A mold capable of temperature reduction

Abstract

This utility model relates to the field of mold technology and discloses a cooling mold, including a lower mold, an upper mold, a pouring port on the top of the upper mold, a cooling component, and an auxiliary component. The cooling component is installed outside the lower mold, and the auxiliary component is installed on the sides of the lower and upper molds. A pump in a water tank delivers cooling water to a circulation pipe for circulation. A semiconductor refrigeration chip continuously cools the passing cooling water, carrying away the heat transferred from the lower mold to the graphite plate, thus cooling the lower mold. Opening a solenoid valve allows some of the cooling water in the circulation pipe to enter a distribution pipe, cooling the air on the intake side of the fan assembly, causing the fan assembly to blow out cold air, accelerating the cooling speed of the product inside the mold, and simultaneously accelerating the heat dissipation speed of the hot end of the semiconductor refrigeration chip.

Description

Technical Field

[0001] This utility model relates to the field of mold technology, specifically to a mold that can be cooled. Background Technology

[0002] Molds are important tools used to produce parts of specific shapes and sizes. They are usually made of metal and can be used in various manufacturing processes such as injection molding, stamping, rolling, and casting.

[0003] When a mold is in use, the principle is to inject molten plastic material into the mold, which is then cooled and solidified to form the product. The cooling of the mold directly affects the molding effect of the product. Mold cooling is mostly achieved through water circulation, oil circulation, or air cooling. Existing mold cooling is mostly set in a single mold with multiple lower molds. A certain amount of heat will be stored in the gap between the lower mold and the upper mold. After the upper mold and the lower mold are separated, the heat in the gap is not easy to dissipate quickly, which affects the processing efficiency of injection mold. Therefore, we propose a mold that can be cooled. Utility Model Content

[0004] The purpose of this invention is to provide a cooling mold to solve the problem mentioned in the background art, where the cooling of existing molds is mostly located in a single mold and there are many lower molds. A certain amount of heat will be stored in the gap between the lower mold and the upper mold. After the upper mold and the lower mold are separated, the heat in the gap is not easy to dissipate quickly, which affects the processing efficiency of injection molds.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a cooling mold, comprising a lower mold, an upper mold, a pouring port located on the top of the upper mold, and further comprising a cooling component and an auxiliary component. The cooling component is installed outside the lower mold, and the auxiliary component is installed on the sides of the lower mold and the upper mold. When the cooling component is activated, it cools the lower mold.

[0006] Preferably, the cooling assembly includes a graphite plate, a semiconductor refrigeration chip, a circulation pipe, a water tank, and a pump. The lower mold surface is provided with a circulation pipe, which is connected to the water tank. One end of the circulation pipe is connected to the output end of the pump inside the water tank. A graphite plate is provided between the lower mold surface and the circulation pipe. The circulation pipe is wrapped around the outside of the graphite plate. Equidistant semiconductor refrigeration chips are embedded on the surface of the circulation pipe.

[0007] Preferably, the auxiliary components include a fan assembly and a frame. The frame is fixedly connected to the top of the water tank on the side of the lower mold and the upper mold. The fan assembly is installed inside the frame, and a dustproof net is provided inside the frame on the air intake side of the fan assembly.

[0008] Preferably, the auxiliary components further include a diverter pipe, a solenoid valve, a flow guide frame, a straight outlet pipe, and an inclined pipe. The flow guide frame is fixedly connected to the side of the frame, the outer end of the flow guide frame is connected to the straight outlet pipe, and the outer end of the flow guide frame is provided with inclined pipes on both sides of the straight outlet pipe.

[0009] Preferably, a diversion pipe is inserted into the top of the water tank on the air inlet side of the fan assembly, the other end of the diversion pipe is connected to the circulation pipe, and a solenoid valve is installed on the end of the diversion pipe near the circulation pipe.

[0010] Preferably, a PLC control panel is installed on the surface of the water tank, and the PLC control panel is electrically connected to the pump, the semiconductor cooling chip and the solenoid valve respectively.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. This utility model provides a circulation pipe on the surface of the lower mold, which is connected to the surface of the lower mold by a graphite plate. A series of semiconductor cooling chips are provided on the surface of the circulation pipe. Cooling water is transported to the circulation pipe by a pump in the water tank and circulated. The semiconductor cooling chips continuously cool the passing cooling water and remove the heat transferred from the lower mold to the graphite plate, thereby achieving the cooling treatment of the lower mold.

[0013] 2. This utility model features a frame at the top of the water tank with a series-connected fan assembly. The fan assembly blows air into the airflow guide frame. On one hand, the airflow passes through the straight outlet pipe to the gap between the lower and upper molds, accelerating the cooling speed of the product and facilitating demolding. On the other hand, the airflow passes through the inclined pipe to the surface of the circulation pipe, blowing away the heat from the hot end of the semiconductor cooling chip on the surface of the circulation pipe, ensuring the stable operation of the semiconductor cooling chip. In addition, opening the solenoid valve allows some of the cooling water in the circulation pipe to enter the distribution pipe, cooling the air on the intake side of the fan assembly. This causes the fan assembly to blow out cold air, accelerating the cooling speed of the product in the mold and simultaneously accelerating the heat dissipation speed of the hot end of the semiconductor cooling chip. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a schematic diagram of some of the components of this utility model;

[0016] Figure 3 This utility model Figure 2 Schematic diagram of the middle component structure;

[0017] In the diagram: 1. Lower mold; 2. Upper mold; 3. Graphite plate; 4. Semiconductor cooling chip; 5. Circulation pipe; 6. Water tank; 7. Diverter pipe; 8. Solenoid valve; 9. Fan assembly; 10. Frame; 11. Flow guide; 12. Straight outlet pipe; 13. Inclined pipe; 14. PLC control panel. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Example

[0020] Please see Figures 1-3 The mold shown in the figure is a type of mold that can be cooled, including a lower mold 1, an upper mold 2, a pouring port located on the top of the upper mold 2, a cooling component and an auxiliary component. The cooling component is installed outside the lower mold 1, and the auxiliary component is installed on the sides of the lower mold 1 and the upper mold 2. When the cooling component is activated, it cools down the lower mold 1.

[0021] Furthermore, the cooling assembly includes a graphite plate 3, a semiconductor cooling chip 4, a circulation pipe 5, a water tank 6, and a pump. The lower mold 1 is provided with a circulation pipe 5, which is connected to the water tank 6. One end of the circulation pipe 5 is connected to the output end of the pump inside the water tank 6. A graphite plate 3 is provided between the surface of the lower mold 1 and the circulation pipe 5. The circulation pipe 5 is wrapped around the outside of the graphite plate 3. Equidistant semiconductor cooling chips 4 are embedded on the surface of the circulation pipe 5.

[0022] A circulation pipe 5 is provided on the surface of the lower mold 1. The circulation pipe 5 and the surface of the lower mold 1 are connected by a graphite plate 3. A series of semiconductor cooling chips 4 are provided on the surface of the circulation pipe 5. Cooling water is transported to the circulation pipe 5 by a pump in the water tank 6. The semiconductor cooling chips 4 continuously cool the passing cooling water and remove the heat transferred from the lower mold 1 to the graphite plate 3, thereby achieving the cooling treatment of the lower mold 1.

[0023] Based on the aforementioned scheme, the auxiliary components include a fan assembly 9 and a frame 10. The top of the water tank 6 on the side of the lower mold 1 and the upper mold 2 is fixedly connected to the frame 10. The fan assembly 9 is installed inside the frame 10. A dustproof net is provided inside the frame 10 on the air intake side of the fan assembly 9. The auxiliary components also include a diverter pipe 7, a solenoid valve 8, a flow guide 11, a straight outlet pipe 12, and an inclined pipe 13. The flow guide 11 is fixedly connected to the side of the frame 10. The outer end of the flow guide 11 is connected to the straight outlet pipe 12. Inclined pipes 13 are provided on both sides of the straight outlet pipe 12 at the outer end of the flow guide 11.

[0024] As a further improvement of this invention, a diversion pipe 7 is inserted into the top of the water tank 6 on the air inlet side of the fan group 9. The other end of the diversion pipe 7 is connected to the circulation pipe 5, and a solenoid valve 8 is installed on the end of the diversion pipe 7 near the circulation pipe 5.

[0025] Furthermore, a PLC control panel 14 is installed on the surface of the water tank 6, and the PLC control panel 14 is electrically connected to the pump, the semiconductor cooling chip 4 and the solenoid valve 8 respectively.

[0026] A frame 10 is installed on top of the water tank 6 to install a series of fan groups 9. The fan group 9 consists of several independent fans arranged horizontally. The fan group 9 blows air into the air guide frame 11. On the one hand, the air force blows through the straight outlet pipe 12 to the gap between the lower mold 1 and the upper mold 2 after separation to accelerate the cooling speed of the product and facilitate demolding. On the other hand, the air force blows through the inclined pipe 13 to the surface of the circulation pipe 5 to blow away the heat from the hot end of the semiconductor cooling chip 4 on the surface of the circulation pipe 5, ensuring the stable operation of the semiconductor cooling chip 4. In addition, the solenoid valve 8 is opened to allow some of the cooling water in the circulation pipe 5 to enter the diversion pipe 7 to cool the air on the intake side of the fan group 9, so that the fan group 9 blows out cold air to accelerate the cooling speed of the product in the mold and at the same time accelerate the heat dissipation speed of the hot end of the semiconductor cooling chip 4.

[0027] It should be noted that this utility model is a mold that can be cooled. First, the pump in the water tank 6 is started by operating the PLC control panel 14. At the same time, the semiconductor cooling chip 4 and the fan assembly 9 are powered on, and the solenoid valve 8 is opened. The pump delivers cooling water to the circulation pipe 5 for circulation. The semiconductor cooling chip 4 continuously cools the passing cooling water, removing the heat transferred from the lower mold 1 to the graphite plate 3, thus cooling the lower mold 1. At the same time, the fan assembly 9 blows air into the guide frame 11. On the one hand, the air force blows through the straight outlet pipe 12 to the gap between the lower mold 1 and the upper mold 2 after separation, accelerating the cooling speed of the product. On the other hand, the air force blows through the inclined pipe 13 to the surface of the circulation pipe 5, removing the heat from the hot end of the semiconductor cooling chip 4 on the surface of the circulation pipe 5, ensuring the stable operation of the semiconductor cooling chip 4. Since the solenoid valve 8 is opened, some of the cooling water in the circulation pipe 5 enters the diversion pipe 7, which cools the air on the intake side of the fan assembly 9, making the fan assembly 9 blow out cold air, resulting in a better actual cooling effect.

[0028] In addition, the PLC control panel mentioned above uses an external power supply, and the semiconductor cooling chip (a device that uses the thermoelectric effect for cooling; when current passes through two different types of semiconductors (usually p-type and n-type) connected, heat is absorbed from one junction and released to the other junction, thus achieving a cooling effect), fan, graphite plate (graphite has very high thermal conductivity, excellent high temperature resistance, chemical stability, and electrical conductivity), and pump (an S-type double-suction centrifugal pump is selected for transporting cooling water) are all existing technologies. Furthermore, the circuitry involved in this utility model is existing technology, and the specific structure and injection molding principle of the upper and lower molds are also existing technologies, which can be fully implemented by those skilled in the art and need not be elaborated upon. The content protected by this utility model does not involve improvements to the internal structure and method.

[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A cooling mold, comprising a lower mold (1), an upper mold (2), and a pouring gate disposed on the top of the upper mold (2), characterized in that: It also includes a cooling component and an auxiliary component. The cooling component is installed outside the lower mold (1), and the auxiliary component is installed on the sides of the lower mold (1) and the upper mold (2). When the cooling component is activated, it cools down the lower mold (1).

2. The cooling mold according to claim 1, characterized in that: The cooling assembly includes a graphite plate (3), a semiconductor cooling chip (4), a circulation pipe (5), a water tank (6), and a pump. The lower mold (1) is provided with a circulation pipe (5), which is connected to the water tank (6), and one end of the circulation pipe (5) is connected to the output end of the pump inside the water tank (6).

3. The cooling mold according to claim 2, characterized in that: A graphite plate (3) is provided between the surface of the lower mold (1) and the circulation tube (5). The circulation tube (5) is wrapped around the outside of the graphite plate (3). Equivalent semiconductor cooling chips (4) are embedded on the surface of the circulation tube (5).

4. The cooling mold according to claim 1, characterized in that: The auxiliary components include a fan assembly (9) and a frame (10). The frame (10) is fixedly connected to the top of the water tank (6) on the side of the lower mold (1) and the upper mold (2). The fan assembly (9) is installed inside the frame (10). A dustproof net is provided inside the frame (10) on the air intake side of the fan assembly (9).

5. A cooling mold according to claim 4, characterized in that: The auxiliary components also include a diverter (7), a solenoid valve (8), a flow guide (11), a straight outlet pipe (12), and an inclined pipe (13). The flow guide (11) is fixedly connected to the side of the frame (10). The outer end of the flow guide (11) is connected to the straight outlet pipe (12). The outer end of the flow guide (11) is provided with inclined pipes (13) on both sides of the straight outlet pipe (12).

6. The cooling mold according to claim 4, characterized in that: The top of the water tank (6) is connected to the air inlet side of the fan group (9) with a diversion pipe (7). The other end of the diversion pipe (7) is connected to the circulation pipe (5), and a solenoid valve (8) is installed on the end of the diversion pipe (7) near the circulation pipe (5).

7. A cooling mold according to claim 6, characterized in that: The water tank (6) is equipped with a PLC control panel (14), which is electrically connected to the pump, the semiconductor cooling chip (4) and the solenoid valve (8).

Images