A high-temperature resistant quartz flexible accelerometer

Abstract

This utility model discloses a high-temperature resistant quartz flexible accelerometer, relating to the technical field of quartz flexible accelerometers. It includes an inner housing, with a first encapsulation plate fixedly installed at the top opening of the inner housing. A support base is fixedly connected to the outer side of the top of the inner housing. The inner housing contains a main component for constituting the quartz flexible accelerometer. An outer shell is coaxially arranged around the inner housing. The advantages of this utility model are: the heat dissipation component can guide the working heat of the main component from inside the inner housing and quickly dissipate it, thereby avoiding the performance degradation of the main component caused by continuous heat accumulation. This keeps the operating temperature of the quartz flexible accelerometer stable, which is beneficial to improving the overall high-temperature resistance of the quartz flexible accelerometer; the protrusions and heat dissipation fins effectively increase the contact area between the heat-conducting shell and the air inside the outer shell, thus facilitating heat dissipation.

Description

Technical Field

[0001] This utility model relates to the field of quartz flexible accelerometer technology, and in particular to a high-temperature resistant quartz flexible accelerometer. Background Technology

[0002] Quartz flexible accelerometers are precision instruments designed based on the inertial principle of Earth's gravitational field. As a force-balanced sensor, it can convert input acceleration into minute displacements of a flexible pendulum and balance them with feedback force. It features high accuracy, strong anti-interference ability, wide measurement range, and strong overload capacity. During the operation of quartz flexible accelerometers, in order to prevent high temperatures from causing degradation of the mechanical properties of quartz materials and affecting the elastic modulus and fatigue life of the flexible structure, quartz flexible accelerometers need to undergo high-temperature resistance treatment.

[0003] Existing quartz flexible accelerometers generally avoid overheating by optimizing housing materials and packaging processes. However, due to the lack of an effective heat dissipation structure for the main internal components, the quartz flexible accelerometer may still overheat due to the continuous accumulation of heat. This is detrimental to the normal use of the quartz flexible accelerometer and has a certain impact on its service life. Utility Model Content

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0006] A high-temperature resistant quartz flexible accelerometer includes an inner housing, a first encapsulation plate fixedly installed at the top opening of the inner housing, a support base fixedly connected to the outer side of the top of the inner housing, and a main component for constituting the quartz flexible accelerometer provided inside the inner housing.

[0007] The outer shell is coaxially arranged around the inner shell. The top of the outer shell is connected to the support base. The interior of the outer shell is provided with a heat dissipation component that can quickly dissipate the working heat of the main component to improve the overall high temperature resistance. A second encapsulation plate is fixedly installed at the bottom opening of the outer shell.

[0008] As a preferred embodiment of the high-temperature resistant quartz flexible accelerometer of this utility model, the main body component includes a flexible ring disposed inside the inner shell, the top and bottom of the flexible ring are provided with magnetic caps, the outer side of the magnetic caps is provided with coils, magnets are provided on the sides of the two magnetic caps that are far apart from each other, and yokes are provided on the sides of the two magnets that are far apart from each other.

[0009] In a preferred embodiment of the high-temperature resistant quartz flexible accelerometer of this utility model, the first encapsulation plate has multiple pins symmetrically arranged on its top, and a control circuit is fixedly installed on its bottom.

[0010] As a preferred embodiment of the high-temperature resistant quartz flexible accelerometer of this utility model, the support base is provided with positioning holes for cooperating with fasteners to achieve overall installation and fixation of the inner shell, and there are no fewer than three positioning holes.

[0011] As a preferred embodiment of the high-temperature resistant quartz flexible accelerometer of this utility model, a protective layer is provided on the outer wall of the outer shell and the bottom surface of the second encapsulation plate, and the protective layer is made of silicon carbide material.

[0012] In a preferred embodiment of the high-temperature resistant quartz flexible accelerometer of this utility model, the heat dissipation assembly includes a heat-conducting film disposed inside the inner shell, the top end of the heat-conducting film penetrating into the interior of the outer shell, a heat-conducting ring disposed on the outer side of the inner shell, the inner wall of the heat-conducting ring contacting the heat-conducting film, and a heat-conducting shell fixedly connected to the outer side of the heat-conducting ring. The heat-conducting film is made of graphene film, silicone film, or boron nitride film material.

[0013] As a preferred embodiment of the high-temperature resistant quartz flexible accelerometer of this utility model, the outer side of the heat-conducting shell is provided with a plurality of protrusions, the plurality of protrusions are equidistantly distributed along the outer circumference of the outer side of the heat-conducting shell, the side of the protrusion away from the heat-conducting ring is in contact with the outer shell, and a plurality of heat dissipation fins are symmetrically installed on the outer side of the protrusion.

[0014] As a preferred embodiment of the high-temperature resistant quartz flexible accelerometer of this utility model, the support base has a first row of heat grooves intermittently spaced at equal intervals, and the second encapsulation plate has a second row of heat grooves intermittently spaced at equal intervals.

[0015] As a preferred embodiment of the high-temperature resistant quartz flexible accelerometer of this utility model, a heat-equalizing layer is provided between the heat-conducting ring and the heat-conducting shell, the heat-equalizing layer is made of heat-conducting gel, and the bottom of the inner cavity of the heat-conducting shell is provided with an injection port for adding the heat-equalizing layer.

[0016] As a preferred embodiment of the high-temperature resistant quartz flexible accelerometer of this utility model, a high-temperature resistant layer is provided between the inner shell and the heat-conducting film, and the high-temperature resistant layer is made of borosilicate glass material.

[0017] The beneficial effects of this utility model are as follows: the heat dissipation component can guide the working heat of the main component out from the inside of the inner shell and quickly dissipate it, thereby avoiding the performance degradation of the main component caused by continuous heat accumulation. This keeps the working temperature of the quartz flexible accelerometer stable and helps to improve the overall high temperature resistance of the quartz flexible accelerometer. The protrusion and heat dissipation fins effectively increase the contact area between the heat-conducting shell and the air inside the outer shell, which is more conducive to the dissipation of heat. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0019] Figure 1 This is a structural diagram of a high-temperature resistant quartz flexible accelerometer.

[0020] Figure 2 This is a diagram of the internal structure of the inner shell of a high-temperature resistant quartz flexible accelerometer.

[0021] Figure 3 This is a structural diagram of the main components of a high-temperature resistant quartz flexible accelerometer.

[0022] Figure 4 This is a detailed structural diagram of the thermal conductive film for a high-temperature resistant quartz flexible accelerometer.

[0023] Figure 5 This is a detailed structural diagram of the outer casing of a high-temperature resistant quartz flexible accelerometer.

[0024] Figure 6 This is a detailed structural diagram of the protrusion of a high-temperature resistant quartz flexible accelerometer.

[0025] Figure 7 This is a diagram of the internal structure of the heat-conducting shell of a high-temperature resistant quartz flexible accelerometer.

[0026] Labels in the diagram: 1. Inner shell; 2. Support base; 3. Outer shell; 4. Main component; 41. Flexible ring; 42. Yoke; 43. Magnet; 44. Magnetic cap; 45. Coil; 5. First encapsulation plate; 6. Control circuit; 7. Pin; 8. Heat dissipation component; 81. Thermal conductive film; 82. Thermal conductive ring; 83. Thermal conductive shell; 9. Second encapsulation plate; 10. Heat dissipation fins; 11. First row of heat channels; 12. Second row of heat channels; 13. Protrusion; 14. Heat dissipation layer; 15. Filling port; 16. High temperature resistant layer; 17. Protective layer; 18. Positioning hole. Detailed Implementation

[0027] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0028] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0029] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0030] Example 1:

[0031] Reference Figures 1 to 7 This is the first embodiment of the present invention. This embodiment provides a high-temperature resistant quartz flexible accelerometer, including an inner shell 1. A first encapsulation plate 5 is fixedly installed at the top opening of the inner shell 1. A support base 2 is fixedly connected to the outer side of the top of the inner shell 1. The inner shell 1 is provided with a main component 4 for constituting the quartz flexible accelerometer.

[0032] The main component 4, which constitutes the main structure of the quartz flexible accelerometer, is set inside the inner housing 1. The first encapsulation plate 5 at the top opening of the inner housing 1 can effectively prevent dust and other impurities from the external environment from entering the inner housing 1, thus providing a certain degree of protection for the main component 4.

[0033] The outer shell 3 is coaxially arranged around the inner shell 1. The top of the outer shell 3 is connected to the support base 2. The interior of the outer shell 3 is provided with a heat dissipation component 8 that can quickly dissipate the working heat of the main component 4 to improve the overall high temperature resistance. A second encapsulation plate 9 is fixedly installed at the bottom opening of the outer shell 3.

[0034] When the main component 4 inside the inner housing 1 is working, it will generate heat. The heat dissipation component 8 located inside the outer housing 3 can guide the heat of the main component 4 out of the inner housing 1 and quickly dissipate it, thereby avoiding the performance degradation of the main component 4 caused by continuous heat accumulation. This keeps the working temperature of the quartz flexible accelerometer stable and helps to improve the overall high temperature resistance of the quartz flexible accelerometer.

[0035] Example 2:

[0036] Reference Figures 2-5 This is the second embodiment of the present invention, which is based on the previous embodiment.

[0037] Specifically, the main body component 4 includes a flexible ring 41 disposed inside the inner shell 1. The top and bottom of the flexible ring 41 are provided with magnetic caps 44. A coil 45 is provided on the outside of the magnetic caps 44. Magnets 43 are provided on the side of the two magnetic caps 44 that are far apart from each other. A yoke 42 is provided on the side of the two magnets 43 that are far apart from each other.

[0038] like Figure 3 As shown, the flexible ring 41, yoke 42, magnet 43, magnetic cap 44 and coil 45, as the main components 4 of the quartz flexible accelerometer, are set inside the inner shell 1. It has the characteristics of simple structure and high accuracy, and therefore has wide applications in inertial navigation systems and geodetic surveying systems.

[0039] Specifically, the top of the first package board 5 is symmetrically provided with multiple pins 7, and the bottom of the first package board 5 is fixedly installed with a control circuit 6.

[0040] The main component 4 is controlled by the control circuit 6 at the bottom of the first package board 5, and the pin 7 at the top of the first package board 5 can be used to connect the control circuit 6 to the external circuit, mainly realizing signal transmission, power supply and control functions.

[0041] Specifically, the support base 2 has positioning holes 18 inside for cooperating with fasteners to achieve overall installation and fixation of the inner shell 1, and there are no fewer than three positioning holes 18.

[0042] In actual use, staff can use the multiple positioning holes 18 inside the support base 2 and fasteners such as bolts to install and fix the inner shell 1 as a whole, which facilitates the disassembly and assembly of the quartz flexible accelerometer.

[0043] Specifically, a protective layer 17 is provided on the outer wall of the outer casing 3 and the bottom surface of the second encapsulation plate 9. The protective layer 17 is made of silicon carbide material.

[0044] The protective layer 17, made of silicon carbide, has the characteristics of high hardness, high strength, high temperature resistance and oxidation resistance. Together with the outer shell 3 and the second encapsulation plate 9, it can effectively protect the inner shell 1 from the outside, thereby improving the working stability of the main component 4.

[0045] Example 3:

[0046] Reference Figures 3-7 This is the third embodiment of the present invention, which is based on the first two embodiments.

[0047] Specifically, the heat dissipation component 8 includes a heat-conducting film 81 disposed inside the inner shell 1, with the top end of the heat-conducting film 81 penetrating into the interior of the outer shell 3. A heat-conducting ring 82 is provided on the outer side of the inner shell 1, with the inner wall of the heat-conducting ring 82 in contact with the heat-conducting film 81. A heat-conducting shell 83 is fixedly connected to the outer side of the heat-conducting ring 82. The heat-conducting film 81 is made of graphene film, silicone film, or boron nitride film material.

[0048] The thermally conductive film 81, made of graphene film, silicone film, or boron nitride film material, has high thermal conductivity, such as... Figure 3 , Figure 4 and Figure 5 As shown, the heat from the main component 4 inside the inner shell 1 can be conducted to the heat-conducting ring 82 and heat-conducting shell 83 on the periphery of the inner shell 1 using the heat-conducting film 81. This guides the heat from the main component 4 out of the inner shell 1, avoiding the performance degradation of the main component 4 caused by continuous heat accumulation, thus keeping the working temperature of the quartz flexible accelerometer stable.

[0049] Specifically, the outer side of the heat-conducting shell 83 is provided with multiple protrusions 13, which are equidistantly distributed along the outer circumference of the heat-conducting shell 83. The side of the protrusion 13 away from the heat-conducting ring 82 is in contact with the outer shell 3, and multiple heat dissipation fins 10 are symmetrically installed on the outer side of the protrusion 13.

[0050] The protrusion 13, together with the heat dissipation fins 10 on its outer side, effectively increases the contact area between the heat-conducting shell 83 and the air inside the outer shell 3, which is more conducive to the dissipation of heat. At the same time, the protrusion 13 can also act as a reinforcing rib, enhancing the overall structural strength of the heat-conducting ring 82.

[0051] Specifically, the support base 2 has a first row of heat grooves 11 with intermittent and equal spacing inside, and the second encapsulation plate 9 has a second row of heat grooves 12 with intermittent and equal spacing inside.

[0052] External air can enter the interior of the outer shell 3 through the first row of heat channels 11 and the second row of heat channels 12, and carry away the heat absorbed by the heat-conducting shell 83 and the heat dissipation fins 10 along the way. This avoids the continuous accumulation of heat and prevents the interior of the inner shell 1 from being in a high-temperature state for a long time. It should also be noted that the length direction of the heat dissipation fins 10 and the protrusions 13 is opposite to the axis of the outer shell 3. This is to allow external air to flow better through the gap between the heat dissipation fins 10 and the protrusions 13, which is beneficial to improving the heat exchange rate.

[0053] Specifically, a heat-spreading layer 14 is provided between the heat-conducting ring 82 and the heat-conducting shell 83. The heat-spreading layer 14 is made of heat-conducting gel, and an injection port 15 for adding the heat-spreading layer 14 is provided at the bottom of the inner cavity of the heat-conducting shell 83.

[0054] Because the heat-spreading layer 14 made of thermally conductive gel has excellent thermal conductivity and good electrical insulation properties, such as... Figure 3 , Figure 6 and Figure 7 As shown, the heat dissipation layer 14 can evenly distribute the heat absorbed by the heat-conducting ring 82 from the heat-conducting film 81 inside the heat-conducting shell 83, thereby preventing the heat dissipation efficiency of the heat dissipation component 8 from being poor due to excessive local temperature of the heat-conducting shell 83. It should also be noted that the multiple filling ports 15 at the bottom of the inner cavity of the heat-conducting shell 83 can be used to add the heat dissipation layer 14. After the heat-conducting gel is added, it can be sealed with a plug.

[0055] Specifically, a high-temperature resistant layer 16 is provided between the inner shell 1 and the heat-conducting film 81, and the high-temperature resistant layer 16 is made of borosilicate glass material.

[0056] The high-temperature resistant layer 16, made of borosilicate glass, has excellent high-temperature resistance and thermal stability, which enables the inner shell 1 to remain stable in high-temperature environments, thereby ensuring the normal operation of the main body component 4 inside the inner shell 1.

[0057] In use, the main component 4, which constitutes the main structure of the quartz flexible accelerometer, is first placed inside the inner shell 1. The temperature inside the inner shell 1 will continuously rise due to the long-term operation of the main component 4. At this time, the heat dissipation component 8 can guide the working heat of the main component 4 out from the inner shell 1 and quickly dissipate it, thereby avoiding the performance degradation of the main component 4 caused by the continuous accumulation of heat. This keeps the working temperature of the quartz flexible accelerometer stable, which is beneficial to improving the overall high temperature resistance of the quartz flexible accelerometer. In this process, the protrusion 13 and the heat dissipation fins 10 effectively increase the contact area between the heat-conducting shell 83 and the air inside the outer shell 3, which is more conducive to the dissipation of heat.

[0058] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A high-temperature resistant quartz flexible accelerometer, comprising an inner housing (1), characterized in that: The first encapsulation plate (5) is fixedly installed at the top opening of the inner shell (1), and a support base (2) is fixedly connected to the outer side of the top of the inner shell (1). The inner shell (1) is provided with a main component (4) for constituting a quartz flexible accelerometer. The outer shell (3) is coaxially provided around the inner shell (1). The top of the outer shell (3) is connected to the support base (2). The interior of the outer shell (3) is provided with a heat dissipation component (8) that can quickly dissipate the working heat of the main component (4) to improve the overall high temperature resistance. A second encapsulation plate (9) is fixedly installed at the bottom opening of the outer shell (3).

2. The high-temperature resistant quartz flexible accelerometer as described in claim 1, characterized in that: The main body component (4) includes a flexible ring (41) disposed inside the inner shell (1). The top and bottom of the flexible ring (41) are provided with magnetic caps (44). A coil (45) is provided on the outside of the magnetic caps (44). Magnets (43) are provided on the side of the two magnetic caps (44) that are far apart from each other. A yoke (42) is provided on the side of the two magnets (43) that are far apart from each other.

3. The high-temperature resistant quartz flexible accelerometer as described in claim 1, characterized in that: The top of the first encapsulation board (5) is symmetrically provided with multiple pins (7), and the bottom of the first encapsulation board (5) is fixedly installed with a control circuit (6).

4. The high-temperature resistant quartz flexible accelerometer as described in claim 1, characterized in that: The support base (2) has positioning holes (18) inside for cooperating with fasteners to achieve overall installation and fixation of the inner shell (1), and there are no fewer than three positioning holes (18).

5. The high-temperature resistant quartz flexible accelerometer as described in claim 1, characterized in that: The outer wall of the outer casing (3) and the bottom surface of the second encapsulation plate (9) are provided with a protective layer (17), which is made of silicon carbide material.

6. The high-temperature resistant quartz flexible accelerometer as described in claim 1, characterized in that: The heat dissipation assembly (8) includes a heat-conducting film (81) disposed inside the inner shell (1), the top end of the heat-conducting film (81) extending into the interior of the outer shell (3), a heat-conducting ring (82) is provided on the outer side of the inner shell (1), the inner wall of the heat-conducting ring (82) is in contact with the heat-conducting film (81), and a heat-conducting shell (83) is fixedly connected to the outer side of the heat-conducting ring (82). The heat-conducting film (81) is made of graphene film, silicone film or boron nitride film material.

7. The high-temperature resistant quartz flexible accelerometer as described in claim 6, characterized in that: The outer side of the heat-conducting shell (83) is provided with a plurality of protrusions (13), which are equidistantly distributed along the outer circumference of the heat-conducting shell (83). The side of the protrusion (13) away from the heat-conducting ring (82) is in contact with the outer shell (3). A plurality of heat dissipation fins (10) are symmetrically installed on the outer side of the protrusion (13).

8. The high-temperature resistant quartz flexible accelerometer as described in claim 6, characterized in that: The support base (2) has a first row of heat grooves (11) intermittently spaced inside, and the second encapsulation plate (9) has a second row of heat grooves (12) intermittently spaced inside.

9. The high-temperature resistant quartz flexible accelerometer as described in claim 6, characterized in that: A heat-spreading layer (14) is provided between the heat-conducting ring (82) and the heat-conducting shell (83). The heat-spreading layer (14) is made of heat-conducting gel. An injection port (15) for adding the heat-spreading layer (14) is provided at the bottom of the inner cavity of the heat-conducting shell (83).

10. The high-temperature resistant quartz flexible accelerometer as described in claim 6, characterized in that: A high-temperature resistant layer (16) is provided between the inner shell (1) and the heat-conducting film (81), and the high-temperature resistant layer (16) is made of borosilicate glass material.

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