An epoxy coil plate

Abstract

This utility model relates to the field of medical auxiliary equipment technology, specifically an epoxy coil board, comprising an epoxy board and a coil. The coil is arranged on a first surface of the epoxy board according to a preset rule, and a circuit area is provided on a second surface of the epoxy board. A conductive layer is laid in the circuit area, and a circuit is arranged on the conductive layer. The circuit is electrically connected to the coil. The first and second surfaces are two opposite sides of the epoxy board. By laying a conductive layer on the surface of the epoxy board opposite to the coil, the circuit can be directly arranged on the epoxy board through the conductive layer without the need for an additional circuit board. This results in higher integration of the epoxy coil board, smaller space occupation during application, and is more conducive to the miniaturization of equipment.

Description

Technical Field

[0001] This utility model relates to the field of medical auxiliary equipment technology, and in particular to an epoxy coil board. Background Technology

[0002] Magnetic resonance imaging (MRI) has become a common imaging method. MRI equipment generally emits radio frequency pulses through a coil plate (radio frequency coil) to excite protons in human tissue. The coil plate receives the radio frequency signals released during the relaxation of protons and transmits them to the reconstruction system to generate corresponding images. Existing coil plates can usually only emit radio frequency pulses and receive MRI signals. They need to be connected to external functional circuit boards for control and signal processing, which makes the entire component occupy a large space and difficult to adapt to the current miniaturization trend.

[0003] Therefore, designing an epoxy coil board with high integration and high space utilization is of great importance to those skilled in the art. Utility Model Content

[0004] The technical problem to be solved by this utility model embodiment is to provide an epoxy coil board with high integration and high space utilization, so as to solve the problem that the existing technology requires connection to external functional circuit boards for control and signal processing, which makes the whole component occupy a large space and difficult to adapt to the development of miniaturization.

[0005] This utility model discloses an epoxy coil board, which includes: an epoxy board and a coil. The coil is arranged on a first surface of the epoxy board according to a preset rule. A circuit area is provided on a second surface of the epoxy board. A conductive layer is laid in the circuit area. A circuit is arranged on the conductive layer. The circuit is electrically connected to the coil. The first surface and the second surface are two opposite surfaces of the epoxy board.

[0006] Optionally, a clearance area is provided on the first surface of the epoxy board corresponding to the circuit area, and the coil is arranged on the first surface of the epoxy board, avoiding the clearance area.

[0007] Optionally, an adhesive layer is provided between the coil and the epoxy board.

[0008] Optionally, the circuit includes one or more of analog circuits, digital circuits, and mixed-signal circuits.

[0009] Optionally, the analog circuit includes one or more of an amplifier circuit, a filter circuit, an oscillator circuit, and a modulation circuit.

[0010] Optionally, the digital circuit includes one or more of the following: logic circuit, storage circuit, counter, and microprocessor.

[0011] Optionally, the mixed-signal circuit includes one or more of analog-to-digital converter circuits and digital-to-analog converter circuits.

[0012] To address the problems existing in the prior art, this utility model also provides an epoxy coil board, which includes: an epoxy board and a coil, wherein the coil is arranged on a first surface of the epoxy board according to a preset rule, and a mounting groove is recessed on a second surface of the epoxy board, and a circuit board is arranged in the mounting groove, wherein the first surface and the second surface are two opposite surfaces of the epoxy board.

[0013] Optionally, the circuit board includes a substrate, a conductive layer, and circuitry disposed on the substrate through the conductive layer.

[0014] Optionally, the circuit board includes a conductive layer and circuitry disposed on the conductive layer.

[0015] Compared with the prior art, the beneficial effects of the epoxy coil board provided by this utility model embodiment are as follows: By designing an epoxy coil board, including an epoxy board and a coil, the coil is arranged on the first surface of the epoxy board according to a preset rule, and a circuit area is provided on the second surface of the epoxy board. A conductive layer is laid in the circuit area, and a circuit is arranged on the conductive layer. The circuit is electrically connected to the coil. The first surface and the second surface are two opposite sides of the epoxy board. By laying a conductive layer on the surface of the epoxy board opposite to the coil, the circuit can be directly arranged on the epoxy board through the conductive layer without the need for an additional circuit board. This makes the epoxy coil board more integrated, occupies less space in application, and is more conducive to the miniaturization of equipment. Attached Figure Description

[0016] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0017] Figure 1 This is a schematic diagram of the structure of the epoxy coil plate provided in this embodiment of the utility model. Figure 1 ;

[0018] Figure 2 This is a schematic diagram of the structure of the epoxy coil plate provided in this embodiment of the utility model. Figure 2 ;

[0019] Figure 3 This is a schematic diagram of the structure of the epoxy coil plate provided in this embodiment of the utility model. Figure 3 ;

[0020] Figure 4 This is a schematic diagram of the structure of the epoxy coil plate provided in this embodiment of the utility model. Figure 4 .

[0021] The labels for the attached figures are as follows:

[0022] 100, Epoxy board; 200, Coil; 300, Mounting slot; 400, Circuit board; 110, Circuit area; 120, Conductive layer; 130, Clearance area; 410, Substrate. Detailed Implementation

[0023] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The preferred embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0024] like Figure 1 and Figure 2 As shown, this utility model provides a specific embodiment of an epoxy coil plate.

[0025] An epoxy coil board, reference Figure 1 and Figure 2 The epoxy coil board includes an epoxy board 100 and a coil 200. The coil 200 is arranged on the first surface of the epoxy board 100 according to a preset rule. The second surface of the epoxy board 100 is provided with a circuit area 110. A conductive layer 120 is laid in the circuit area 110. A circuit is arranged on the conductive layer 120. The circuit is electrically connected to the coil 200. The first surface and the second surface are two opposite surfaces of the epoxy board 100.

[0026] Specifically, refer to Figure 1 and Figure 2 The epoxy coil board can be used in nuclear magnetic resonance imaging equipment. The epoxy board 100 is a flexible epoxy board. Its first surface is used to fix the coil 200 after it is set according to a preset rule. The second surface, which is set opposite to the first surface, is provided with a circuit area 110. The conductive layer 120 is directly laid on the surface within the circuit area 110. The circuit is laid on the conductive layer 120 for the switching control and data processing of the epoxy coil board.

[0027] As a key component of the nuclear magnetic resonance system, coil 200 can radiate radio frequency electromagnetic waves of a specified frequency and a certain power to the human body to excite the resonance of atomic nuclei inside the human body. When radio frequency current is delivered to the transmitting coil 200, an oscillating magnetic field perpendicular to the main magnetic field is generated. This oscillating magnetic field drives the magnetization vector of hydrogen protons in the imaging object to rotate, thereby generating a strong radio frequency pulse signal. After the radio frequency pulse is transmitted, coil 200 can receive magnetic resonance signals from inside the human body. After receiving the magnetic resonance signal, the magnetic resonance signal will be transmitted to the circuit in circuit area 110. The circuit in circuit area 110 can perform data processing on the magnetic resonance signal.

[0028] Existing epoxy coil boards only have the function of transmitting radio frequency signals and receiving magnetic resonance signals. When the coil receives magnetic resonance signals from inside the human body, the magnetic resonance signals need to be converted into electrical signals and then converted into images through subsequent signal processing. This means that the epoxy coil board also needs to be connected to an external functional circuit board 400 for switching control, detection control and signal processing throughout the imaging process. This makes the entire component occupy a large space. In nuclear magnetic resonance imaging equipment, space also needs to be reserved for the installation of epoxy coil boards and external functional circuit boards 400, which is not suitable for the current miniaturization development.

[0029] In this embodiment, an epoxy coil board is designed, including an epoxy board 100 and a coil 200. The coil 200 is arranged on the first surface of the epoxy board 100 according to a preset rule. A circuit area 110 is provided on the second surface of the epoxy board 100. A conductive layer 120 is laid in the circuit area 110, and a circuit is arranged on the conductive layer 120. The circuit is electrically connected to the coil 200. The first surface and the second surface are two opposite sides of the epoxy board 100. By laying the conductive layer 120 on the surface of the epoxy board 100 opposite to the coil 200, the circuit can be directly arranged on the epoxy board 100 through the conductive layer 120 without the need for an additional circuit board 400. This makes the epoxy coil board more integrated, occupies less space in application, and is more conducive to the miniaturization of equipment.

[0030] In one embodiment, reference Figure 1 An avoidance area 130 is provided on the first surface of the epoxy board 100 corresponding to the circuit area 110. The coil 200 is arranged on the first surface of the epoxy board 100, avoiding the avoidance area 130. By avoiding the circuit, the mutual interference between the coil 200 and the circuit can be effectively reduced. On the other hand, when the epoxy coil board is used, it needs to be rolled to form an arc structure. By avoiding the circuit, the hardness of the entire epoxy board 100 can be effectively reduced.

[0031] In one embodiment, an adhesive layer is provided between the coil 200 and the epoxy board 100. When installing the coil 200 on the epoxy board 100, a layer of adhesive is first applied to the epoxy board 100, and then the coil 200 is attached to the epoxy board 100 with the adhesive and hot-pressed to form an epoxy coil board. The cured adhesive will form an adhesive layer between the coil 200 and the epoxy board 100.

[0032] In one embodiment, the circuit includes one or more of analog circuits, digital circuits, and mixed-signal circuits.

[0033] Specifically, the analog circuit includes one or more of the following: an amplifier circuit, a filter circuit, an oscillator circuit, and a modulation circuit. The amplifier circuit is used to amplify the intensity of the magnetic resonance signal, the filter circuit is used to filter out noise or unwanted frequency components in the magnetic resonance signal, the oscillator circuit is used to generate a periodic oscillation signal to transmit radio frequency electromagnetic waves of a specified frequency, and the modulation circuit can realize the modulation and demodulation of the magnetic resonance signal when the epoxy coil board and the main controller communicate wirelessly.

[0034] Digital circuits include one or more of logic circuits, storage circuits, counters, and microprocessors. Logic circuits are used for logical operations and can be switching circuits to turn epoxy coil boards on or off. Storage circuits are used to store magnetic resonance signal data. Counters are used for frequency measurement and timing control. Microprocessors are used for data processing. Mixed-signal circuits include one or more of analog-to-digital converters and digital-to-analog converters.

[0035] like Figure 3 and Figure 4 As shown, this utility model also provides a specific embodiment of an epoxy coil plate.

[0036] An epoxy coil board, reference Figure 3 and Figure 4 The epoxy coil board includes an epoxy board 100 and a coil 200. The coil 200 is arranged on the first surface of the epoxy board 100 according to a preset rule. The second surface of the epoxy board 100 is recessed with a mounting groove 300. A circuit board 400 is arranged in the mounting groove 300. The first surface and the second surface are two opposite surfaces of the epoxy board 100.

[0037] In one embodiment, reference Figure 3 and Figure 4 The circuit board 400 includes a substrate 410, a conductive layer 120, and a circuit disposed on the substrate 410 through the conductive layer 120. The substrate 410 is disposed in contact with the bottom of the mounting groove 300. The conductive layer 120 is laid on the substrate 410, and the circuit is soldered to the substrate 410 through the conductive layer 120.

[0038] It should be noted that the circuit board 400 may also be made without the substrate 410, and the conductive layer 120 may be placed directly at the bottom of the mounting groove 300, with the circuitry placed on the conductive layer 120.

[0039] In one embodiment, the circuit includes one or more of analog circuits, digital circuits, and mixed-signal circuits.

[0040] Specifically, the analog circuit includes one or more of the following: an amplifier circuit, a filter circuit, an oscillator circuit, and a modulation circuit. The amplifier circuit is used to amplify the intensity of the magnetic resonance signal, the filter circuit is used to filter out noise or unwanted frequency components in the magnetic resonance signal, the oscillator circuit is used to generate a periodic oscillation signal to transmit radio frequency electromagnetic waves of a specified frequency, and the modulation circuit can realize the modulation and demodulation of the magnetic resonance signal when the epoxy coil board and the main controller communicate wirelessly.

[0041] Digital circuits include one or more of logic circuits, storage circuits, counters, and microprocessors. Logic circuits are used for logical operations and can be switching circuits to turn epoxy coil boards on or off. Storage circuits are used to store magnetic resonance signal data. Counters are used for frequency measurement and timing control. Microprocessors are used for data processing. Mixed-signal circuits include one or more of analog-to-digital converters and digital-to-analog converters.

[0042] It should be understood that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; and all such modifications and substitutions should fall within the protection scope of the appended claims of this utility model.

Claims

1. An epoxy coil plate characterized by, include: An epoxy board and a coil are provided. The coil is arranged on the first surface of the epoxy board according to a preset rule. A circuit area is provided on the second surface of the epoxy board. A conductive layer is laid in the circuit area. A circuit is arranged on the conductive layer. The circuit is electrically connected to the coil. The first surface and the second surface are two opposite surfaces of the epoxy board.

2. The epoxy coil board according to claim 1, wherein The first surface of the epoxy board has a clearance area corresponding to the circuit area, and the coil is arranged on the first surface of the epoxy board, avoiding the clearance area.

3. The epoxy coil board according to claim 1, wherein An adhesive layer is provided between the coil and the epoxy board.

4. The epoxy coil board according to claim 1, wherein The circuit includes one or more of analog circuits, digital circuits, and mixed-signal circuits.

5. The epoxy coil board according to claim 1, wherein The analog circuit includes one or more of the following: amplifier circuit, filter circuit, oscillator circuit, and modulation circuit.

6. The epoxy coil board according to claim 1, wherein The digital circuit includes one or more of the following: logic circuit, storage circuit, counter, and microprocessor.

7. The epoxy coil board according to claim 1, wherein The mixed-signal circuit includes one or more of analog-to-digital converter circuits and digital-to-analog converter circuits.

8. An epoxy coil former, characterized by, include: An epoxy board and a coil are provided. The coil is arranged on the first surface of the epoxy board according to a preset rule. A mounting groove is recessed on the second surface of the epoxy board, and a circuit board is arranged in the mounting groove. The first surface and the second surface are two opposite sides of the epoxy board.

9. The epoxy coil plate according to claim 8, characterized in that, The circuit board includes a substrate, a conductive layer, and circuitry arranged on the substrate through the conductive layer.

10. The epoxy coil board according to claim 8, wherein The circuit board includes a conductive layer and circuitry disposed on the conductive layer.

Images