Integrated lightweight inversion brick structure

Abstract

The utility model provides an integrated lightweight inversion brick structure, comprising a water cooling plate, a heat radiation water channel, a thin film capacitor installation cavity and a three-phase assembly which are integrally injection-molded, and the heat radiation water channel is arranged at the top end of the outer wall of the thin film capacitor installation cavity; the power module covers the water cooling plate and is located over the heat dissipation water channel, a sealing ring used for sealing the heat dissipation water channel is arranged between the bottom of the power module and the heat dissipation water channel, and a heat dissipation structure is further arranged at the bottom of the power module; according to the utility model, the integrated level limitation of the traditional layered architecture is broken through, the production and assembly process is simplified, the cost is reduced, the weight bottleneck caused by a metal structure can be solved, and the heat dissipation performance of key components such as the thin-film capacitor and the like can be improved.

Description

Technical Field

[0001] This utility model relates to an inverter brick, and more specifically, an integrated lightweight inverter brick structure. Background Technology

[0002] Currently, most new energy vehicle motor controllers adopt a discrete architecture, and the main technical solutions are as follows:

[0003] 1. A metal casing is used as the structural carrier, and the internal functional components (IGBT modules, DC-LINK film capacitors, water-cooled plates, drive control PCBs, etc.) are assembled in a layered stacking manner;

[0004] 2. The cooling system adopts a separate design with a metal water-cooled plate, which contacts the power module through a thermally conductive interface material;

[0005] 3. The film capacitor casing is fixed by an independent bracket and dissipates heat through contact with the water-cooling plate via a thermal pad;

[0006] 4. The three-phase modules adopt a bolt-fixed independent structure;

[0007] 5. Multiple assembly processes, with complex mechanical connections between the components;

[0008] While this solution meets basic functional requirements, it suffers from technical limitations such as low integration, large size and weight, and low production efficiency. These limitations are mainly reflected in:

[0009] 1. Loose structure: Each functional component is designed independently, resulting in high cost, complex assembly process, and poor product consistency;

[0010] 2. High weight: The metal structure results in a high power-to-weight ratio;

[0011] 3. Poor heat dissipation performance: The film capacitor has an independent plastic shell and dissipates heat through the contact between the thermal pad and the water cooling plate, resulting in high thermal resistance of the heat dissipation system;

[0012] 5. Difficult to repair: When internal parts are damaged, the upper-level parts need to be removed one by one for repair.

[0013] 6. Poor compatibility: Low cross-platform component reuse rate. Utility Model Content

[0014] To address the aforementioned technical issues, this invention proposes an integrated lightweight inverter brick structure that breaks through the integration limitations of traditional layered architectures, simplifies production and assembly processes, reduces costs, solves the weight bottleneck caused by metal structures, and improves the heat dissipation performance of key components such as thin-film capacitors.

[0015] To achieve the above objectives, the present invention adopts the following technical solution:

[0016] An integrated lightweight inverter brick structure includes:

[0017] The water-cooled plate is integrally injection molded and includes heat dissipation channels, a thin-film capacitor mounting cavity, and a three-phase module. The heat dissipation channels are located at the top of the outer wall of the thin-film capacitor mounting cavity.

[0018] The power module is covered on the water-cooling plate and is located directly above the heat dissipation channel. A sealing ring is installed between the bottom of the module and the heat dissipation channel to seal the heat dissipation channel.

[0019] Film capacitors are encapsulated in epoxy resin within a film capacitor mounting cavity and are located directly below the heat dissipation channels.

[0020] The structural features of this utility model also lie in:

[0021] The water-cooled plate is made of plastic.

[0022] The thin-film capacitor includes a capacitor core, positive and negative copper busbars, and insulating paper. The terminals of the thin-film capacitor are electrically connected to the terminals of the power module.

[0023] The three-phase component is formed by injection molding a three-phase copper busbar, a current sensor core, and a three-phase component housing. The three-phase copper busbar is electrically connected to the power module terminals.

[0024] The power module has a heat dissipation structure at its bottom.

[0025] It also includes a driver board packaged on the power module and a control board located at the bottom of the water-cooled plate. The control board is located below the thin-film capacitor and is connected to the driver board via a wiring harness.

[0026] The water-cooled plate has a matching sealing groove formed according to the position and shape of the sealing ring, and the sealing ring is placed in the sealing groove.

[0027] Compared with existing technologies, the beneficial effects of this utility model are reflected in:

[0028] 1. The water-cooled plate adopts a multi-module integrated design, which is low in cost, small in size and light in weight. Compared with the traditional design that requires three sets of molds, this invention can be reduced to one mold, which can effectively reduce the cost of controller parts and improve product consistency. At the same time, the integrated design eliminates the positioning and assembly structure between parts, which can reduce the overall structural space of the inverter brick by 20%.

[0029] 2. Traditional inverter bricks require additional heat dissipation structures for their thin-film capacitors, often relying on thermal pads for heat transfer. This invention uses a multi-functional, integrated water-cooled plate as the integrated carrier to achieve an integrated design for the thin-film capacitor. The heat dissipation channels can be directly used for the heat dissipation of both the thin-film capacitor and the power module, which not only reduces costs but also lowers the thermal resistance of the thin-film capacitor and improves heat dissipation efficiency.

[0030] 3. Optimize production process: The assembly process of film capacitors and three-phase fixed bases has been eliminated, which not only effectively improves production efficiency, but also improves product consistency. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the structure of this utility model;

[0032] Figure 2 This is an exploded structural diagram of the present invention;

[0033] Figure 3 This is a structural schematic diagram of an integrated water-cooled plate.

[0034] In the diagram, 1 is a water-cooled plate; 11 is a heat dissipation channel; 12 is a thin-film capacitor mounting cavity; 13 is a three-phase assembly; 131 is a three-phase copper busbar; 132 is a current sensor core; 2 is a sealing ring; 3 is a power module; 4 is a thin-film capacitor; 5 is a driver board; and 6 is a control board. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below in conjunction with the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0036] Please refer to Figures 1 to 3 The integrated lightweight inverter brick structure of this embodiment is arranged in a multi-layered manner, including:

[0037] The water-cooled plate 1 is integrally injection molded with a heat dissipation channel 11, a thin-film capacitor mounting cavity 12, and a three-phase module 13. The heat dissipation channel 11 is located at the top of the outer wall of the thin-film capacitor mounting cavity 12. Thus, the positioning and assembly structure of the thin-film capacitor 4 and the three-phase module are eliminated, the inverter brick structure is simplified, and the space is compact. At the same time, it replaces the previous screw-locking connection method of parts, simplifies the production and assembly process, and significantly improves product consistency and production efficiency.

[0038] The power module 3 is covered on the water-cooled plate 1 and is located directly above the heat dissipation channel 11. A sealing ring 2 for sealing the heat dissipation channel 11 is provided between the bottom and the heat dissipation channel 11.

[0039] The thin-film capacitor 4 is encapsulated in the thin-film capacitor mounting cavity 12 with epoxy resin and is located directly below the heat dissipation channel 11. It can directly utilize the heat dissipation channel 11 for heat dissipation, thereby improving the heat dissipation effect.

[0040] In practical implementation, the corresponding structural settings of this integrated lightweight inverter brick structure also include:

[0041] The water-cooled plate 1 is made of plastic, which is low in cost and lightweight. During the injection molding process of the water-cooled plate 1, the three-phase copper busbar 131, the current sensor core 132, and the three-phase component 13 plastic shell are integrally injection molded to form the three-phase component 13. The three-phase copper busbar 131 and the current sensor core 132 are installed on the plastic shell of the three-phase component 13. The three-phase component 13 plastic shell is formed integrally with the water-cooled plate 1. The three-phase copper busbar 131 is electrically connected to the terminals of the power module 3 through connectors.

[0042] The three-phase assembly 13 can be connected to different interfaces of the three-phase lines at the motor end by adjusting the direction and position of the terminals of the three-phase copper busbar 131, thereby achieving platform compatibility.

[0043] As an alternative to this embodiment, to improve heat dissipation performance, the water-cooled plate 1 can be made of a metal-based composite material, such as aluminum alloy. When a metal-based composite material is selected, the water-cooled plate 1 is die-cast with heat dissipation channels 11 and a thin-film capacitor mounting cavity 12, and the three-phase assembly 13 is injection-molded and then assembled onto the water-cooled plate 1 with screws.

[0044] The film capacitor 4 includes components such as a capacitor core, positive and negative copper busbars, and insulating paper. After the capacitor core is welded to the positive and negative copper busbars, it is encapsulated in the cavity of the film capacitor 4 with epoxy resin. The terminals of the film capacitor 4 are electrically connected to the terminals of the power module 3 through connectors.

[0045] Based on this embodiment, the film capacitor 4 can be further designed to connect to filter components with different interface methods by adjusting the terminal interface, thereby achieving platform compatibility.

[0046] The bottom of the power module 3 is equipped with a heat dissipation structure, which is a PINFIN located directly above the heat dissipation channel 11. Water cooling is performed through the PINFIN.

[0047] It also includes a driver board 5 encapsulated on the power module 3 and a control board 6 located at the bottom of the water-cooled plate 1. The control board 6 is located below the thin film capacitor 4 and is connected to the driver board 5 via a wiring harness.

[0048] The water-cooled plate 1 has several mounting parts reserved at the bottom of the outer wall of the cavity of the thin film capacitor 4 according to the position and shape of the control board 6. Each mounting part is used for the installation and positioning of the control board 6.

[0049] A matching sealing groove is formed on the water-cooled plate 1 according to the position and shape of the sealing ring 2, and the sealing ring 2 is placed in the sealing groove.

[0050] In summary, this embodiment uses a multifunctional, integrated water-cooled plate 1 as the integrated carrier. A power module 3 and a drive board 5 are mounted above the heat dissipation channel 11, and a thin-film capacitor 4 and a control board 6 are mounted below the heat dissipation channel 11. The water-cooled plate 1 integrates three functional modules: the cooling channel, the thin-film capacitor mounting cavity 12, and the three-phase module 13, all integrally injection molded, resulting in lower costs. The power module 3 above the water-cooled plate 1, the thin-film capacitor 4 below the water-cooled plate 1, and the heat dissipation channel 11 between the power module 3 and the thin-film capacitor 4 are arranged in a vertically stacked manner. This integrated water-cooled plate 1 solution not only solves the problems of excessively large physical integration volume and complex assembly processes for individual components, but also achieves dual heat dissipation for the power module 3 and the thin-film capacitor 4 by sharing the heat dissipation channel 11, reducing the thermal resistance of the thin-film capacitor 4 and improving the heat dissipation utilization rate of the water-cooled plate 1.

[0051] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An integrated lightweight inverter brick structure, characterized in that: include: The water-cooled plate is integrally injection molded and includes heat dissipation channels, a thin-film capacitor mounting cavity, and a three-phase module. The heat dissipation channels are located at the top of the outer wall of the thin-film capacitor mounting cavity. The power module is covered on the water-cooling plate and is located directly above the heat dissipation channel. A sealing ring is installed between the bottom of the module and the heat dissipation channel to seal the heat dissipation channel. Film capacitors are encapsulated in epoxy resin within a film capacitor mounting cavity and are located directly below the heat dissipation channels.

2. The integrated lightweight inverter brick structure according to claim 1, characterized in that: The water-cooled plate is made of plastic.

3. The integrated lightweight inverter brick structure according to claim 1, characterized in that: The thin-film capacitor includes a capacitor core, positive and negative copper busbars, and insulating paper. The terminals of the thin-film capacitor are electrically connected to the terminals of the power module.

4. The integrated lightweight inverter brick structure according to claim 1, characterized in that: The three-phase component is formed by injection molding a three-phase copper busbar, a current sensor core, and a three-phase component housing. The three-phase copper busbar is electrically connected to the power module terminals.

5. The integrated lightweight inverter brick structure according to claim 1, characterized in that: The power module has a heat dissipation structure at its bottom.

6. The integrated lightweight inverter brick structure according to any one of claims 1-5, characterized in that: It also includes a driver board packaged on the power module and a control board located at the bottom of the water-cooled plate. The control board is located below the thin-film capacitor and is connected to the driver board via a wiring harness.

7. The integrated lightweight inverter brick structure according to claim 1, characterized in that: The water-cooled plate has a matching sealing groove formed according to the position and shape of the sealing ring, and the sealing ring is placed in the sealing groove.

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