A gateway device for the power Internet of Things
By designing a rectangular cavity and heat-conducting structure in the power Internet of Things gateway, and utilizing a combination of fans and fins, the problem of poor heat dissipation in the gateway device was solved, achieving a highly efficient fully enclosed heat dissipation effect and preventing dust from entering.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 安徽楚通电气股份有限公司
- Filing Date
- 2025-08-19
- Publication Date
- 2026-05-26
AI Technical Summary
Existing power IoT gateways suffer from problems such as chip frequency reduction due to high temperatures inside the sealed enclosure and poor heat dissipation from traditional fins.
Design a gateway device for the Internet of Things in the power industry. It adopts a bottom box with a mesh inside a rectangular cavity, equipped with a fan and a heat conduction component. The heat conduction component includes a heat transfer shell and an external threaded tube. The airflow generated by the fan enters the inner cavity of the heat transfer shell through the flared mouth and the external threaded tube, and the fins absorb heat and discharge it to achieve fully enclosed heat dissipation.
It significantly improves the heat dissipation effect of the power IoT gateway, preventing dust and other debris from entering the gateway body while ensuring good heat dissipation performance.
Smart Images

Figure CN224289819U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of power gateway technology, specifically a gateway device for the power Internet of Things. Background Technology
[0002] As power systems evolve towards intelligence and automation, a large number of power devices require efficient and stable remote monitoring and management. The Internet of Things (IoT) gateway serves as the central hub for these devices, collecting data, sensing information, communicating with the network, and providing functions such as security, offline services, and real-time device control. IoT gateways can handle protocol conversion between sensing and communication networks, as well as between different types of sensing networks, enabling both wide-area and local-area interconnection. Therefore, gateways based on the power IoT have been widely adopted.
[0003] In practical applications, existing power IoT gateways often suffer from problems such as chip frequency reduction due to the high temperature inside the sealed enclosure and the poor heat dissipation effect of traditional fins. Utility Model Content
[0004] The purpose of this invention is to provide a gateway device for the power Internet of Things (IoT) to solve the problem of poor heat dissipation in current power IoT gateways.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a gateway device for the power Internet of Things, comprising a rectangular cavity inside a base box, the bottom surface of which is provided with mesh holes, and the outer edge of the top surface of the base box being fixedly connected to the outer edge of the bottom surface of the gateway body; a fan being fixed to the bottom of the rectangular cavity; a heat-conducting component including a heat transfer shell and multiple externally threaded tubes fixed to the bottom surface of the heat transfer shell, the outer peripheral wall of the heat transfer shell being provided with several annular fins along the vertical direction, a locking nut being threaded onto the bottom end of the externally threaded tubes, and a flared mouth being fixed to the bottom end of the locking nut; rectangular slots matching the insertion of the heat transfer shell being provided on both sides of the middle part of the top plate of the gateway body, and insertion holes matching the externally threaded tubes being provided on the bottom plate of the gateway body.
[0006] Preferably, the top surface of the gateway body is provided with a side groove at the outer edge of the rectangular slot, and a rectangular frame that fits and matches the side groove is fixed to the outer edge of the top of the heat transfer housing. A sealing gasket is provided between the bottom surface of the rectangular frame and the side groove.
[0007] Preferably, a grid plate is nested inside the rectangular frame cavity.
[0008] Preferably, the top of the rectangular cavity is provided with a diffusion cavity that is smaller at the bottom and larger at the top.
[0009] Preferably, the front and rear walls of the rectangular cavity are respectively fixed with support strips near the bottom, and the fan is fixedly connected to the support strips with screws.
[0010] Preferably, the outer edge of the top surface of the base box is provided with a plurality of threaded holes evenly distributed, and a plurality of sleeves extending vertically and corresponding one-to-one with the threaded holes are fixedly sleeved on the outer edge of the gateway body, and a series bolt with the bottom end matching the threaded hole is fitted inside the sleeve.
[0011] Compared with the prior art, the beneficial effects of this utility model are:
[0012] 1. In a gateway device for the Internet of Things (IoT) of power systems, the fan generates airflow that enters the inner cavity of the heat transfer housing sequentially through a flared opening and an external threaded pipe. Finally, the airflow exits from the top of the inner cavity of the heat transfer housing. As the airflow flows through the inner cavity of the heat transfer housing, it absorbs the heat generated in the inner cavity of the gateway body through the walls of the heat transfer housing and the fins on its outer wall, thereby achieving continuous heat dissipation from the inner cavity of the gateway body and significantly improving the heat dissipation effect of the IoT gateway.
[0013] 2. In the gateway device for the Internet of Things for power, the cooling airflow only passes through the inner cavity of the heat transfer shell and does not come into contact with the components inside the gateway body. That is, the gateway body is fully enclosed, which prevents dust and other debris from entering the inner cavity of the gateway body while ensuring that the gateway body has a good heat dissipation effect. Attached Figure Description
[0014] Figure 1 This is a three-dimensional structural diagram of the entire utility model;
[0015] Figure 2 This is a three-dimensional structural diagram of the gateway body of this utility model;
[0016] Figure 3 This is a three-dimensional structural diagram of the bottom box of this utility model;
[0017] Figure 4 This is a three-dimensional structural diagram of the fan of this utility model;
[0018] Figure 5 This is an exploded structural diagram of the heat-conducting component of this utility model.
[0019] In the diagram: 1-Gateway body; 1.1-Rectangular slot; 1.2-Socket; 1.3-Side slot; 1.4-Sleeve;
[0020] 2-Base box; 2.1-Rectangular cavity; 2.2-Diffusion cavity; 2.3-Support strip; 2.4-Threaded hole; 2.5-Mesh;
[0021] 3- Fan;
[0022] 4-Heat-conducting component; 4.1-Heat transfer shell; 4.2-Externally threaded pipe; 4.3-Locking nut; 4.4-Flanged mouth; 4.5-Rectangular frame; 4.6-Grid plate;
[0023] 5-Connecting bolts. Detailed Implementation
[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0025] Please see Figure 1-5 This utility model provides a technical solution: a gateway device for the Internet of Things in the power industry. The top plate of the gateway body 1 has rectangular slots 1.1 on both sides of its central portion. The bottom plate of the gateway body 1 has a row of multiple insertion holes 1.2 corresponding to the rectangular insertion holes 1.1. A side groove 1.3 is provided on the top surface of the gateway body 1 at the outer edge of the rectangular slots 1.1. Multiple sleeves 1.4 extending vertically are fixedly fitted onto the outer edge of the gateway body 1.
[0026] The bottom box 2 has a rectangular cavity 2.1 with mesh holes 2.5 on its bottom surface. Support strips 2.3 are fixed to the front and rear walls of the rectangular cavity 2.1 near the bottom. The top of the rectangular cavity 2.1 has a diffusion cavity 2.2 that is smaller at the bottom and larger at the top. The outer edge of the top surface of the bottom box 2 has a plurality of threaded holes 2.4 evenly distributed, and the threaded holes 2.4 correspond one-to-one with the sleeves 1.4. A plurality of connecting bolts 5 are respectively fitted into the sleeves 1.4, and the bottom of the connecting bolts 5 are threaded into the threaded holes 2.4, so that the outer edge of the top surface of the bottom box 2 is fixedly connected to the outer edge of the bottom surface of the gateway body 1.
[0027] Fan 3 is fixedly connected to the support strip 2.3 with screws. Fan 3 can be a common cooling fan used in computer host.
[0028] The heat-conducting component 4 includes a heat transfer housing 4.1 and multiple externally threaded tubes 4.2 fixed to the bottom surface of the heat transfer housing 4.1. The outer peripheral wall of the heat transfer housing 4.1 has several annular fins arranged vertically. A locking nut 4.3 is threaded onto the bottom end of each externally threaded tube 4.2, and a flared end 4.4 is fixed to the bottom end of the locking nut 4.3. A rectangular frame 4.5, which fits into the side groove 1.3, is fixed to the outer edge of the top of the heat transfer housing 4.1. A sealing gasket is provided between the bottom surface of the rectangular frame 4.5 and the side groove 1.3. That is, when installing the heat-conducting component 4, the heat transfer housing... 4.1 Insert the rectangular slot 1.1 into the inner cavity of the gateway body 1, and pass the external threaded tube 4.2 through the corresponding insertion hole 1.2 until the rectangular frame 4.5 is inserted into the side slot 1.3. Then, screw the locking nut 4.3 onto the bottom end of the external threaded tube 4.2 and tighten the locking nut 4.3 so that the locking nut 4.3 is pressed against the bottom surface of the gateway body 1. For airtight packaging, a sealing gasket can be installed between the locking nut 4.3 and the bottom surface of the gateway body 1. The heat transfer shell 4.1 and the fins on its outer wall are made of copper.
[0029] In summary, during operation, fan 3 generates an upward airflow. This airflow enters the inner cavity of the heat transfer housing 4.1 sequentially through the flared opening 4.4 and the external threaded pipe 4.2. After flowing through the inner cavity of the heat transfer housing 4.1, the airflow exits from the top of the inner cavity. As the airflow flows through the inner cavity of the heat transfer housing 4.1, the heat generated by the components within the gateway body 1 during operation is absorbed by the walls and fins of the outer wall of the heat transfer housing 4.1. This continuous dissipation of heat from the inner cavity of the gateway body 1 improves the heat dissipation effect of the power IoT gateway.
[0030] To prevent debris from falling from the rectangular frame 4.5 into the inner cavity of the heat transfer housing 4.1, a mesh plate 4.6 is nested inside the inner cavity of the rectangular frame 4.5.
[0031] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A gateway device for power internet of things, comprising a gateway body (1), characterized in that, Also includes: The bottom box (2) has a rectangular cavity (2.1) inside. The bottom surface of the rectangular cavity (2.1) is provided with mesh holes (2.5). The outer edge of the top surface of the bottom box (2) is fixedly connected to the outer edge of the bottom surface of the gateway body (1). The fan (3) is fixed to the bottom of the inner cavity of the rectangular cavity (2.1); The heat-conducting component (4) includes a heat transfer shell (4.1) and a plurality of externally threaded tubes (4.2) fixed to the bottom surface of the heat transfer shell (4.1). The outer peripheral wall of the heat transfer shell (4.1) is provided with a plurality of annular fins along the vertical direction. The bottom end of the externally threaded tube (4.2) is threaded with a locking nut (4.3), and the bottom end of the locking nut (4.3) is fixed with a flared mouth (4.4). The top plate of the gateway body (1) is provided with rectangular slots (1.1) on both sides of the middle part of the top plate, which are matched with the heat transfer shell (4.1) for insertion. The bottom plate of the gateway body (1) is provided with insertion holes (1.2) that are matched with the external threaded pipe (4.2) for sleeve insertion. 2.The gateway device for power internet of things of claim 1, wherein: The top surface of the gateway body (1) is provided with a side groove (1.3) located at the outer edge of the rectangular slot (1.1). The outer edge of the top of the heat transfer shell (4.1) is fixed with a rectangular frame (4.5) that fits and matches the side groove (1.3). A sealing gasket is provided between the bottom surface of the rectangular frame (4.5) and the side groove (1.3).
3. A gateway device for the power Internet of Things according to claim 2, characterized in that: The rectangular frame (4.5) has a mesh plate (4.6) nested inside its cavity.
4. A gateway device for the power Internet of Things according to claim 1, characterized in that: The top of the rectangular cavity (2.1) is provided with a diffusion cavity (2.2) that is smaller at the bottom and larger at the top.
5. A gateway device for the power Internet of Things according to claim 1, characterized in that: The rectangular cavity (2.1) has support strips (2.3) fixed to the front and rear walls near the bottom, and the fan (3) is fixed to the support strips (2.3) with screws.
6. A gateway device for the power Internet of Things according to claim 1, characterized in that: The outer edge of the top surface of the bottom box (2) is provided with a plurality of threaded holes (2.4) evenly distributed. The outer edge of the gateway body (1) is fixedly fitted with a plurality of sleeves (1.4) that extend vertically and correspond one-to-one with the threaded holes (2.4). The sleeves (1.4) are fitted with a series bolt (5) whose bottom end is threaded and matched with the threaded hole (2.4).