Substrate and semiconductor light source

Abstract

The utility model relates to a substrate and a semiconductor light source. The substrate comprises a base body, a solid crystal electrode and a side electrode, the base body is provided with a front face and a side face which are connected, and the solid crystal electrode is arranged on the front face. And the side surface electrode is arranged on the side surface and is electrically connected with the die bonding electrode. The front surface is provided with a first blank area and a second blank area which are located at the edge and are opposite to each other, the die bonding electrodes and the side surface electrodes are located between the first blank area and the second blank area, and the first blank area and the second blank area are reserved areas for assembly. The substrate can integrate a light-emitting chip and a lens to form a laterally-attached semiconductor light source, a traditional lateral light-emitting module is replaced, namely, the substrate integrates a substrate of the traditional light-emitting module and a support of a light-emitting device, the product integration degree is improved, the structure of the traditional light-emitting module is greatly simplified, the size of the traditional light-emitting module is remarkably reduced, and the cost is reduced. And the cost is obviously reduced.

Description

Technical Field

[0001] This application relates to the field of semiconductor light-emitting technology, and in particular to a substrate and a semiconductor light source. Background Technology

[0002] Traditional side-emitting modules are mounted laterally within a housing. They consist of a substrate and a light-emitting device, which can be either a through-hole device or a surface-mount device, inserted into or attached to the substrate. The housing has a lateral slot with two opposing slots. The substrate is inserted into each slot on its side, allowing it to be placed laterally. The light-emitting device is inserted into or attached to the side of the substrate, enabling lateral emission of light. For electrical connection to the circuit board on the housing, the top surface of the substrate has pads, and the circuit board has spring contacts that spring against the pads to achieve electrical connection. The light-emitting device specifically includes a bracket, a light-emitting chip, and a lens. The light-emitting chip is mounted on the bracket, and the lens is fixed to the bracket and covers the light-emitting chip. However, traditional side-emitting modules are complex in structure, have low integration, and are costly. Summary of the Invention

[0003] Therefore, it is necessary to provide a substrate and semiconductor light source to address the problems of complex structure, low integration, and high cost of traditional side-emitting modules.

[0004] A substrate, comprising:

[0005] A substrate having a connected front and side surfaces;

[0006] A die-bonding electrode, wherein the die-bonding electrode is disposed on the front side; and

[0007] A side electrode, wherein the side electrode is disposed on the side and is electrically connected to the die-bonding electrode;

[0008] The front side has a first blank area and a second blank area located at the edge and opposite to each other. The die-bonding electrode and the side electrode are both located between the first blank area and the second blank area. The first blank area and the second blank area are reserved assembly areas.

[0009] In one embodiment, the substrate further has a back side, which is opposite to the front side and connected to the side side; the substrate further includes a back electrode and a conductive element, the back electrode is disposed on the back side and connected to the side electrode, and the conductive element penetrates the substrate and is respectively connected to the die-bonding electrode and the back electrode.

[0010] In one embodiment, the front surface is further provided with a first clearance area and a second clearance area located at the edge and opposite to each other. The first clearance area is connected to the first blank area and the second blank area, and the second clearance area is connected to the first blank area and the second blank area, forming a closed region around the die-bonding electrode.

[0011] In one embodiment, the die-bonding electrode includes a main chip region; at least two connection holes corresponding to the main chip region are formed on the substrate, each connection hole passing through the back electrode and the substrate, and for the insertion of the conductive element, thereby electrically connecting the main chip region and the back electrode.

[0012] In one embodiment, the substrate further includes at least two concentric rings, each ring of which is disposed on the front side and surrounds the die-bonding electrode, with a resist groove formed between adjacent concentric rings.

[0013] In one embodiment, the at least two retaining walls include a first retaining wall, a second retaining wall, and a third retaining wall arranged from the inside out, with one adhesive groove formed between the first retaining wall and the second retaining wall, and another adhesive groove formed between the second retaining wall and the third retaining wall.

[0014] In one embodiment, the die bond electrode and all the barriers are etched from the same metal layer; or the die bond electrode, all the barriers, and the side electrodes are etched from the same metal layer.

[0015] In one embodiment, a limiting groove is formed on the side surface, the side electrode is located in the limiting groove, the limiting groove has two opposing limiting sides, the two limiting sides are used to limit the two sides of the side electrode.

[0016] In one embodiment, at least one corner of the substrate is provided with a notch.

[0017] A semiconductor light source, comprising:

[0018] The substrate is the substrate described in any of the above embodiments;

[0019] A light-emitting chip, wherein the light-emitting chip is disposed on the die-bonding electrode; and

[0020] A lens is disposed on the substrate, located between the first blank area and the second blank area, and covers the light-emitting chip.

[0021] The aforementioned substrate and semiconductor light source, by setting opposing first and second blank areas at the edge of the front side of the substrate, allow the first blank area and its opposite back area to be inserted into one side slot of a side slot, and the second blank area and its opposite back area to be inserted into the other side slot of the side slot. Thus, the substrate can be inserted into the side slot. The die-bonding electrode on the front side of the substrate is used to mount the light-emitting chip, and the side electrode on the side of the substrate is used to electrically connect to external circuits. Therefore, the light-emitting chip and lens can be integrated on the substrate to form a side-mounted semiconductor light source, replacing the traditional side-emitting module. In other words, this substrate integrates the substrate of a traditional light-emitting module and the support of the light-emitting device, improving product integration, significantly simplifying the structure of the traditional light-emitting module, significantly reducing its size, and significantly lowering its cost.

[0022] Furthermore, by setting a back electrode on the back side of the substrate, the back electrode is electrically connected to the die-bonding electrode through a conductive element and connected to the side electrode. The back electrode can be used for front mounting of the substrate, thus having both side mounting and front mounting applications, increasing its application scenarios and improving its applicability. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the substrate structure in one embodiment of this application.

[0024] Figure 2 for Figure 1 Top view of the middle base plate and the side card slot after assembly.

[0025] Figure 3 for Figure 1 Front view of the middle substrate.

[0026] Figure 4 for Figure 1 Top view of the middle substrate.

[0027] Figure 5 for Figure 1 Bottom view of the middle substrate.

[0028] Figure 6 This is a top view of a semiconductor light source in one embodiment of this application.

[0029] Figure 7 for Figure 6 An exploded view of a semiconductor light source.

[0030] Explanation of reference numerals in the attached figures:

[0031] 100-Substrate; 110-Base; 111-First blank area; 112-Second blank area; 113-First clearance area; 114-Second clearance area; 115-Supporting groove; 116-Notch; 117-Connecting hole; 120-Die bonding electrode; 122-Main chip area; 124-Auxiliary chip area; 130-Side electrode; 132-Side positive electrode; 134-Side negative electrode; 140-Side slot; 142-Slot; 150-Back electrode; 152-Back positive electrode; 154-Back negative electrode; 160-Block; 161-Resin groove; 162-First block; 163-Second block; 164-Third block; 170-Conductive component; 172-Supporting side;

[0032] 200 - Semiconductor light source; 210 - Light-emitting chip; 220 - Lens. Detailed Implementation

[0033] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0034] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0035] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0036] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0037] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0038] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0039] Please see Figure 1 and Figure 2 , Figure 1 A schematic diagram of the substrate structure in one embodiment of this application is shown. Figure 2 It shows Figure 1 A top view of the substrate after assembly with the side slots. An embodiment of this application provides a substrate 100, including a base 110, a die-bonding electrode 120, and a side electrode 130. The base 110 has a connected front and side surface. The die-bonding electrode 120 is located on the front surface. The side electrode 130 is located on the side surface and is electrically connected to the die-bonding electrode 120. The front surface has a first blanking area 111 and a second blanking area 112 located at the edges and opposite to each other. The die-bonding electrode 120 and the side electrode 130 are both located between the first blanking area 111 and the second blanking area 112. The first blanking area 111 and the second blanking area 112 are reserved assembly areas.

[0040] By providing a first blanking area 111 and a second blanking area 112 at the edge of the front side of the substrate 110, with the first blanking area 111 and the second blanking area 112 positioned opposite each other and reserved for assembly, the die-bonding electrode 120 and the side electrode 130 are both located between the first blanking area 111 and the second blanking area 112. When assembling the substrate 100 in the lateral slot 140, the first blanking area 111 and its opposite back area can be inserted into one side slot 142 of the lateral slot 140, and the second blanking area 112 and its opposite back area can be inserted into the lateral slot 140. On the other side of the slot 140, in the slot 142, the substrate 100 can be inserted into the side slot 140. The die-bonding electrode 120 is used to install the light-emitting chip, and the side electrode 130 is used to electrically connect to the external circuit. Therefore, the light-emitting chip and lens can be integrated on the substrate 100 to form a side-mounted semiconductor light source, replacing the traditional side-emitting module. That is, the substrate 100 integrates the substrate of the traditional light-emitting module and the support of the light-emitting device, which improves the product integration, greatly simplifies the structure of the traditional light-emitting module, significantly reduces its size, and significantly reduces its cost.

[0041] It should be noted that, in order to facilitate the insertion of the card substrate 100, the back-facing areas of the first blank area 111 and the second blank area 112 and back-facing areas are all blank areas without any components. The electrical connection between the side electrode 130 and the die-bonding electrode 120 can be achieved through the conductive structure inside the substrate 110 or through the conductive layer disposed on the surface of the substrate 110.

[0042] The front side of the substrate 100 is also provided with a first clearance area 113 and a second clearance area 114 located at the edge and opposite to each other. The first clearance area 113 is connected to the first blank area 111 and the second blank area 112, and the second clearance area 114 is connected to the first blank area 111 and the second blank area 112, forming a closed region surrounding the die-bonding electrode 120. The first clearance area 113 and the second clearance area 114 provide areas to prevent assembly interference. When the substrate 100 is assembled in the lateral slot 140, the probability of assembly interference between the components on the substrate 100, such as lenses, and the lateral slot 140 is reduced, preventing the components from being damaged or falling off due to assembly interference. At the same time, it reduces the assembly difficulty and improves the assembly efficiency.

[0043] The first clearance area 113 can be the front area connected to the side where the side electrode 130 is located. When the side electrode 130 faces upward, the first clearance area 113 is located above the second clearance area 114. After the side electrode 130 elastically abuts against the spring tab of the external circuit board, the first clearance area 113 can also provide clearance space for components on the circuit board. In other embodiments, when the side electrode 130 faces downward, the first clearance area 113 can be located below the second clearance area 114.

[0044] Please see Figures 3 to 5 , Figure 3 A front view of the substrate in this embodiment is shown. Figure 4 A top view of the substrate in this embodiment is shown. Figure 5 A bottom view of the substrate in this embodiment is shown. The substrate 110 also has a back side, which is opposite to the front side and connected to the side side. The substrate 100 also includes a back electrode 150 and a conductive element 170. The back electrode 150 is disposed on the back side and connected to the side electrode 130. The conductive element 170 penetrates the substrate 110 and is connected to the die-bonding electrode 120 and the back electrode 150, respectively.

[0045] By providing a back electrode 150 on the back side of the substrate 110, the back electrode 150 is electrically connected to the die-bonding electrode 120 via a conductive element 170 and is also connected to the side electrode 130. The back electrode 150 can be used for front mounting of the substrate 100, thus combining side mounting and front mounting applications, increasing its application scenarios and expanding its applicability. Moreover, the conductive element 170 not only serves to electrically connect the die-bonding electrode 120 and the back electrode 150, but also serves to conduct heat, transferring the heat generated by the light-emitting chip on the die-bonding electrode 120 to the back electrode 150. The back electrode 150 can radiate heat outward, thereby improving the heat dissipation effect.

[0046] Please combine Figure 2 Since the back electrode 150 occupies most of the back surface of the substrate 110, the opposite region of the first blank area 111 is the corresponding surface on one side of the back electrode 150, and the opposite region of the second blank area 112 is the corresponding surface on the other side of the back electrode 150. It is understood that in other embodiments, the opposite region of the first blank area 111 may be the corresponding region on one side of the back surface of the substrate 110, and the opposite region of the second blank area 112 may be the corresponding region on the other side of the back surface of the substrate 110.

[0047] The back electrode 150 includes a back positive electrode 152 and a back negative electrode 154 spaced apart, and the side electrode 130 includes a side positive electrode 132 and a side negative electrode 134 spaced apart, wherein the back positive electrode 152 is connected to the side positive electrode 132, and the back negative electrode 154 is connected to the side negative electrode 134.

[0048] The die-bonding electrode 120 includes a main chip region 122, which is used to mount a light-emitting chip. At least two connection holes 117 corresponding to the main chip region 122 are formed on the substrate 100. Each connection hole 117 passes through the back electrode 150 and the substrate 110, and allows a conductive element 170 to be inserted, electrically connecting the main chip region 122 and the back electrode 150. That is, the back negative electrode 154 is electrically connected to the main chip region 122 through the conductive element 170, while the main chip region 122 is the front negative electrode.

[0049] Because the connection hole 117 penetrates the back electrode 150 (back negative electrode 154), it facilitates the insertion of the conductive element 170 from the back of the substrate 100. Since at least two connection holes 117 contain conductive elements 170, the heat dissipation of the substrate 100 is improved, and the electrical connection between different electrodes of the substrate 100 is more reliable. In an alternative embodiment, the connection hole 117 may only penetrate the substrate 110 without penetrating the back electrode 150, and the conductive element 170 is connected between the main chip area 122 and the back electrode 150 without being exposed.

[0050] The die-bonding electrode 120 also includes an auxiliary chip region 124, which is spaced apart from the main chip region 122 and is used to mount an electrostatic discharge (ESD) protection chip. The ESD protection chip can prevent ESD from damaging the light-emitting chip and thus avoid chip failure. The substrate 100 also has at least one connection hole 117 corresponding to the auxiliary chip region 124. The connection hole 117 passes through the back positive electrode 152 and the substrate 110, and a conductive element 170 is inserted therein, electrically connecting the auxiliary chip region 124 and the back positive electrode 152. That is, the back positive electrode 152 is electrically connected to the auxiliary chip region 124 through the conductive element 170, and the auxiliary chip region 124 is the front positive electrode.

[0051] It should be noted that both the light-emitting chip and the electrostatic discharge (ESD) protection chip can be, but are not limited to, vertical chips. The negative electrode of the light-emitting chip is soldered to the main chip area 122 (front negative electrode), and its positive electrode is electrically connected to the auxiliary chip area 124 (front positive electrode) via a bonding wire. The positive electrode of the ESD protection chip is soldered to the auxiliary chip area 124, and its negative electrode is connected to the main chip area 122 via a bonding wire. In other embodiments, the light-emitting chip and the ESD protection chip can be flip-chips, directly bonded between the front negative electrode and the front positive electrode, without the need for bonding wires.

[0052] Please combine Figure 1 The substrate 100 also includes at least two concentric rings of baffles 160. Each baffle 160 is located on the front side of the substrate 110 and surrounds the die-bonding electrode 120. Adhesive grooves 161 are formed between adjacent baffles 160. All baffles 160 are located between the first blank area 111 and the second blank area 112. When bonding a lens to the substrate 100, adhesive needs to be placed in one adhesive groove 161. The baffles 160 can block the adhesive, preventing it from overflowing. If the adhesive overflows due to excess, it can flow into another adhesive groove 161 and be blocked by the outer and inner rings of baffles 160, preventing the adhesive from flowing into the first blank area 111 and the second blank area 112 and interfering with the lateral insertion of the substrate 100. At the same time, all baffles 160 are located between the first clearance area 113 and the second clearance area 114 and are surrounded by a closed area.

[0053] The at least two concentric retaining walls 160 specifically include a first retaining wall 162, a second retaining wall 163, and a third retaining wall 164 arranged from the inside out. A glue-receiving groove 161 is formed between the first retaining wall 162 and the second retaining wall 163, and another glue-receiving groove 161 is formed between the second retaining wall 163 and the third retaining wall 164. When bonding the lens, glue is usually placed in the glue-receiving groove 161 between the first retaining wall 162 and the second retaining wall 163. Excess glue that overflows can flow into the glue-receiving groove 161 between the second retaining wall 163 and the third retaining wall 164, forming a multi-layer anti-overflow structure and improving the glue overflow prevention effect.

[0054] Furthermore, the volume of the adhesive-receiving groove 161 between the first retaining wall 162 and the second retaining wall 163 is larger than the volume of the adhesive-receiving groove 161 between the second retaining wall 163 and the third retaining wall 164, thus accommodating more adhesive and improving bonding sealing and stability. In other embodiments, the number of retaining walls 160 is not limited to the above-described case and can be set according to actual needs. For example, the number of retaining walls 160 can be two, four, or more.

[0055] The die-bonding electrode 120 and all the retaining walls 160 on the front side of the substrate 100 are etched from the same metal layer, eliminating the need for additional retaining walls 160 on the front side of the substrate 110. The retaining walls 160 are formed simultaneously with the die-bonding electrode 120, simplifying the process, improving production efficiency, and significantly differing from conventional designs where the metal layers on traditional substrates or supports are all used as conductive polar metals (metal electrodes). In alternative embodiments, the retaining walls 160 can be dams directly formed or bonded to the substrate 110, or protrusions formed on the front side of the substrate 110.

[0056] Since the metal pattern etched on the substrate 100 typically includes the die bond electrode 120, the side electrode 130, and the back electrode 150, all the barriers 160, the die bond electrode 120, the side electrode 130, and the back electrode 150 are etched from the same metal layer. Specifically, the metal pattern of the substrate 100 can be etched in one step on a copper clad laminate (CCL); however, the substrate of the substrate 100 is not limited to a copper clad laminate.

[0057] It should be noted that in other embodiments, the die bond electrode 120 and all the retaining walls 160 may be formed of the same metal layer, while the side electrode 130 and the back electrode 150 may be formed of another metal layer; or, the die bond electrode 120, all the retaining walls 160 and the side electrode 130 may be formed of the same metal layer, while the back electrode 150 may be formed of another metal layer.

[0058] A limiting groove 115 is formed on the side of the substrate 110, and the side electrode 130 is located in the limiting groove 115. The limiting groove 115 has two opposing limiting sides 172, which limit the two sides of the side electrode 130 and thus limit the side electrode 130. The bottom of the limiting groove 115 is connected between the two limiting sides 172. When the side electrode 130 is cut along the limiting direction, the limiting groove 115 can prevent the side electrode 130 from shifting or deforming due to the cutting force. When electrically connected to an external circuit board, the circuit board is provided with an elastically retractable spring piece. The spring piece extends into the limiting groove 115 and elastically abuts against the side electrode 130, thereby realizing the electrical connection between the substrate 100 and the circuit board.

[0059] Since the side electrode 130 includes a side positive electrode 132 and a side negative electrode 134, two limiting grooves 115 are formed on the side of the substrate 110, wherein the side positive electrode 132 is located in one limiting groove 115 and the side negative electrode 134 is located in the other limiting groove 115.

[0060] To reduce assembly difficulty, at least one corner of the substrate 110 is provided with a notch 116. When the corner of the substrate 110 is assembled with the corner of other structures, the notch 116 can provide assembly redundancy, making it easier for the substrate 100 to fit with other structures without increasing structural precision. When a lens is mounted on the substrate 100, the notch 116 can also reduce the probability of the lens being scratched.

[0061] Furthermore, the substrate 100 is cuboid, meaning the base 110 has four corners, each of which has a notch 116, which is concave. In alternative embodiments, the substrate 100 can be other polygons, cylinders, elliptical cylinders, or other shapes, depending on actual needs.

[0062] It should be noted that the type and specifications of substrate 100 are not specifically limited in this application. Substrate 100 can be, but is not limited to, BT board (Bismaleimide Triazine), FR4 board (glass fiber cloth epoxy resin laminate), ceramic substrate, aluminum substrate, or other substrates, depending on the type of light-emitting chip. For example, when the light-emitting chip is a high-power chip, substrate 100 can be a ceramic substrate or an aluminum substrate, which has good heat dissipation. When substrate 100 is an FR4 board, the material of substrate 110 is epoxy resin filled with glass fiber cloth. As for the specifications of substrate 100, they depend on its application scenario. For example, in miniaturized applications, the smaller the size, the better.

[0063] Please see Figure 6 and Figure 7 , Figure 6 A top view of a semiconductor light source according to an embodiment of this application is shown. Figure 7 It shows Figure 6 An exploded view of a semiconductor light source is provided in one embodiment of this application. The semiconductor light source 200 includes a substrate 100, a light-emitting chip 210, and a lens 220. The light-emitting chip 210 is disposed on the substrate 100, and the lens 220 is disposed on the substrate 100 and covers the light-emitting chip 210. The specific structure of the substrate 100 is the same as described in the above embodiments. Since the semiconductor light source 200 in this embodiment adopts all the technical solutions of all the above embodiments, it also has all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here. The light-emitting chip 210 is disposed on the die-bonding electrode 120 of the substrate 100, and the lens 220 is located between the first blank area 111 and the second blank area 112.

[0064] The light-emitting chip 210 can be, but is not limited to, an LED chip or a semiconductor laser chip. The semiconductor laser chip can be, but is not limited to, a VCSEL (Vertical Cavity Surface Emitting Laser) chip. The VCSEL chip can be a single-aperture chip or a multi-aperture chip. Furthermore, the number of light-emitting chips 210 is not limited to one. When the light-emitting chip 210 is a VCSEL chip and there is only one, the light-emitting aperture of the single-aperture VCSEL chip is centered and aligned with the lens 220. For multi-aperture VCSEL chips, the centers of the multiple apertures are centered and aligned with the lens 220. When the light-emitting chip 210 is a VCSEL chip and there are multiple chips, the center of the line connecting the multiple single-aperture VCSEL chips is centered and aligned with the lens 220.

[0065] It should be noted that the application scenarios of substrate 100 in this application are not limited to laser light sources, but can also be LED light sources or other semiconductor light sources, and can even be applied to the packaging of non-light-emitting chips.

[0066] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0067] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A substrate, characterized in that, include: A substrate (110) having a connected front and side surfaces; A die-bonding electrode (120) is disposed on the front side; and Side electrode (130), the side electrode (130) is disposed on the side and electrically connected to the die-bonding electrode (120); The front side is provided with a first blank area (111) and a second blank area (112) located at the edge and opposite to each other. The die-bonding electrode (120) and the side electrode (130) are both located between the first blank area (111) and the second blank area (112). The first blank area (111) and the second blank area (112) are reserved assembly areas.

2. The substrate according to claim 1, characterized in that, The substrate (110) also has a back side, which is opposite to the front side and connected to the side side; The substrate (100) further includes a back electrode (150) and a conductive element (170). The back electrode (150) is disposed on the back side and connected to the side electrode (130). The conductive element (170) penetrates the substrate (110) and connects the die-bonding electrode (120) and the back electrode (150) respectively.

3. The substrate according to claim 1 or 2, characterized in that, The front side is also provided with a first void area (113) and a second void area (114) located at the edge and opposite to each other. The first void area (113) is connected to the first blank area (111) and the second blank area (112) respectively, and the second void area (114) is connected to the first blank area (111) and the second blank area (112) respectively, thus forming a closed area around the die-bonding electrode (120).

4. The substrate according to claim 2, characterized in that, The die-bonding electrode (120) includes a main chip region (122); The substrate (100) has at least two connection holes (117) corresponding to the main chip area (122). Each connection hole (117) passes through the back electrode (150) and the substrate (110) and allows the conductive element to be inserted, thereby electrically connecting the main chip area (122) and the back electrode (150).

5. The substrate according to claim 1 or 2, characterized in that, Also includes: At least two rings of retaining walls (160) are provided on the front side and surrounding the die-bonding electrode (120), and a glue-containing groove (161) is formed between adjacent retaining walls (160).

6. The substrate according to claim 5, characterized in that, The at least two retaining walls (160) include a first retaining wall (162), a second retaining wall (163), and a third retaining wall (164) arranged from the inside out. A receiving groove (161) is formed between the first retaining wall (162) and the second retaining wall (163), and another receiving groove (161) is formed between the second retaining wall (163) and the third retaining wall (164).

7. The substrate according to claim 5, characterized in that, The die-bonding electrode (120) and all the retaining walls (160) are etched from the same metal layer; or The die-bonded electrode (120), all the retaining walls (160) and the side electrode (130) are etched from the same metal layer.

8. The substrate according to claim 1 or 2, characterized in that, A limiting groove (115) is provided on the side, and the side electrode (130) is located in the limiting groove (115). The limiting groove (115) has two opposing limiting sides (172), which are used to limit the two sides of the side electrode (130).

9. The substrate according to claim 1 or 2, characterized in that, At least one corner of the base (110) is provided with a notch (116).

10. A semiconductor light source, characterized in that, include: Substrate (100), wherein the substrate (100) is the substrate (100) according to any one of claims 1 to 9. A light-emitting chip (210) is disposed on the die-bonding electrode (120); as well as Lens (220) is disposed on the substrate (100), located between the first blank area (111) and the second blank area (112), and covers the light-emitting chip (210).

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