Table type constant-temperature reaction instrument

Abstract

The utility model discloses a table type constant temperature reaction instrument, including reaction instrument shell, constant temperature cold bath assembly, oscillation assembly and control assembly, the reaction instrument shell is composed of main shell and shell cover, the top of the shell cavity of main shell is provided with cavity hole, constant temperature cold bath assembly is provided in the cavity hole, oscillation assembly is provided in the cavity hole. The oscillation assembly is installed at the bottom of the constant-temperature cold bath assembly, the control assembly is installed in the shell cavity, the constant-temperature cold bath assembly comprises a heat insulation shell, a constant-temperature hole is formed in the heat insulation shell, a cold bath seat is installed in the constant-temperature hole in an embedded mode, and the control assembly is installed in the shell cavity. The bottom of the cold bath base is connected with a semiconductor chilling plate arranged in the heat insulation shell, and a water cooling radiator is installed at the hot end of the semiconductor chilling plate. The incubation box has the advantages that a plurality of cold bath tank bodies can be provided, the temperature in the tank bodies can rapidly reach the specified temperature, the conduction efficiency is high, the temperature distribution is uniform, and the environment needed by the incubation box is optimized in cooperation with oscillation.

Description

Technical Field

[0001] This utility model relates to the field of thermostats, and in particular to a benchtop thermostat reactor. Background Technology

[0002] Thermostats provide a better incubation environment for biological culture. Most existing thermostats use semiconductor coolers for cooling. These utilize PN junctions made of special semiconductor materials to form thermocouple pairs and generate the Peltier effect, a novel cooling method that uses direct current for cooling. It is considered one of the three major cooling methods in the world, along with compression refrigeration and absorption refrigeration. Compared to the other two methods, semiconductor refrigeration is more convenient and smaller in size, and therefore widely used in thermostats. However, due to the limitation that its cold end is used as the temperature control end of the cold bath, the temperature distribution in larger incubation tanks is often uneven due to the size of the end. Furthermore, most existing thermostats operate in a static environment, while biological culture incubation sometimes requires a vibrating environment. Therefore, it is essential to improve the temperature uniformity, heat transfer, and multifunctionality of thermostats. Utility Model Content

[0003] The purpose of this invention is to provide a benchtop constant temperature reactor in order to solve the above-mentioned problems.

[0004] This utility model achieves the above objectives through the following technical solutions:

[0005] A benchtop constant temperature reactor includes a reactor housing, a constant temperature cold bath assembly, an oscillation assembly, and a control assembly. The reactor housing consists of a main shell and a cover. The top of the main shell cavity has a cavity opening. The constant temperature cold bath assembly is disposed in the cavity opening. The oscillation assembly is installed at the bottom of the constant temperature cold bath assembly. The control assembly is installed inside the cavity.

[0006] The constant temperature cold bath assembly includes a heat insulation shell with a constant temperature hole. A cold bath base is embedded in the constant temperature hole. The bottom of the cold bath base is connected to a semiconductor cooling chip located inside the heat insulation shell. A water-cooled radiator is installed at the hot end of the semiconductor cooling chip. A temperature sensor is embedded in the bottom surface of the cold bath base. A heat-conducting enclosure is installed on the top of the cold bath base. A heat spreader is installed on the cold bath base inside the heat-conducting enclosure. An inner heat insulation cover is provided on the outer side of the enclosure.

[0007] Furthermore, the oscillation assembly includes a drive frame, on which an oscillation arm is rotatably mounted via an oscillation shaft, and an oscillation plate is rotatably mounted on the end side shaft of the oscillation arm. The oscillation shaft is connected to a motor via a transmission assembly, and a horizontal movement limit track assembly is installed between the oscillation plate and the drive frame.

[0008] Furthermore, the horizontal movement limiting track assembly consists of an intermediate frame, a lower longitudinal rail and an upper transverse rail respectively installed on the upper and lower sides of the intermediate frame, with the lower longitudinal rail and the upper transverse rail arranged vertically.

[0009] Furthermore, the transmission assembly consists of a driving wheel, a driven wheel, and a transmission belt connecting the driving wheel and the driven wheel.

[0010] Furthermore, an upper heat-conducting ring disk is installed on the top of the inner side of the heat insulation cavity of the heat insulation shell. The annular hole of the upper heat-conducting ring disk is fitted to the cold end of the semiconductor cooling chip. The top surface of the upper heat-conducting ring disk is in contact with the bottom surface of the cold bath base. A gasket ring is installed at the top edge of the heat insulation shell.

[0011] Furthermore, the inner insulation cover consists of a cover ring, a transparent plate installed on the top of the cover ring, and a strong magnetic sealing ring strip installed on the bottom ring edge of the cover ring. The cover ring is installed to the top of the heat insulation shell through an inner cover hinge.

[0012] Furthermore, the outer cover is mounted to the main housing via an outer cover hinge. The main housing has a power socket, a USB plug, a power switch, a touch display, and a filter screen mounted on its shell wall. The outer cover consists of a snap-on cover and an embedded window installed in the middle of the snap-on cover.

[0013] The beneficial effects are as follows: The benchtop constant temperature reactor described in this utility model can not only provide multiple cold bath tanks, but also can quickly reach the specified temperature in the tank. It has high conduction efficiency and uniform temperature distribution. At the same time, it is combined with oscillation and has diversified functions, thereby optimizing the environment required by the incubation box. Attached Figure Description

[0014] Figure 1 This utility model describes the structure of a benchtop constant temperature reactor. Figure 1 ;

[0015] Figure 2 This utility model describes the structure of a benchtop constant temperature reactor. Figure 2 ;

[0016] Figure 3 This is an internal structural diagram of a benchtop constant temperature reactor described in this utility model;

[0017] Figure 4 This is a structural diagram of the constant temperature cold bath assembly of a benchtop constant temperature reactor described in this utility model;

[0018] Figure 5 This is a schematic diagram of the internal structure of the heat insulation shell of a benchtop constant temperature reactor as described in this utility model;

[0019] Figure 6 This is a structural diagram of the oscillation assembly of a benchtop constant temperature reactor described in this utility model.

[0020] The annotations in the attached figures are explained as follows:

[0021] 100. Reactor housing; 110. Main housing; 111. Touch screen display; 112. Foot pad; 113. Filter screen; 114. Power socket; 115. Power switch; 120. Housing cover; 121. Cover cover; 122. Embedded window; 123. Housing hinge.

[0022] 200. Constant temperature cold bath assembly; 201. Heat insulation shell; 202. Cold bath base; 203. Heat conduction enclosure; 204. Temperature sensor; 205. Upper heat conduction ring plate; 206. Semiconductor refrigeration chip; 207. Water-cooled radiator; 208. Heat spreader plate; 209. Gasket ring; 210. Inner insulation cover; 211. Cover ring; 212. Strong magnetic sealing ring strip; 213. Transparent plate;

[0023] 300. Oscillating assembly; 310. Motor; 311. Motor frame; 320. Horizontal movement limit track assembly; 321. Intermediate frame; 322. Lower longitudinal rail; 323. Upper transverse rail; 330. Transmission assembly; 331. Drive wheel; 332. Transmission belt; 333. Driven wheel; 340. Drive fixed frame; 350. Oscillating plate; 360. Oscillating arm; 361. Oscillating shaft;

[0024] 400. Control assembly. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments.

[0026] The following is combined Figures 1 to 6 The benchtop constant temperature reactor provided in this embodiment will be further described as follows:

[0027] Please refer to Figure 1 The present invention provides a benchtop constant temperature reactor, including a reactor housing 100, a constant temperature cold bath assembly 200, an oscillation assembly 300 and a control assembly 400;

[0028] The reactor housing 100 consists of a main housing 110 and a housing cover 120. The top of the main housing 110 has a cavity, and the constant temperature cold bath assembly 200 is located in the cavity. A gap is left between the cavity and the constant temperature cold bath assembly 200 to facilitate oscillation. The oscillation assembly 300 is installed at the bottom of the constant temperature cold bath assembly 200, and the control assembly 400 is installed inside the housing.

[0029] The constant-temperature cold bath assembly 200 includes a heat insulation shell 201. The heat insulation shell 201 has a constant-temperature hole, and a cold bath holder 202 is embedded within the constant-temperature hole. The bottom of the cold bath holder 202 is connected to a semiconductor cooling chip 206 located inside the heat insulation shell 201. The cold end of the semiconductor cooling chip 206 contacts the cold bath holder 202. A water-cooled radiator 207 is installed at the hot end of the semiconductor cooling chip 206. The water-cooled radiator 207 is a commonly used heat dissipation component, including a cooling fan assembly, a circulating pump, and... Its supporting pipelines include a cooling fan assembly located on the outside of the heat insulation shell 201 for easy heat dissipation. A temperature sensor 204 is embedded in the bottom surface of the cold bath base 202. A heat-conducting enclosure 203 is installed on the top of the cold bath base 202. A heat-spreading plate 208, made of aluminum, is installed on the cold bath base 202 inside the heat-conducting enclosure 203. This plate can conduct heat evenly, making the temperature distribution of the constant temperature cold bath inside the enclosure 203 uniform. This is the main reaction site. An inner heat-insulating cover 210 is installed on the outside of the enclosure 203.

[0030] like Figures 1-6 As shown, embodiments of this utility model also disclose the following more optimized specific structures:

[0031] The oscillation assembly 301 includes a drive frame 340, an oscillation arm 360 is rotatably mounted on the drive frame 340 via an oscillation shaft 261, an oscillation plate 350 is rotatably mounted on the end shaft of the oscillation arm 360, a motor 310 is connected to the oscillation shaft 261 via a transmission assembly 330, and a horizontal movement limit track assembly 320 is installed between the oscillation plate 350 and the drive frame 340 to ensure that the oscillation plate 350 oscillates horizontally.

[0032] The horizontal movement limiting track assembly 320 consists of an intermediate frame 321, a lower longitudinal rail 322 and an upper transverse rail 323 respectively installed on the upper and lower sides of the intermediate frame 321, with the lower longitudinal rail 322 and the upper transverse rail 323 arranged vertically.

[0033] The transmission assembly 330 consists of a driving wheel 331, a driven wheel 333, and a transmission belt 332 connecting the driving wheel 331 and the driven wheel 333. The driving wheel 331 is mounted on the motor shaft of the motor 310, and the driven wheel 333 is mounted on the oscillating shaft 361. The motor 310 is fixed to the inner bottom of the main housing 11 by the motor frame 311.

[0034] An upper heat-conducting ring disk 205 is installed on the top of the inner side of the heat insulation cavity of the heat insulation shell 201. The annular hole of the upper heat-conducting ring disk 205 is fitted to the cold end of the semiconductor cooling chip 206, and the top surface of the upper heat-conducting ring disk 205 is in contact with the bottom surface of the cold bath base 202 to enhance the cooling and heat conduction effect. A gasket ring 209 is installed at the top edge of the heat insulation shell 201 to cover any gaps that may vibrate.

[0035] The inner insulation cover 210 consists of a cover ring 211, a transparent plate 213 installed on the top of the cover ring 211, and a strong magnetic sealing ring strip 212 installed on the bottom ring edge of the cover ring 211. The cover ring 211 is installed to the top of the heat insulation shell 201 through an inner cover hinge.

[0036] The outer cover 120 is mounted to the main housing 110 via the outer cover hinge 123. The main housing 110 has a power socket 114, a USB plug, a power switch 115, a touch display 111, and a filter 113 mounted on its shell wall. The power socket 114 and the USB plug are located on the back side. Several feet 112 are mounted on the bottom of the main housing 110. The outer cover 120 consists of a snap-on cover 121 and an embedded window 122 installed in the middle of the snap-on cover 121 to facilitate observation of the internal situation.

[0037] The control assembly 400 consists of a circuit protection housing, a power module installed inside the circuit protection housing, and a control board. It is the control center of the entire device. A cooling fan is installed on the circuit protection housing to protect the internal circuitry.

[0038] like Figures 1-6 The tabletop constant temperature reactor shown mainly provides a place for incubation reaction experiments that require a cold bath. The reactants are placed in the heat-conducting enclosure 203 above the cold bath base 202. The heat-conducting enclosure 203 is equipped with a rib plate to separate multiple reaction tanks. In this embodiment, it is divided into three tanks. With the heat spreader 208, the temperature of each tank is more uniform. After the inner insulation cover 210 is closed, the outer cover 120 is closed to ensure good insulation inside. Turn on the power switch 115 and then control the time and temperature through the touch display 111 to carry out the cold bath. The heat of the semiconductor cooling chip 206 is discharged through the water-cooled radiator 207 instead of the traditional direct air cooling, which can ensure the sealing of the heat insulation shell 201, making the cooling efficiency faster and the cooling efficiency of the cold bath base higher.

[0039] The oscillation assembly 301 drives the oscillation arm 360 to rotate eccentrically through the transmission component 330, thereby causing the oscillation plate 350 to oscillate in the horizontal direction, so that the constant temperature cold bath assembly on its top is oscillated.

[0040] The above structure can accommodate multiple incubation boxes for cold bathing at 4~25℃. Due to the setting of the heat spreader, the temperature difference between multiple incubation boxes is within ±1.5℃. The internal sealing is good and the heat conduction speed is fast, so that the width of the cold bath base can reach the specified temperature. In addition, with the vibration function, the incubation is better.

[0041] Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of this utility model as claimed.

Claims

1. A benchtop constant temperature reactor, characterized in that: The reactor includes a reactor housing, a constant temperature cold bath assembly, an oscillation assembly, and a control assembly. The reactor housing consists of a main housing and a housing cover. The top of the main housing cavity has a cavity opening. The constant temperature cold bath assembly is located inside the cavity opening. The oscillation assembly is installed at the bottom of the constant temperature cold bath assembly. The control assembly is installed inside the cavity. The constant temperature cold bath assembly includes a heat insulation shell with a constant temperature hole. A cold bath base is embedded in the constant temperature hole. The bottom of the cold bath base is connected to a semiconductor cooling chip located inside the heat insulation shell. A water-cooled radiator is installed at the hot end of the semiconductor cooling chip. A temperature sensor is embedded in the bottom surface of the cold bath base. A heat-conducting enclosure is installed on the top of the cold bath base. A heat spreader is installed on the cold bath base inside the heat-conducting enclosure. An inner heat insulation cover is provided on the outer side of the enclosure.

2. The benchtop constant temperature reactor according to claim 1, characterized in that: The oscillation assembly includes a drive frame, on which an oscillation arm is rotatably mounted via an oscillation shaft. An oscillation plate is rotatably mounted on the end side of the oscillation arm. The oscillation shaft is connected to a motor via a transmission assembly. A horizontal movement limit track assembly is installed between the oscillation plate and the drive frame.

3. A benchtop constant temperature reactor according to claim 2, characterized in that: The horizontal movement limiting track assembly consists of an intermediate frame, a lower longitudinal rail and an upper transverse rail respectively installed on the upper and lower sides of the intermediate frame, with the lower longitudinal rail and the upper transverse rail arranged vertically.

4. A benchtop constant temperature reactor according to claim 2, characterized in that: The transmission assembly consists of a driving wheel, a driven wheel, and a transmission belt connecting the driving wheel and the driven wheel.

5. A benchtop constant temperature reactor according to claim 1, characterized in that: An upper heat-conducting ring is installed on the top of the inner side of the heat insulation cavity of the heat insulation shell. The annular hole of the upper heat-conducting ring is fitted to the cold end of the semiconductor cooling chip. The top surface of the upper heat-conducting ring is in contact with the bottom surface of the cold bath base. A gasket ring is installed at the top edge of the heat insulation shell.

6. A benchtop constant temperature reactor according to claim 1, characterized in that: The inner insulation cover consists of a cover ring, a transparent plate installed on the top of the cover ring, and a strong magnetic sealing ring strip installed on the bottom ring edge of the cover ring. The cover ring is installed to the top of the heat insulation shell through an inner cover hinge.

7. A benchtop constant temperature reactor according to claim 1, characterized in that: The outer cover is mounted to the main housing via an outer cover hinge. The main housing has a power socket, a USB plug, a power switch, a touch display, and a filter screen mounted on its shell wall. The outer cover consists of a snap-on cover and an embedded window installed in the middle of the snap-on cover.

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