high stability and reliability. In addition, this disclosure avoids the connection by bolting the terminals, which can improve reliability and is conducive to improving production efficiency and reducing costs.

[0047] like Figure 1 and Figure 2As shown, in one embodiment of this disclosure, the second connecting portion 120 may be provided with two crimping wings 121 arranged at intervals along a second direction, which intersects the first direction, for example, but not limited to, perpendicular to it. The second direction can be referred to as direction D2 shown in the accompanying drawings. Accordingly, the second connecting portion 120 is connected to the core of the acquisition wire by the two crimping wings 121. Through the above structural design, this disclosure can strengthen the crimping connection between the crimping wings 121 and the core, and improve the stability and reliability of the voltage acquisition function. In other embodiments of this disclosure, the second connecting portion 120 may also be provided with only one crimping wing 121, or may be provided with three or more crimping wings 121. When there are multiple crimping wings 121 (i.e., two or more), the multiple crimping wings 121 may be connected to the same position of the core by at least two of them, or the multiple crimping wings 121 may be connected to different positions of the core respectively, and this is not limited to this embodiment.

[0048] like Figure 1 and Figure 2 As shown, in one embodiment of this disclosure, the second connecting portion 120 can be connected to the first connecting portion 110 via a bending portion 130. Due to the design of the bending portion 130, when the first connecting portion 110 is connected to the acquisition structure 200, there is a gap between the second connecting portion 120 and the acquisition structure 200. That is, the second connecting portion 120 is farther away from the connection interface of the acquisition structure 200 for connecting the voltage acquisition piece 100 than the first connecting portion 110, so that the acquisition wire is located on the side of the second connecting portion 120 facing away from the acquisition structure 200. Through the above structural design, this disclosure can use the bending portion 130 to stagger the arrangement of the first connecting portion 110 and the second connecting portion 120, thereby creating a certain gap between the second connecting portion 120 and the acquisition structure 200. This provides more space for the connection operation (e.g., welding operation) of the voltage acquisition piece 100 to the acquisition structure 200 or the crimping connection operation with the acquisition wire, improving operational convenience and helping to avoid structural interference.

[0049] like Figure 1 and Figure 2 As shown, in one embodiment of this disclosure, the first connecting portion 110, the second connecting portion 120, and their pressing wings 121 can be an integral structure. In other embodiments of this disclosure, the above structure can also be a combination structure of multiple relatively independent components connected together, and is not limited to this embodiment.

[0050] like Figure 1 and Figure 2As shown, in one embodiment of this disclosure, the second connecting portion 120 may further include a crimping wing 122. The crimping wing 122 is connected to one side of the first connecting portion 110 in a first direction. The crimping wing 122 has an opening 1221, and the crimping wing 121 is connected to the crimping wing 122 and located within the opening 1221. Through the above structural design, this disclosure can utilize the crimping wing 122 to increase the bonding strength between the first connecting portion 110 and the second connecting portion 120, thereby improving the structural reliability of the voltage acquisition chip 100.

[0051] like Figure 1 and Figure 2 As shown, in one embodiment of this disclosure, the first connecting portion 110 and the second connecting portion 120, along with their pressing wings 121 and pressing side wings 122, can be an integral structure. In other embodiments of this disclosure, the above structure can also be a combination structure of multiple relatively independent components connected together, and is not limited to this embodiment.

[0052] like Figure 1 and Figure 2 As shown, in one embodiment of this disclosure, the second connecting portion 120 may further include a crimping tail 123. The crimping tail 123 is connected to the end of the crimping wing 121 away from the first connecting portion 110, and is used to constrain and limit the outer sheath of the acquisition wire. Through the above structural design, when the voltage acquisition piece 100 proposed in this disclosure is connected to the acquisition wire, the core of the acquisition wire is crimped by the crimping wing 121. Furthermore, the outer sheath of the acquisition wire is constrained by the crimping tail 123, thereby preventing failure due to fatigue fracture at the crimping root that may occur later when only the core of the acquisition wire is crimped. In addition, it can improve the stability of the connection between the wire and the voltage acquisition piece 100.

[0053] like Figure 1As shown, based on the structural design of the second connecting portion 120 with crimping tail fins 123, in one embodiment of this disclosure, the second connecting portion 120 may be provided with two crimping tail fins 123 arranged at intervals along a third direction, which intersects with the first direction. The two crimping tail fins 123 are used to jointly constrain and limit the outer sheath of the acquisition wire. The third direction can be referred to as direction D2 shown in the accompanying drawings, that is, the third direction can be parallel to the second direction. In other embodiments of this disclosure, the third direction may also intersect with the second direction, and is not limited to this embodiment. Through the above structural design, this disclosure can enhance the constraint and limiting effect of the crimping tail fins 123 on the outer sheath of the acquisition wire, and improve the stability and reliability of the voltage acquisition function. In other embodiments of this disclosure, the second connecting portion 120 may be provided with only one crimping tail 123, or it may be provided with three or more crimping tail 123. When there are multiple crimping tail 123, at least two of the multiple crimping tail 123 may be crimped together at the same position on the outer sheath of the acquisition wire, or multiple crimping tail 123 may be crimped together at different positions on the outer sheath of the acquisition wire, and this is not limited to this embodiment.

[0054] like Figure 1 and Figure 2 As shown, in one embodiment of this disclosure, the first connecting portion 110 and the second connecting portion 120, along with their pressing wings 121 and pressing tail wings 123, can be an integral structure. In other embodiments of this disclosure, the above structure can also be a combination structure of multiple relatively independent components connected together, and is not limited to this embodiment.

[0055] like Figure 1 and Figure 2 As shown, in one embodiment of this disclosure, the first connecting portion 110 may be provided with a first visual positioning structure 111, which is used to cooperate with the second visual positioning structure provided in the acquisition structure 200 for positioning. Through the above structural design, by utilizing the first visual positioning structure 111, this disclosure can realize addressing use in connection processes such as welding, and the size, shape, or position of the first visual positioning structure 111 can be adjusted according to the actual needs of the welding equipment.

[0056] like Figure 1 and Figure 2As shown, the structural design of the first visual positioning structure 111 based on the first connecting portion 110 is such that, in one embodiment of this disclosure, the first visual positioning structure 111 can be a through hole. In other embodiments of this disclosure, the first visual positioning structure 111 can also be a notch or a mark, or a combination of at least two of the following: through hole, notch, and mark. Correspondingly, depending on the specific design of the first visual positioning structure 111, the second visual positioning structure provided by the acquisition structure 200 can adopt a matching specific design.

[0057] In one embodiment of this disclosure, the voltage acquisition chip 100 can be connected to the acquisition structure 200 by welding. For example, the first connecting part 110 can be welded to the acquisition structure 200. The welding area is the area where the weld is located, and its size can be adjusted according to the actual weld requirements.

[0058] like Figures 1 to 4 As shown, in one embodiment of this disclosure, the voltage sampling piece may further include a pre-fixing part 140. This pre-fixing part 140 is connected to the first connecting part 110. When the first connecting part 110 is not connected to the acquisition structure 200, the pre-fixing part 140 is used to pre-fix the voltage sampling piece to the acquisition structure 200. Through this structural design, this disclosure facilitates the pre-fixed installation of the voltage sampling piece 100 on the acquisition structure 200, thereby improving the convenience and accuracy of formally fixing the first connecting part 110 to the acquisition structure 200 (e.g., welding), and enhancing the connection effect. Furthermore, compared to existing solutions that pre-weld (e.g., spot weld) the sampling piece to the acquisition structure 200 or use structural adhesive for pre-fixation, this disclosure uses the pre-fixing part 140 to mechanically pre-fix the acquisition structure 200, which reduces the number of parts and the investment in assembly equipment, improves production efficiency, and reduces process costs.

[0059] like Figure 1 and Figure 2 As shown, based on the structural design of the voltage acquisition chip 100 including the pre-fixing part 140, in one embodiment of this disclosure, the pre-fixing part 140 and the second connecting part 120 can be respectively connected to opposite ends of the first connecting part 110 in a first direction. In other embodiments of this disclosure, the pre-fixing part 140 and the second connecting part 120 can also be respectively connected to the ends of the first connecting part 110 in different directions, or they can be respectively connected to the same end of the first connecting part 110. The specific choice can be flexibly made according to the specific design needs of the battery device, and is not limited to this embodiment.

[0060] like Figures 1 to 4As shown, based on the structural design of the voltage acquisition chip 100 including the pre-fixing part 140, in one embodiment of this disclosure, the pre-fixing part 140 may be provided with a protrusion, which is used to be accommodated in the recess 210 provided in the acquisition structure 200. Through the above structural design, this disclosure can achieve the pre-fixation of the voltage acquisition chip 100 on the acquisition structure 200 by utilizing the cooperation between the protrusion and the recess 210.

[0061] like Figures 1 to 4 As shown, based on the pre-fixing part 140 with a protruding structure design, in one embodiment of this disclosure, the pre-fixing part 140 may include a through-slot structure 141, which constitutes a protrusion. Specifically, the through-slot structure 141 has two slot walls spaced apart along a fourth direction. This fourth direction can refer to direction D2 shown in the figure, that is, the fourth direction can be parallel to the aforementioned second or third direction. Of course, the third direction can also intersect with the aforementioned directions, and is not limited to this embodiment. Based on this, the two slot walls of the through-slot structure 141 are relatively inclined so that the width W2 at the opening of the through-slot structure 141 along the fourth direction is greater than the width W1 at the bottom of the slot. Correspondingly, along the fourth direction, the width of the recess 210 provided by the collecting structure 200 can be greater than or equal to the width W1 at the bottom of the through-slot structure 141, and less than the width W2 at the opening of the through-slot structure 141. With the above structural design, when the through groove structure 141 enters the recess 210, the bottom part of the groove enters the recess 210 first. As it continues to enter, the width of the through groove structure 141 in the fourth direction gradually increases until the two side walls of the through groove structure 141 abut against the two side inner walls of the recess 210, thereby generating a relative inward deformation. The pre-fixing part 140 can utilize the rebound force of the through groove structure 141 in this deformed state to achieve the effect of the two side groove walls pressing against the inner wall of the recess 210 relative to each other, thereby achieving a reliable pre-fixing effect between the through groove structure 141 and the recess 210.

[0062] like Figures 1 to 3As shown, based on the structural design of the pre-fixing part 140 including the through-slot structure 141, in one embodiment of this disclosure, the two slot walls of the through-slot structure 141 can be a first slot wall 1411 and a second slot wall 1412, respectively. The first slot wall 1411 is connected to the first connecting part 110. Furthermore, the first slot wall 1411 and the first connecting part 110 can be relatively perpendicular, that is, the second slot wall 1412 has a spatial angle of not 90° relative to the first connecting part 110. Through the above structural design, when pre-fixing with the recess 210 using the through-slot structure 141, since the first slot wall 1411 is relatively perpendicular to the first connecting part 110, the first slot wall 1411 will not deform significantly during the process of the through-slot structure 141 entering the recess 210. This ensures that the relative position of the first connecting part 110 and the acquisition structure 200 is more stable during the pre-fixing process, thereby resulting in higher accuracy and a better connection effect when the first connecting part 110 and the acquisition structure 200 are formally fixed together.

[0063] In one embodiment of this disclosure, the voltage acquisition chip 100 proposed in this disclosure can be made of copper, aluminum, nickel, or other materials that can ensure crimping and conduction performance.

[0064] It should be noted that the voltage acquisition chip 100 shown in the accompanying drawings and described in this specification is merely a few examples among many voltage acquisition chips 100 capable of employing the principles of this disclosure. It should be clearly understood that the principles of this disclosure are by no means limited to any detail or component of the voltage acquisition chip 100 shown in the accompanying drawings or described in this specification.

[0065] Based on the above detailed description of several exemplary embodiments of the voltage acquisition chip 100 proposed in this disclosure, an exemplary embodiment of the battery device proposed in this disclosure will be described below.

[0066] See also Figure 4 In one embodiment of this disclosure, the battery device proposed in this disclosure includes a voltage sampling chip proposed in this disclosure and included in the above exemplary embodiments.

[0067] In one embodiment of this disclosure, a tinning structure can be provided at the crimping point between the crimping wing 121 and the core of the acquisition wire. Specifically, tinning can be performed after the crimping wing 121 is crimped with the core to ensure the reliability of the crimping and improve conductivity and bonding strength.

[0068] In one embodiment of this disclosure, the acquisition structure 200 is a busbar or high-voltage box of a battery device.

[0069] It should be noted that the battery devices shown in the accompanying drawings and described in this specification are merely a few examples among many battery devices capable of employing the principles of this disclosure. It should be clearly understood that the principles of this disclosure are by no means limited to any detail or component of the battery devices shown in the accompanying drawings or described in this specification.

[0070] In summary, the voltage sampling piece proposed in this disclosure is used to connect the acquisition structure 200 and the acquisition wire of the battery device. The voltage sampling piece includes a first connecting portion 110 and a second connecting portion 120. The first connecting portion 110 is used to connect the acquisition structure 200. The second connecting portion 120 is connected to one side of the first connecting portion 110 in a first direction. The second connecting portion 120 is provided with a crimping wing 121, which is used to crimp the core of the acquisition wire. Through the above structural design, the voltage sampling piece 100 proposed in this disclosure uses the crimping wing 121 to connect the core of the acquisition wire in a crimping manner, thereby realizing the connection between the acquisition structure 200 and the acquisition wire via the voltage sampling piece 100, effectively ensuring the structural strength of the connection and having high stability and reliability. In addition, this disclosure avoids the connection by bolting the terminals, which can improve reliability and is conducive to improving production efficiency and reducing costs.

[0071] Furthermore, the term “exemplary” is used herein to mean serving as an example, instance, or illustration. Any aspect or design described herein as “exemplary” is not necessarily to be construed as advantageous compared to other aspects or designs. Rather, the use of the term “exemplary” is intended to present the concept in a concrete manner. As used herein, the term “or” is intended to mean an inclusive “or” rather than an exclusive “or.” That is, unless otherwise specified or clear from the context, “X applies A or B” is intended to mean any of the natural inclusive arrangements. That is, “X applies A or B” satisfies any of the foregoing instances if X applies A; X applies B; or both X applies A and B. Additionally, unless otherwise specified or clear from the context to refer to the singular form, the articles “a” and “an” as used in this application and the appended claims are generally understood to mean “one or more.”

[0072] Similarly, although this disclosure has been shown and described with respect to one or more implementations, equivalent variations and modifications will occur to those skilled in the art upon reading and understanding the specification and drawings. This disclosure includes all such modifications and variations and is limited only by the scope of the claims. In particular, with respect to the various functions performed by the components described above (e.g., elements, resources, etc.), unless otherwise indicated, the terminology used to describe such components is intended to correspond to any component (functionally equivalent) that performs the specific function of the described component, even if structurally not equivalent to the disclosed structure. Furthermore, although specific features of this disclosure may have been disclosed with respect to only one of several implementations, such features may be combined with one or more other features of other implementations, as may be desired and advantageous to any given or particular application. Moreover, with regard to the terms “comprising,” “owning,” “having,” “having,” or variations thereof as used in the detailed description or claims, such terms are intended to be inclusive in a manner similar to the term “including.”

[0073] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0074] It should be understood that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., used in the embodiments of this disclosure should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms herein according to the specific circumstances.

[0075] Although terms such as “first” and “second” may be used herein to describe various components, parts, regions, layers, or sections, these components, parts, regions, layers, or sections are not limited to these terms. Rather, these terms are used only to distinguish one component, part, region, layer, or section from another. Therefore, without departing from the teachings of the examples described herein, the first component, part, region, layer, or section mentioned in the examples may also be referred to as the second component, part, region, layer, or section. Furthermore, the terms “first” and “second” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as “first” or “second” may explicitly or implicitly include at least one of that feature. In the description herein, “a plurality” means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0076] It should be understood that spatial relative terms, such as “above,” “upper,” “below,” and “lower,” are used herein to describe the relationship between one element and another shown in the figures. In addition to the orientation depicted in the figures, these spatial relative terms are also intended to encompass different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as “above” or “upper” relative to another element would be “below” or “lower” relative to that other element. Thus, depending on the spatial orientation of the device, the term “above” encompasses both above and below orientations. Devices may have other orientations (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein should be interpreted accordingly.

[0077] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A voltage sampling chip, characterized in that, The voltage sampling structure and sampling wires are used to connect the battery device; the voltage sampling chip includes: A first connecting part is used to connect the acquisition structure; and The second connecting part is connected to one side of the first connecting part in the first direction; the second connecting part is provided with a crimping wing, which is used to crimp and connect the core of the acquisition wire.

2. The voltage sampling chip according to claim 1, characterized in that, The second connecting portion is provided with a plurality of crimping wings arranged at intervals along a second direction, which intersects with the first direction. The plurality of crimping wings are used to jointly crimp and connect the core of the acquisition wire.

3. The voltage sampling chip according to claim 1, characterized in that, The second connecting part is connected to the first connecting part via a bend. When the first connecting part is connected to the acquisition structure, there is a gap between the second connecting part and the acquisition structure, and the acquisition wire is located on the side of the second connecting part facing away from the acquisition structure.

4. The voltage sampling chip according to claim 1, characterized in that, The second connecting part further includes: A crimping wing is connected to one side of the first connecting portion in a first direction; the crimping wing is provided with an opening, and the crimping wing is connected to the crimping wing and located in the opening.

5. The voltage sampling chip according to claim 1, characterized in that, The second connecting part further includes: A crimping tail fin is connected to the end of the crimping fin away from the first connecting part, and the crimping tail fin is used to constrain and limit the outer sheath of the acquisition wire.

6. The voltage sampling chip according to claim 1, characterized in that, The voltage sampling chip also includes: The pre-fixed part is connected to the first connecting part; When the first connecting part is not connected to the acquisition structure, the pre-fixing part is used to pre-fix the voltage sampling chip to the acquisition structure.

7. The voltage sampling chip according to claim 6, characterized in that, The pre-fixed part and the second connecting part are respectively connected to the opposite ends of the first connecting part in the first direction.

8. The voltage sampling chip according to claim 6, characterized in that, The pre-fixed part is provided with a protrusion, which is used to be accommodated in the recess of the acquisition structure.

9. The voltage sampling chip according to claim 8, characterized in that, The pre-fixing part includes a through-slot structure, which forms the protrusion; the through-slot structure has two slot walls spaced apart along a fourth direction, the two slot walls being inclined relative to each other, such that the width of the slot opening along the fourth direction is greater than the width at the bottom of the slot; wherein, along the fourth direction, the width of the recess is greater than or equal to the width at the bottom of the slot and less than the width at the slot opening.

10. The voltage sampling chip according to claim 9, characterized in that, The two groove walls are a first groove wall and a second groove wall, with the first groove wall connected to the first connecting part; wherein the first groove wall is perpendicular to the first connecting part.

11. A battery device, characterized in that, The battery device includes the voltage sampling chip as described in any one of claims 1 to 10.

12. The battery device according to claim 11, characterized in that, The crimping joint between the crimping wing and the core of the acquisition wire is provided with a tin-plated structure.

13. The battery device according to claim 11, characterized in that, The acquisition structure is the busbar or high-voltage box of the battery device.

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