Wafer polishing equipment

Abstract

This utility model discloses a wafer polishing apparatus, which includes a first polishing component, a first driving component, a measuring component, a protective component, and an exhaust component. The first polishing component includes a first rotating disk and a first polishing pad, the first polishing pad having a first polishing surface. The measuring component is disposed on the first rotating disk. The protective component includes a light-transmitting element, which is sealed and fitted within a first through hole and spaced apart on one side of the measuring component adjacent to the first polishing surface. A receiving cavity is provided between the light-transmitting element and the measuring component, allowing the measuring signal emitted by the measuring component to pass through the receiving cavity and be emitted through the light-transmitting element. The exhaust component includes an exhaust pipe and an aerodynamic mechanism connected in series with the exhaust pipe. One end of the exhaust pipe is connected to the receiving cavity, allowing the exhaust component to discharge the gas inside the receiving cavity. Therefore, the exhaust component can reduce the influence of water vapor on the measuring component during the polishing process, thus improving the detection accuracy of the measuring component.

Description

Technical Field

[0001] This utility model relates to the field of wafer polishing equipment technology, and in particular to a wafer polishing device. Background Technology

[0002] During the wafer polishing process, the polishing fluid needs to continuously wash the wafer surface to achieve effective polishing. At the same time, the measuring components need to monitor the thickness and flatness of the wafer in real time during the polishing process to ensure the product quality of the wafer.

[0003] However, if moisture penetrates and comes into contact with the measurement components during wafer polishing, it will reduce the measurement accuracy of the measurement components. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a wafer polishing apparatus, wherein the venting assembly can reduce the influence of water vapor on the measurement of the measuring components during the polishing process, thereby improving the detection accuracy of the measuring components.

[0005] A wafer polishing apparatus according to an embodiment of the present invention includes: a first polishing component, a first driving component, a measuring component, a protective component, and an exhaust component. The first polishing component includes a first rotating disk and a first polishing pad. The first polishing pad is disposed on the first rotating disk and has a first polishing surface suitable for polishing a workpiece. The first polishing pad also has spaced-apart first through holes and liquid supply holes, both of which penetrate the first polishing surface. The liquid supply holes are suitable for supplying polishing fluid and / or cleaning fluid toward the first polishing surface. The first driving component drives the first rotating disk to rotate the first polishing pad. The measuring component... The measuring component is located on the first rotating disk and is used to measure the thickness and / or flatness of the workpiece. The protective component is located on the side of the measuring component facing the first polished surface and includes a light-transmitting component. The light-transmitting component is sealed and fitted in the first through hole and spaced apart on the side of the measuring component adjacent to the first polished surface. There is a receiving cavity between the light-transmitting component and the measuring component so that the measurement signal emitted by the measuring component passes through the receiving cavity and is emitted through the light-transmitting component. The exhaust component is located on the first polishing component and includes an exhaust pipe and an aerodynamic mechanism connected in series with the exhaust pipe. One end of the exhaust pipe is connected to the receiving cavity so that the exhaust component can exhaust the gas in the receiving cavity.

[0006] According to an embodiment of the present invention, a wafer polishing apparatus includes a first polishing pad with a first through hole and a liquid supply hole spaced apart. The liquid supply hole is adapted to provide polishing liquid and / or cleaning liquid to the first polishing surface. A light-transmitting element is sealed and fitted to the first through hole and is spaced apart on the side of the measuring component adjacent to the first polishing surface, so that the measurement signal emitted by the measuring component can be emitted through the light-transmitting element. A receiving cavity is also provided between the light-transmitting element and the measuring component. One end of an exhaust pipe is connected to the receiving cavity. When the seal between the light-transmitting element and the first through hole is damaged, water vapor may penetrate into the receiving cavity from the gap between the wall of the light-transmitting element and the first through hole. At this time, the exhaust pipe can discharge the water vapor in the receiving cavity to reduce the influence of water vapor on the measurement of the measuring component and improve the reliability of the wafer polishing apparatus.

[0007] In some embodiments, the exhaust assembly further includes a processor and a humidity sensor. The humidity sensor is located inside the housing cavity and is used to detect the humidity inside the housing cavity. The humidity sensor and the aerodynamic mechanism are respectively in communication with the processor. The other end of the exhaust pipe is connected to the external environment. The processor is used to determine whether to activate the aerodynamic mechanism based on the detection result of the humidity sensor.

[0008] In some embodiments, the wafer polishing apparatus is configured to satisfy at least one of the following conditions: Condition A1, the light-transmitting element is inclined relative to the first polishing surface on one side surface; Condition A2, the light transmittance of the light-transmitting element is greater than or equal to 85%, and the measuring component includes a laser measuring instrument; Condition A3, the light-transmitting element is a glass element and is a hardened element; Condition A4, the thickness of the light-transmitting element is D, 2mm≤D≤3mm; Condition A5, the light-transmitting element and the first polishing surface are spaced apart axially in the first through hole.

[0009] In some embodiments, the wafer polishing apparatus satisfies at least condition A1, and also satisfies at least one of the following conditions: the angle between the side surface of the light-transmitting element corresponding to the first polishing surface and the first polishing surface is α, 3°≤α≤7°; the axial distance between the light-transmitting element and the first polishing surface decreases in the direction away from the rotation axis of the first polishing assembly; a drain groove is formed on the first polishing surface, the drain groove penetrating the hole wall of the first through hole and the outer peripheral wall of the first polishing pad.

[0010] In some embodiments, a plurality of drainage grooves are formed on the first polishing surface. The plurality of drainage grooves include a plurality of first drainage grooves and a plurality of second drainage grooves. The plurality of first drainage grooves are spaced apart along a first direction and each first drainage groove extends along a second direction. The plurality of second drainage grooves are spaced apart along the second direction and each second drainage groove extends along the first direction, so that the first drainage grooves and the second drainage grooves are intersected. Both the first direction and the second direction are parallel to the first polishing surface.

[0011] In some embodiments, the first rotating disk has a mounting hole that is opposite to and communicates with the first through hole, and the measuring component is disposed in the mounting hole and extends into the first through hole.

[0012] In some embodiments, the wafer polishing apparatus further includes: a second polishing component and a second driving component. The second polishing component is disposed below the first polishing component and includes a second rotating disk and a second polishing pad. The second polishing pad is disposed vertically opposite to the first polishing pad and has a second polishing surface opposite to the first polishing surface. The second driving component is used to drive the second polishing component to rotate. The rotation direction of the second polishing component is opposite to that of the first polishing component.

[0013] In some embodiments, the protective assembly further includes a mounting base that is sealed within a first through-hole and has a second through-hole, wherein a light-transmitting element is sealed within the second through-hole such that the light-transmitting element is indirectly sealed within the first through-hole via the mounting base, and a portion of the second through-hole located on the side of the light-transmitting element opposite to the first polished surface defines at least a portion of the receiving cavity.

[0014] In some embodiments, the end of the mounting base opposite to the first polished surface is sealed to the measuring component so that a portion of the second through hole defines a receiving cavity, and a communication port is formed on the mounting base for an exhaust pipe to pass through, and the exhaust pipe is clearance-fitted to the communication port.

[0015] In some embodiments, the mounting base is configured to satisfy at least one of the following conditions: the mounting base is made of stainless steel; the mounting base and the first polished surface are axially spaced apart in the first through hole; the mounting base includes a first body portion and a second body portion, the first body portion is located on the side of the second body portion opposite to the first polished surface and is threadedly connected to the first through hole, the second body portion extends radially out of the outer peripheral wall of the first body portion along the first through hole, and the portion of the second body portion extending out of the first body portion is sealed and fitted with the first through hole in the axial direction of the first through hole; the second through hole is formed as a stepped hole and includes a first hole portion and a second hole portion, the first hole portion is located on the side of the second hole portion opposite to the first polished surface, and the diameter of the first hole portion is smaller than the diameter of the second hole portion, so that a step portion is formed between the first hole portion and the second hole portion; the light-transmitting element has a uniform thickness structure and is sealed and connected to the step portion by an adhesive, the step portion is inclined relative to the first polished surface, so that the light-transmitting element is inclined relative to the first polished surface; the mounting base is threadedly connected to the first through hole, and at least one clamping groove is formed at one end of the corresponding polished surface of the mounting base.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0018] Figure 1 This is a schematic diagram of a wafer polishing apparatus according to some embodiments of the present invention;

[0019] Figure 2 yes Figure 1 The diagram shows the assembly of the protective components and the exhaust components.

[0020] Figure 3 yes Figure 1 A schematic diagram of the protective components shown;

[0021] Figure 4 yes Figure 3 Another schematic diagram of the protective components shown;

[0022] Figure 5 yes Figure 4 Another schematic diagram of the protective components shown.

[0023] Figure reference numerals: Wafer polishing apparatus 100,

[0024] First polishing component 1, first rotating disk 10, mounting hole 10a, first polishing pad 12, first polishing surface 12a, first through hole 12b

[0025] Measuring component 2, receiving cavity 20

[0026] Protective component 3, light-transmitting element 30, mounting base 31, connecting port 31a, first base body 31b, second base body 31c, clamping groove 31d, second through hole 32, first hole 32a, second hole 32b, stepped part 32c, first seal 33, second seal 34.

[0027] Exhaust assembly 4, exhaust pipe 40, aerodynamic mechanism 41, processor 42, humidity sensor 43, valve structure 44. Detailed Implementation

[0028] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0029] The following disclosure provides numerous different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention; however, those skilled in the art will recognize the applicability of other processes and / or the use of other materials.

[0030] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0031] Hereinafter, with reference to the accompanying drawings, a wafer polishing apparatus 100 according to an embodiment of the present invention will be described.

[0032] Please refer to Figure 1 and Figure 2 The wafer polishing apparatus 100 includes: a first polishing component 1, a first driving component, a measuring component 2, a protective component 3, and an exhaust component 4. The first polishing component 1 includes a first rotating disk 10 and a first polishing pad 12. The first polishing pad 12 is disposed on the first rotating disk 10 and has a first polishing surface 12a suitable for polishing a workpiece. The first polishing pad 12 also forms a first through hole 12b and a liquid supply hole spaced apart. Both the first through hole 12b and the liquid supply hole penetrate the first polishing surface 12a, and the liquid supply hole is suitable for supplying polishing fluid and / or cleaning fluid toward the first polishing surface 12a. The first driving component... The first rotating disk 10 is used to drive the first polishing pad 12 to rotate. The measuring component 2 is disposed on the first rotating disk 10 and is used to measure the thickness and / or flatness of the workpiece. The protective component 3 is disposed on the side of the measuring component 2 facing the first polishing surface 12a and includes a light-transmitting component 30. The light-transmitting component 30 is sealed and fitted in the first through hole 12b and spaced apart on the side of the measuring component 2 adjacent to the first polishing surface 12a. There is a receiving cavity 20 between the light-transmitting component 30 and the measuring component 2 so that the measurement signal emitted by the measuring component 2 passes through the receiving cavity 20 and is emitted through the light-transmitting component 30.

[0033] Understandably, when the wafer polishing apparatus 100 is a single-sided polishing apparatus, the workpiece can be placed on a support platform, and the first polishing component 1 is located on one side of the workpiece for single-sided polishing. When the wafer polishing apparatus 100 is a double-sided polishing apparatus, it has two polishing components arranged opposite to each other. The workpiece can be placed on the polishing pad of one of the polishing components, for example, on the first polishing pad 12 or on the second polishing pad described later, so that both sides of the workpiece contact the two polishing pads respectively for double-sided polishing. Furthermore, there can be one or more liquid supply holes. For a single liquid supply hole, it can be used only to provide polishing fluid or only to provide cleaning fluid. Of course, in some examples, a single liquid supply hole can switch between providing polishing fluid and providing cleaning fluid.

[0034] For example, taking the bottom surface of the first polishing pad 12 as the first polishing surface 12a, in the vertical direction, the measuring components 2 are spaced above the first polishing surface 12a, and the protective components 3 are located between the measuring components 2 and the first polishing surface 12a.

[0035] The protective component 3 is located between the measuring component 2 and the first polishing surface 12a. When the measuring component 2 measures the thickness and / or flatness of the workpiece, the measuring component 2 performs non-contact measurement, so that the measuring component 2 is less likely to scratch or contaminate the workpiece during the measurement process. This is especially suitable for thinner workpieces or scenarios where the workpiece surface is more sensitive, which can improve the applicability of the wafer polishing device 100.

[0036] As can be seen, the first polishing pad 12 has a first through hole 12b and a liquid supply hole spaced apart. The light emitted from the measuring component 2 needs to pass through the first through hole 12b before being emitted. By spaced the liquid supply hole and the first through hole 12b, the polishing liquid sprayed from the liquid supply hole is less likely to affect the measurement signal emitted from the measuring component 2, which facilitates the improvement of the stability of the measuring component 2. The first polishing pad 12 has a first polishing surface 12a for polishing the workpiece. The first driving component is used to drive the first rotating disk 10 to drive the first polishing pad 12 to rotate, so that the first polishing surface 12a can move relative to the workpiece to achieve polishing of the workpiece. At the same time, the polishing liquid can flow to the workpiece through the liquid supply hole, which can promptly remove the debris and heat generated during the polishing process, avoid debris accumulation on the workpiece surface causing scratches, reduce workpiece deformation or material property changes caused by local overheating, thereby significantly improving the surface smoothness and flatness of the workpiece. The polishing liquid can also reduce the frictional resistance between the first polishing pad 12 and the workpiece, so that the workpiece and the first polishing component 1 are not easily damaged, extend the service life of the first polishing component 1, and improve the stability and reliability of the polishing operation.

[0037] Furthermore, the measuring component 2 is located on the first rotating disk 10, and the light-transmitting element 30 is sealed and fitted in the first through hole 12b. The light-transmitting element 30 is spaced apart on the side of the measuring component 2 adjacent to the first polishing surface 12a. Therefore, the measuring component 2 is farther away from the first polishing surface 12a than the light-transmitting element 30. There is a receiving cavity 20 between the measuring component 2 and the light-transmitting element 30. By sealing and fitting the light-transmitting element 30 in the first through hole 12b, the light-transmitting element 30 can separate the polishing liquid from the measuring component 2 during the operation of the wafer polishing device 100. This makes it difficult for the polishing liquid, water vapor, etc., during the workpiece polishing process to enter the receiving cavity 20 through the edge of the light-transmitting element 30, so as to provide a certain degree of protection for the measuring component 2 and facilitate the improvement of the measurement accuracy of the measuring component 2.

[0038] The exhaust assembly 4 is located on the first polishing assembly 1 and includes an exhaust pipe 40 and an aerodynamic mechanism 41 connected in series with the exhaust pipe 40. One end of the exhaust pipe 40 is connected to the receiving cavity 20, so that the exhaust assembly 4 can exhaust the gas in the receiving cavity 20. Even if the seals of the light-transmitting element 30 and the first through hole 12b are damaged, and / or other locations in the receiving cavity 20 are not sealed or the seals fail, causing some water vapor to enter the receiving cavity 20 during the polishing process, the aerodynamic mechanism 41 can still drive the gas flow in the exhaust pipe 40 to exhaust the water vapor in the receiving cavity 20, so that the water vapor is not... Most of the moisture remains within the receiving cavity 20, reducing the impact of water vapor on the measurement of the measuring component 2. Furthermore, water vapor is less likely to affect the light transmittance of the light-transmitting element 30. This is especially beneficial for measuring components 2 where light transmittance is critical, ensuring better measurement accuracy. Simultaneously, the side of the light-transmitting element 30 facing the measuring component 2 will not gradually accumulate excessive amounts of liquid such as polishing fluid or cleaning fluid, thus preventing it from affecting the measuring component 2. This allows the measurement data from the measuring component 2 to more accurately reflect the thickness and / or flatness of the workpiece, improving product quality and enhancing the reliability of the wafer polishing apparatus 100. Therefore, the venting component 4 facilitates the continuous maintenance of a water-free environment inside the receiving cavity 20, ensuring dimensional stability of the processed products.

[0039] For example, the light-transmitting element 30 and the first through hole 12b are sealed by a sealing element. During the wafer polishing process, the wafer polishing apparatus 100 needs to perform polishing and cleaning steps. For example, the liquid supply hole can not only provide polishing fluid, but also cleaning fluid (especially high-pressure cleaning). Since the temperature of the cleaning fluid is lower than that of the polishing fluid, the sealing element may cause a gap between the light-transmitting element 30 and the first through hole 12b due to thermal expansion and contraction. At this time, water vapor may enter the receiving cavity 20 through the gap between the light-transmitting element 30 and the first through hole 12b. This application can promptly discharge the water vapor in the receiving cavity 20 by setting the exhaust component 4, so as to reduce the influence of water vapor on the measurement of the measuring component 2 and improve the reliability of the wafer polishing apparatus 100.

[0040] For example, the light-transmitting element 30 and the first through hole 12b are sealed by a sealing element. During the wafer polishing process, the pressure between the first polishing component 1 and the wafer bearing component is relatively large, which may cause partial deformation of the sealing element. At this time, water vapor may enter the receiving cavity 20 through the gap between the light-transmitting element 30 and the first through hole 12b. This application can promptly discharge the water vapor in the receiving cavity 20 by setting the exhaust component 4, so as to reduce the influence of water vapor on the measurement of the measuring component 2 and improve the reliability of the wafer polishing device 100.

[0041] It should be noted that the receiving cavity 20 is not a sealed enclosure. Therefore, when the exhaust assembly 4 discharges water vapor from the receiving cavity 20, it will not create a certain degree of vacuum within the receiving cavity 20. For example, there may be a connecting gap between the receiving cavity 20 and the external environment. The connecting gap can be an assembly gap between two adjacent components or a deliberately reserved gap. The connecting gap can be located on the side of the receiving cavity 20 away from the first polishing surface 12a, so that polishing liquid and cleaning liquid cannot easily flow into the receiving cavity 20 through the connecting gap. The connecting gap can be spaced apart from the exhaust assembly 4, or the connecting gap can be defined between the protective assembly 3 and the exhaust assembly 4. For example, the connecting gap is located on the side of the receiving cavity 20 away from the first polishing surface 12a, and the connecting gap is located between the first polishing pad 12 and the measuring assembly 2. For another example, the exhaust pipe 40 mentioned later is fitted with the connecting port 31a on the protective assembly 3 with a clearance, so that the receiving cavity 20 can communicate with the external environment through the gap between the connecting port 31a and the exhaust pipe 40.

[0042] According to the wafer polishing apparatus 100 of this utility model embodiment, the first polishing pad 12 forms a first through hole 12b and a liquid supply hole spaced apart. The liquid supply hole is adapted to provide polishing liquid towards the first polishing surface 12a. The light-transmitting element 30 is sealed and fitted to the first through hole 12b and is spaced apart on the side of the measuring component 2 adjacent to the first polishing surface 12a, so that the measurement signal emitted by the measuring component 2 can be emitted through the light-transmitting element 30. There is also a receiving cavity 20 between the light-transmitting element 30 and the measuring component 2. One end of the exhaust pipe 40 is connected to the receiving cavity 20. The exhaust pipe 40 can discharge water vapor in the receiving cavity 20 to reduce the influence of water vapor on the measurement of the measuring component 2 and improve the reliability of the wafer polishing apparatus 100 operation.

[0043] Please refer to Figure 1 and Figure 2In some embodiments, the exhaust assembly 4 further includes a processor 42 and a humidity sensor 43. The humidity sensor 43 is located inside the receiving cavity 20 and is used to detect the humidity inside the receiving cavity 20. The humidity sensor 43 and the aerodynamic mechanism 41 communicate with the processor 42 respectively. The other end of the exhaust pipe 40 is connected to the external environment. The processor 42 is used to determine whether to activate the aerodynamic mechanism 41 based on the detection result of the humidity sensor 43. Of course, in other embodiments of this application, the other end of the exhaust pipe 40 may also be connected to other locations, as long as the exhaust assembly 4 can discharge the gas inside the receiving cavity 20.

[0044] As can be seen, the humidity sensor 43 is located inside the receiving cavity 20, which can more accurately reflect the humidity inside the receiving cavity 20. The humidity sensor 43 can transmit the detection result to the processor 42. When the processor 42 determines that the humidity inside the receiving cavity 20 has reached the predetermined value, the processor 42 can control the aerodynamic mechanism 41 to start, so as to discharge the gas with high humidity inside the receiving cavity 20, so as to reduce the influence of water vapor on the measurement of the measuring component 2. When the processor 42 determines that the humidity inside the receiving cavity 20 has dropped below the predetermined value, the processor 42 can control the aerodynamic mechanism 41 to shut down, so that the aerodynamic mechanism 41 will not continuously pump air into the receiving cavity 20, thereby reducing the energy consumption of the exhaust component 4. At the same time, the receiving cavity 20 will not be in a vacuum state, which will affect the service life of the light-transmitting component 30.

[0045] It is understandable that the preset value can vary significantly depending on the sensitivity of different measuring components 2 to humidity. For example, high-precision optical measuring instruments are highly susceptible to corrosion and interference from moisture. Moisture adhering to the lens surface can cause light scattering and changes in refractive index, thereby affecting the accuracy and stability of the measurement. In this case, the preset value needs to be set relatively low, such as 30% to 40% relative humidity, to ensure that the optical components are always in a dry working environment. For some electronic measuring components that are relatively insensitive to humidity, the preset value can be appropriately relaxed to 60% to 70% relative humidity, reducing the frequent start-up of the aerodynamic mechanism 41 while ensuring measurement performance.

[0046] For example, the preset value is 38% relative humidity, so that water vapor does not easily affect the measurement of measuring component 2, and the aerodynamic mechanism 41 does not need to be started frequently.

[0047] Optionally, the aerodynamic mechanism 41 can be a fan, vacuum pump, or air pump, etc.; the processor 42 can be a microcontroller, single-chip microcomputer, digital signal processor, programmable logic controller (PLC), etc.

[0048] It is understood that the humidity sensor 43 can be disposed on the light-transmitting element 30, the first polishing pad 12, or other components of the protective assembly 3 (such as the mounting base 31 described below), as long as the humidity sensor 43 is located within the receiving cavity 20, and this application does not impose any restrictions on this.

[0049] In some embodiments, the processor 42 is located outside the first rotating disk 10, and the processor 42 also has an alarm light. When the processor 42 determines that the humidity in the containment cavity 20 has reached a predetermined value, the alarm light illuminates to remind the staff to perform subsequent inspection and maintenance on the wafer polishing apparatus 100.

[0050] Please refer to Figure 1 and Figure 2 In some embodiments, the exhaust assembly 4 further includes a valve structure 44, which controls the opening and closing of the aerodynamic mechanism 41 and the exhaust pipe 40. The valve structure 44 communicates with the processor 42. When the processor 42 determines that the humidity in the containment cavity 20 has reached a predetermined value, the processor 42 can control the valve structure 44 to open so that the aerodynamic mechanism 41 and the exhaust pipe 40 are connected, and the aerodynamic mechanism 41 can extract the gas from the containment cavity 20. When the processor 42 determines that the humidity in the containment cavity 20 has dropped below the predetermined value, the processor 42 can control the valve structure 44 to close so that the aerodynamic mechanism 41 will not continuously extract air from the containment cavity 20.

[0051] Optionally, due to the presence of valve structure 44, the pneumatic mechanism 41 can be in a normally open state, so that the pneumatic mechanism 41 can extract the gas from the containment cavity 20 more quickly, while the pneumatic mechanism 41 will not continuously extract the air from the containment cavity 20, which helps to improve the stability of the wafer polishing apparatus 100.

[0052] Optionally, valve structure 44 is a solenoid valve. The solenoid valve has a faster response rate, which helps to improve the exhaust efficiency of exhaust assembly 4.

[0053] In some embodiments, the wafer polishing apparatus 100 is configured to satisfy at least one of the following conditions:

[0054] Please refer to condition A1. Figure 1 and Figure 3The light-transmitting element 30 is inclined relative to the first polishing surface 12a on one side. The first driving component can drive the first rotating disk 10 to rotate the first polishing pad 12. The light-transmitting element 30 is disposed inside the first polishing pad 12, that is, the first driving component can indirectly drive the light-transmitting element 30 to rotate. During the polishing process, some polishing liquid may adhere to the side surface of the light-transmitting element 30 corresponding to the first polishing surface 12a. By inclining the side surface of the light-transmitting element 30 corresponding to the first polishing surface 12a relative to the first polishing surface 12a, the light-transmitting element 30 can be thrown out from the inclined side of the light-transmitting element 30 by centrifugal force during rotation. This improves the problem of liquid accumulation on the side surface of the light-transmitting element 30 away from the measuring component 2, so that the polishing liquid is less likely to affect the measurement signal emitted by the measuring component 2, which is beneficial to improving the measurement accuracy of the measuring component 2.

[0055] It is understood that the light-transmitting element 30 can be of uniform thickness, and the light-transmitting element 30 is inclinedly fitted into the first through hole 12b so that the side surface of the light-transmitting element 30 corresponding to the first polished surface 12a is inclined relative to the first polished surface 12a; or the light-transmitting element 30 is of unequal thickness, in which case the light-transmitting element 30 can be horizontally fitted into the first through hole 12b so that the side surface of the light-transmitting element 30 corresponding to the first polished surface 12a is inclined relative to the first polished surface 12a.

[0056] In condition A2, the transmittance of the light-transmitting element 30 is greater than or equal to 85%. The measuring component 2 includes a laser measuring instrument. By setting the transmittance of the light-transmitting element 30 to a range greater than or equal to 85%, for example, the transmittance of the light-transmitting element 30 is in the range of 85% to 90%, so that the light-transmitting element 30 does not easily affect the laser emitted by the laser measuring instrument, so that the laser measuring instrument can obtain better signal feedback, which facilitates the improvement of the measurement accuracy of the measuring component 2.

[0057] In condition A3, the light-transmitting element 30 is a glass component and a hardened component. By hardening the light-transmitting element 30, the structural strength of the light-transmitting element 30 is enhanced. Even if the workpiece is damaged and broken during polishing (for example, the wafer breaks during polishing), the light-transmitting element 30 will not be damaged. That is, the light-transmitting element 30 is not easily scratched by the workpiece breakage. At the same time, the dirt in the workpiece polishing process is not easily scratched by the light-transmitting element 30, so that the light-transmitting element 30 can have good light transmittance, making the transmission of the measurement signal of the measuring component 2 more stable and improving the reliability of the wafer polishing device 100.

[0058] Please refer to condition A4. Figure 1 and Figure 3The thickness of the light-transmitting element 30 is D, where 2mm ≤ D ≤ 3mm. When the thickness of the light-transmitting element 30 is too small (e.g., D < 2mm), its structural strength may be weak, increasing the possibility of damage. When the thickness of the light-transmitting element 30 is too large (e.g., D > 3mm), it has good structural strength, but when the overall size of the light-transmitting element 30 is large, installation may be inconvenient. By setting the thickness of the light-transmitting element 30 within the range of 2mm to 3mm, it achieves good structural strength without significantly restricting its installation. For example, D can be 2mm, 2.2mm, 2.5mm, 2.6mm, 2.8mm, or 3mm.

[0059] For example, the light-transmitting element 30 is fixed to other components (such as the mounting base 31 described later) by an adhesive. When the thickness of the light-transmitting element 30 is greater than 3 mm, the adhesive may not effectively cover the part where the light-transmitting element 30 mates with other components, making the installation of the light-transmitting element 30 more cumbersome. By setting the thickness of the light-transmitting element 30 within the range of 2 mm to 3 mm, the adhesive can effectively cover the part where the light-transmitting element 30 mates with other components, thus improving the installation efficiency of the light-transmitting element 30. Of course, the light-transmitting element 30 can also be fixed to the wall of the first through hole 12b by an adhesive to achieve a sealed fit between the light-transmitting element 30 and the first through hole 12b.

[0060] Please refer to condition A5. Figure 1 and Figure 3 The light-transmitting element 30 and the first polishing surface 12a are axially spaced apart in the first through hole 12b, and the light-transmitting element 30 is sealed within the first through hole 12b so that the side surface of the light-transmitting element 30 corresponding to the first polishing surface 12a does not protrude from the first polishing surface 12a. When the first polishing surface 12a polishes the workpiece, the arrangement of the light-transmitting element 30 ensures a certain gap between the light-transmitting element 30 and the workpiece, making the light-transmitting element 30 less prone to significant wear and thus improving its service life. Taking the first polishing surface 12a located on the bottom side of the first polishing pad 12 as an example, the light-transmitting element 30 is spaced above the first polishing surface 12a.

[0061] In some embodiments, the wafer polishing apparatus 100 satisfies at least the following conditions: the side surface of the light-transmitting element 30 corresponding to the first polishing surface 12a is inclined relative to the first polishing surface 12a; and the wafer polishing apparatus 100 also satisfies at least one of the following conditions B1 to B3:

[0062] Please refer to condition B1. Figure 3The angle between the side surface of the light-transmitting element 30 corresponding to the first polished surface 12a and the first polished surface 12a is α, where 3°≤α≤7°. When the angle between the side surface of the light-transmitting element 30 corresponding to the first polished surface 12a and the first polished surface 12a is too small (e.g., α<3°), the tilt angle of the side surface of the light-transmitting element 30 corresponding to the first polished surface 12a is small, resulting in poor drainage of polishing liquid adhering to the surface of the light-transmitting element 30 during rotation. When the angle between the side surface of the light-transmitting element 30 corresponding to the first polished surface 12a and the first polished surface 12a is too large (e.g., ... (e.g., α > 7°) so that the side of the light-transmitting element 30 corresponding to the first polishing surface 12a can easily provide a large accumulation space for the polishing liquid. However, if the polishing liquid is not drained in time, it may affect the accuracy of the measurement signal emitted by the measuring component 2. By setting the angle between the side of the light-transmitting element 30 corresponding to the first polishing surface 12a and the first polishing surface 12a in the range of 3° to 7°, the light-transmitting element 30 can have a good liquid drainage effect during rotation. At the same time, the side of the light-transmitting element 30 corresponding to the first polishing surface 12a cannot store too much polishing liquid, which helps to improve the measurement accuracy of the measuring component 2. For example, α is 3°, 4°, 5°, 7°, etc.

[0063] In condition B2, the axial distance between the light-transmitting element 30 and the first polished surface 12a is along the rotation axis away from the first polishing assembly 1 (e.g., Figure 1 The direction of L1) decreases, that is, the axial distance between the part of the light-transmitting element 30 away from the rotation axis of the first polishing assembly 1 and the first polishing surface 12a is less than the axial distance between the part of the light-transmitting element 30 adjacent to the rotation axis of the first polishing assembly 1 and the first polishing surface 12a. Therefore, relative to the part of the light-transmitting element 30 adjacent to the rotation axis of the first polishing assembly 1, the part of the light-transmitting element 30 away from the rotation axis of the first polishing assembly 1 is closer to the first light-transmitting surface. This allows the surface of the light-transmitting element 30 corresponding to the first polishing surface 12a to be thrown outward radially along the rotation axis of the first polishing assembly 1 during rotation, so that the light-transmitting element 30 can have a better liquid drainage effect and improve the reliability of the wafer measurement device.

[0064] In addition, the above-mentioned arrangement facilitates the smooth flow of polishing liquid or cleaning liquid to the space between the light-transmitting element 30 and the workpiece under centrifugal force during the rotation of the first polishing component 1. The polishing liquid or cleaning liquid between the light-transmitting element 30 and the workpiece can be thrown out through the gap between the light-transmitting element 30 and the workpiece under centrifugal force, but it will not be thrown out all at once, so that some polishing liquid and cleaning liquid can remain between the light-transmitting element 30 and the workpiece.

[0065] In condition B3, a drain groove is formed on the first polishing surface 12a. The drain groove penetrates the hole wall of the first through hole 12b and the outer peripheral wall of the first polishing pad 12. The drain groove can be formed by a recess in a part of the first polishing surface 12a. As can be seen, the light-transmitting element 30 is sealed and fitted inside the first through hole 12b. The side surface of the light-transmitting element 30 corresponding to the first polishing surface 12a is inclined relative to the first polishing surface 12a. The drain groove penetrates the hole wall of the first through hole 12b, so that the polishing liquid adhering to the side surface of the light-transmitting element 30 corresponding to the first polishing surface 12a can be discharged more conveniently. Moreover, the polishing liquid splashed out when the light-transmitting element 30 rotates can have a clear drain path, which can improve the draining effect of the polishing element. At the same time, the drain groove penetrates the outer peripheral wall of the first polishing pad 12, so that the polishing liquid located in the drain groove can be thrown to the outer peripheral wall of the first polishing pad 12 during the rotation of the first polishing pad 12, and will not flow back to the light-transmitting element 30, so that the polishing liquid is not easy to adhere to the light-transmitting element 30, which can improve the measurement accuracy of the measuring component 2.

[0066] It is understood that the draining groove is formed to divide the first polishing surface 12a into multiple polishing zones, with at least a portion of the draining groove located between two adjacent polishing zones.

[0067] In some embodiments, a plurality of drainage channels are formed on the first polishing surface 12a. The plurality of drainage channels include a plurality of first drainage channels and a plurality of second drainage channels. The plurality of first drainage channels are spaced apart along a first direction and each first drainage channel extends along a second direction. The plurality of second drainage channels are spaced apart along the second direction and each second drainage channel extends along the first direction, so that the first drainage channels and the second drainage channels are intersected. Thus, the first drainage channels and the second drainage channels can be connected. Both the first direction and the second direction are parallel to the first polishing surface 12a and intersect each other.

[0068] As can be seen, the first polishing surface 12a includes multiple drainage grooves. The multiple first drainage grooves and multiple second drainage grooves can form a mesh drainage channel on the first polishing pad 12, so that the polishing liquid sprayed by the rotating light-transmitting element 30 can be fully received by the multiple drainage grooves, which can improve the drainage efficiency of the light-transmitting element 30, and make the polishing liquid less likely to adhere to the light-transmitting element 30, which can improve the measurement accuracy of the measuring component 2.

[0069] Optionally, the first direction and the second direction can be perpendicular. Of course, the angle between the first direction and the second direction can also be non-right angle.

[0070] Please refer to Figure 1 In some embodiments, the first rotating disk 10 has a mounting hole 10a that is opposite to and communicates with the first through hole 12b, and the measuring component 2 is disposed in the mounting hole 10a and extends into the first through hole 12b.

[0071] As can be seen, the measuring component 2 can be partially located within the first rotating disk 10, and the other part of the measuring component 2 is located within the first polishing pad 12. When the measuring component 2 rotates with the first rotating disk 10, it will be protected and constrained by the first rotating disk 10, so that the measuring component 2 is not prone to shaking or displacement. At the same time, when the measuring component 2 needs to measure the thickness and / or flatness of the workpiece, the measurement signal emitted by the measuring component 2 can sequentially contact the workpiece through the first through hole 12b and the light-transmitting element 30, so that the first rotating disk 10 and the first polishing pad 12 are not likely to affect the measurement of the measuring component 2, thus improving the reliability of the measuring component 2.

[0072] In some embodiments, the wafer polishing apparatus 100 further includes a second polishing component and a second driving component. The second polishing component is disposed below the first polishing component 1, and includes a second rotating disk and a second polishing pad. The second polishing pad is disposed vertically opposite to the first polishing pad 12, and has a second polishing surface opposite to the first polishing surface 12a. The second driving component drives the second polishing component to rotate, and the rotation direction of the second polishing component is opposite to that of the first polishing component 1. It is understood that the workpiece can be placed on the first polishing pad 12 or on the second polishing pad.

[0073] As can be seen, the workpiece is located between the first polishing pad 12 and the second polishing pad. The first polishing surface 12a and the second polishing surface can polish both sides of the workpiece at the same time, which can improve the polishing efficiency of the workpiece. Moreover, the first polishing component 1 and the second polishing component rotate in opposite directions, so that the workpiece can move relative to the two polishing surfaces during the polishing process, so that both sides of the workpiece can get a better polishing effect.

[0074] In some embodiments, there are multiple workpieces, each placed on a second polishing pad by a carrier assembly. Each carrier assembly can carry at least one workpiece. The wafer polishing apparatus 100 further includes a third driving assembly for driving the carrier assembly to rotate about the central axis of the carrier assembly. That is, the multiple workpieces not only rotate with the second polishing pad, but also rotate about the central axis of the carrier assembly to change the placement position of the multiple workpieces on the second polishing pad (e.g., change the radial and / or circumferential position of the multiple workpieces relative to the first through hole 12b). At this time, there can be one or more measuring components 2. When there is only one measuring component 2, the measurement... The measuring component 2 can rotate with the second polishing component, and multiple workpieces can also rotate around the central axis of the supporting component, so that one measuring component 2 can measure the thickness and / or flatness of multiple workpieces at different positions. When there are multiple measuring components 2, the multiple measuring components 2 are set at different positions on the second polishing disk. At the same time, the multiple measuring components 2 can rotate with the second polishing component, and can also rotate around the central axis of the supporting component with multiple workpieces, so that the multiple measuring components 2 can more comprehensively provide feedback on the thickness and flatness of multiple workpieces, reducing the possibility that the measuring component 2 fails to measure a certain workpiece, and facilitating the improvement of the reliability of the wafer polishing apparatus 100.

[0075] For example, the third drive assembly includes an inner rotating ring and an outer rotating ring arranged radially spaced along the second polishing pad. The inner rotating ring and the outer rotating ring rotate in opposite directions. The outer wall of the inner rotating ring has a first tooth, and the inner wall of the outer rotating ring has a second tooth. The bearing assembly meshes between the first tooth and the second tooth.

[0076] Please refer to Figure 1 , Figure 3 and Figure 4 In some embodiments, the protective component 3 further includes a mounting base 31, which is sealed within the first through hole 12b and has a second through hole 32. The light-transmitting element 30 is sealed within the second through hole 32, so that the light-transmitting element 30 is indirectly sealed within the first through hole 12b through the mounting base 31. The portion of the second through hole 32 located on the side of the light-transmitting element 30 opposite to the first polished surface 12a defines at least a portion of the receiving cavity 20.

[0077] As can be seen, the light-transmitting element 30 is sealed within the second through hole 32 to prevent water vapor from easily entering the receiving cavity 20 through the gap between the light-transmitting element 30 and the second through hole 32, thereby reducing the influence of water vapor on the measurement of the measuring component 2. At the same time, the mounting base 31 is sealed within the second through hole 32 to prevent water vapor from easily entering the receiving cavity 20 through the gap between the mounting base 31 and the first through hole 12b, thereby further reducing the influence of water vapor on the measurement of the measuring component 2.

[0078] The light-transmitting element 30 is fitted into the second through hole 32, including: Example 1, the side surface of the mounting base 31 corresponding to the first polished surface 12a is flush with the side surface of the light-transmitting element 30 corresponding to the first polished surface 12a, which is closest to the first polished surface 12a; Example 2, the side surface of the light-transmitting element 30 corresponding to the first polished surface 12a is spaced apart from the side surface of the mounting base 31 corresponding to the first polished surface 12a, away from the first polished surface 12a. This allows for more flexible relative positions between the light-transmitting element 30 and the mounting base 31, making it easier to adapt to different usage environments.

[0079] Taking the first polishing surface 12a located at the bottom of the first polishing pad 12 as an example, the lower surface of the mounting base 31 is flush with the lowest position of the lower surface of the light-transmitting element 30, or the lower surface of the light-transmitting element 30 is spaced above the lower surface 31 of the mounting base 31, so that the light-transmitting element 30 does not protrude from the mounting base 31 toward the side where the first polishing surface 12a is located.

[0080] When the light-transmitting element 30 is spaced apart from the side of the mounting base 31 that is away from the first polishing surface 12a, if the first polishing pad 12 is too thin, the area where the protective component 3 is provided on the first polishing pad 12 may bulge towards the workpiece during the polishing process of the wafer polishing apparatus 100. By providing the protective component 3, even if the area where the protective component 3 is provided on the first polishing pad 12 bulges towards the workpiece and the mounting base 31 contacts the workpiece, there can still be a certain distance between the light-transmitting element 30 and the workpiece, so that the light-transmitting element 30 is not easy to scratch or damage the workpiece, which facilitates the improvement of the stability of the operation of the wafer polishing apparatus 100.

[0081] In addition, the light-transmitting element 30 is indirectly sealed to the first through hole 12b through the mounting base 31. The mounting base 31 can provide a certain degree of protection for the light-transmitting element 30. Even if the workpiece is damaged and broken during the polishing process, the light-transmitting element 30 is not easy to break, which helps to improve the reliability of the protective component 3.

[0082] Even if the seals of the light-transmitting element 30 and the second through hole 32 are damaged, and water vapor enters the receiving cavity 20 through the gap between the light-transmitting element 30 and the second through hole 32, the exhaust assembly 4 can still effectively extract the water vapor from the receiving cavity 20 to reduce the influence of water vapor on the measurement of the measuring component 2. Even if the seals of the mounting base 31 and the first through hole 12b are damaged, and water vapor enters the receiving cavity 20 through the gap between the mounting base 31 and the first through hole 12b, the exhaust assembly 4 can still effectively extract the water vapor from the receiving cavity 20 to reduce the influence of water vapor on the measurement of the measuring component 2.

[0083] Please refer to Figure 1 and Figures 3-5In some embodiments, the end of the mounting base 31 facing away from the first polished surface 12a is sealed to the measuring component 2 so that a portion of the second through hole 32 defines the receiving cavity 20. A communication port 31a is formed on the mounting base 31 for the exhaust pipe 40 to pass through. The communication port 31a communicates with the receiving cavity 20, and the exhaust pipe 40 is clearance-fitted with the communication port 31a. The communication port 31a can penetrate the inner and outer peripheral walls of the mounting base 31 radially.

[0084] As can be seen, the end of the mounting base 31 facing away from the first polished surface 12a is axially sealed with the measuring component 2 in the second through hole 32a. This allows multiple seals to be formed on the mounting base 31 against the receiving cavity 20a, which helps to improve the sealing performance of the receiving cavity 20a and further reduces the risk of water vapor entering the receiving cavity 20a. Even if the seal between the mounting base 31 and the first through hole 12b is damaged, water vapor can still penetrate through the gap between the mounting base 31 and the first through hole 12b, making it difficult for water vapor to enter the receiving cavity 20a, thereby reducing the impact of water vapor on the measurement of the measuring component 2.

[0085] In addition, a connecting port 31a is formed on the mounting base 31, providing space for the exhaust pipe 40 to pass through. At the same time, the exhaust pipe 40 and the connecting port 31a are fitted together with a clearance, so that even if the exhaust pipe 40 extracts the gas in the receiving cavity 20, the receiving cavity 20 can still be connected to the external environment through the connecting port 31a, so that the pressure in the receiving cavity 20 is not too high due to the extraction of gas, and the light-transmitting element 30 and the measuring component 2 are not easily damaged due to excessive pressure, which helps to improve the service life of the light-transmitting element 30 and the measuring component 2.

[0086] Please refer to Figure 1 and Figures 3-5 In some embodiments, a communication port 31a is formed on the mounting base 31, and the exhaust assembly 4 also includes a humidity sensor 43 and a processor 42. The humidity sensor 43 is located inside the receiving cavity 20, and the processor 42 is located outside the receiving cavity 20. The humidity sensor 43 and the processor 42 communicate through a wire harness. At this time, the wire harness can be passed through the communication port 31a to connect the humidity sensor 43 and the processor 42.

[0087] Furthermore, the wire harness and the connecting port 31a are fitted with a gap so that the receiving cavity 20 can still be connected to the external environment through the connecting port 31a. This makes it less likely that the pressure inside the receiving cavity 20 will become too high due to air extraction, so that the light-transmitting element 30 and the measuring component 2 will not be damaged due to excessive pressure, thus improving the service life of the light-transmitting element 30 and the measuring component 2.

[0088] It is understood that the wiring harness and the exhaust pipe 40 can be installed in the same connection port 31a, or the wiring harness and the exhaust pipe 40 can be installed in different connection ports 31a, so that the arrangement of the wiring harness and the exhaust pipe 40 is more flexible. If the wiring harness and the exhaust pipe 40 are installed in different connection ports 31a, the two connection ports 31a can be spaced apart circumferentially along the mounting base 31, for example, the two connection ports 31a are spaced apart circumferentially by 60°, 90°, or 180°, etc.

[0089] In some embodiments, the mounting base 31 is configured to satisfy at least one of the following conditions C1 to C5:

[0090] In condition C1, the mounting base 31 is made of stainless steel. Stainless steel has good structural strength, so even if the workpiece is damaged or broken during polishing, the mounting base 31 can still provide a certain degree of protection for the light-transmitting element 30, making it less likely to break and improving the reliability of the protective component 3. At the same time, stainless steel has good corrosion resistance. Even if the polishing fluid is corrosive during the polishing process, the mounting base 31 is less likely to rust or flake, so that the mounting base 31 will not affect the polishing of the workpiece and improve the product quality of the workpiece.

[0091] Please refer to condition C2. Figure 1 and Figure 3 The mounting base 31 and the first polishing surface 12a are axially spaced apart in the first through hole 12b. The mounting base 31 is located inside the first through hole 12b, meaning that the side of the mounting base 31 facing the first polishing surface 12a has a certain gap with the first polishing surface 12a. This prevents the mounting base 31 from directly contacting the workpiece when the first polishing surface 12a polishes it, thus reducing wear and extending its service life. Taking the first polishing surface 12a located on the bottom side of the first polishing pad 12 as an example, the mounting base 31 is spaced above the first polishing surface 12a.

[0092] Please refer to condition C3. Figure 1 and Figure 3 The mounting base 31 includes a first base portion 31b and a second base portion 31c. The first base portion 31b is located on the side of the second base portion 31c that is away from the first polished surface 12a, and the first base portion 31b is threadedly connected to the first through hole 12b. The second base portion 31c extends radially out of the outer peripheral wall of the first base portion 31b along the first through hole 12b, and the portion of the second base portion 31c extending out of the first base portion 31b is sealed in axial direction with the first through hole 12b.

[0093] As can be seen, the first seat portion 31b is threadedly connected to the first through hole 12b. For example, an external thread is formed on the outer peripheral wall of the first seat portion 31b, and an internal thread is formed on the peripheral wall of the first through hole 12b, so that the first seat portion 31b and the first through hole 12b can be threadedly engaged, which facilitates the assembly efficiency of the protective component 3 and the first through hole 12b. Moreover, the part of the second seat portion 31c extending out of the first seat portion 31b is sealed with the first through hole 12b in the axial direction. For example, the part of the second seat portion 31c extending out of the first seat portion 31b is sealed with the first hole wall through the second sealing element 34. When the first seat portion 31b and the first through hole 12b are threadedly engaged, the second seat portion 31c can exert a certain amount of pressure on the second sealing element 34, so that the sealing engagement between the mounting seat 31 and the first through hole 12b is more stable, thereby reducing the possibility of water vapor entering the receiving cavity 20 through the gap between the mounting seat 31 and the first through hole 12b, which is beneficial to improving the measurement accuracy of the measuring component 2.

[0094] Furthermore, the first seat portion 31b is located on the side of the second seat portion 31c that is away from the first polishing surface 12a. That is, the second seat portion 31c is located closer to the first polishing surface 12a than the first seat portion 31b. The second seat portion 31c extends radially out of the outer peripheral wall of the first seat portion 31b along the first through hole 12b. Therefore, the coverage area of ​​the second seat portion 31c is greater than the coverage area of ​​the first seat portion 31b, so that the second seat portion 31c can play a certain blocking effect on the polishing liquid, further reducing the possibility of water vapor entering the receiving cavity 20 through the gap between the mounting seat 31 and the first through hole 12b.

[0095] Optionally, the first housing 31b and the first through hole 12b are threaded together, and the operator can apply lubricant (such as lubricating oil) to the mating part of the first housing 31b and the first through hole 12b, so that even if the processing temperature is high during the wafer polishing process and the mounting base 31 undergoes thermal expansion and contraction, the mounting base 31 is not easy to get stuck with the first through hole 12b, making the disassembly of the protective component 3 more convenient and facilitating the subsequent replacement or maintenance of the protective component 3.

[0096] Please refer to condition C4. Figure 1 and Figure 3 The second through hole 32 is formed as a stepped hole and includes a first hole portion 32a and a second hole portion 32b. The first hole portion 32a is located on the side of the second hole portion 32b that is away from the first polished surface 12a, and the diameter of the first hole portion 32a is smaller than the diameter of the second hole portion 32b, so that a step portion 32c is formed between the first hole portion 32a and the second hole portion 32b. The light-transmitting element 30 has a uniform thickness structure and is sealed to the step portion 32c by an adhesive. The step portion 32c is inclined relative to the first polished surface 12a, so that the light-transmitting element 30 is inclined relative to the first polished surface 12a.

[0097] As can be seen, the step portion 32c is inclined relative to the first polished surface 12a. Even if the light-transmitting element 30 is designed with equal thickness, after the light-transmitting element 30 is fitted with the step portion 32c, the light-transmitting element 30 can still be inclined relative to the first polished surface 12a, which simplifies the manufacturing process of the light-transmitting element 30 and makes the processing of the light-transmitting element 30 more convenient.

[0098] Furthermore, the first hole 32a is located on the side of the second hole 32b that is away from the first polished surface 12a. That is, the second hole 32b is located closer to the first polished surface 12a than the first hole 32a, and the diameter of the first hole 32a is smaller than the diameter of the second hole 32b, so that a step 32c is formed between the first hole 32a and the second hole 32b. The light-transmitting element 30 is fitted to the step 32c. By the fact that the second hole 32b is located closer to the first polished surface 12a, it is easier for the staff to access the step 32c, thereby making it easier to install the light-transmitting element 30 onto the step 32c by means of an adhesive. At the same time, the diameter of the second hole 32b is larger than the diameter of the first hole 32a, which provides more space for the installation of the light-transmitting element 30 and facilitates the improvement of the installation efficiency of the light-transmitting element 30.

[0099] Optionally, the light-transmitting element 30 is sealed to the mounting base 31 using ultraviolet-cured UV adhesive. For example, UV adhesive is added to the mating position between the light-transmitting element 30 and the mounting base 31, and after 24 hours of irradiation with ultraviolet light at 38 degrees Celsius, the light-transmitting element 30 and the mounting base 31 can be firmly bonded, which helps to improve the structural strength of the protective component 3. The UV adhesive has good corrosion resistance. Even during the polishing process of the workpiece, when the polishing fluid has a certain degree of corrosiveness, the seal between the light-transmitting element 30 and the mounting base 31 is not easily damaged. At the same time, the UV adhesive has good adhesion, which makes the fit between the light-transmitting element 30 and the mounting base 31 more stable and less prone to separation. For example, if the mounting base 31 is made of stainless steel, the light-transmitting element 30 can still be stably bonded to the mounting base 31 by UV adhesive, which helps to improve the reliability of the wafer polishing device 100.

[0100] Please refer to condition C5. Figure 1 and Figure 3 The mounting base 31 is threadedly connected to the first through hole 12b. At least one clamping groove 31d is formed at one end of the corresponding polished surface of the mounting base 31. The operator can insert a clamping tool into the clamping groove 31d to drive the mounting base 31 to rotate. Even if the overall volume of the protective component 3 is small, the rotation operation of the mounting base 31 can be carried out more conveniently, which can improve the assembly efficiency of the protective component 3.

[0101] It is understood that multiple clamping grooves 31d can be formed on the mounting base 31. For example, multiple clamping grooves 31d are arranged circumferentially on the mounting base 31 along the first through hole 12b. The operator can insert a clamping tool into one or more clamping grooves 31d to drive the mounting base 31 to rotate. The clamping groove 31a can provide a force point for installing and removing the mounting base 31, which facilitates the improvement of the installation and removal efficiency of the protective component 3.

[0102] In some embodiments, please refer to Figure 1 and Figure 3 The mounting base 31 includes a first base portion 31b and a second base portion 31c. The first base portion 31b is located on the side of the second base portion 31c that is opposite to the first polished surface 12a. The second base portion 31c extends radially out of the outer peripheral wall of the first base portion 31b along the first through hole 12b, and the portion of the second base portion 31c extending out of the first base portion 31b is sealed in axial direction with the first through hole 12b. The end of the first base portion 31b that is opposite to the second base portion 31c is sealed in axial direction with the measuring component 2, for example, the portion of the second base portion 31c extending out of the first base portion 31b. A second mounting groove for mounting a second seal 34 is formed on the first seat 31b, so that the portion of the second seat 31c extending out of the first seat 31b and the first through hole 12b are sealed together by the second seal 34. A first mounting groove for mounting a first seal 33 is formed on the portion of the first seat 31b facing the measuring assembly 2, so that the first seat 31b and the measuring assembly 2 are sealed together by the first seal 33. The first seal 33 and the second seal 34 can form a double seal, so as to further reduce the possibility of water vapor entering the receiving cavity 20 and facilitate the improvement of the measurement accuracy of the measuring assembly 2.

[0103] In some embodiments, please refer to Figure 1 and Figure 3 The mounting base 31 includes a first base portion 31b and a second base portion 31c. The first base portion 31b is located on the side of the second base portion 31c facing away from the first polished surface 12a. The axial length of the first base portion 31b along the first through hole 12b is L2, where 5mm ≤ L2 ≤ 8mm. By setting the axial length of the first base portion 31b within the range of 5mm to 8mm, the first base portion 31b has sufficient length to block water vapor even if it comes into contact with the first base portion 31b through the gap between the second base portion 31c and the first through hole 12b. This reduces the possibility of water vapor entering the receiving cavity 20 and improves the measurement accuracy of the measuring component 2. For example, L2 can be 5mm, 6mm, 7mm, 8mm, etc.

[0104] Furthermore, it should be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. To avoid unnecessary repetition, this application will not describe the various possible combinations separately. In addition, various different embodiments of this application can also be arbitrarily combined, as long as they do not violate the spirit of this application, they should also be regarded as the content disclosed in this application.

[0105] In the description of this application, it should be understood that the terms "center," "lateral," "length," "thickness," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "multiple" means two or more. In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a mechanical connection or an electrical connection; it can refer to a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0106] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on the upper side" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "on the lower side" of the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0107] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A wafer polishing apparatus, characterized in that, include: The first polishing assembly includes a first rotating disk and a first polishing pad. The first polishing pad is disposed on the first rotating disk and has a first polishing surface suitable for polishing a workpiece. The first polishing pad also forms a first through hole and a liquid supply hole that are spaced apart. The first through hole and the liquid supply hole are both disposed through the first polishing surface, and the liquid supply hole is suitable for providing polishing liquid and / or cleaning liquid toward the first polishing surface. A first driving component is used to drive the first rotary disk to rotate the first polishing pad. A measuring component, disposed on the first rotating disk, is used to measure the thickness of the workpiece and / or the flatness of the workpiece; A protective component is provided on the side of the measuring component facing the first polished surface and includes a light-transmitting element. The light-transmitting element is sealed and fitted in the first through hole and spaced apart on the side of the measuring component adjacent to the first polished surface. A receiving cavity is provided between the light-transmitting element and the measuring component so that the measuring signal emitted by the measuring component passes through the receiving cavity and is emitted through the light-transmitting element. An exhaust assembly is disposed on the first polishing assembly and includes an exhaust pipe and an aerodynamic mechanism connected in series with the exhaust pipe. One end of the exhaust pipe is connected to the receiving cavity so that the exhaust assembly can discharge the gas in the receiving cavity.

2. The wafer polishing apparatus according to claim 1, characterized in that, The exhaust assembly also includes a processor and a humidity sensor. The humidity sensor is located within the receiving cavity and is used to detect the humidity within the receiving cavity. The humidity sensor and the aerodynamic mechanism are respectively connected to the processor. The other end of the exhaust pipe is connected to the external environment. The processor is used to determine whether to activate the aerodynamic mechanism based on the detection result of the humidity sensor.

3. The wafer polishing apparatus according to claim 1, characterized in that, The wafer polishing apparatus is configured to satisfy at least one of the following conditions: Condition A1: The light-transmitting element is inclined relative to the first polished surface on one side surface; Condition A2: The light transmittance of the light-transmitting component is greater than or equal to 85%, and the measuring component includes a laser measuring instrument; Condition A3: The light-transmitting component is a glass component and is a hardened component; Condition A4: The thickness of the light-transmitting element is D, where 2mm ≤ D ≤ 3mm; Condition A5: The light-transmitting element and the first polished surface are spaced apart axially from each other in the first through hole.

4. The wafer polishing apparatus according to claim 3, characterized in that, The wafer polishing apparatus satisfies at least condition A1, and also satisfies at least one of the following conditions: The angle between the light-transmitting element and the first polished surface on one side is α, where 3°≤α≤7°. The axial distance between the light-transmitting element and the first polished surface decreases in a direction away from the rotation axis of the first polishing assembly; A drainage groove is formed on the first polishing surface, and the drainage groove penetrates the hole wall of the first through hole and the outer peripheral wall of the first polishing pad.

5. The wafer polishing apparatus according to claim 4, characterized in that, A plurality of drainage grooves are formed on the first polishing surface. The plurality of drainage grooves include a plurality of first drainage grooves and a plurality of second drainage grooves. The plurality of first drainage grooves are spaced apart along a first direction, and each first drainage groove extends along a second direction. The plurality of second drainage grooves are spaced apart along the second direction, and each second drainage groove extends along the first direction, so that the first drainage grooves and the second drainage grooves are intersecting. Both the first direction and the second direction are parallel to the first polishing surface.

6. The wafer polishing apparatus according to claim 1, characterized in that, The first rotating disk has a mounting hole that is opposite to and communicates with the first through hole, and the measuring component is disposed in the mounting hole and extends into the first through hole.

7. The wafer polishing apparatus according to claim 1, characterized in that, Also includes: The second polishing assembly is disposed below the first polishing assembly and includes a second rotating disk and a second polishing pad. The second polishing pad is disposed vertically opposite to the first polishing pad and has a second polishing surface opposite to the first polishing surface. A second driving component is used to drive the second polishing component to rotate, and the second polishing component rotates in the opposite direction to the first polishing component.

8. The wafer polishing apparatus according to any one of claims 1-7, characterized in that, The protective components also include: The mounting base is sealed within the first through hole and has a second through hole. The light-transmitting element is sealed within the second through hole so that the light-transmitting element is indirectly sealed within the first through hole through the mounting base. The portion of the second through hole located on the side of the light-transmitting element opposite to the first polished surface defines at least a portion of the receiving cavity.

9. The wafer polishing apparatus according to claim 8, characterized in that, The end of the mounting base opposite to the first polished surface is sealed to the measuring component so that a portion of the second through hole defines the receiving cavity. A communication port is formed on the mounting base for the exhaust pipe to pass through, and the exhaust pipe is clearance-fitted with the communication port.

10. The wafer polishing apparatus according to claim 8, characterized in that, The mounting base is configured to satisfy at least one of the following conditions: The mounting base is made of stainless steel. The mounting base and the first polished surface are spaced apart axially from the first through hole; The mounting base includes a first base portion and a second base portion. The first base portion is located on the side of the second base portion opposite to the first polished surface and is threadedly connected to the first through hole. The second base portion extends radially out of the outer peripheral wall of the first base portion along the first through hole, and the portion of the second base portion extending out of the first base portion is sealed in fit with the first through hole in the axial direction of the first through hole. The second through hole is formed as a stepped hole and includes a first hole portion and a second hole portion. The first hole portion is located on the side of the second hole portion away from the first polished surface, and the diameter of the first hole portion is smaller than the diameter of the second hole portion, so that a step portion is formed between the first hole portion and the second hole portion. The light-transmitting element has a uniform thickness structure and is sealed to the step portion by an adhesive. The step portion is inclined relative to the first polished surface, so that the light-transmitting element is inclined relative to the first polished surface. The mounting base is threadedly connected to the first through hole, and at least one clamping groove is formed at one end of the mounting base corresponding to the polished surface.

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