A uniform temperature GPU water cooling device

Abstract

This utility model belongs to the field of GPU heat dissipation technology, and particularly relates to a uniform temperature GPU water cooling device, including a water-cooled plate, a heat dissipation recirculation mechanism, a heat dissipation mechanism, and a water cooling mechanism. The heat dissipation mechanism includes a water-cooled tank and heat dissipation components. The water cooling mechanism includes a water-cooling pump, a water-cooling input component, and a water-cooling output component. The uniform temperature GPU water cooling device provided by this application can efficiently absorb the heat generated by the GPU through multiple evenly arranged water-cooling channels in the water-cooled plate, and then transport the coolant after absorbing heat to the heat dissipation mechanism through the heat dissipation recirculation mechanism; the heat dissipation fins and cooling fan in the heat dissipation mechanism work together to improve heat dissipation efficiency, and can dissipate the heat in the coolant in time, ensuring that the GPU always operates in a low temperature environment, effectively avoiding the performance and lifespan degradation caused by heat accumulation.

Description

Technical Field

[0001] This utility model belongs to the field of GPU heat dissipation technology, and in particular relates to a uniform temperature GPU water cooling device. Background Technology

[0002] With the rapid development of technology, GPUs are being used more and more widely in high-performance computing, gaming, artificial intelligence, and other fields, and their performance is constantly improving. However, GPUs generate a lot of heat during operation. If this heat cannot be dissipated in a timely and effective manner, it will cause the GPU temperature to become too high, thereby affecting its performance and lifespan.

[0003] Currently, there are various GPU liquid cooling devices on the market. Some of these devices use a single air cooling method, which relies primarily on airflow generated by a fan to remove heat. However, when the GPU is under high load, the heat generated far exceeds the cooling capacity of the air cooling system, causing the GPU heat to be unable to be dissipated in time. For example, in some large-scale game scenarios or complex computing tasks, the GPU is under high load for extended periods, and the temperature rises rapidly. The efficiency of air cooling cannot meet the demand for rapid heat dissipation, resulting in a decrease in GPU performance and phenomena such as stuttering and frame drops. At the same time, prolonged high-temperature environments will also accelerate the aging of the internal electronic components of the GPU, shortening its lifespan. Utility Model Content

[0004] The purpose of this invention is to provide a uniform temperature GPU water cooling device, which aims to solve the technical problem that the efficiency of existing air cooling cannot meet the needs of rapid heat dissipation, resulting in a decrease in GPU performance, accelerated aging of internal electronic components of the GPU, and shortened lifespan.

[0005] To achieve the above objectives, the present invention provides a uniform temperature GPU water cooling device, comprising a water-cooled plate, a heat dissipation recirculation mechanism, a heat dissipation mechanism, and a water cooling mechanism. The water-cooled plate is attached to the GPU and is used to absorb the heat of the GPU. The heat dissipation recirculation mechanism is connected to the water-cooled plate and the heat dissipation mechanism respectively, and is used to deliver coolant to the heat dissipation mechanism. The heat dissipation mechanism is used to dissipate heat from the coolant. The water cooling mechanism is connected to the water-cooled plate and the heat dissipation mechanism respectively, and is used to deliver coolant from the heat dissipation mechanism to the water-cooled plate.

[0006] The heat dissipation mechanism includes a heat dissipation water-cooled box and a heat dissipation component. The heat dissipation water-cooled box is connected to the heat dissipation return mechanism and the water-cooling mechanism, respectively. The heat dissipation water-cooled box is provided with a water-cooling cavity for containing the coolant. The heat dissipation component is disposed in the heat dissipation water-cooled box and dissipates heat from the coolant in the water-cooling cavity.

[0007] The water-cooling mechanism includes a water-cooling pump, a water-cooling input component, and a water-cooling output component. One end of the water-cooling input component is connected to the heat dissipation water-cooling box, and the other end is connected to the water-cooling pump. One end of the water-cooling output component is connected to the water-cooling pump, and the other end is connected to the water-cooling plate.

[0008] As an optional solution of this utility model, the water-cooled plate is provided with water-cooled channels, and there are multiple water-cooled channels, which are evenly arranged on the water-cooled plate.

[0009] As an optional solution of this utility model, the heat dissipation recirculation mechanism includes a first recirculation connector, a heat dissipation recirculation pipe, and a second recirculation connector. The first recirculation connector is fixedly connected to the water-cooled plate and the heat dissipation recirculation pipe, respectively, and the second recirculation connector is fixedly connected to the heat dissipation recirculation pipe and the heat dissipation water-cooling box, respectively.

[0010] As an optional embodiment of this utility model, the heat dissipation water-cooled box is provided with an inlet and an outlet. The inlet is located at the top of the heat dissipation water-cooled box, and the outlet is located at the bottom of the heat dissipation water-cooled box. Both the inlet and the outlet are connected to the water-cooling cavity, and the second reflux connector is connected to the inlet. A heat dissipation mounting groove is provided in the middle of the heat dissipation water-cooled box.

[0011] As an optional solution of this utility model, the heat dissipation component includes heat dissipation fins and a heat dissipation fan. The heat dissipation fins are fixedly connected to the heat dissipation water-cooling box and disposed in the heat dissipation mounting slot, and the heat dissipation fan is fixedly connected to the heat dissipation water-cooling box.

[0012] As an optional solution of this utility model, multiple heat dissipation fins are provided and fixedly connected to the heat dissipation water cooling box, and adjacent heat dissipation fins are fixedly connected.

[0013] As an optional solution of this utility model, the water-cooled input assembly includes a first water-cooled input connector, a water-cooled input pipe, and a second water-cooled input connector. The first water-cooled input connector is fixedly connected to the water-cooled input pipe and is connected to the water outlet. The second water-cooled input connector is fixedly connected to the water-cooled input pipe and is connected to the water-cooled pump.

[0014] As an optional solution of this utility model, the water-cooled output assembly includes a first water-cooled output connector, a water-cooled output pipe, and a second water-cooled output connector. The first water-cooled output connector is fixedly connected to the water-cooled output pipe and is connected to the water-cooled pump. The second water-cooled output connector is fixedly connected to the water-cooled output pipe and is connected to the water-cooled plate.

[0015] The above-mentioned one or more technical solutions in the uniform temperature GPU water cooling device provided in this embodiment of the utility model have at least one of the following technical effects:

[0016] The uniform temperature GPU water cooling device provided in this application can efficiently absorb the heat generated by the GPU through multiple evenly arranged water cooling channels in the water cooling plate, and then transport the coolant after absorbing the heat to the heat dissipation mechanism through the heat dissipation return mechanism. The heat dissipation fins and heat dissipation fan in the heat dissipation mechanism work together to improve the heat dissipation efficiency and can dissipate the heat in the coolant in time, ensuring that the GPU always operates in a low temperature environment, effectively avoiding the performance and lifespan degradation caused by heat accumulation. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A perspective view of the uniform temperature GPU water cooling device provided in an embodiment of this utility model.

[0019] Figure 2 A perspective view of the uniform temperature GPU water cooling device provided in an embodiment of this utility model.

[0020] Figure 3 A perspective view of the heat dissipation fins of the uniform temperature GPU water cooling device provided in an embodiment of this utility model.

[0021] Figure 4 A perspective view of the cooling water box of the uniform temperature GPU water cooling device provided in the embodiment of this utility model.

[0022] Figure 5 for Figure 4 Sectional view along the middle AA.

[0023] Figure 6 A perspective view of the water-cooling plate of the uniform temperature GPU water-cooling heat dissipation device provided in the embodiment of this utility model.

[0024] The following are the labeling elements in the figure:

[0025] 1. Water-cooled plate; 2. Heat dissipation recirculation mechanism; 3. Heat dissipation mechanism; 4. Water-cooling mechanism;

[0026] 11. Water-cooled flow channel;

[0027] 21. First return connector; 22. Heat dissipation return pipe; 23. Second return connector;

[0028] 31. Water-cooled box; 32. Heat dissipation components;

[0029] 41. Water-cooled pump; 42. Water-cooled input assembly; 43. Water-cooled output assembly;

[0030] 311. Water inlet; 312. Water outlet; 313. Heat dissipation mounting slot; 314. Water cooling cavity;

[0031] 321. Heat dissipation fins; 322. Cooling fan;

[0032] 421. First water-cooling input connector; 422. Water-cooling input pipe; 423. Second water-cooling input connector;

[0033] 431. First water-cooled output connector; 432. Water-cooled output pipe; 433. Second water-cooled output connector. Detailed Implementation

[0034] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the embodiments of this utility model, and should not be construed as limiting the utility model.

[0035] In the description of the embodiments of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0036] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0037] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.

[0038] In one embodiment of this utility model, such as Figures 1-6 As shown, a uniform temperature GPU water cooling device is provided, including a water cooling plate 1, a heat dissipation recirculation mechanism 2, a heat dissipation mechanism 3, and a water cooling mechanism 4. The water cooling plate 1 is attached to the GPU and is used to absorb the heat of the GPU. The heat dissipation recirculation mechanism 2 is connected to the water cooling plate 1 and the heat dissipation mechanism 3 respectively, and is used to deliver coolant to the heat dissipation mechanism 3. The heat dissipation mechanism 3 is used to dissipate heat from the coolant. The water cooling mechanism 4 is connected to the water cooling plate 1 and the heat dissipation mechanism 3 respectively, and is used to deliver coolant in the heat dissipation mechanism 3 to the water cooling plate 1.

[0039] The heat dissipation mechanism 3 includes a heat dissipation water-cooled box 31 and a heat dissipation component 32. The heat dissipation water-cooled box 31 is connected to the heat dissipation return mechanism 2 and the water-cooling mechanism 4 respectively. A water-cooling cavity 314 is provided inside the heat dissipation water-cooled box 31 and is used to contain coolant. The heat dissipation component 32 is provided in the heat dissipation water-cooled box 31 and dissipates heat from the coolant in the water-cooling cavity 314.

[0040] The water-cooling mechanism 4 includes a water-cooling pump 41, a water-cooling input component 42, and a water-cooling output component 43. One end of the water-cooling input component 42 is connected to the heat dissipation water-cooling box 31, and the other end is connected to the water-cooling pump 41. One end of the water-cooling output component 43 is connected to the water-cooling pump 41, and the other end is connected to the water-cooling plate 1.

[0041] The uniform temperature GPU water cooling device provided in this application can efficiently absorb the heat generated by the GPU through multiple evenly arranged water cooling channels 11 in the water cooling plate 1. The heat-absorbing coolant is then transported to the heat dissipation mechanism 3 through the heat dissipation return mechanism 2. The heat dissipation fins 321 and the heat dissipation fan 322 in the heat dissipation mechanism 3 work together to improve the heat dissipation efficiency and can dissipate the heat in the coolant in time, ensuring that the GPU always operates in a low temperature environment and effectively avoiding the performance and lifespan degradation caused by heat accumulation.

[0042] In another embodiment of this utility model, a plurality of water-cooling channels 11 are provided in the water-cooling plate 1 and are evenly arranged in the water-cooling plate 1. The multiple evenly arranged water-cooling channels 11 can make the coolant evenly contact the GPU, improve the heat absorption efficiency, ensure the temperature uniformity of various parts of the GPU, avoid the occurrence of local overheating, and help extend the service life of the GPU.

[0043] In another embodiment of this utility model, the heat dissipation reflux mechanism 2 includes a first reflux connector 21, a heat dissipation reflux pipe 22, and a second reflux connector 23. The first reflux connector 21 is fixedly connected to the water-cooled plate 1 and the heat dissipation reflux pipe 22, respectively, and the second reflux connector 23 is fixedly connected to the heat dissipation reflux pipe 22 and the heat dissipation water-cooling box 31, respectively. The heat dissipation reflux mechanism 2 can ensure that the coolant flows stably between the water-cooled plate 1 and the heat dissipation mechanism 3, ensuring the normal operation of the heat dissipation cycle.

[0044] In another embodiment of this utility model, the heat dissipation water-cooled box 31 is provided with an inlet 311 and an outlet 312. The inlet 311 is located at the top of the heat dissipation water-cooled box 31, and the outlet 312 is located at the bottom of the heat dissipation water-cooled box 31. Both the inlet 311 and the outlet 312 are connected to the water-cooling cavity 314. The second return connector 23 is connected to the inlet 311. A heat dissipation mounting groove 313 is provided in the middle of the heat dissipation water-cooled box 31. The high-temperature coolant returning from the water-cooling plate 1 enters the water-cooling cavity 314 through the top inlet 311. Under the action of gravity, it can flow downward naturally and gradually come into full contact with the heat dissipation water-cooled box 31 and the heat dissipation component 32, prolonging the heat exchange time and improving the heat dissipation efficiency. The cooled low-temperature coolant can flow out smoothly from the bottom outlet 312, avoiding the mixing and interference of hot and cold coolants in the cavity, and ensuring that the coolant entering the water-cooling mechanism 4 is always at a low temperature.

[0045] In another embodiment of this utility model, the heat dissipation assembly 32 includes heat dissipation fins 321 and a cooling fan 322. The heat dissipation fins 321 are fixedly connected to the water-cooled box 31 and disposed in the heat dissipation mounting groove 313. The cooling fan 322 is fixedly connected to the water-cooled box 31. Multiple heat dissipation fins 321 are provided and fixedly connected to the water-cooled box 31, with adjacent fins fixedly connected. These multiple heat dissipation fins 321, fixed to the water-cooled box 31 and distributed in the heat dissipation mounting groove 313, can directly contact the water-cooling cavity 314 of the water-cooled box 31, rapidly transferring the heat of the coolant inside the cavity to the fin surface. Due to the large number of fins and the connection of adjacent fins, the heat dissipation area is significantly increased, allowing more heat carriers to diffuse to the surrounding air. Simultaneously, the tightly connected structure ensures uniform heat transfer between the fins, avoiding localized heat accumulation and improving overall thermal conductivity. After being fixed to the water-cooled box 31, the cooling fan 322 actively drives airflow, accelerating air circulation around the heat dissipation fins 321. The airflow generated by the fan quickly removes heat from the surface of the fins, solving the problems of slow airflow and low heat dissipation efficiency in natural cooling. Especially under high loads, it can promptly expel the heat absorbed by the fins, preventing heat from flowing back into the water cooling chamber 314. The cooling fan 322 is located on the outside of the water cooling box 31, and the heat it generates can be dissipated through the air.

[0046] In another embodiment of this utility model, the water-cooled input assembly 42 includes a first water-cooled input connector 421, a water-cooled input pipe 422, and a second water-cooled input connector 423. The first water-cooled input connector 421 is fixedly connected to the water-cooled input pipe 422 and is connected to the outlet 312. The second water-cooled input connector 423 is fixedly connected to the water-cooled input pipe 422 and is connected to the water-cooled pump 41. The low-temperature coolant, after being cooled by the cooling water tank 31, flows out from the outlet 312, enters the water-cooled input pipe 422 through the first water-cooled input connector 421, and is then transported to the water-cooled pump 41 through the second water-cooled input connector 423. The water-cooled input pipe 422, as a transmission carrier, provides a stable flow path for the coolant, ensuring that the coolant flows orderly and efficiently from the cooling water tank 31 to the water-cooled pump 41 under pressure, avoiding turbulent flow.

[0047] In another embodiment of this utility model, the water-cooled output assembly 43 includes a first water-cooled output connector 431, a water-cooled output pipe 432, and a second water-cooled output connector 433. The first water-cooled output connector 431 is fixedly connected to the water-cooled output pipe 432 and is connected to the water-cooling pump 41. The second water-cooled output connector 433 is fixedly connected to the water-cooled output pipe 432 and is connected to the water-cooling plate 1. The coolant, pressurized by the water-cooling pump 41, enters the water-cooled output pipe 432 through the first water-cooled output connector 431 and is then transported to the water-cooling plate 1 through the second water-cooled output connector 433. The water-cooled output pipe 432 provides a stable flow path for the coolant, ensuring that the coolant flows orderly and efficiently from the water-cooling pump 41 to the water-cooling plate 1 under pressure, avoiding turbulent flow that could affect the heat dissipation effect.

[0048] The vapor chamber GPU water cooling device provided in this application operates as follows:

[0049] A suitable amount of coolant, such as water, is injected into the cooling water tank 31. The water pump 41 is then activated. Under the action of the water pump 41, the coolant flows out from the outlet 312 at the bottom of the cooling water tank 31, passes through the water-cooling input component 42, and enters the water pump 41. The water pump 41 pressurizes the coolant and delivers it to the water-cooling plate 1 through the water-cooling output component 43. Inside the water-cooling plate 1, the coolant absorbs the heat generated by the GPU, its temperature rises, and then it flows back to the inlet 311 at the top of the cooling water tank 31 through the heat dissipation return mechanism 2. Inside the cooling water tank 31, the heat dissipation component 32 dissipates heat from the coolant, lowering its temperature. This cycle repeats continuously, achieving continuous and efficient heat dissipation for the GPU.

[0050] The uniform temperature GPU water cooling device provided in this application can efficiently absorb the heat generated by the GPU through multiple evenly arranged water cooling channels 11 in the water cooling plate 1. The heat-absorbing coolant is then transported to the heat dissipation mechanism 3 through the heat dissipation return mechanism 2. The heat dissipation fins 321 and the heat dissipation fan 322 in the heat dissipation mechanism 3 work together to improve the heat dissipation efficiency and can dissipate the heat in the coolant in time, ensuring that the GPU always operates in a low temperature environment and effectively avoiding the performance and lifespan degradation caused by heat accumulation.

[0051] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A uniform temperature GPU water cooling device, characterized in that, The device includes a water-cooled plate, a heat dissipation recirculation mechanism, a heat dissipation mechanism, and a water-cooling mechanism. The water-cooled plate is attached to the GPU and is used to absorb the heat of the GPU. The heat dissipation recirculation mechanism is connected to the water-cooled plate and the heat dissipation mechanism and is used to deliver coolant to the heat dissipation mechanism. The heat dissipation mechanism is used to dissipate heat from the coolant. The water-cooling mechanism is connected to the water-cooled plate and the heat dissipation mechanism and is used to deliver coolant from the heat dissipation mechanism to the water-cooled plate. The heat dissipation mechanism includes a heat dissipation water-cooled box and a heat dissipation component. The heat dissipation water-cooled box is connected to the heat dissipation return mechanism and the water-cooling mechanism, respectively. The heat dissipation water-cooled box is provided with a water-cooling cavity for containing the coolant. The heat dissipation component is disposed in the heat dissipation water-cooled box and dissipates heat from the coolant in the water-cooling cavity. The water-cooling mechanism includes a water-cooling pump, a water-cooling input component, and a water-cooling output component. One end of the water-cooling input component is connected to the heat dissipation water-cooling box, and the other end is connected to the water-cooling pump. One end of the water-cooling output component is connected to the water-cooling pump, and the other end is connected to the water-cooling plate.

2. The uniform temperature GPU water cooling device according to claim 1, characterized in that, The water-cooled plate is provided with multiple water-cooled channels, which are evenly distributed on the water-cooled plate.

3. The uniform temperature GPU water cooling device according to claim 1, characterized in that, The heat dissipation recirculation mechanism includes a first recirculation connector, a heat dissipation recirculation pipe, and a second recirculation connector. The first recirculation connector is fixedly connected to the water-cooled plate and the heat dissipation recirculation pipe, respectively, and the second recirculation connector is fixedly connected to the heat dissipation recirculation pipe and the heat dissipation water-cooled box, respectively.

4. The uniform temperature GPU water cooling device according to claim 3, characterized in that, The cooling water box is provided with an inlet and an outlet. The inlet is located at the top of the cooling water box, and the outlet is located at the bottom of the cooling water box. Both the inlet and the outlet are connected to the water cooling cavity. The second reflux connector is connected to the inlet. A heat dissipation mounting groove is provided in the middle of the cooling water box.

5. The uniform temperature GPU water cooling device according to claim 4, characterized in that, The heat dissipation assembly includes heat dissipation fins and a cooling fan. The heat dissipation fins are fixedly connected to the water-cooled tank and disposed in the heat dissipation mounting slot. The cooling fan is fixedly connected to the water-cooled tank.

6. The uniform temperature GPU water cooling device according to claim 5, characterized in that, The heat dissipation fins are provided in multiple ways and are fixedly connected to the heat dissipation water cooling box, with adjacent heat dissipation fins being fixedly connected.

7. The uniform temperature GPU water cooling device according to claim 4, characterized in that, The water-cooled input assembly includes a first water-cooled input connector, a water-cooled input pipe, and a second water-cooled input connector. The first water-cooled input connector is fixedly connected to the water-cooled input pipe and is connected to the water outlet. The second water-cooled input connector is fixedly connected to the water-cooled input pipe and is connected to the water-cooled pump.

8. The uniform temperature GPU water cooling device according to claim 1, characterized in that, The water-cooled output assembly includes a first water-cooled output connector, a water-cooled output pipe, and a second water-cooled output connector. The first water-cooled output connector is fixedly connected to the water-cooled output pipe and is connected to the water-cooled pump. The second water-cooled output connector is fixedly connected to the water-cooled output pipe and is connected to the water-cooled plate.

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