Heat dissipation structure of laser

Abstract

The utility model discloses a heat dissipation structure of a laser, which comprises a first shell, a second shell, a heat dissipation fan and a PCB (Printed Circuit Board), and is characterized in that the first shell is provided with a plurality of first fins and a plurality of first heat-conducting fins, the plurality of first fins are symmetrically distributed at two sides of the first shell, the plurality of first heat-conducting fins are located on the bottom surface of the first shell, and the plurality of first heat-conducting fins are symmetrically distributed at two sides of the second shell; the second shell is connected with the first shell, the second shell is provided with a plurality of second fins and a plurality of second heat-conducting fins, the second fins are symmetrically distributed on the two sides of the second shell, the second heat-conducting fins are located on the top face of the second shell, and the cooling fan is located at the end of the first shell and the end of the second shell. The cooling fan is fixedly connected with the first shell and the second shell, the PCB is fixed to the second shell, the PCB is close to one side of the second heat-conducting fin, and the cooling fan is covered with the PCB. By arranging the multiple first fins, the first heat conduction pieces, the second fins and the second heat conduction pieces, the heat dissipation area is increased, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of lasers, and more specifically, to a heat dissipation structure for a laser. Background Technology

[0002] A laser is a device that generates light through stimulated emission, and it has important applications in many fields. During operation, the pump source and gain medium of a laser generate heat. If this heat is not dissipated in time, the internal temperature of the laser housing will continue to rise, leading to an increase in the laser's threshold current, a decrease in output power, and in severe cases, affecting the device's lifespan and performance, and accelerating its degradation.

[0003] Existing lasers typically dissipate heat through ventilation holes on their surface. However, when heat is continuously generated, it is difficult to dissipate and remains inside the laser housing, leading to heat dissipation difficulties and affecting the normal operation of the laser. Therefore, improvements are needed. Utility Model Content

[0004] The purpose of this application is to provide a heat dissipation structure for a laser to solve the problem of heat dissipation difficulties in existing lasers, which affect normal use.

[0005] To solve the above problems, this application adopts the following technical solution:

[0006] This application provides a heat dissipation structure for a laser, including:

[0007] The first housing has a plurality of first fins and a plurality of first heat-conducting plates. The plurality of first fins are symmetrically distributed on both sides of the first housing, and the plurality of first heat-conducting plates are located on the bottom surface of the first housing.

[0008] The second housing is connected to the first housing. The second housing is provided with a plurality of second fins and a plurality of second heat-conducting plates. The plurality of second fins are symmetrically distributed on both sides of the second housing, and the plurality of second heat-conducting plates are located on the top surface of the second housing.

[0009] A cooling fan is located at the end of the first housing and the second housing, and the cooling fan is fixedly connected to the first housing and the second housing;

[0010] A PCB board is fixed to the second housing, with the PCB board on the side near the second heat-conducting sheet, and the PCB board covering the cooling fan.

[0011] By arranging multiple first fins and multiple first heat-conducting plates in the first housing, and multiple second fins and multiple second heat-conducting plates in the second housing, the heat dissipation area is increased, and the heat dissipation rate is improved. The symmetrical distribution of the first fins and the symmetrical distribution of the second fins facilitates air convection, further optimizes the heat conduction path, reduces heat retention inside the housing, and improves heat dissipation efficiency.

[0012] Furthermore, the second housing is provided with a plurality of clearance holes, which are symmetrically distributed on both sides of the second housing and penetrate through the second fin.

[0013] By setting clearance holes, it is easier to install other components inside the clearance holes, reducing the space occupied by the laser and improving space utilization.

[0014] Furthermore, the second housing is provided with a perforation for accommodating the light-emitting component of the laser, thereby fixing the light-emitting component to the second housing, which facilitates the installation and removal of the light-emitting component from the second housing.

[0015] Furthermore, the second housing is provided with a groove, which is annular, and the through hole is coaxially arranged with the groove. Because of the groove, the light-emitting component is avoided, while the laser's light-emitting component is accommodated, allowing for better positioning and installation / removal.

[0016] Furthermore, the groove is located on the side of the second housing near the second heat-conducting sheet, and the groove penetrates the second heat-conducting sheet, thereby enabling the cooling fan to dissipate heat from the light-emitting component and also to dissipate heat from the second housing.

[0017] Furthermore, the second housing is provided with fixing holes for fixing the light-emitting component of the laser. The fixing holes in the second housing facilitate fixing the light-emitting component and improve the efficiency of its assembly and disassembly.

[0018] Furthermore, the second housing is provided with a plurality of fixing holes, which are arranged around the periphery of the through hole. The multiple fixing holes improve the fixing effect of the light-emitting component and enhance the stability of the laser.

[0019] Furthermore, the second housing is provided with a positioning groove, which is located on the second housing at one end near the cooling fan. By providing the positioning groove, it is easier to install components disposed within the positioning groove, thereby improving installation efficiency.

[0020] Furthermore, the second housing is provided with a clearance groove, which, along with the positioning groove, is located on both sides of the second housing. By providing the clearance groove and the positioning groove, it is beneficial to install other components within the positioning groove, while simultaneously reducing the space occupied by the laser.

[0021] In summary, this application includes at least one of the following beneficial technical effects:

[0022] 1. By setting multiple first fins and multiple first heat-conducting plates in the first housing and multiple second fins and multiple second heat-conducting plates in the second housing, the heat dissipation area is increased, and the heat dissipation efficiency is improved when the cooling fan performs cooling.

[0023] 2. The symmetrical distribution of the first and second fins facilitates air convection, optimizes heat conduction, reduces heat retention inside the casing, and improves heat dissipation efficiency. Simultaneously, the PCB board is fitted with a cooling fan, saving space and making the overall structure more compact. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of a laser provided in an embodiment of this application;

[0025] Figure 2 for Figure 1 A schematic diagram of a laser structure from another perspective;

[0026] Figure 3 An exploded view of a laser provided in an embodiment of this application;

[0027] Figure 4 This is a schematic diagram of the structure of a second housing provided in an embodiment of this application;

[0028] Figure 5 for Figure 4 A schematic diagram of the second shell structure from another perspective.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1. First shell; 11. First fin; 12. First heat-conducting plate;

[0031] 2. Second housing; 21. Second fin; 22. Second heat-conducting plate; 23. Clearance hole; 24. Perforation; 25. Groove; 26. Fixing hole; 27. Positioning groove; 28. Clearance groove;

[0032] 3. Cooling fan; 4. PCB board. Detailed Implementation

[0033] The specific embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0034] It should be noted that, unless otherwise specified, the embodiments and technical features in the embodiments of this application can be combined with each other, and the detailed descriptions in the specific implementation should be understood as explanations of the purpose of this application and should not be regarded as undue limitations on this application.

[0035] It should be understood that the orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings. These orientation terms are only for the convenience of describing this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this application.

[0036] Lasers generate heat during operation, and cooling measures are generally taken to ensure normal use of the laser and protection of the equipment. In air cooling, heat is dissipated through heat dissipation holes on the surface of the laser. However, when heat is continuously generated, it is difficult to dissipate and will remain inside the laser housing, leading to heat dissipation difficulties and affecting the normal use of the laser. Therefore, it is necessary to improve this method.

[0037] Figure 1 This is a schematic diagram of the structure of a laser provided in an embodiment of this application. Figure 2 for Figure 1 A schematic diagram of the laser structure from another perspective. Figure 3 An exploded view of a laser provided in an embodiment of this application. Figure 4 This is a schematic diagram of the structure of a second shell provided in an embodiment of this application. Figure 5 for Figure 4 A schematic diagram of the second shell structure from another perspective.

[0038] In view of this, such as Figures 1 to 5 As shown in the figure, this application embodiment provides a heat dissipation structure for a laser, including a first housing 1, a second housing 2, a cooling fan 3, and a PCB board 4. The first housing 1 is provided with a plurality of first fins 11 and a plurality of first heat-conducting plates 12. The plurality of first fins 11 are symmetrically distributed on both sides of the first housing 1, and the plurality of first heat-conducting plates 12 are located on the bottom surface of the first housing. The second housing 2 is connected to the first housing 1. The second housing 2 is provided with a plurality of second fins 21 and a plurality of second heat-conducting plates 22. The plurality of second fins 21 are symmetrically distributed on both sides of the second housing 2, and the plurality of second heat-conducting plates 22 are located on the top surface of the second housing 2. The cooling fan 3 is located at the ends of the first housing 1 and the second housing 2 and is fixedly connected to the first housing 1 and the second housing 2. The PCB board 4 is fixed to the second housing 2. The side of the PCB board 4 closest to the second heat-conducting plates 22 is covered by the cooling fan 3.

[0039] Specifically, the first housing 1 and the second housing 2 serve as the main supporting structures of the laser. Multiple first fins 11 are symmetrically distributed on both sides of the first housing 1. The first fins 11 increase the heat dissipation area and promote air convection, thereby improving heat dissipation efficiency. In addition, multiple first heat-conducting plates 12 are provided on the bottom surface of the first housing 1, which also help to conduct heat from the inside of the laser to the surface of the housing for heat dissipation. The second housing 2 is connected to the first housing 1 to form the housing of the laser. Multiple second fins 21 are symmetrically distributed on both sides of the second housing 2, and multiple second heat-conducting plates 22 are provided on the top surface. The functions of the second fins 21 and the second heat-conducting plates 22 are the same as those of the first fins 11 and the first heat-conducting plates 12, namely, increasing the heat dissipation area and promoting heat dissipation. A cooling fan 3 is located at the ends of the first housing 1 and the second housing 2 and is fixedly connected to them. The function of the cooling fan 3 is to generate forced airflow, accelerating airflow and thus more effectively removing heat from the fins and heat-conducting plates. The PCB board 4 is the carrier of the electronic components inside the laser and is fixed to the second housing 2. The PCB board 4 is located near the second heat-conducting plate 22 to more effectively conduct the heat generated on the PCB board 4 to the second heat-conducting plate 22 for heat dissipation. When the laser is working, its internal pump source and gain medium generate a large amount of heat. The heat is first conducted to the surface of the housing through the first heat-conducting plate 12, the second heat-conducting plate 22, the first fin 11, and the second fin 21 on the first housing 1 and the second housing 2. The forced airflow generated by the cooling fan 3 accelerates the airflow, allowing the heat to dissipate more quickly. The heat generated on the PCB board 4 is then carried away by the airflow generated by the cooling fan 3.

[0040] The second housing 2 is joined to the first housing 1. The cooling fan 3 is located at the ends of the second housing 2 and the first housing 1 and is fixed to the ends of the second housing 2 and the first housing 1 by screws. For example, each end of the second housing 2 and the first housing 1 has two threaded holes, and the second housing 2, the first housing 1, and the cooling fan 3 are fixed by four screws. A light-emitting hole is provided at the end away from the cooling fan 3, through which the laser emitted by the laser is emitted.

[0041] It should be noted that by providing multiple first fins 11 and multiple first heat-conducting plates 12 in the first housing 1, and multiple second fins 21 and multiple second heat-conducting plates 22 in the second housing 2, the heat dissipation area is increased, improving the heat dissipation efficiency when the cooling fan 3 is operating. The symmetrical distribution of the first fins 11 and the second fins 21 facilitates air convection, optimizes heat conduction, reduces heat retention inside the housing, and improves heat dissipation efficiency. Simultaneously, the PCB board 4 covers the cooling fan 3, saving space and making the overall structure more compact.

[0042] In some embodiments, such as Figure 4 and Figure 5As shown, the second housing 2 is provided with a plurality of clearance holes 23, which are symmetrically distributed on both sides of the second housing 2 and penetrate through the second fin 21.

[0043] Specifically, the second housing 2, as an important component of the laser's heat dissipation structure, includes multiple second fins 21 and multiple second heat-conducting plates 22, as well as multiple clearance holes 23. The second fins 21 are symmetrically distributed on both sides of the second housing 2, increasing the heat dissipation area and promoting air convection, thereby improving heat dissipation efficiency. The number of clearance holes 23 is adjusted according to the size of the second housing 2 and the arrangement of the second fins 21. For example, four clearance holes 23 are provided, penetrating through the second fins 21. Screws are installed within the clearance holes 23 to connect the first housing 1 and the second housing 2. The clearance holes 23 facilitate the installation of other components, reducing the space occupied by the laser and improving space utilization.

[0044] In some embodiments, the second housing 2 is provided with a through hole 24 for accommodating the light-emitting component of the laser. For example, in addition to the original plurality of second fins 21 and multiple second heat-conducting plates 22, the second housing 2 is also provided with a through hole 24. The position and size of the through hole 24 are set according to the specific size and position of the laser light-emitting component. The through hole 24 precisely matches the shape and size of the light-emitting component to ensure that the light-emitting component can be securely installed in the through hole 24 and maintain the correct optical path. It should be understood that the shape of the through hole 24 can be adjusted according to the shape of the light-emitting component, such as circular, rectangular, or other shapes. The shape design should consider facilitating the installation and fixation of the light-emitting component. The light-emitting component is fixed through the through hole 24, thereby ensuring the stability of the light-emitting component and avoiding damage to the light-emitting component. The laser light-emitting component is placed in the through hole 24, and the light-emitting component is fixedly connected to the through hole 24 by an appropriate fixing method to ensure its stable position and normal operation. Fixing the light-emitting component in the perforation 24 makes the entire laser structure more compact and saves space. At the same time, the precise design of the perforation 24 ensures the stable installation of the light-emitting component, guarantees the stability of the optical path, improves the output beam quality of the laser, and facilitates the installation and removal of the light-emitting component from the second housing 2.

[0045] In some embodiments, the second housing 2 is provided with a groove 25, which is annular, and the through hole 24 is coaxially arranged with the groove 25. Specifically, the groove 25 is annular, and its shape and size are designed according to the through hole 24 and the light-emitting component. The annular groove can enhance the strength and stability of the structure. The groove 25 is coaxial with the through hole 24, that is, the center of the groove 25 coincides with the center of the through hole 24. This coaxial design can ensure that the light-emitting component remains concentric during installation, thereby ensuring the accuracy of the optical path. The depth of the groove 25 can be designed as needed to facilitate the installation and fixation of the light-emitting component. The light-emitting component of the laser is placed in the through hole 24 and fixed by the groove 25. The light-emitting component is tightly connected to the groove 25 by an appropriate fixing method to ensure its stability and optical path stability.

[0046] Because of the groove 25, the light-emitting components are avoided, and the light-emitting components of the laser are accommodated while being better positioned and installed / removed.

[0047] In some embodiments, the groove 25 is located on the second housing 2 near the second heat-conducting sheet 22, and the groove 25 penetrates the second heat-conducting sheet 22. The shape of the groove 25 is designed according to the perforation 24 and the light-emitting component. To enhance the structural strength and heat dissipation effect, the groove 25 can be designed as annular or other suitable shapes. The groove 25 penetrates the second heat-conducting sheet 22, thereby utilizing the thermal conductivity of the second heat-conducting sheet 22 to dissipate heat, which can significantly improve heat dissipation efficiency and reduce the temperature inside the laser housing and critical components.

[0048] In some embodiments, the second housing 2 is provided with fixing holes 26 for fixing the light-emitting component of the laser. Specifically, fixing holes 26 are provided on the second housing 2 to fix the light-emitting component of the laser, effectively integrating the light-emitting component of the laser with the heat dissipation structure, ensuring that the laser achieves its optical function while dissipating heat efficiently. The position of the fixing holes 26 is designed according to the installation position of the laser light-emitting component, and the position of the fixing holes 26 should ensure that the light-emitting component can be firmly fixed to the second housing 2 and maintain the correct optical path. The shape of the fixing holes 26 is designed according to the fixing method of the laser light-emitting component. For example, if a screw fixing method is used, the fixing holes 26 can be threaded holes. In particular, the number of fixing holes 26 is designed according to the size of the laser light-emitting component and the fixing method, and multiple fixing holes 26 are provided to ensure that the light-emitting component can be firmly fixed to the second housing 2. For example, the second housing 2 is provided with multiple fixing holes 26, which are arranged around the periphery of the through hole 24. By providing multiple fixing holes 26, the fixing effect of the light-emitting component is improved, and the stability of the laser is enhanced.

[0049] The fixing hole 26 securely fixes the laser light-emitting component to the second housing 2, preventing it from loosening or falling off during operation. The design of the fixing hole 26 ensures precise installation of the laser light-emitting component, maintains the correct optical path, and thus guarantees the output beam quality of the laser.

[0050] In some embodiments, the second housing 2 is provided with a positioning groove 27, which is located at one end of the second housing 2 near the cooling fan 3. Specifically, the positioning groove 27 is located at one end of the second housing 2 near the cooling fan 3. The shape of the positioning groove 27 is designed according to the component to be positioned. For example, if the component to be positioned has a specific shape or structure, the positioning groove 27 can be designed with a corresponding shape to achieve precise fit. By installing the component to be positioned into the positioning groove 27, the positioning groove 27 can ensure the precise positioning of the component on the second housing 2, avoiding deviations during the installation process, thereby ensuring the overall structural accuracy of the laser. By providing the positioning groove 27 on the second housing 2, it is convenient to install the components set in the positioning groove 27, improving installation efficiency, realizing the precise positioning and installation of specific components, improving the structural accuracy and stability of the laser, and simplifying the component installation process, which has significant application value and practicality.

[0051] In some embodiments, the second housing 2 is provided with a clearance groove 28, which, along with a positioning groove 27, is located on both sides of the second housing 2. Specifically, the positioning groove 27 is located on one end of the second housing 2 near the cooling fan 3. The positioning groove 27 is used for precise positioning and installation of specific components, ensuring their accurate position and stability. The clearance groove 28 and the positioning groove 27 are located on both sides of the second housing 2. This design, with its distribution on both sides, considers both the positioning requirements and the clearance requirements of surrounding components or structures, providing clearance space for specific components or structures, avoiding interference with other components or structures, and ensuring the rational utilization of the internal space of the laser.

[0052] For example, opposite the positioning slot 27, i.e., on the other side of the second housing 2, a clearance slot 28 is designed. The design of the clearance slot 28 should be based on the shape and size of the component or structure to be clearanced, ensuring sufficient clearance space. The component requiring positioning is installed into the positioning slot 27, ensuring it is securely fixed within the slot and maintains the correct position. By setting the clearance slot 28 and the positioning slot 27, it is beneficial to install other components within the positioning slot 27, while simultaneously reducing the space occupied by the laser.

[0053] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions claimed in this application.

Claims

1. A heat dissipation structure for a laser, characterized in that, include: The first housing has a plurality of first fins and a plurality of first heat-conducting plates. The plurality of first fins are symmetrically distributed on both sides of the first housing, and the plurality of first heat-conducting plates are located on the bottom surface of the first housing. The second housing is connected to the first housing. The second housing is provided with a plurality of second fins and a plurality of second heat-conducting plates. The plurality of second fins are symmetrically distributed on both sides of the second housing, and the plurality of second heat-conducting plates are located on the top surface of the second housing. A cooling fan is located at the end of the first housing and the second housing, and the cooling fan is fixedly connected to the first housing and the second housing; A PCB board is fixed to the second housing, with the PCB board on the side near the second heat-conducting sheet, and the PCB board covering the cooling fan.

2. The heat dissipation structure for a laser according to claim 1, characterized in that, The second housing is provided with a plurality of clearance holes, which are symmetrically distributed on both sides of the second housing and penetrate through the second fin.

3. The heat dissipation structure for a laser according to claim 1, characterized in that, The second housing has a perforation for accommodating the light-emitting components of the laser.

4. The heat dissipation structure for a laser according to claim 3, characterized in that, The second housing has a groove, which is annular, and the perforation is coaxially arranged with the groove.

5. The heat dissipation structure for a laser according to claim 4, characterized in that, The groove is located on the side of the second housing near the second heat-conducting sheet, and the groove penetrates the second heat-conducting sheet.

6. The heat dissipation structure for a laser according to claim 3, characterized in that, The second housing is provided with fixing holes for fixing the light-emitting components of the laser.

7. The heat dissipation structure for a laser according to claim 6, characterized in that, The second housing is provided with a plurality of fixing holes, which are arranged around the periphery of the through hole.

8. The heat dissipation structure for a laser according to claim 1, characterized in that, The second housing is provided with a positioning groove, which is located on the second housing at one end near the cooling fan.

9. The heat dissipation structure for a laser according to claim 8, characterized in that, The second housing is provided with a clearance groove, and the clearance groove and the positioning groove are respectively located on both sides of the second housing.

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