A shielding cover structure for a PCBA board and a PCBA board

CN224290161UActive Publication Date: 2026-05-26深圳圆机科技有限公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
深圳圆机科技有限公司
Filing Date
2025-06-11
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

The existing PCBA board shielding has a limited contact area with the outside air, resulting in insufficient heat exchange capacity and ineffective heat dissipation.

Method used

A fin and a blower are introduced into the shielding structure. The blower is connected to the top of the fin to accelerate the airflow. V-shaped parts and vents are provided at both ends of the fin to increase the contact area and flow rate. Guide blocks and grooves are used to guide the flow and increase the contact area, forming a forced convection heat dissipation structure.

Benefits of technology

By using forced convection and increasing the contact area, the heat exchange capacity of the shielding cover is significantly improved, ensuring the stable operation of electronic components and extending their service life.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention provides a shielding cover structure and a PCBA board for PCBA boards, belonging to the field of circuit board technology. It includes a shielding cover body and a heat exchange mechanism. The heat exchange mechanism includes several fins fixed to the top of the shielding cover body, and a blower is connected to the top of each fin. The blower's operation accelerates the airflow speed at the fins. This invention, by using fins and a blower, increases the contact area between the shielding cover body and the outside air, improving the heat exchange capacity of the shielding cover body. Simultaneously, the blower's operation forces airflow through the top of the shielding cover body and the fins, accelerating airflow and further enhancing the heat exchange capacity of the shielding cover body, thereby achieving effective heat dissipation for the electronic components inside the shielding cover body.
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Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a shielding cover structure for PCBA boards and a PCBA board. Background Technology

[0002] PCBA boards are finished boards made by soldering electronic components onto printed circuit boards using surface mount technology and other processes. The electromagnetic shielding cover of a PCBA board is a cover made of metal material. Its function is to block electromagnetic radiation and reduce the influence of external electromagnetic fields on high-frequency signal components and sensitive analog components on the board, thereby protecting them.

[0003] After using a shielding cover to cover the high-frequency signal components and sensitive analog components on the circuit board, the heat generated by the high-frequency signal components and sensitive analog components during operation can usually only be dissipated through heat exchange between the shielding cover and the outside air. However, when heat exchange is only carried out through the shielding cover, the contact area between the shielding cover and the outside air is limited, and the heat exchange capacity needs to be improved. Therefore, this application provides a shielding cover structure and a PCBA board for PCBA boards to meet the requirements. Utility Model Content

[0004] This utility model provides a shielding cover structure and a PCBA board to solve the problem that after using a shielding cover to cover high-frequency signal components and sensitive analog components on the circuit board, the contact area between the shielding cover and the outside air is limited, and the heat exchange capacity needs to be improved.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0006] A shielding cover structure for PCBA boards includes a shielding cover body and further includes:

[0007] The heat exchange mechanism includes several fins fixed to the top of the shield body. The top of the several fins is connected to a blower. When the blower operates, it accelerates the airflow speed at the fins.

[0008] Preferably, both ends of the fins are fixed with V-shaped portions, which are fixed to the top of the shield body.

[0009] Preferably, the side of the V-shaped portion is provided with ventilation openings, and the number of ventilation openings corresponds to the number of V-shaped portions.

[0010] Preferably, the inner wall of the vent is inclined.

[0011] Preferably, a flow guide block is fixed to the top of the shield body, the flow guide block is fixed to the side of the fin, and the top of the flow guide block is inverted V-shaped.

[0012] Preferably, the top of the guide block has a groove, which is in the shape of an inverted V.

[0013] A PCBA board, which is used in the above-mentioned shielding structure for PCBA boards, includes a circuit board body, on the top of the circuit board body are electrically connected to a plurality of electronic components, and the shielding body covers the plurality of electronic components.

[0014] Compared with the prior art, this utility model has at least the following beneficial effects:

[0015] In the above scheme, by setting fins and a blower, the fins increase the contact area between the shield body and the outside air, thereby improving the heat exchange capacity of the shield body. At the same time, the operation of the blower forces the airflow to pass through the top of the shield body and the fins, accelerating the airflow speed and further improving the heat exchange capacity of the shield body, thereby achieving effective heat dissipation of the electronic components inside the shield body.

[0016] By incorporating V-shaped sections and vents, the V-shaped sections further increase the contact area between the fins and the air, thereby enhancing the heat exchange capacity at the fins. Simultaneously, as the airflow passes through the V-shaped sections, the speed of the airflow increases due to the gradually narrowing space between adjacent V-shaped sections, allowing it to carry away more heat within a unit area, further improving the heat dissipation capacity of the shield body. Additionally, a small portion of the airflow enters the opening of the V-shaped section through the vents, accelerating the airflow speed at the opening of the V-shaped section, thereby further enhancing the heat exchange capacity at the V-shaped section.

[0017] By setting guide blocks and grooves, the blower operates to direct airflow towards the top of the shield body. During the airflow process, the airflow is influenced by the guide blocks and flows towards the V-shaped part in the forward and backward direction. The guide blocks guide the airflow and prevent the airflow from accumulating at the bottom of the blower, thereby ensuring the airflow speed at the fins. This ensures a stable heat dissipation capacity of the airflow on the fins and the shield body. The grooves increase the contact area between the guide blocks and the airflow, thereby improving the heat dissipation capacity at the guide blocks, which in turn improves the heat dissipation capacity of the shield body. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a three-dimensional structural diagram of the flow guide block of this utility model;

[0020] Figure 3 This is a three-dimensional structural diagram of the V-shaped portion of this utility model;

[0021] Figure 4 This is a schematic diagram of the internal structure of the shielding cover body of this utility model.

[0022] In the diagram: 1. Shielding cover body; 2. Circuit board body; 3. Electronic components; 4. Heat exchange mechanism; 5. Fins; 6. V-shaped part; 7. Vent; 8. Hair dryer; 9. Guide block; 10. Groove.

[0023] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiments of this utility model. However, this is only for illustrative purposes and is not intended to limit this utility model to the specific structure, device and environment. According to specific needs, those skilled in the art can adjust or modify these devices and environments, and such adjustments or modifications are still included in the scope of the appended claims. Detailed Implementation

[0024] The shielding cover structure for PCBA boards and the PCBA boards provided by this utility model will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art can use other alternative methods to implement some known technologies; moreover, the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit this utility model.

[0025] like Figures 1-4 As shown, an embodiment of this utility model provides a shielding cover structure for a PCBA board, including a shielding cover body 1, and further comprising:

[0026] The heat exchange mechanism 4 includes several fins 5 fixed to the top of the shield body 1. The tops of the several fins 5 are connected to a blower 8. When the blower 8 operates, it accelerates the airflow speed at the fins 5. The fins 5 increase the heat dissipation area of ​​the shield body 1 and enhance the heat transfer efficiency between the shield body 1 and the air. The forced convection formed by the blower 8 causes the airflow to quickly sweep across the fins 5 and the surface of the shield body 1. By improving the heat exchange capacity on the air side of the shield body 1, the heat dissipation capacity at the shield body 1 is further enhanced.

[0027] like Figures 2-4 As shown in this embodiment, V-shaped portions 6 are fixed at both ends of the fins 5. The V-shaped portions 6 are fixed to the top of the shield body 1. The V-shaped portions 6 expand the effective heat dissipation area of ​​the fins 5 through their bending structure and form a gradually narrowing channel between adjacent V-shaped portions 6, which accelerates the airflow velocity in the channel and can carry away more heat per unit area, further improving the heat dissipation capacity of the shield body 1. At the same time, the distance between two adjacent V-shaped portions 6 is designed according to the distance between two adjacent fins 5, as long as the distance between two adjacent V-shaped portions 6 is not too small to cause blockage during airflow.

[0028] like Figure 3 and Figure 4 As shown in this embodiment, the side of the V-shaped part 6 is provided with a vent 7. The number of vents 7 corresponds to the number of V-shaped parts 6. The vents 7 allow a small portion of the airflow passing through the V-shaped part 6 to enter the opening area of ​​the V-shaped part 6, thereby improving the heat exchange efficiency of the inner wall of the V-shaped part 6 and further improving the heat exchange capacity of the V-shaped part 6. The size of the vent 7 is determined according to the area of ​​the side of the V-shaped part 6. It is only necessary to ensure that a small portion of the airflow enters the opening of the V-shaped part 6 to dissipate heat, while most of the airflow still passes between two adjacent V-shaped parts 6.

[0029] like Figure 3 and Figure 4 As shown in this embodiment, the inner wall of the vent 7 is inclined. The inclined inner wall serves as a guide surface, making it easier for airflow to enter the vent 7 and pass through the vent 7, thus preventing the inner wall of the vent 7 from having a vertical surface that obstructs the flow of air.

[0030] like Figure 2 and Figure 4 As shown in this embodiment, a guide block 9 is fixed to the top of the shield body 1. The guide block 9 is fixed to the side of the fin 5, and the top of the guide block 9 is inverted V-shaped. The guide block 9 disperses the concentrated airflow blown out by the blower 8 to the V-shaped part 6 area in the front and rear direction through the inverted V-shaped structure, so as to avoid the airflow forming a stagnant area directly below the blower 8, and ensure that each part of the fin 5 receives sufficient cooling airflow. At the same time, the guide block 9 is a copper block or an aluminum alloy block, which has good thermal conductivity and can further improve the heat dissipation capacity at the guide block 9.

[0031] like Figure 2 and Figure 4 As shown in this embodiment, the top of the guide block 9 is provided with a groove 10. The groove 10 is in the shape of an inverted V. The groove 10 directly participates in heat exchange by increasing the surface area of ​​the guide block 9, thereby enhancing the heat dissipation capacity of the guide block 9 itself. The inverted V-shaped groove 10 can prevent the groove 10 itself from causing resistance to the airflow and improve the airflow at the guide block 9.

[0032] A PCBA board, using the aforementioned shielding structure for PCBA boards, includes a circuit board body 2. Several electronic components 3 are electrically connected to the top of the circuit board body 2. The shielding body 1 covers the several electronic components 3. The electronic components 3 are high-frequency signal components and sensitive analog components. The shielding structure, through the synergistic effect of fins 5, V-shaped parts 6, vents 7, guide blocks 9, and grooves 10, dissipates the heat generated by the electronic components 3 in a timely manner, effectively extending their service life and ensuring the working stability of the circuit board body 2. A hair dryer 8 is connected to the circuit board body 2 through wires, thereby providing power to the hair dryer 8.

[0033] Working principle: After the blower 8 is started, the forced airflow flows at high speed from the top of the shield body 1 and the fins 5. The fins 5 increase the contact area between the shield body 1 and the air. Combined with the accelerated airflow, the heat exchange efficiency between the shield body 1 and the outside air is greatly improved, and the heat generated by the electronic components 3 is carried away.

[0034] The V-shaped portions 6 at both ends of the fin 5 further expand the heat exchange area between the fin 5 and the air. When the airflow passes through the gradually narrowing space between adjacent V-shaped portions 6, the flow rate increases, and more heat is carried away per unit time, which enhances the heat dissipation effect at the fin 5. At the same time, a small portion of the airflow enters its opening area through the vent 7 on the side of the V-shaped portion 6, which accelerates the airflow at the opening and forms a secondary heat exchange enhancement.

[0035] The air guide block 9 on the top of the shield body 1 directs the airflow blown out by the blower 8 to the V-shaped part 6 in the front-to-back direction, preventing the airflow from accumulating at the bottom of the blower 8 and maintaining a stable airflow velocity at the fins 5. The groove 10 on the top of the air guide block 9 increases the contact area between the air guide block 9 and the airflow, improving the heat dissipation capacity at the air guide block 9, thereby further improving the heat dissipation capacity of the shield body 1 for the electronic components 3. Through effective heat dissipation of the electronic components 3 inside the shield body 1, the stable operation of the electronic components 3 on the circuit board body 2 is ensured.

[0036] This utility model encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this utility model. To provide the public with a thorough understanding of this utility model, specific details have been described in detail in the above preferred embodiments; however, those skilled in the art can fully understand this utility model even without these detailed descriptions.

[0037] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A shielding cover structure for PCBA boards, comprising a shielding cover body (1), characterized in that, Also includes: The heat exchange mechanism (4) includes several fins (5) fixed on the top of the shield body (1). The top of the several fins (5) is connected to a blower (8). The blower (8) operates to accelerate the flow speed of the airflow at the fins (5).

2. The shielding cover structure for PCBA boards according to claim 1, characterized in that, Both ends of the fin (5) are fixed with V-shaped parts (6), and the V-shaped parts (6) are fixed to the top of the shield body (1).

3. The shielding cover structure for PCBA boards according to claim 2, characterized in that, The side of the V-shaped part (6) is provided with a vent (7), and the number of vents (7) corresponds to the number of V-shaped parts (6).

4. The shielding cover structure for PCBA boards according to claim 3, characterized in that, The inner wall of the vent (7) is inclined.

5. The shielding cover structure for PCBA boards according to claim 1, characterized in that, The top of the shield body (1) is fixed with a flow guide block (9), which is fixed on the side of the fin (5), and the top of the flow guide block (9) is inverted V shape.

6. The shielding cover structure for PCBA boards according to claim 5, characterized in that, The top of the guide block (9) is provided with a groove (10), which is in the shape of an inverted V.

7. A PCBA board, applied to a shielding structure for a PCBA board as described in any one of claims 1-6, characterized in that, The circuit board body (2) includes a circuit board body (2) with several electronic components (3) electrically connected to its top, and a shield body (1) covering the several electronic components (3).