A novel layered circuit board

Abstract

This utility model discloses a novel layered circuit board, relating to the field of circuit board technology. It includes a top signal layer with pre-drilled screw holes at its four corners. A bottom signal layer is located below the top signal layer. A first inner core layer and a second inner core layer are fixedly connected between the top and bottom signal layers. This novel layered circuit board, by incorporating side edging and pre-drilled slots, allows the top signal layer, first inner core layer, second inner core layer, and bottom signal layer to be stacked to form a layered circuit board during use. The plastic side edging covers the narrow edges of the circuit board, further reinforcing the layers and reducing the probability of delamination and cracking under external force. The pre-drilled slots are adapted to the pre-drilled screw holes, achieving a delamination-preventing function and addressing the problem of devices lacking this function.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically a novel layered circuit board. Background Technology

[0002] A layered circuit board refers to a printed circuit board with two or more layers. It consists of connecting wires on several layers of insulating substrate and pads for assembling and soldering electronic components. It serves both to conduct the circuitry between the layers and to insulate each other from each other.

[0003] Most layered circuit boards commonly found on the market are similar in overall structure, consisting of two main signal layers with two or four sets of inner core layers sandwiched in between, connected by blind vias, buried vias, and through-holes. However, they have some functional shortcomings in actual use and have room for improvement. For example, layered circuit boards are made by laminating multiple circuit boards together, and there are boundaries between the layers at their edges. When subjected to external forces, delamination can easily occur along the edges, causing poor contact of the internal circuits and affecting their normal function. They also lack the function of covering and preventing delamination.

[0004] Now, a novel layered circuit board is proposed to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a novel layered circuit board to solve the problem mentioned in the background art of not having the function of covering and preventing delamination.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a novel layered circuit board, comprising a top signal layer, with pre-drilled screw holes at the four corners of the top of the top signal layer, a bottom signal layer below the top signal layer, a first inner core layer and a second inner core layer fixedly connected between the top signal layer and the bottom signal layer, side edging covering the left and right sides of the top signal layer and the bottom signal layer, with two sets of pre-drilled slots at the upper and lower ends of the side edging, insulating reinforcing ribs horizontally embedded inside the first inner core layer and the second inner core layer, multiple sets of blind holes at the top of the top of the top signal layer, an upper cover welded to the top of the blind holes, a cover clip fixedly connected to the bottom of the upper cover, and a resin rod glued to the bottom of the cover clip.

[0007] As a further technical solution of this utility model, the pre-drilled screw hole penetrates the interior of the top signal layer, the first inner core layer, the second inner core layer, and the bottom signal layer, and the position of the pre-drilled slot corresponds to the top signal layer.

[0008] As a further technical solution of this utility model, the inner side of the side edging is fixedly connected to the top signal layer, the first inner core layer, the second inner core layer, and the bottom signal layer, and the side edging is symmetrically distributed about the vertical center line of the top signal layer.

[0009] As a further technical solution of this utility model, the front and rear ends of the side edge are flush with the front and rear ends of the top signal layer, the first inner core layer, the second inner core layer, and the bottom signal layer, respectively, and the inner diameters of the pre-drilled screw holes and pre-drilled slots are the same.

[0010] As a further technical solution of this utility model, the insulating reinforcing ribs are arranged at equal intervals, and the left and right sides of the insulating reinforcing ribs are flush with the left and right sides of the first inner core layer and the second inner core layer, respectively.

[0011] As a further technical solution of this utility model, the blind hole penetrates the interior of the top signal layer, the first inner core layer, and the second inner core layer, and the outer diameter of the capping head is the same as the inner diameter of the blind hole.

[0012] Compared with the prior art, the beneficial effects of this utility model are: the new layered circuit board not only realizes the function of covering and preventing delamination, but also realizes the function of internal reinforcement and anti-bending, and also realizes the function of hole protection;

[0013] (1) By setting side edging and pre-slots, when in use, the top signal layer and bottom signal layer serve as signal layers for component installation and main circuit routing, while the first inner core layer and second inner core layer serve as inner cores, mainly as bottom and power layers. The top signal layer, first inner core layer, second inner core layer and bottom signal layer are stacked to form a layered circuit board. The plastic side edging covers the narrow edges on both sides of the circuit board, covering the edges of the layers as further reinforcement, which can reduce the probability of the circuit board delaminating and cracking under external force. The pre-slots are adapted to pre-drilled screw holes, realizing the function of covering and preventing delamination.

[0014] (2) By setting a first inner core layer, a second inner core layer and insulating reinforcing ribs, when in use, the first inner core layer and the second inner core layer serve as the inner core, mainly as the ground layer and power layer. Multiple sets of insulating reinforcing ribs are added inside, which can increase the overall structural strength of the circuit board and realize the function of internal reinforcement against bending.

[0015] (3) By setting up an upper cover, a cover clip and a resin rod, when using, the blind hole is usually used to dock with the chip. In order to prevent solder paste from entering the blind hole, an upper cover is usually soldered on the top of the blind hole. The cover clip at the bottom of the upper cover is inserted into the blind hole, which facilitates the soldering of the upper cover on the one hand, and also prevents the solder liquid from flowing into the hole when the upper cover is soldered through. The resin rod plays a supporting role and realizes the function of hole opening protection. Attached Figure Description

[0016] Figure 1 This is a front view structural diagram of the present utility model;

[0017] Figure 2 This is a bottom view of the structure of this utility model;

[0018] Figure 3 This is a partial cross-sectional view of the second inner core layer of this utility model.

[0019] Figure 4 This is an enlarged cross-sectional view of the blind hole structure of this utility model.

[0020] In the diagram: 1. Top signal layer; 2. Pre-drilled screw holes; 3. Side edge wrapping; 4. Pre-drilled grooves; 5. First inner core layer; 6. Second inner core layer; 7. Bottom signal layer; 8. Insulating reinforcing ribs; 9. Blind holes; 10. Top cover; 11. Cover clip; 12. Resin rod. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Example: Please refer to Figure 1-4 A novel layered circuit board includes a top signal layer 1, with pre-drilled screw holes 2 at the four corners of the top of the top signal layer 1, a bottom signal layer 7 below the top signal layer 1, a first inner core layer 5 and a second inner core layer 6 fixedly connected between the top signal layer 1 and the bottom signal layer 7, and side edging 3 covering the left and right sides of the top signal layer 1 and the bottom signal layer 7, with two sets of pre-drilled slots 4 at the upper and lower ends of the side edging 3.

[0023] The pre-drilled screw hole 2 penetrates the interior of the top signal layer 1, the first inner core layer 5, the second inner core layer 6, and the bottom signal layer 7. The position of the pre-drilled slot 4 corresponds to the top signal layer 1. The inner side of the side edge 3 is fixedly connected to the top signal layer 1, the first inner core layer 5, the second inner core layer 6, and the bottom signal layer 7. The side edge 3 is symmetrically distributed about the vertical center line of the top signal layer 1. The front and rear ends of the side edge 3 are flush with the front and rear ends of the top signal layer 1, the first inner core layer 5, the second inner core layer 6, and the bottom signal layer 7, respectively. The inner diameters of the pre-drilled screw hole 2 and the pre-drilled slot 4 are the same, which can protect the side from delamination.

[0024] Specifically, such as Figure 1 and Figure 2As shown, the top signal layer 1 and the bottom signal layer 7 serve as signal layers for component mounting and main circuit routing. The first inner core layer 5 and the second inner core layer 6 serve as inner cores, mainly as the bottom layer and power layer. The top signal layer 1, the first inner core layer 5, the second inner core layer 6, and the bottom signal layer 7 are stacked to form a layered circuit board. The plastic side edging 3 covers the narrow edges of the circuit board on both sides, covering the edges of the layers as further external reinforcement, which can reduce the probability of the circuit board delaminating and cracking under external force. The pre-grooved slot 4 is adapted to the pre-grooved screw hole 2.

[0025] Insulating reinforcing ribs 8 are horizontally embedded in the interior of the first inner core layer 5 and the second inner core layer 6, respectively. The insulating reinforcing ribs 8 are arranged at equal intervals, and the left and right sides of the insulating reinforcing ribs 8 are flush with the left and right sides of the first inner core layer 5 and the second inner core layer 6, respectively.

[0026] Specifically, such as Figure 2 and Figure 3 As shown, the first inner core layer 5 and the second inner core layer 6 serve as the inner core, mainly as the bottom layer and power layer. Multiple sets of insulating reinforcing ribs 8 are added inside to increase the overall structural strength of the circuit board.

[0027] Multiple blind holes 9 are formed at the top of the top signal layer 1. An upper cover 10 is welded to the top of the blind hole 9. A cover clip 11 is fixedly connected to the bottom of the upper cover 10. A resin rod 12 is glued to the bottom of the cover clip 11. The blind hole 9 penetrates the interior of the top signal layer 1, the first inner core layer 5, and the second inner core layer 6. The outer diameter of the cover clip 11 is the same as the inner diameter of the blind hole 9, which can protect the hole.

[0028] Specifically, such as Figure 1 and Figure 4 As shown, blind via 9 is usually used to interface with chips. In order to prevent solder paste from entering the blind via 9, a top cover 10 is usually soldered on the top of the blind via 9. The cover clip 11 at the bottom of the top cover 10 is inserted into the blind via 9. On the one hand, it facilitates the soldering of the top cover 10, and on the other hand, it can also prevent molten solder from flowing into the hole when the top cover 10 is soldered through. The resin rod 12 plays a supporting role.

[0029] Working Principle: In use, the top signal layer 1 and bottom signal layer 7 serve as signal layers for component mounting and main circuit routing. The first inner core layer 5 and second inner core layer 6 serve as inner cores, primarily acting as the bottom layer and power layer. These layers are stacked to form a layered circuit board. Plastic side edging 3 covers the narrow edges of the circuit board, further reinforcing the layers and reducing the probability of delamination and cracking under external force. Pre-grooved slots 4 accommodate pre-drilled screw holes 2. The first inner core layer 5 and second inner core layer 6, serving as the inner cores and primarily as the bottom layer and power layer, have multiple sets of insulating reinforcing ribs 8 inside, increasing the overall structural strength of the circuit board. Blind via 9 is usually used to interface with chips. In order to prevent solder paste from entering the blind via 9, a top cover 10 is usually soldered on the top of the blind via 9. The cover clip 11 at the bottom of the top cover 10 is inserted into the blind via 9. On the one hand, it facilitates the soldering of the top cover 10, and on the other hand, it can also prevent molten solder from flowing into the hole when the top cover 10 is soldered through. The resin rod 12 plays a supporting role.

[0030] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A novel layered circuit board, comprising a top signal layer (1), characterized in that: The top signal layer (1) has four pre-drilled screw holes (2) at the four corners of its top. The bottom signal layer (7) is located below the top signal layer (1). The top signal layer (1) and the bottom signal layer (7) are fixedly connected by a first inner core layer (5) and a second inner core layer (6). The top signal layer (1) and the bottom signal layer (7) are covered with side edging (3) on their left and right sides respectively. The upper and lower ends of the side edging (3) are respectively provided with two sets of pre-drilled slots (4). The first inner core layer (5) and the second inner core layer (6) are respectively horizontally embedded with insulating reinforcing ribs (8). The top of the top signal layer (1) has multiple sets of blind holes (9). The top of the blind holes (9) is welded with an upper cover (10). The bottom of the upper cover (10) is fixedly connected with a cover clip (11). The bottom of the cover clip (11) is glued with a resin rod (12).

2. The novel layered circuit board according to claim 1, characterized in that: The pre-drilled screw hole (2) penetrates the interior of the top signal layer (1), the first inner core layer (5), the second inner core layer (6), and the bottom signal layer (7), and the position of the pre-drilled slot (4) corresponds to the top signal layer (1).

3. A novel layered circuit board according to claim 1, characterized in that: The inner side of the side edging (3) is fixedly connected to the top signal layer (1), the first inner core layer (5), the second inner core layer (6), and the bottom signal layer (7). The side edging (3) is symmetrically distributed about the vertical center line of the top signal layer (1).

4. A novel layered circuit board according to claim 1, characterized in that: The front and rear ends of the side edge (3) are flush with the front and rear ends of the top signal layer (1), the first inner core layer (5), the second inner core layer (6), and the bottom signal layer (7), respectively. The inner diameters of the pre-drilled screw holes (2) and the pre-drilled slots (4) are the same.

5. A novel layered circuit board according to claim 1, characterized in that: The insulating reinforcing ribs (8) are arranged at equal intervals, and the left and right sides of the insulating reinforcing ribs (8) are flush with the left and right sides of the first inner core layer (5) and the second inner core layer (6), respectively.

6. A novel layered circuit board according to claim 1, characterized in that: The blind hole (9) penetrates the interior of the top signal layer (1), the first inner core layer (5), and the second inner core layer (6), and the outer diameter of the capping head (11) is the same as the inner diameter of the blind hole (9).

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