Silicon wafer polishing solution cooling circulation structure
By adopting a double-spiral copper heat exchanger structure in the polishing slurry cooling system, the problem of substandard polishing slurry cooling was solved, achieving stable temperature and uniformity of the polishing slurry, thereby improving the quality of silicon wafer polishing and the service life of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TUNGHSU TECH GRP CO LTD
- Filing Date
- 2024-12-05
- Publication Date
- 2026-05-22
AI Technical Summary
Existing polishing slurry cooling mechanisms cannot effectively reduce temperature, affecting the quality of silicon wafer polishing and the wear of polishing pads.
The double-spiral copper heat exchanger structure increases the heat exchange area. The double-spiral copper heat exchanger allows for full contact with the polishing fluid, enabling layer-by-layer cooling. It also isolates the coolant from the polishing fluid, preventing the pump's suction action from affecting the coolant circulation.
This achieves temperature stability of the polishing slurry, ensuring its uniformity and quality, and extending the service life of the equipment.
Smart Images
Figure CN224266025U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of photovoltaic production equipment technology, specifically a silicon wafer polishing fluid cooling circulation structure. Background Technology
[0002] Silicon wafers used in the photovoltaic industry often employ CMP (Chemical Mechanical Polishing) technology. During the polishing process, friction between solids and the chemical reaction between the polishing slurry and the silicon wafer cause localized temperature increases, directly affecting the polishing quality of the silicon wafer and the wear of the polishing pad. Existing polishing slurry cooling mechanisms suffer from insufficient cooling temperature. To address this technical issue, a silicon wafer polishing slurry cooling circulation structure is proposed. Utility Model Content
[0003] One of the technical problems that this disclosure aims to solve is that existing polishing slurry cooling mechanisms have the problem of not reaching the required cooling temperature.
[0004] To address the aforementioned technical problems, this disclosure provides a silicon wafer polishing slurry cooling circulation structure.
[0005] To achieve the above objectives, this utility model provides the following technical solution:
[0006] A silicon wafer polishing slurry cooling circulation structure includes: a polishing slurry return cylinder, wherein the top of the polishing slurry return cylinder is provided with an opening;
[0007] A return cylinder cover is provided at the top opening of the polishing fluid return cylinder, and the return cylinder cover is detachably installed on the polishing fluid return cylinder;
[0008] The double-spiral copper heat exchanger is installed inside the polishing fluid return cylinder. The coolant outlet of the double-spiral copper heat exchanger passes through the first through hole on the return cylinder cover, and the coolant inlet of the double-spiral copper heat exchanger passes through the second through hole on the return cylinder cover.
[0009] A polishing fluid pump is installed on the reflux cylinder cover. The input end of the polishing fluid pump is located inside the polishing fluid reflux cylinder and in the middle of the double spiral copper heat exchanger.
[0010] and a reflux funnel installed on the reflux cylinder cover, the reflux funnel being installed on the third through hole on the reflux cylinder cover.
[0011] The double-helix copper heat exchanger in this design features a double-helix structure, which increases the heat exchange area and allows the polishing fluid to fully contact and cool layer by layer, ensuring a stable temperature of the polishing fluid pumped by the pump.
[0012] In some embodiments, the coolant outlet of the double-helix copper heat exchanger and the coolant inlet of the pump are both installed on the chiller unit.
[0013] In some embodiments, a vent hood is also installed on the fourth through hole of the reflux cylinder cover.
[0014] In some embodiments, the ventilated cover is provided with a first filter screen.
[0015] In some embodiments, a flange is provided at the top opening of the polishing fluid return cylinder, and the return cylinder cover is mounted on the flange.
[0016] In some embodiments, the reflux cylinder cover is bolted to the flange.
[0017] In some embodiments, the input end of the polishing fluid pump is provided with a stirring mechanism.
[0018] In some embodiments, the reflux funnel is provided with a polishing fluid reflux port.
[0019] In some embodiments, a second filter screen is provided on the polishing fluid return port.
[0020] In some embodiments, the polishing fluid pump is provided with a cooling polishing fluid outlet.
[0021] Compared with the prior art, the beneficial effects of this utility model are: the double-helix copper heat exchanger has a double-helix structure, which increases the heat exchange area, and the polishing liquid is fully contacted and cooled layer by layer, ensuring that the temperature of the polishing liquid drawn by the pump is stable; the coolant and polishing liquid are isolated, and the pump's suction action will not affect the circulation of the coolant. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Fig. 1 This is an exploded structural diagram of a silicon wafer polishing fluid cooling circulation structure according to an embodiment of this utility model.
[0024] Fig. 2 This is a top view of a silicon wafer polishing fluid cooling circulation structure in an embodiment of this utility model.
[0025] In the diagram: 1-Polishing fluid return cylinder, 2-Double spiral copper heat exchanger, 3-Return cylinder cover, 4-Ventilation hood, 5-Heat exchanger joint fixing plate, 6-Return funnel, 7-Polishing fluid, 21-Coolant outlet, 22-Pump coolant inlet, 61-Polishing fluid return port. Detailed Implementation
[0026] The embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of this disclosure by way of example, but should not be used to limit the scope of this disclosure. This disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
[0027] These embodiments are provided to make the disclosure thorough and complete, and to fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values set forth in these embodiments should be interpreted as exemplary only and not as limiting.
[0028] It should be noted that, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0029] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. When a particular device is described as being located between a first device and a second device, an intermediary device may or may not be present between the particular device and the first or second device.
[0030] See Fig. 1 and Fig. 2 As shown, Fig. 1 This is an exploded structural diagram of a silicon wafer polishing fluid cooling circulation structure according to an embodiment of this utility model. Fig. 2 This is a top view of a silicon wafer polishing slurry cooling circulation structure according to an embodiment of the present invention. Existing polishing slurry cooling mechanisms suffer from insufficient cooling temperature. To address this technical problem, a silicon wafer polishing slurry cooling circulation structure is proposed.
[0031] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.
[0032] Example 1
[0033] Please see Figs. 1-2 This utility model provides a structural diagram of a silicon wafer polishing slurry cooling circulation structure according to Embodiment 1. The silicon wafer polishing slurry cooling circulation structure includes: a polishing slurry return cylinder 1, with a return cylinder cover 3 covering the top opening of the polishing slurry return cylinder 1. The return cylinder cover 3 is detachably installed on the polishing slurry return cylinder 1, forming a semi-enclosed polishing slurry return space. A double-helix copper heat exchanger 2 is installed inside the polishing slurry return cylinder 1. The coolant outlet 21 of the double-helix copper heat exchanger 2 passes through a first through hole on the return cylinder cover 3, and the coolant inlet 22 of the double-helix copper heat exchanger 2 passes through a second through hole on the return cylinder cover 3. A polishing slurry pump 7 is also installed on the return cylinder cover 3, with its input end located inside the polishing slurry return cylinder 1. A return funnel 6 is installed on the return cylinder cover 3, with the return funnel 6 installed in a third through hole on the return cylinder cover 3. The input end of the polishing slurry pump 7 is located in the middle of the double-helix copper heat exchanger 2.
[0034] The double-helix copper heat exchanger 2 of this utility model has a double-helix structure, which increases the heat exchange area, allows the polishing liquid to fully contact and cool layer by layer, and ensures that the temperature of the polishing liquid drawn by the pump is stable; it isolates the coolant and the polishing liquid, so that the pump's suction action will not affect the circulation of the coolant.
[0035] In a preferred embodiment of this invention, the coolant outlet 21 and pump coolant inlet 22 of the double-helix copper heat exchanger 2 are both installed on the chiller unit. The coolant inside the double-helix copper heat exchanger 2 circulates within the chiller, exchanging heat with the refrigerant in the chiller unit. It does not crystallize with the pipes inside the chiller, ensuring long-term performance and eliminating the need for cleaning the internal pipes. The chiller unit is existing technology and will not be described in detail here.
[0036] In a preferred embodiment of this utility model, a vent 4 is also installed on the fourth through hole on the return cylinder cover 3, and the vent 4 is set to make the air pressure inside and outside the polishing liquid return cylinder 1 the same.
[0037] In a preferred embodiment of this utility model, the vent 4 is provided with a first filter screen to prevent impurities from mixing into the polishing liquid.
[0038] In a preferred embodiment of this utility model, a flange is provided at the top opening of the polishing fluid return cylinder 1, and the return cylinder cover 3 is mounted on the flange, which facilitates the disassembly of the return cylinder cover 3. The return cylinder cover 3 is mounted on the flange by bolts.
[0039] In a preferred embodiment of this utility model, the input end of the polishing slurry pump 7 is provided with a stirring mechanism, which can stir the polishing slurry inside the polishing slurry return cylinder 1 to ensure the uniformity of the polishing slurry. The stirring mechanism is prior art and can be purchased on the market, so it will not be described in detail here.
[0040] In a preferred embodiment of the present invention, the reflux funnel 6 is provided with a polishing liquid reflux port 61.
[0041] In a preferred embodiment of this utility model, a second filter screen is provided on the polishing fluid return port 61 to prevent impurities from mixing into the polishing fluid.
[0042] In a preferred embodiment of this utility model, the polishing liquid pump 7 is provided with a cooling polishing liquid outlet.
[0043] In a preferred embodiment of the present invention, a heat exchanger joint fixing plate 5 is also fixedly installed at the bottom of the reflux cylinder cover 3. The heat exchanger joint fixing plate 5 is used to fix the coolant outlet 21 and the pump coolant inlet 22 on the double spiral copper heat exchanger 2, so as to fix the double spiral copper heat exchanger 2.
[0044] The working principle of this utility model is as follows:
[0045] The used polishing slurry in the polishing equipment enters the polishing slurry return cylinder 1 from the polishing slurry return port 61 under gravity, where it exchanges heat with the cooling slurry inside the heat exchanger 2 and is reduced to the operating temperature. The polishing slurry pump 7 is located in the middle of the double spiral copper heat exchanger 2, stirring the polishing slurry inside the polishing slurry return cylinder 1 to make it uniform and prevent sedimentation, and drawing the polishing slurry cooled at the bottom center of the double spiral copper heat exchanger 2 and pumping it into the polishing equipment for subsequent processes.
[0046] The embodiments of this disclosure have now been described in detail. To avoid obscuring the concept of this disclosure, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.
[0047] While specific embodiments of this disclosure have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any manner.
Claims
1. A silicon wafer polishing slurry cooling circulation structure, characterized in that, include: Polishing fluid return cylinder (1), wherein the top of the polishing fluid return cylinder (1) is provided with an opening; A return cylinder cover (3) is placed over the top opening of the polishing fluid return cylinder (1), and the return cylinder cover (3) is detachably installed on the polishing fluid return cylinder (1); The double spiral copper heat exchanger (2) is installed inside the polishing liquid return cylinder (1). The coolant outlet (21) of the double spiral copper heat exchanger (2) passes through the first through hole on the return cylinder cover (3), and the coolant inlet (22) of the double spiral copper heat exchanger (2) passes through the second through hole on the return cylinder cover (3). A polishing fluid pump (7) is installed on the return cylinder cover (3). The input end of the polishing fluid pump (7) is located inside the polishing fluid return cylinder (1). The input end of the polishing fluid pump (7) is located in the middle position of the double spiral copper heat exchanger (2). and a reflux funnel (6) installed on the reflux cylinder cover (3), the reflux funnel (6) being installed on the third through hole on the reflux cylinder cover (3).
2. The silicon wafer polishing slurry cooling circulation structure according to claim 1, characterized in that, The coolant outlet (21) and pump coolant inlet (22) of the double-helix copper heat exchanger (2) are both installed on the chiller unit.
3. The silicon wafer polishing slurry cooling circulation structure according to claim 1, characterized in that, A ventilator (4) is also installed on the fourth through hole of the reflux cylinder cover (3).
4. The silicon wafer polishing slurry cooling circulation structure according to claim 3, characterized in that, The breathable cover (4) is provided with a first filter screen.
5. The silicon wafer polishing slurry cooling circulation structure according to claim 1, characterized in that, The polishing fluid return cylinder (1) has a flange at the top opening, and the return cylinder cover (3) is installed on the flange.
6. The silicon wafer polishing slurry cooling circulation structure according to claim 5, characterized in that, The reflux cylinder cover (3) is bolted to the flange.
7. The silicon wafer polishing slurry cooling circulation structure according to claim 1, characterized in that, The input end of the polishing liquid pump (7) is equipped with a stirring mechanism.
8. The silicon wafer polishing slurry cooling circulation structure according to claim 1, characterized in that, The reflux funnel (6) is provided with a polishing liquid reflux port (61).
9. A silicon wafer polishing slurry cooling circulation structure according to claim 8, characterized in that, A second filter screen is provided on the polishing liquid return port (61).
10. The silicon wafer polishing slurry cooling circulation structure according to claim 1, characterized in that, The polishing fluid pump (7) is equipped with a cooling polishing fluid outlet.