Multi-band combiner

Abstract

This disclosure provides a multi-band combiner, which includes a main housing, a bridge structure, a connector structure, two filter structures, and two combining structures. The bridge structure is located on the side of the main housing opposite to the connector structure, extending along its length. Its input terminals are connected to the filter signal output terminals of the two filter structures, allowing the multi-band combiner to fully utilize internal space, shorten the signal transmission path, and improve integration and miniaturization. The connector structure is fixed to one long side of the main housing and includes multiple transmission signal input terminals for different frequency bands. Each input terminal is connected to the signal input terminal of a filter component. The output terminal of the bridge structure is connected to the combining signal input terminal of the two combining structures. Furthermore, the connector structure includes multiple transmission signal input terminals, enabling accurate filtering and combining of wideband signals across multiple frequency bands, while improving compatibility and versatility.

Description

Technical Field

[0001] This disclosure relates to the technical field of combiners, and in particular to a multi-band combiner. Background Technology

[0002] Against the backdrop of rapid development in modern communication technology, wireless communication systems are evolving rapidly towards multi-band and multi-standard convergence. The coexistence of different communication operators, various communication services, and diverse communication standards has made communication frequency band resources increasingly abundant and complex. In order to efficiently utilize spectrum resources, reduce the construction cost of communication systems, and improve overall performance, multi-frequency combiners, as a key passive radio frequency device, are becoming increasingly important.

[0003] The universality, compatibility, and integration of multi-frequency combiners have become core requirements for the current industry development. This necessitates that multi-frequency combiners be able to adapt to the frequency band combination requirements of different regions, different operators, and different communication scenarios, and have broad applicability. At the same time, they should be able to seamlessly interface with various types of communication equipment, antenna systems, and signal processing modules to ensure the stable operation of the entire communication system.

[0004] However, as Figure 5 As shown, in order to meet the requirements of multi-frequency combiners for processing signals of different frequency bands, traditional multi-frequency combiners have a relatively complex bridge structure, which leads to an increase in the overall size of the multi-frequency combiner. Therefore, traditional combiners need to increase the volume of the bridge structure while meeting the requirements of multi-frequency combining.

[0005] For example, the existing patent document CN201922474150.7 discloses a novel multi-system combining platform. Through the collaborative work of a primary combining section and a secondary combining section, it combines signals from different operators, frequency bands, and standards. The primary combining section is responsible for the initial combining of the original 12-frequency signals, while the secondary combining section further combines the 5G signals from China Telecom and China Unicom with the signals already combined in the primary section. Utilizing the signal distribution and combining characteristics of a bridge, signals from different frequency bands are precisely processed, ultimately achieving integrated output of multi-system signals. However, the bridge structure, designed to meet the requirements of multi-system combining, results in a corresponding increase in size, which is detrimental to the miniaturization of the combiner. Utility Model Content

[0006] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a multi-band combiner with universality, high compatibility and integration.

[0007] The purpose of this disclosure is achieved through the following technical solution:

[0008] A multi-band combiner includes a main housing, a bridge structure, a connector structure, two filter structures, and two combining structures. The main housing has a bridge receiving cavity, two filter receiving cavities, and two combining cavities. Each combining structure is disposed in a combining cavity, each filter structure is disposed in a filter receiving cavity, the bridge structure is disposed in the bridge receiving cavity, and the connector structure is fixed to a long side of the main housing.

[0009] The bridge structure is disposed on the other long side of the main housing opposite to the connector structure. The bridge structure extends along the length of the main housing. The input terminals of the bridge structure are respectively connected to the filter signal output terminals of two filter structures. The connector structure includes multiple transmission signal input terminals of different frequency bands. The filter structure includes multiple filter components. Each transmission signal input terminal is connected to the signal input terminal of one of the filter components. The output terminals of the bridge structure are respectively connected to the combined signal input terminals of the two combining structures. The transmission signal output terminals of the connector structure are respectively connected to the combined signal output terminals of the two combining structures.

[0010] In one embodiment, the combining structure includes a low-pass combining component and a high-pass filtering component. The input terminal of the high-pass filtering component is connected to the transmission signal input terminal of the connector structure, and the output terminal of the high-pass filtering component is connected to the transmission signal output terminal of the connector structure. The low-pass combining component includes a strip filter body and multiple resonant branches. The multiple resonant branches are spaced apart on the strip filter body. The input terminal of the strip filter body is connected to the output terminal of the bridge structure, and the output terminal of the strip filter body is connected to the transmission signal output terminal of the connector structure.

[0011] In one embodiment, the plurality of resonant branches are all disposed on the same side of the strip filter body.

[0012] In one embodiment, the main housing is further provided with a bridge combining signal through hole, which is connected to the bridge receiving cavity and the combining cavity respectively, and the input end of the strip filter body is disposed in the bridge combining signal through hole.

[0013] In one embodiment, the length extension direction of the strip filter body is perpendicular to the length extension direction of the bridge structure.

[0014] In one embodiment, the high-pass filter component includes a first high-pass filter sub-component and a second high-pass filter sub-component, the input terminals of the first high-pass filter sub-component and the second high-pass filter sub-component are respectively connected to the transmission signal input terminal, and the output terminals of the first high-pass filter sub-component and the second high-pass filter sub-component are both connected to the transmission signal output terminal.

[0015] In one embodiment, the bridge structure includes two bridge chip assemblies, the input terminal of each bridge chip assembly is connected to the filter signal output terminal of the filter structure, and the output terminal of each bridge chip assembly is connected to the combined signal input terminal of the combiner structure.

[0016] In one embodiment, the main housing is further provided with a bridge input signal through hole, which is connected to the bridge receiving cavity and the filter receiving cavity respectively. The filter structure also includes a combining fly rod, one end of which is disposed in the bridge input signal through hole and connected to the input end of the bridge chip assembly, and the other end of which is connected to the filter structure.

[0017] In one embodiment, the main housing has a partition plate arranged along the centerline of the main housing along its length, and the two merging cavities are symmetrically arranged on both sides of the partition plate.

[0018] In one embodiment, the two combining structures are symmetrically arranged on both sides of the separator, and the two filtering structures are located on both sides of the two combining structures.

[0019] Compared with the prior art, this disclosure has at least the following advantages:

[0020] Compared to traditional combiners, the aforementioned multi-band combiner features a bridge structure and connector structure positioned on opposite sides of the main housing, arranged along the length of the combiner. This fully utilizes the internal space of the multi-band combiner and shortens the signal transmission path, significantly improving its integration and miniaturization. Simultaneously, the connector structure includes multiple signal input terminals connected to the input terminals of corresponding filtering components. This enables precise filtering and combining of wideband signals from various frequency bands and systems, enhancing the compatibility and versatility of the multi-band combiner. Ultimately, this allows the multi-band combiner to achieve multi-band compatible combining while simultaneously improving the device's miniaturization. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of a multi-band combiner according to one embodiment;

[0023] Figure 2 for Figure 1 The diagram shows a partial structural schematic of a multi-band combiner.

[0024] Figure 3 for Figure 1 The diagram shows the structural schematic of the bridge structure.

[0025] Figure 4 for Figure 1 Another structural schematic diagram of the multi-band combiner shown;

[0026] Figure 5 It is a bridge structure for traditional combiners. Detailed Implementation

[0027] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0028] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0030] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments:

[0031] like Figures 1 to 5 As shown, a multi-band combiner 10 according to an embodiment of the present disclosure includes a main housing 100, a bridge structure 200, a connector structure 300, two filter structures 400, and two combining structures 500. The main housing 100 is provided with a bridge receiving cavity 1001, two filter receiving cavities 1002, and two combining cavities 1003. Each combining structure 500 is disposed in a combining cavity 1003, each filter structure 400 is disposed in a filter receiving cavity 1002, the bridge structure 200 is disposed in the bridge receiving cavity 1001, and the connector structure 300 is fixed to a long side of the main housing 100.

[0032] The bridge structure 200 is disposed on the other long side of the main housing 100 opposite to the connector structure 300. The bridge structure 200 is arranged along the length L of the main housing 100. The input terminals of the bridge structure 200 are respectively connected to the filter signal output terminals of the two filter structures 400. The connector structure 300 includes multiple transmission signal input terminals of different frequency bands. The filter structure 400 includes multiple filter components. Each transmission signal input terminal is connected to the signal input terminal of a filter component. The output terminals of the bridge structure 200 are respectively connected to the combined signal input terminals of the two combining structures 500. The transmission signal output terminals of the connector structure 300 are respectively connected to the combined signal output terminals of the two combining structures 500.

[0033] In this embodiment, the multi-band combiner 10 includes 14 transmission signal input terminals. Each transmission signal input terminal is connected to a corresponding filter component signal input terminal in the filter structure 400, allowing signals of different frequency bands to be transmitted to the corresponding filter components through the multiple transmission signal input terminals of the connector structure 300. Each filter component contains multiple resonators and performs precise filtering for specific frequency band signals while effectively suppressing interference signals from non-target frequency bands. The filtered signal is then output from the filtered signal output terminals of the two filter structures 400 to the bridge structure 200. Since the input terminal of the bridge structure 200 is connected to the filtered signal output terminals of the two filter structures 400, it can receive filtered signals from the two filter structures 400. The bridge structure 200 precisely adjusts parameters such as amplitude and phase of signals of different frequency bands to achieve combined output while avoiding mutual interference between signals, thereby improving the compatibility and universality of signal combining.

[0034] On the other hand, such as Figure 5As shown, compared to the traditional combiner 30 where the bridge structure and the combiner body are designed separately, in this embodiment, the bridge structure 200 of the multi-band combiner 10 is located on the other long side of the main housing 100 away from the connector structure 300, and is arranged along the length L of the main housing 100. This makes full use of the width W of the main housing 100 and reduces the signal transmission path length. Thus, by reducing the signal transmission path and optimizing the spatial layout, the integration and miniaturization level of the multi-band combiner 10 is effectively improved.

[0035] Furthermore, the combined signal processed by the bridge structure 200 is output to the combiner structure 500 through its output terminal. The two combiner structures 500 each receive a combined signal output from the bridge structure 200. Then, within the combiner structure 500, signals from different frequency bands are integrated to form a combined signal containing multiple frequency bands. Finally, the combined signal is output to the communication device through the transmission signal output terminal of the connector structure 300.

[0036] Compared to traditional combiners, the aforementioned multi-band combiner 10 features a bridge structure 200 and a connector structure 300 positioned on opposite sides of the main housing and arranged along the length of the multi-band combiner 10. This fully utilizes the internal space of the multi-band combiner 10 and shortens the signal transmission path, significantly improving its integration and miniaturization. Simultaneously, the connector structure 300 includes multiple signal input terminals connected to the input terminals of corresponding filtering components. This enables precise filtering and combining of wideband signals from various frequency bands and systems, enhancing the compatibility and versatility of the multi-band combiner 10. Ultimately, this allows the multi-band combiner 10 to achieve multi-band compatible combining while simultaneously improving the device's miniaturization.

[0037] like Figures 1 to 4As shown, in one embodiment, the combining structure 500 includes a low-pass combining component 510 and a high-pass filter component 520. The input terminal of the high-pass filter component 520 is connected to the transmission signal input terminal of the connector structure 300, and the output terminal of the high-pass filter component 520 is connected to the transmission signal output terminal of the connector structure 300. The low-pass combining component 510 includes a strip filter body 511 and multiple resonant branches 512, which are spaced apart from the strip filter body 511. The input terminal of the strip filter body 511 is connected to the output terminal of the bridge structure 200, and the output terminal of the strip filter body 511 is connected to the transmission signal output terminal of the connector structure 300. In this embodiment, the strip filter body 511 serves as a low-pass stripline, allowing low-frequency signals to pass smoothly while suppressing high-frequency signals. This enables the low-pass combining component 510 to accurately filter signals, ensuring that only low-frequency signals can pass through, thereby achieving precise filtering of the signal frequency band. Multiple resonant branches 512 are spaced apart on the strip filter body 511, with each resonant branch equivalent to a capacitor. This structure allows the strip filter body 511 and the resonant branches 512 to work synergistically to effectively remove high-frequency noise and interference components from the signal, improving signal purity and quality, thereby ensuring signal stability during transmission. Furthermore, the integrated design of the strip filter body 511 and the resonant branches 512 makes the low-pass combiner component 510 more compact and efficient, contributing to improved integration and miniaturization of the multi-band combiner 10.

[0038] like Figures 1 to 4 As shown, in one embodiment, multiple resonant branches 512 are all disposed on the same side of the strip filter body 511. In this embodiment, disposing of multiple resonant branches 512 on the same side of the strip filter body 511 simplifies the overall design of the combining structure 500, reduces the longitudinal space occupied by the combining structure 500 within the main housing 100, and makes the internal structure of the multi-band combiner 10 more compact, thereby facilitating the miniaturization of the multi-band combiner 10.

[0039] like Figures 1 to 4As shown, in one embodiment, the main housing 100 also has a bridge combining signal through-hole 1004, which is connected to the bridge receiving cavity 1001 and the combining cavity 1003. The input end of the strip filter body 511 is disposed in the bridge combining signal through-hole 1004. In this embodiment, the bridge combining signal through-hole 1004 provides an efficient signal transmission channel between the bridge structure 200 and the combining structure 500. The combined signal processed by the bridge structure 200 can be transmitted to the input end of the strip filter body 511 in the combining structure 500 through the bridge combining signal through-hole 1004. This direct signal transmission method avoids signal transmission in the complex space inside the main housing 100, thereby reducing signal attenuation and interference during signal transmission, and ensuring signal integrity and stability, so that the filtered and combined signal can output a high-quality combined signal to the communication device.

[0040] like Figures 1 to 4 As shown, in one embodiment, the length extension direction of the strip filter body 511 is perpendicular to the length extension direction of the bridge structure 200. In this embodiment, because the strip filter body 511 and the bridge structure 200 form a perpendicular intersection in space, the space inside the main housing 100 is utilized more fully. Compared with the traditional parallel arrangement, the vertical arrangement can integrate more functional modules within a limited space, thereby effectively reducing the overall volume of the multi-band combiner 10. Specifically, by making the length extension direction of the strip filter body 511 perpendicular to the length extension direction of the bridge structure 200, the integration degree of the multi-band combiner 10 can be improved without increasing the size of the main housing 100.

[0041] like Figures 1 to 4 As shown, in one embodiment, the high-pass filter component 520 includes a first high-pass filter sub-component 521 and a second high-pass filter sub-component 522. The input terminals of the first high-pass filter sub-component 521 and the second high-pass filter sub-component 522 are respectively connected to the transmission signal input terminal, and the output terminals of the first high-pass filter sub-component 521 and the second high-pass filter sub-component 522 are both connected to the transmission signal output terminal. In this embodiment, the first high-pass filter sub-component 521 and the second high-pass filter sub-component 522 perform high-pass filtering processing for different frequency bands or signal characteristics, enabling the multi-band combiner 10 to more accurately filter and transmit high-frequency signals of different frequency bands and effectively suppress low-frequency interference signals. By processing signals of different frequency bands in parallel, the frequency range of signal processing is increased, thereby improving the versatility of the multi-band combiner 10.

[0042] like Figures 1 to 4As shown, in one embodiment, the bridge structure 200 includes two bridge chip assemblies 210. The input terminal of each bridge chip assembly 210 is connected to the filter signal output terminal of a filter structure 400, and the output terminal of each bridge chip assembly 210 is connected to the combined signal input terminal of a combiner structure 500. In this embodiment, the bridge chip assemblies 210 adopt a double-layer stacked layout design, achieving precise signal power distribution and phase compensation through electromagnetic coupling effect. Each bridge chip assembly 210 consists of two sets of symmetrically arranged microstrip line resonant units. By precisely controlling the microstrip line width and coupling gap, 3dB power distribution and 90° phase difference compensation can be achieved simultaneously. When filter signals from different filter structures 400 are input, the bridge chip assembly 210 dynamically equalizes and adjusts the signal amplitude through its unique coupling matrix structure, thereby ensuring that signals of different frequency bands maintain amplitude consistency during the combining process.

[0043] like Figures 1 to 4 As shown, in one embodiment, the main housing 100 also has a bridge input signal through-hole 1005, which is connected to the bridge receiving cavity 1001 and the filter receiving cavity 1002 respectively. The filter structure 400 also includes a combining fly rod, one end of which is disposed in the bridge input signal through-hole and connected to the input end of the bridge chip assembly 210, and the other end of which is connected to the filter structure 400. In this embodiment, because the bridge input signal through-hole 1005 shortens the signal transmission path, the transmission time of the signal from the filter structure 400 to the bridge structure 200 is shortened. The multi-band combiner 10 can respond to the input signal faster, improving the response speed of the entire system. The signal transmitted through the bridge input signal through-hole 1005 can reduce signal reflection and crosstalk during transmission, so that the amplitude, phase and other parameters of the signal can be transmitted to the bridge structure 200 more accurately, ensuring that the final output is a high-quality combined signal and reducing signal distortion and error. The bridge input signal through-hole 1005 is directly opened on the main housing 100, making full use of the internal space of the main housing 100. No additional connecting parts or complex structures are needed to realize the signal transmission between the filter structure 400 and the bridge structure 200, thereby saving space and improving the space utilization efficiency of the multi-band combiner 10.

[0044] like Figures 1 to 4As shown, in one embodiment, the main housing 100 has a partition plate 110, which is arranged along the centerline of the length direction of the main housing 100. Two combining cavities 1003 are symmetrically arranged on both sides of the partition plate 110. In this embodiment, the partition plate 110 divides the internal space of the main housing 100 into symmetrical dual-functional areas, so that the two combining cavities 1003 can share the width W direction space of the main housing. Specifically, when the strip filter body 511 extends along the partition plate 110 in a direction perpendicular to the bridge structure 200, the symmetrical layout can form a mirror symmetrical structure in the width direction of the main housing, without occupying additional long side L space, thereby compressing the overall width W space of the combiner, reducing unnecessary space waste, and thus improving the compactness of the multi-band combiner 10.

[0045] like Figures 1 to 4 As shown, in one embodiment, two combining structures 500 are symmetrically arranged on both sides of the partition plate 110, and two filtering structures 400 are located on both sides of the two combining structures 500. In this embodiment, the partition plate 110 is arranged along the centerline of the length direction of the main housing 100, and the two combining structures 500 are symmetrically arranged on both sides of the partition plate, forming a mirror-symmetrical cavity structure. The combining cavity 1003 and the filtering receiving cavity 1002 utilize the width W space of the multi-band combiner 10, avoiding the redundant width occupied by independent cavities in traditional designs. When the strip-shaped filter body 511 of the combining structure 500 extends along the width direction W of the partition plate 110, its longitudinal space occupation will reduce the transverse L space utilization of the filtering structure 400, ultimately compressing the width W of the main housing to improve the space utilization rate of the multi-band combiner 10.

[0046] Compared with the prior art, this disclosure has at least the following advantages:

[0047] Compared to traditional combiners, the aforementioned multi-band combiner 10 features a bridge structure 200 and a connector structure 300 positioned on opposite sides of the main housing and arranged along the length of the multi-band combiner 10. This fully utilizes the internal space of the multi-band combiner 10 and shortens the signal transmission path, significantly improving its integration and miniaturization. Simultaneously, the connector structure 300 includes multiple signal input terminals connected to the input terminals of corresponding filtering components. This enables precise filtering and combining of wideband signals from various frequency bands and systems, enhancing the compatibility and versatility of the multi-band combiner 10. Ultimately, this allows the multi-band combiner 10 to achieve multi-band compatible combining while simultaneously improving the device's miniaturization.

[0048] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the disclosed patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A multi-band combiner, comprising a main housing, a bridge structure, a connector structure, two filter structures, and two combining structures, wherein the main housing has a bridge receiving cavity, two filter receiving cavities, and two combining cavities, each combining structure is disposed within a combining cavity, each filter structure is disposed within a filter receiving cavity, the bridge structure is disposed within the bridge receiving cavity, and the connector structure is fixed to a long side of the main housing, characterized in that... The bridge structure is disposed on the other long side of the main housing opposite to the connector structure. The bridge structure extends along the length of the main housing. The input terminals of the bridge structure are respectively connected to the filter signal output terminals of two filter structures. The connector structure includes multiple transmission signal input terminals of different frequency bands. The filter structure includes multiple filter components. Each transmission signal input terminal is connected to the signal input terminal of one of the filter components. The output terminals of the bridge structure are respectively connected to the combined signal input terminals of the two combining structures. The transmission signal output terminals of the connector structure are respectively connected to the combined signal output terminals of the two combining structures.

2. The multi-band combiner of claim 1, wherein, The combining structure includes a low-pass combining component and a high-pass filtering component. The input terminal of the high-pass filtering component is connected to the transmission signal input terminal of the connector structure, and the output terminal of the high-pass filtering component is connected to the transmission signal output terminal of the connector structure. The low-pass combining component includes a strip filter body and multiple resonant branches. The multiple resonant branches are spaced apart on the strip filter body. The input terminal of the strip filter body is connected to the output terminal of the bridge structure, and the output terminal of the strip filter body is connected to the transmission signal output terminal of the connector structure.

3. The multi-band combiner of claim 2, wherein, All of the resonant branches are located on the same side of the strip filter body.

4. The multi-band combiner of claim 2, wherein, The main housing is also provided with a bridge combining signal through hole, which is connected to the bridge receiving cavity and the combining cavity respectively. The input end of the strip filter body is disposed in the bridge combining signal through hole.

5. The multi-band combiner of claim 2, wherein, The length extension direction of the strip filter body is perpendicular to the length extension direction of the bridge structure.

6. The multi-band combiner of claim 2, wherein, The high-pass filter component includes a first high-pass filter sub-component and a second high-pass filter sub-component. The input terminals of the first high-pass filter sub-component and the second high-pass filter sub-component are respectively connected to the transmission signal input terminal, and the output terminals of the first high-pass filter sub-component and the second high-pass filter sub-component are both connected to the transmission signal output terminal.

7. The multi-band combiner of claim 1, wherein, The bridge structure includes two bridge chip assemblies. The input terminal of each bridge chip assembly is connected to the filter signal output terminal of the filter structure, and the output terminal of each bridge chip assembly is connected to the combined signal input terminal of the combiner structure.

8. The multi-band combiner of claim 7, wherein, The main housing is also provided with a bridge input signal through hole, which is connected to the bridge receiving cavity and the filter receiving cavity respectively. The filter structure also includes a combining fly rod, one end of which is disposed in the bridge input signal through hole and connected to the input end of the bridge chip assembly, and the other end of which is connected to the filter structure.

9. The multi-band combiner of claim 1, wherein, The main housing has a partition plate, which is arranged along the centerline of the length direction of the main housing, and the two merging cavities are respectively symmetrically arranged on both sides of the partition plate.

10. The multi-band combiner of claim 9, wherein, The two combining structures are symmetrically arranged on both sides of the separator, and the two filtering structures are located on both sides of the two combining structures.

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