Uniform gold plating device for circuit board processing

Abstract

The utility model discloses a uniform gold plating device for circuit board processing, which comprises an electroplating bath and an electroplating suspension structure, the electroplating suspension structure is arranged in the electroplating bath, and the electroplating suspension structure comprises a cylindrical suspension bracket and a hook; the lower ring pipe is mounted on the inner wall of the bottom of the electroplating bath, and the upper ring pipe is mounted on the inner wall of the top of the electroplating bath; the circulating pump is mounted on one side of the top end of the electroplating bath, a filter cartridge is arranged below the circulating pump, and a first circulating pipe is mounted on the outer wall of the filter cartridge; and the lifting mechanism is arranged on one side of the electroplating bath. According to the utility model, the electroplating liquid is forced to circularly flow, so that chemical components in the liquid are uniformly distributed, local concentration difference is prevented, a circuit board is uniformly contacted with the electroplating liquid, the electroplating liquid is prevented from being gathered in a specific area, and the electroplating liquid is uniformly distributed on the surface of a workpiece through rotary electroplating, so that the uniformity of gold plating is improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, specifically to a uniform gold plating device for circuit board processing. Background Technology

[0002] Gold plating is widely used in circuit board manufacturing, mainly in high-precision circuit boards, high-frequency circuit boards, and high-sensitivity circuit boards. The gold plating process forms a metal plating layer on the surface of the circuit board through a special electrolytic process. The main advantages of gold plating are that it can greatly improve the conductivity and corrosion resistance of the circuit board, while also improving the aesthetics of the product and enhancing its surface hardness and wear resistance.

[0003] When immersing circuit boards in an electroplating solution for gold plating, the chemical composition of the solution is unevenly distributed, resulting in local concentration differences and uneven distribution of the plating solution on the workpiece surface. This leads to uneven distribution of the plating layer on the workpiece surface, affecting the appearance and performance of the product. Therefore, we propose a uniform gold plating device for circuit board processing. Utility Model Content

[0004] The purpose of this invention is to provide a uniform gold plating device for circuit board processing, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a uniform gold plating apparatus for circuit board processing, comprising an electroplating tank, and further comprising...

[0006] An electroplating suspension structure is provided inside an electroplating tank. The electroplating suspension structure includes a cylindrical suspension frame and hooks. The hooks are fixed to the outer wall of the cylindrical suspension frame inside the electroplating tank. A support arm is provided above the electroplating tank, and a second motor is installed at the top of the support arm. The output end of the second motor extends into the interior of the support arm and is fitted with a large gear. The top of the cylindrical suspension frame extends into the interior of the support arm and is fitted with a small gear. The small gear meshes tightly with the large gear.

[0007] The lower ring pipe is installed on the inner wall of the bottom of the electroplating tank, and the inner wall of the lower ring pipe is provided with equally spaced liquid suction ports. The upper ring pipe is installed on the inner wall of the top of the electroplating tank, and the bottom end of the upper ring pipe is provided with equally spaced liquid discharge ports.

[0008] A circulation pump is installed on one side of the top of the electroplating tank, a filter cartridge is provided below the circulation pump, and a first circulation pipe is installed on the outer wall of the filter cartridge;

[0009] A lifting mechanism is provided on one side of the electroplating tank. The lifting mechanism includes a lifting frame, a lead screw, and a first motor.

[0010] Preferably, the lead screw is installed inside the lifting frame on one side of the electroplating tank, the first motor is installed at the output end of the lead screw, and one end of the support arm extends into the interior of the lifting frame and engages with the lead screw thread.

[0011] Preferably, the filter cartridge has a filter element inside, and the filter element has a hollow cylindrical structure.

[0012] Preferably, the top of the filter cartridge is threaded with a sealing cap, and the bottom of the sealing cap is provided with a liquid inlet chamber. A liquid inlet is provided on the outer wall of the filter cartridge on one side of the liquid inlet chamber. Rotating the sealing cap can open the filter cartridge, thereby facilitating the removal and replacement of the filter element.

[0013] Preferably, one end of the first circulation pipe is connected to the liquid inlet, and the other end of the first circulation pipe extends into the interior of the electroplating tank and is connected to the lower ring pipe.

[0014] Preferably, the input and output ends of the circulation pump are respectively equipped with a second circulation pipe and an infusion pipe, and the second circulation pipe is connected to the bottom of the filter cartridge, and the infusion pipe is connected to the upper ring pipe.

[0015] Preferably, the bottom of the hook is provided with a limiting groove, and the limiting groove is an arc-shaped structure. The limiting groove can limit the circuit board and prevent it from shifting.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] The circuit board is hung on a hook on the outer wall of the cylindrical suspension frame. The first motor drives the lead screw to rotate, causing the support arm to move the electroplating suspension structure down into the electroplating tank, immersing the circuit board in the electroplating solution. The circulation pump operates, causing the first circulation pipe to draw out the electroplating solution from the bottom of the electroplating tank through the lower ring pipe and the suction port. The electroplating solution enters the inlet chamber from the inlet, then enters the filter element, and is discharged after being filtered by the filter element. The filter element removes impurities, improving the purity of the electroplating solution and thus improving the quality of electroplating. The second circulation pipe and the infusion pipe guide the electroplating solution into the upper ring pipe. The electroplating solution flows evenly back into the electroplating tank from the drain port. By forcibly circulating the electroplating solution, the chemical components in the liquid are evenly distributed, preventing local concentration differences. At the same time, the second motor drives the large gear to rotate, and the large gear drives the cylindrical suspension frame to rotate through the small gear, causing the circuit board to rotate. This ensures that the circuit board is evenly contacted with the electroplating solution, preventing the electroplating solution from accumulating in specific areas and ensuring that the electroplating solution is evenly distributed on the surface of the workpiece, thereby improving the uniformity of gold plating. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the front cross-sectional structure of this utility model;

[0019] Figure 2This is an enlarged schematic diagram of the electroplating suspension structure of this utility model;

[0020] Figure 3 For the present utility model Figure 1 Enlarged structural diagram at point A in the middle;

[0021] Figure 4 This is an enlarged side view cross-sectional schematic diagram of the filter cartridge of this utility model.

[0022] In the diagram: 1. Electroplating tank; 2. Electroplating suspension structure; 201. Cylindrical suspension frame; 202. Hook; 203. Limiting groove; 3. Lower ring pipe; 4. Suction port; 5. First circulation pipe; 6. Filter cartridge; 7. Second circulation pipe; 8. Circulation pump; 9. Infusion pipe; 10. Upper ring pipe; 11. Drain port; 12. Support arm; 13. Lifting mechanism; 14. Lifting frame; 15. Lead screw; 16. First motor; 17. Small gear; 18. Large gear; 19. Second motor; 20. Filter element; 21. Sealing cap; 22. Liquid inlet chamber; 23. Liquid inlet. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Therefore, the following detailed description of the embodiments of this utility model provided in the drawings is not intended to limit the scope of the claimed utility model, but merely to illustrate selected embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0025] Please see Figure 1-4 One embodiment of this utility model provides: a uniform gold plating device for circuit board processing, including an electroplating tank 1, and further comprising...

[0026] Electroplating suspension structure 2 is installed inside the electroplating tank 1. Electroplating suspension structure 2 includes a cylindrical suspension frame 201 and a hook 202. The hook 202 is fixed to the outer wall of the cylindrical suspension frame 201 inside the electroplating tank 1. A support arm 12 is provided above the electroplating tank 1, and a second motor 19 is installed at the top of the support arm 12. The output end of the second motor 19 extends into the interior of the support arm 12 and is fitted with a large gear 18. The top of the cylindrical suspension frame 201 extends into the interior of the support arm 12 and is fitted with a small gear 17. The small gear 17 meshes tightly with the large gear 18.

[0027] Specifically, the circuit board is hung on the hook 202 on the outer wall of the cylindrical suspension frame 201. The setting of the limiting groove 203 can limit the circuit board and prevent it from shifting. The first motor 16 drives the lead screw 15 to rotate, so that the support arm 12 drives the electroplating suspension structure 2 to move down into the electroplating tank 1 and immerse the circuit board in the electroplating solution.

[0028] The second motor 19 drives the large gear 18 to rotate, which in turn drives the cylindrical suspension frame 201 to rotate via the small gear 17. This causes the circuit board to rotate, ensuring uniform contact between the circuit board and the electroplating solution. This prevents the electroplating solution from accumulating in specific areas and ensures that the electroplating solution is evenly distributed on the workpiece surface, thereby improving the uniformity of gold plating.

[0029] The lower ring pipe 3 is installed on the inner wall of the bottom of the electroplating tank 1, and the inner wall of the lower ring pipe 3 is provided with equally spaced liquid suction ports 4. The upper ring pipe 10 is installed on the inner wall of the top of the electroplating tank 1, and the bottom end of the upper ring pipe 10 is provided with equally spaced liquid discharge ports 11.

[0030] A circulation pump 8 is installed on one side of the top of the electroplating tank 1. A filter cartridge 6 is provided below the circulation pump 8, and a first circulation pipe 5 is installed on the outer wall of the filter cartridge 6.

[0031] Specifically, the operation of the circulation pump 8 causes the first circulation pipe 5 to draw out the electroplating solution from the bottom of the electroplating tank 1 through the lower ring pipe 3 and the suction port 4. The electroplating solution enters the inlet chamber 22 from the inlet port 23, and then enters the filter element 20. After being filtered by the filter element 20, it is discharged. The filter element 20 filters out the impurities inside, which can improve the purity of the electroplating solution and thus improve the quality of electroplating. Then, the electroplating solution is introduced into the upper ring pipe 10 through the second circulation pipe 7 and the delivery pipe 9. The electroplating solution flows back into the electroplating tank 1 evenly from the drain port 11. By forcibly circulating the electroplating solution, the chemical components in the liquid are evenly distributed, and local concentration differences are prevented.

[0032] The lifting mechanism 13 is located on one side of the electroplating tank 1. The lifting mechanism 13 includes a lifting frame 14, a lead screw 15, and a first motor 16.

[0033] The lead screw 15 is installed inside the lifting frame 14 on one side of the electroplating tank 1. The first motor 16 is installed at the output end of the lead screw 15. One end of the support arm 12 extends into the interior of the lifting frame 14 and is threadedly engaged with the lead screw 15.

[0034] The filter cartridge 6 is equipped with a filter element 20, and the filter element 20 has a hollow cylindrical structure.

[0035] The top of the filter cartridge 6 is threaded with a sealing cap 21, and the bottom of the sealing cap 21 is provided with a liquid inlet chamber 22. The outer wall of the filter cartridge 6 on one side of the liquid inlet chamber 22 is provided with a liquid inlet 23. Rotating the sealing cap 21 can open the filter cartridge 6, thereby facilitating the removal and replacement of the filter element 20.

[0036] One end of the first circulation pipe 5 is connected to the liquid inlet 23, and the other end of the first circulation pipe 5 extends into the interior of the electroplating tank 1 and is connected to the lower ring pipe 3.

[0037] The input and output ends of the circulating pump 8 are respectively equipped with a second circulation pipe 7 and an infusion pipe 9, and the second circulation pipe 7 is connected to the bottom of the filter cartridge 6, and the infusion pipe 9 is connected to the upper ring pipe 10.

[0038] The bottom of the hook 202 is provided with a limiting groove 203, and the limiting groove 203 has an arc-shaped structure.

[0039] In this embodiment, the circuit board is first hung on the hook 202 on the outer wall of the cylindrical suspension frame 201. The limiting groove 203 limits the circuit board and prevents it from shifting. The first motor 16 drives the lead screw 15 to rotate, causing the support arm 12 to move the electroplating suspension structure 2 down into the electroplating tank 1, immersing the circuit board in the electroplating solution. Then, during the electroplating process, the circulation pump 8 operates, causing the first circulation pipe 5 to draw out the electroplating solution from the bottom of the electroplating tank 1 through the lower ring pipe 3 and the suction port 4. The electroplating solution enters the inlet chamber 22 from the inlet port 23, and then enters the filter element 20. After being filtered by the filter element 20, it is discharged. The filter element 20 filters out the impurities inside, which can improve the purity of the electroplating solution. This improves the quality of electroplating. The electroplating solution is then introduced into the upper ring pipe 10 through the second circulation pipe 7 and the infusion pipe 9. The electroplating solution flows back evenly into the electroplating tank 1 from the drain port 11. By forcibly circulating the electroplating solution, the chemical components in the liquid are evenly distributed, preventing local concentration differences. At the same time, the second motor 19 drives the large gear 18 to rotate, and the large gear 18 drives the cylindrical suspension frame 201 to rotate through the small gear 17, causing the circuit board to rotate. This ensures that the circuit board is evenly in contact with the electroplating solution, preventing the electroplating solution from accumulating in specific areas and ensuring that the electroplating solution is evenly distributed on the surface of the workpiece, thereby improving the uniformity of gold plating. Furthermore, rotating the sealing cover 21 can open the filter cartridge 6, making it easy to remove and replace the filter element 20.

[0040] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

Claims

1. A uniform gold plating device for processing a circuit board, comprising an electroplating bath (1), characterized in that: Also includes An electroplating suspension structure (2) is provided inside an electroplating tank (1). The electroplating suspension structure (2) includes a cylindrical suspension frame (201) and a hook (202). The hook (202) is fixed to the outer wall of the cylindrical suspension frame (201) inside the electroplating tank (1). A support arm (12) is provided above the electroplating tank (1). A second motor (19) is installed at the top of the support arm (12). The output end of the second motor (19) extends into the interior of the support arm (12) and is fitted with a large gear (18). The top of the cylindrical suspension frame (201) extends into the interior of the support arm (12) and is fitted with a small gear (17). The small gear (17) meshes tightly with the large gear (18). The lower ring pipe (3) is installed on the inner wall of the bottom of the electroplating tank (1), and the inner wall of the lower ring pipe (3) is provided with equally spaced suction ports (4). The inner wall of the top of the electroplating tank (1) is installed with an upper ring pipe (10), and the bottom end of the upper ring pipe (10) is provided with equally spaced drain ports (11). A circulation pump (8) is installed on one side of the top of the electroplating tank (1). A filter cartridge (6) is provided below the circulation pump (8), and a first circulation pipe (5) is installed on the outer wall of the filter cartridge (6). The lifting mechanism (13) is located on one side of the electroplating tank (1). The lifting mechanism (13) includes a lifting frame (14), a lead screw (15), and a first motor (16).

2. The uniform gold plating device for a circuit board processing according to claim 1, characterized by: The lead screw (15) is installed inside the lifting frame (14) on one side of the electroplating tank (1), the first motor (16) is installed at the output end of the lead screw (15), and one end of the support arm (12) extends into the interior of the lifting frame (14) and engages with the lead screw (15) threadedly.

3. The uniform gold plating device for a circuit board processing according to claim 1, characterized in that: The filter cartridge (6) is provided with a filter element (20) inside, and the filter element (20) is a hollow cylindrical structure.

4. The uniform gold plating device for a circuit board process according to claim 1, characterized by: The top of the filter cartridge (6) is threaded with a sealing cap (21), and the bottom of the sealing cap (21) is provided with a liquid inlet chamber (22), and a liquid inlet (23) is provided on the outer wall of the filter cartridge (6) on one side of the liquid inlet chamber (22).

5. The uniform gold plating apparatus for processing a circuit board according to claim 1, wherein: One end of the first circulation pipe (5) is connected to the liquid inlet (23), and the other end of the first circulation pipe (5) extends into the interior of the electroplating tank (1) and is connected to the lower ring pipe (3).

6. The uniform gold plating apparatus for a circuit board process according to claim 1, characterized by: The input and output ends of the circulation pump (8) are respectively equipped with a second circulation pipe (7) and an infusion pipe (9), and the second circulation pipe (7) is connected to the bottom of the filter cartridge (6), and the infusion pipe (9) is connected to the upper ring pipe (10).

7. The uniform gold plating apparatus for a circuit board process according to claim 1, characterized by: The bottom of the hook (202) is provided with a limiting groove (203), and the limiting groove (203) is an arc-shaped structure.

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