Heat dissipation device and power conversion equipment

Abstract

The utility model discloses a heat dissipation device and power conversion equipment, and relates to the technical field of heat dissipation. The heat dissipation device comprises a shell, the shell is provided with a first cavity and a second cavity in the preset direction, the first cavity and the second cavity are not communicated with each other, the first cavity is a sealed power cavity, and the two ends of the second cavity are communicated with the external environment; a heat dissipation assembly is arranged in the second cavity and adjacent to the first cavity, and a heat exchange component is arranged in the heat dissipation assembly; wherein the heat exchange component is arranged at a designated position of the heat dissipation assembly according to a preset requirement, so that the utilization rate of a low-efficiency heat dissipation area in the heat dissipation assembly is increased. According to the utility model, the problems that the existing heat dissipation parts and heat exchange parts are large in volume space and large in number, conflict with the requirements of miniaturization, high power density and low cost of power conversion equipment, and cannot meet the development requirements are solved.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a heat dissipation device and a power conversion device. Background Technology

[0002] Inverters or energy storage converters, as core grid-building components in the photovoltaic energy storage field, play a crucial role in the system's performance, reliability, and safety characteristics due to their heat dissipation capabilities.

[0003] Current power conversion equipment, such as inverters, typically includes a high-protection power chamber and a back-mounted, directly ventilated cooling chamber. Inside the power chamber, power modules transfer heat to the heatsink fins via surface-mount heat sinks, where it is then cooled by cool air drawn in by an external fan. Components such as circuit boards (PCBAs) within the power chamber dissipate heat through indirect heat exchange with heat exchangers within the cooling chamber. The entire cooling system, including heat sinks, heat exchangers, and internal and external circulating fans, is bulky and has many components. This configuration conflicts with the demands for miniaturization, high power density, and low cost in power conversion equipment, failing to meet development requirements. Currently, no effective solution has been proposed to address these issues. Utility Model Content

[0004] Purpose of the utility model: To provide a heat dissipation device and a power conversion device to at least solve one of the problems existing in the prior art.

[0005] Technical solution: A heat dissipation device, comprising:

[0006] The housing has two non-communicating cavities, a first cavity and a second cavity, respectively arranged along a predetermined direction. The first cavity is a sealed power cavity, and the two ends of the second cavity are respectively connected to the external environment.

[0007] A heat dissipation assembly is disposed inside the second cavity and adjacent to the first cavity, and a heat exchange component is disposed inside the heat dissipation assembly;

[0008] The heat exchange components are set at designated locations in the heat dissipation assembly according to preset requirements to improve the utilization rate of low-efficiency heat dissipation areas in the heat dissipation assembly.

[0009] Preferably, the heat dissipation assembly includes: a heat dissipation substrate disposed adjacent to the first cavity, a plurality of heat dissipation fins arranged in a sequentially spaced array on the side of the heat dissipation substrate facing the second cavity, the heat exchange component passing through the heat dissipation fins, and the two ends of the heat exchange component being respectively connected to the air collection cavity disposed on the heat dissipation substrate.

[0010] The opening side of the gas collecting chamber faces the first cavity, and the heat exchange channel of the heat exchange component and the chamber of the gas collecting chamber form an airflow circulation channel for circulating and sealing the power cavity.

[0011] Preferably, the opening area of ​​the heat dissipation fins is larger than the outer diameter of the heat exchange component, so that the heat inside the heat exchange component tube is conducted to the outer wall of the heat exchange component and is directly carried away by the external cold air; or, the heat exchange component is in contact with the heat dissipation fins to reduce the contact thermal resistance, so that the heat of the heat exchange component is conducted to the outer surface and then conducted to the heat dissipation fins by heat conduction and is carried away by the external cold air.

[0012] Preferably, the air collection chamber is provided with a first heat dissipation component for providing internal circulation power on the side facing the first cavity. The first heat dissipation component is disposed opposite to the heat exchange component and is located inside the first cavity.

[0013] Preferably, a second heat dissipation component is provided inside the second cavity;

[0014] Wherein, the second heat dissipation component is located at the lower part of the heat dissipation assembly and is disposed opposite to the heat dissipation assembly; or, the second heat dissipation component is located in the middle part of the second cavity and is disposed opposite to the heat exchange component.

[0015] Preferably, the designated position is the upper part of the heat dissipation fins, the middle part of the heat dissipation fins, or the lower part of the heat dissipation fins.

[0016] Preferably, the heat exchange tube is any one or a combination of two or more of the following shapes: rhomboid, square, circular, racetrack-shaped, or elliptical.

[0017] Preferably, the heat exchange components are arranged in a horizontal or cross-shaped configuration.

[0018] Preferably, a plurality of power modules are arranged in a spaced array on the heat dissipation substrate and located within the first cavity, and the plurality of power modules are connected to the heat dissipation substrate through a thermal interface component.

[0019] To achieve the above objectives, according to another aspect of this application, a power conversion device is also provided.

[0020] The power conversion device according to this application includes the aforementioned heat dissipation device.

[0021] Beneficial effects: In this embodiment of the application, by adding heat exchange components, the utilization rate of the low-efficiency heat dissipation area in the heat dissipation component is improved by setting the heat exchange components at the designated positions of the heat dissipation component according to preset requirements. This achieves the purpose of improving the heat dissipation efficiency of the heat dissipation component, thereby realizing the technical effects of simplifying the structure and reducing production costs. In turn, it solves the technical problem that the existing heat dissipation components and heat exchange components are large in volume and number, and conflict with the requirements of miniaturization, high power density and low cost of power conversion equipment, and cannot meet the development requirements. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural diagram of the heat dissipation device of this utility model;

[0023] Figure 2 This is a three-dimensional structural diagram of another heat dissipation device of this utility model;

[0024] Figure 3 This is a schematic diagram of the heat exchange component of the heat dissipation device of this utility model, which runs across the lower part of the heat dissipation fins.

[0025] Figure 4 This is a schematic diagram of the heat exchange component of the heat dissipation device of this utility model, which crosses the upper part of the heat dissipation fins; and

[0026] Figure 5 This is a schematic diagram of the heat exchange component of the heat dissipation device of this utility model, which runs through the middle of the heat dissipation fins.

[0027] The attached figures are labeled as follows:

[0028] 10. Shell;

[0029] 20. First cavity;

[0030] 30. Second cavity;

[0031] 40. Heat dissipation assembly; 401. Heat dissipation base plate; 402. Heat dissipation fins; 403. Air collection cavity;

[0032] 50. Heat exchange components;

[0033] 60. First heat dissipation component;

[0034] 70. Second heat dissipation component;

[0035] 80. Power module;

[0036] 90. Printed circuit boards. Detailed Implementation

[0037] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0038] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0039] Furthermore, the terms "installation," "setup," "equipped with," "connection," "linking," and "socketing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.

[0040] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0041] like Figure 1-5 As shown, this application relates to a heat dissipation device and a power conversion device. The heat dissipation device includes a housing 10, which has two non-communicating first cavities 20 and second cavities 30 arranged along a predetermined direction. The first cavity 20 is a sealed power cavity, and the two ends of the second cavity 30 are respectively connected to the external environment. The housing 10 is a component with protective functions, achieving good protection and also facilitating the assembly of various other components, thus realizing multiple functions. Dividing the housing 10 into two independent cavities, with the two cavities structurally non-communicating, achieves functional isolation, thereby preventing the two cavities from interfering with each other.

[0042] Of course, the methods of dividing the housing 10 into two independent chambers include, but are not limited to: using a partition plate; which can achieve a good separation effect, thereby ensuring the independence and sealing of the two spaces.

[0043] The first cavity 20 is a sealed power cavity used to house power components, such as power modules and power supplies. It can prevent dust, moisture, and gas from entering, thus protecting the core components.

[0044] The two ends of the second cavity 30 are connected to the external environment. The second cavity 30 has an open structure with openings at both ends that are connected to the outside atmosphere. This allows air to flow in from one end and out from the other end, forming an airflow channel. This facilitates the flow of air from natural wind or a fan through the cavity, achieving convective heat dissipation and thus improving the overall heat exchange efficiency of the equipment.

[0045] The preset direction can be the vertical direction or the Y-axis direction in the two coordinate system.

[0046] A heat dissipation assembly 40 is disposed within the second cavity 30 and adjacent to the first cavity 20. The heat dissipation assembly 40 contains a heat exchange component 50. This enables good heat dissipation, transferring heat from the power cavity and carrying it away through airflow. In this application, the heat exchange component 50 is a heat exchange tube.

[0047] Specifically, the heat exchange component 50 is positioned at a designated location on the heat dissipation assembly 40 according to preset requirements to improve the utilization rate of the low-efficiency heat dissipation area in the heat dissipation assembly 40. The utilization efficiency of the radiator in this area is improved by utilizing the finned area of ​​the heat dissipation assembly 40, which has a lower heat dissipation efficiency, to exchange heat across the heat exchange assembly.

[0048] In order to solve the problems of large heat dissipation devices and low heat dissipation efficiency, the common approach in the existing technology is to increase the extended surface of the heat sink or heat exchanger to enhance heat dissipation. For example, heat sinks have high-density fins to reduce fin height, and heat exchangers increase the number of flat tubes and increase the density of fins on the outer surface to reduce their volume. The disadvantages of doing so are that it increases the difficulty and weight of component manufacturing and increases system resistance, requiring a more powerful fan. Overall, it does not significantly improve the reduction of heat dissipation costs and the size of heat dissipation devices.

[0049] As can be seen from the above description, this application achieves the following technical effects:

[0050] In this embodiment, a heat exchange component 50 is added. By setting the heat exchange component 50 at a designated position in the heat dissipation assembly 40 according to preset requirements, the utilization rate of the low-efficiency heat dissipation area in the heat dissipation assembly 40 is improved, thereby achieving the purpose of improving the heat dissipation efficiency of the heat dissipation assembly 40. This achieves the technical effect of simplifying the structure and reducing production costs, and solves the technical problem that the heat dissipation component and heat exchange component are large in volume and number, and conflict with the requirements of miniaturization, high power density and low cost of power conversion equipment, and cannot meet the development requirements.

[0051] like Figure 1-2As shown, the heat dissipation assembly 40 includes: a heat dissipation substrate 401 disposed adjacent to the first cavity 20; a plurality of heat dissipation fins 402 are arranged in a series of intervals on the side of the heat dissipation substrate 401 facing the second cavity 30; the heat exchange component 50 is disposed inside the heat dissipation fins 402; and the two ends of the heat exchange component 50 are respectively connected to the air collection cavity 403 disposed on the heat dissipation substrate 401.

[0052] The opening side of the air collecting cavity 403 faces the first cavity 20, and the heat exchange channel of the heat exchange component 50 and the cavity of the air collecting cavity 403 form an airflow circulation channel for circulating the sealed power cavity. It is understood that efficient heat dissipation is achieved: the heat dissipation fins 402 significantly increase the contact area with air, contributing to enhanced heat exchange efficiency.

[0053] Optimized heat conduction: Through the design of the heat exchange component 50, the heat in the first cavity 20 can be quickly transferred to the outside, avoiding overheating and damage to the equipment.

[0054] Specifically, the heat dissipation fins 402 corresponding to the low-loss module area or the high-temperature margin module area have openings that traverse the heat exchange tube. Two air collection chambers 403 are connected to both ends of the heat exchange tube. The air collection chambers 403 have openings on the side facing the power cavity. The internal channel of the heat exchange tube and the inner sides of the two air collection chambers 403 form the airflow circulation channel for the power cavity. An internal circulation fan is installed on the side of the two air collection chambers 403 facing the power cavity to provide internal circulation power. The internal circulation fan draws hot air from the power cavity into the air collection chamber 403 and sends it into the heat exchange tube. The heat is conducted to the inner wall of the heat exchange tube through convection and then to the heat dissipation fins 402 connected to the heat exchange tube through thermal conduction. The heat is then carried away by external cold air or directly by external cold air blowing across the outer surface of the heat exchange tube.

[0055] Preferably, the heat dissipation fins 402 can be processed by methods such as inserts, serrations, or profiles. This allows for flexible selection of various shapes for different applications.

[0056] Furthermore, the opening area of ​​the heat dissipation fins 402 is larger than the outer diameter of the heat exchange component 50, so that the heat inside the heat exchange component 50 is conducted to the outer wall surface of the heat exchange component 50 and directly carried away by the external cold air; or, the heat exchange component 50 is in contact with the heat dissipation fins 402 to reduce the contact thermal resistance, so that the heat from the heat exchange component 50 is conducted to the outer surface and then conducted to the heat dissipation fins 402 through heat conduction and carried away by the external cold air. It is understandable that this achieves a good heat dissipation effect.

[0057] Specifically, for the perforated fin form of heat exchange tubes, there are two ways to connect the heat exchange tubes to the fins. In one way, the heat exchange tube passes through the opening of the radiator fins without contacting the fins, that is, the opening area of ​​the fins is larger than the outer diameter of the heat exchange tube. The heat inside the heat exchange tube is conducted to the outer wall of the heat exchange tube and is directly carried away by the external cold air. In the other way, the heat exchange tube is perforated and then directly contacts the heat dissipation fins. It is connected by tube expansion or welding to reduce the contact thermal resistance. The heat of the heat exchange tube is conducted to the outer surface and then conducted to the heat dissipation fins through heat conduction and is carried away by the external cold air.

[0058] Furthermore, a first heat dissipation component 60 for providing internal circulation power is provided on the side of the gas collection chamber 403 facing the first cavity 20. The first heat dissipation component 60 is disposed opposite to the heat exchange component 50 and is located inside the first cavity 20. It is understood that this can improve the circulation efficiency within the first cavity, thereby improving heat dissipation efficiency. Simultaneously, the first heat dissipation component 60 and the heat exchange component 50 can be integrated into a single unit, allowing one device to simultaneously meet the heat dissipation needs of both the power cavity board and the power module 80, reducing heat dissipation costs and the number of heat dissipation components. Of course, depending on actual usage requirements, they can be omitted from the integration; this application does not impose any limitations on this.

[0059] In this application, the first heat dissipation component 60 is an internal circulation fan.

[0060] like Figure 3-5 As shown, a second heat dissipation component 70 is provided inside the second cavity 30;

[0061] The second heat dissipation component 70 is located at the lower part of the heat dissipation assembly 40 and is disposed opposite to the heat dissipation assembly 40; or, the second heat dissipation component 70 is located in the middle part of the second cavity 30 and is disposed opposite to the heat exchange component 50. It can be understood that by placing the second heat dissipation component 70 at different positions in the second cavity, a good heat dissipation cooperation effect with the heat dissipation assembly 40 can be achieved, thereby further improving the heat dissipation efficiency.

[0062] In this application, the second heat dissipation component 70 is an external circulation fan.

[0063] Furthermore, the designated location is the upper part, the middle part, or the lower part of the heat dissipation fin 402. It is understood that the heat exchange tube is traversed across the bottom, middle, or upper part of the heat dissipation fins to meet the heat dissipation requirements of different module layouts and save overall heat dissipation space.

[0064] Specifically, when the designated position is the upper part of the heat dissipation fin 402, that is, the heat exchange tube crosses the upper part of the heat dissipation fin, and the second heat dissipation component 70 is located at the lower part of the heat dissipation assembly 40, the airflow flows from top to bottom to ensure good heat dissipation effect.

[0065] When the designated position is the middle of the heat dissipation fin 402, that is, the heat exchange tube crosses the middle of the heat dissipation fin, the second heat dissipation component 70 is set opposite to the heat exchange component 50, and the airflow flows upward and downward with the heat exchange component 50 as the center to ensure good heat dissipation effect.

[0066] When the designated position is the lower part of the heat dissipation fin 402, that is, the heat exchange tube crosses the lower part of the heat dissipation fin, and the second heat dissipation component 70 is located at the lower part of the heat dissipation assembly 40, the airflow flows from bottom to top to ensure good heat dissipation effect.

[0067] Furthermore, the heat exchange tube can be any one or a combination of two or more of the following shapes: rhomboid, square, circular, racetrack-shaped, or elliptical. This allows for a variety of shapes to be chosen, thus enabling flexible use.

[0068] Furthermore, the heat exchange components 50 are arranged in a horizontal or staggered pattern. This arrangement achieves a good overall effect.

[0069] Furthermore, a plurality of power modules 80 are arranged in a spaced array on the heat dissipation substrate 401 and within the first cavity 20, and the plurality of power modules 80 are connected to the heat dissipation substrate 401 through thermal interface components. It is understood that this achieves good assembly results while ensuring good heat dissipation. The thermal interface components include, but are not limited to, silicone grease, thermal conductive gel, etc.

[0070] Specifically, the power module 80 is attached to one side of the heat sink substrate using an interface material, such as silicone grease or thermal conductive gel. Its heat is conducted to the heat sink substrate 401 and then to the heat sink fins 402 connected to the heat sink substrate 401 through thermal conduction. Finally, the heat is carried to the external environment by external cold air.

[0071] Furthermore, a printed circuit board 90 is disposed within the first cavity 20, and the printed circuit board 90 is electrically connected to the power module 80. This allows for good electrical compatibility.

[0072] This utility model also provides a power conversion device, including the aforementioned heat dissipation device.

[0073] This application also has the following beneficial effects:

[0074] I. Improve the overall utilization efficiency of radiators;

[0075] Second, the integrated heat dissipation device not only meets the heat dissipation requirements of the power module 80 but also takes into account the heat dissipation of other components in the power cavity. At the same time, it saves the space occupied by the heat dissipation device, reduces the heat dissipation cost, and achieves the design requirements of miniaturization and high power density of power conversion equipment.

[0076] 3. Enhanced airflow circulation: The cooperation between the air collection chamber and the heat dissipation components forms a closed-loop airflow system, ensuring that heat is quickly carried away;

[0077] IV. High-efficiency heat dissipation and sealing: The sealed power cavity and heat dissipation channel are effectively isolated, reducing external contamination and achieving high-efficiency heat dissipation.

[0078] The preferred embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the specific details of the above embodiments. Within the scope of the technical concept of the present invention, various equivalent transformations can be made to the technical solutions of the present invention, and all such equivalent transformations fall within the protection scope of the present invention.

Claims

1. A heat dissipation device, characterized in that, include: The housing has two non-communicating cavities, a first cavity and a second cavity, respectively arranged along a predetermined direction. The first cavity is a sealed power cavity, and the two ends of the second cavity are respectively connected to the external environment. A heat dissipation assembly is disposed inside the second cavity and adjacent to the first cavity, and a heat exchange component is disposed inside the heat dissipation assembly; The heat exchange components are set at designated locations in the heat dissipation assembly according to preset requirements to improve the utilization rate of low-efficiency heat dissipation areas in the heat dissipation assembly.

2. The heat dissipation device according to claim 1, characterized in that, The heat dissipation assembly includes: a heat dissipation substrate disposed adjacent to the first cavity, a plurality of heat dissipation fins arranged in a sequentially spaced array on the side of the heat dissipation substrate facing the second cavity, the heat exchange component passing through the heat dissipation fins, and the two ends of the heat exchange component being respectively connected to the air collection cavity disposed on the heat dissipation substrate; The opening side of the gas collecting chamber faces the first cavity, and the heat exchange channel of the heat exchange component and the chamber of the gas collecting chamber form an airflow circulation channel for circulating and sealing the power cavity.

3. The heat dissipation device according to claim 2, characterized in that, The opening area of ​​the heat dissipation fins is larger than the outer diameter of the heat exchange component, so that the heat inside the heat exchange component tube is conducted to the outer wall of the heat exchange component and is directly carried away by the external cold air; or, the heat exchange component is in contact with the heat dissipation fins to reduce the contact thermal resistance, so that the heat of the heat exchange component is conducted to the outer surface and then conducted to the heat dissipation fins by heat conduction and is carried away by the external cold air.

4. The heat dissipation device according to claim 2, characterized in that, The gas collection chamber is provided with a first heat dissipation component for providing internal circulation power on the side facing the first cavity. The first heat dissipation component is disposed opposite to the heat exchange component and is located inside the first cavity.

5. The heat dissipation device according to claim 1, characterized in that, A second heat dissipation component is provided inside the second cavity; Wherein, the second heat dissipation component is located at the lower part of the heat dissipation assembly and is disposed opposite to the heat dissipation assembly; or, the second heat dissipation component is located in the middle part of the second cavity and is disposed opposite to the heat exchange component.

6. The heat dissipation device according to claim 2, characterized in that, The designated location is the upper part of the heat dissipation fins, the middle part of the heat dissipation fins, or the lower part of the heat dissipation fins.

7. The heat dissipation device according to claim 1, characterized in that, The heat exchange component is any one or a combination of two or more tube shapes, such as rhombus, square, circle, racetrack, or ellipse.

8. The heat dissipation device according to claim 1, characterized in that, The heat exchange components are arranged in a horizontal or cross-shaped pattern.

9. The heat dissipation device according to claim 2, characterized in that, A plurality of power modules are arranged in a spaced array on the heat dissipation substrate and located within the first cavity, and the plurality of power modules are connected to the heat dissipation substrate through a thermal interface component.

10. A power conversion device, characterized in that, Includes the heat dissipation device as described in any one of claims 1-9.

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