Vehicle PCBA sealing structure and vehicle

Abstract

This utility model relates to the field of vehicle parts technology, and in particular to a vehicle-mounted PCBA sealing structure and a vehicle. The vehicle-mounted PCBA sealing structure includes: a PCBA component comprising a PCB board and electronic components mounted on the PCB board; a limiting member formed as a frame structure surrounding the circumferential edge of the PCB board, the inner wall of the limiting member being in contact with the PCB board, such that the inner wall of the limiting member and the PCB board form a glue injection cavity, the depth of which is greater than the height of the electronic components in the thickness direction of the PCB board; and sealant, filling the glue injection cavity to form a sealing layer on the surface of the PCB board, the shape of which is the same as the shape of the PCB board, and the thickness of which is greater than the height of the electronic components. This utility model can achieve sealing of all electronic components on the PCB board, effectively preventing dust, moisture, oxides, or corrosive substances from corroding the electronic components, and also has a reliable cooling and heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of vehicle parts technology, and in particular to a vehicle-mounted PCBA sealing structure and vehicle. Background Technology

[0002] PCBA, or Printed Circuit Board Assembly, is a complete circuit module formed by soldering electronic components onto a PCB (Printed Circuit Board Body) using methods such as SMT (Surface Mount Technology) or DIP (Dual In-line Package Technology).

[0003] Electronic components in PCBAs generate heat during operation. Most current automotive controller PCBAs use thermal paste or thermal oil to coat the surface of electronic components for heat dissipation, and some are coated with conformal coating for corrosion, mold, and salt spray protection. For low-power electronic components or PCBAs with a small number of components, applying thermal paste or thermal oil and conformal coating is sufficient for product functionality. However, for high-power electronic components or PCBAs with a large number of components, the required heat dissipation and protection cannot be guaranteed. Furthermore, vibration can generate additional stress, which can lead to exposed electronic components detaching or developing poor solder joints, and they are also susceptible to corrosion, affecting product functionality. Utility Model Content

[0004] In view of this, the purpose of this application is to provide a vehicle-mounted PCBA sealing structure and vehicle to solve the problem that the protection and heat dissipation of high-power electronic components and PCBAs with a large number of electronic components in existing vehicles cannot meet the requirements.

[0005] The first aspect of this utility model provides a vehicle-mounted PCBA sealing structure, wherein the vehicle-mounted PCBA sealing structure includes:

[0006] PCBA components include a PCB board and electronic components mounted on the PCB board;

[0007] The limiting member is formed as a frame structure surrounding the circumferential edge of the PCB board. The inner wall of the limiting member is fitted to the PCB board, so that the inner wall of the limiting member and the PCB board form a glue injection cavity. The depth dimension of the glue injection cavity is greater than the height dimension of the electronic component in the thickness direction of the PCB board.

[0008] A sealant is filled into the injection cavity to form a sealing layer on the surface of the PCB board. The shape of the sealing layer is the same as that of the PCB board, and the thickness of the sealing layer is greater than the height of the electronic component.

[0009] Preferably, the inner wall of the limiting member is provided with a scale.

[0010] Preferably, the electronic components are disposed on both the front and back surfaces of the PCB board, the PCB board is disposed at the middle position in the height direction of the limiting member, and the sealing layer is disposed on both the front and back surfaces of the PCB board.

[0011] Preferably, multiple electronic components are provided, and the number of electronic components on the front and back surfaces of the PCB board is different.

[0012] Preferably, the inner wall of the limiting member is provided with a degumming layer, and the sealant can contact the degumming layer.

[0013] Preferably, the limiting member is a plastic part, and the degumming layer is a metal layer.

[0014] Preferably, the maximum thickness of the electronic components on one side surface of the PCB board is H, and the thickness of the sealing layer disposed on the same side is 1.4H to 1.6H.

[0015] Preferably, the limiting member is formed as a frame structure surrounded by a plate-like structure, and the thickness of the plate-like structure is greater than the thickness of the PCB board.

[0016] Preferably, the limiting member is interference-fitted with the PCB board.

[0017] The second aspect of this utility model provides a vehicle including the vehicle-mounted PCBA sealing structure described in any of the above technical solutions.

[0018] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0019] This utility model discloses a vehicle-mounted PCBA sealing structure. The PCBA component includes a PCB board and electronic components mounted on the PCB board. A limiting member is formed as a frame structure surrounding the circumferential edge of the PCB board. The inner wall of the limiting member is fitted to the PCB board, so that the inner wall of the limiting member and the PCB board form a glue injection cavity. The depth of the glue injection cavity is greater than the height of the electronic components in the thickness direction of the PCB board. Sealant is filled into the glue injection cavity to form a sealing layer on the surface of the PCB board. The shape of the sealing layer is the same as the shape of the PCB board, and the thickness of the sealing layer is greater than the height of the electronic components. This achieves sealing of all electronic components on the PCB board, effectively preventing dust, moisture, and oxidation. The sealant prevents corrosion from contaminating electronic components, thus extending the lifespan of PCBA parts and protecting confidential electronic components. It also improves the reliability of electronic components mounted on the PCB board, providing a secure and shock-absorbing effect to prevent components from falling off or being damaged during vibration, ensuring the stability and reliability of PCBA parts and extending their lifespan. Furthermore, the sealant has insulating properties and increases the heat transfer capacity of electronic components, preventing interference and short circuits between different circuits within the PCBA part, and providing reliable cooling and heat dissipation. This allows all electronic components to operate at room temperature, meeting usage requirements, improving the user experience, and making vehicle performance more stable.

[0020] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0021] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 An exploded view of the vehicle-mounted PCBA sealing structure provided in an embodiment of this utility model;

[0023] Figure 2 A schematic diagram of the vehicle-mounted PCBA sealing structure provided in the embodiments of this utility model, showing the removal of the limiting component after the sealing layer is formed;

[0024] Figure 3 A cross-sectional view of the vehicle-mounted PCBA sealing structure provided in an embodiment of this utility model after the sealing layer is formed, showing the removal of the limiting component.

[0025] Icons: 10-PCBA component; 11-PCB board; 12-electronic component; 20-limiting component; 21-insertion cavity; 30-sealing layer. Detailed Implementation

[0026] The following detailed embodiments are provided to help the reader gain a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will be apparent after understanding the disclosure of this application. For example, the order of operations described herein is merely illustrative and is not limited to the order set forth herein; changes that will be apparent after understanding the disclosure of this application are possible, except for operations that must occur in a specific order. Furthermore, for clarity and brevity, descriptions of features known in the art may be omitted.

[0027] The features described herein may be implemented in different forms and should not be construed as being limited to the examples described herein. Rather, the examples described herein have been provided merely to illustrate some of the many feasible ways of implementing the methods, apparatus, and / or systems described herein that will be apparent upon understanding the disclosure of this application.

[0028] Throughout the specification, when an element (such as a layer, region, or substrate) is described as being "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, it may be directly "on" another element, "connected to" another element, "bonded to" another element, "on" another element, or "covering" another element, or there may be one or more other elements in between. In contrast, when an element is described as being "directly on" another element, "directly connected to" another element, "directly bonded to" another element, "directly on" another element, or "directly covering" another element, there may be no other elements in between.

[0029] As used herein, the term “and / or” includes any one of the relevant items listed and any combination of any two or more items.

[0030] Although terms such as “first,” “second,” and “third” may be used herein to describe individual components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts are not limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teachings of the examples described herein, the first component, assembly, region, layer, or part referred to as the second component, assembly, region, layer, or part may also be referred to as the second component, assembly, region, layer, or part.

[0031] For ease of description, spatial relation terms such as “above,” “upper,” “below,” and “lower” are used herein to describe the relationship between one element and another, as shown in the accompanying drawings. Such spatial relation terms are intended to include not only the orientation depicted in the drawings but also different orientations of the device during use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “upper” relative to another element will subsequently be “below” or “lower” relative to that other element. Therefore, the term “above” includes both “above” and “below” orientations depending on the spatial orientation of the device. The device may also be positioned in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relation terms used herein will be interpreted accordingly.

[0032] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. The terms “comprising,” “including,” and “having” enumerate the stated features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0033] Variations in the shapes shown in the accompanying drawings may occur due to manufacturing techniques and / or tolerances. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include changes in shape that may occur during manufacturing.

[0034] The features of the examples described herein can be combined in various ways that will be apparent upon understanding the disclosure of this application. Furthermore, although the examples described herein have a wide variety of constructions, other constructions are possible, as will be apparent upon understanding the disclosure of this application.

[0035] According to a first aspect of the present invention, a vehicle-mounted PCBA sealing structure is provided, which includes a PCBA component 10, a limiting component 20, and a sealant.

[0036] The specific structure of the above-mentioned components in the vehicle PCBA sealing structure according to this embodiment will be described below.

[0037] In this embodiment, as Figure 1As shown, PCBA component 10 includes a PCB board 11 and electronic components 12 disposed on the PCB board 11. The PCB board 11 is formed into a plate-like structure, such as a rectangular plate-like structure. In other optional embodiments, the PCB board 11 can also be formed into a plate-like structure of other shapes such as circular, polygonal, or elliptical. The limiting member 20 is formed into a frame structure surrounding the circumferential edge of the PCB board 11. The inner wall of the limiting member 20 is fitted to the PCB board 11, such that the size and shape of the inner wall of the limiting member 20 are the same as the shape of the circumferential edge of the PCB board 11. The inner wall of the limiting member 20 and the PCB board 11 form a glue injection cavity 21. The glue injection cavity 21 forms a groove structure. The PCB board 11 forms the bottom of the groove of the glue injection cavity 21. Part of the limiting member 20 forms the groove wall of the glue injection cavity 21. The depth dimension of the glue injection cavity 21 is greater than the height dimension of the electronic components 12 in the thickness direction of the PCB board 11.

[0038] In a preferred embodiment, such as Figure 1 As shown, the limiting member 20 is formed as a frame structure surrounded by a plate-like structure. The thickness of the plate-like structure is greater than the thickness of the PCB board 11. This ensures that the limiting member 20 has reliable structural strength and that the subsequent demolding of the sealing layer 30 is smooth and does not deform. Preferably, the thickness of the plate-like structure of the limiting member 20 surrounding the frame structure is twice the thickness of the PCB board 11. For example, when the thickness of the PCB board 11 is 1.6 mm, the thickness of the plate-like structure surrounding the limiting member 20 is 3.2 mm.

[0039] like Figures 1 to 3 As shown, sealant is filled into the injection cavity 21 to form a sealing layer 30 on the surface of the PCB board 11. This serves to encapsulate the electronic components 12 on the PCB board 11. The shape of the sealing layer 30 is the same as that of the PCB board 11, and the thickness of the sealing layer 30 is greater than the height of the electronic components 12. This allows the sealing layer 30 to completely cover the outside of the electronic components 12, effectively preventing dust, moisture, oxides, or corrosive substances from eroding the electronic components 12, thereby extending the service life of the PCBA component 10. It can also be used for components that require... The sealant protects the confidential electronic components 12, enhances the reliability of the electronic components 12 fixed on the PCB board 11, provides a fixed and shockproof effect, prevents the electronic components 12 from falling off or being damaged during vibration, ensures the stability and reliability of the PCBA component 10, and extends its service life. The sealant also has the functions of insulation and increasing the heat transfer capacity of the electronic components 12, preventing interference and short circuits between different circuits in the PCBA component 10, and has a reliable cooling and heat dissipation function, so that all electronic components 12 can maintain a normal operating temperature and meet the usage requirements. In addition, it also makes the appearance of the packaged PCBA component 10 more beautiful and neat.

[0040] In this embodiment, the sealant can be selected from polyurethane adhesive, epoxy resin, silicone, acrylic, polyamide, etc. Preferably, the sealant is selected so that it can cure within seconds after being injected into the dispensing cavity 21, thus saving time in encapsulating electronic components 12 and improving encapsulation efficiency.

[0041] In an optional embodiment, electronic components 12 are provided on both the front and back surfaces of the PCB board 11. Before injecting sealant, the PCB board 11 is positioned at the middle of the height direction of the limiting member 20. A sealing layer 30 is provided on both the front and back surfaces of the PCB board 11. The electronic components 12 on one side can be encapsulated first. After the sealant is injected on one side and cured, the limiting member 20 is flipped over to encapsulate the electronic components 12 on the other side. In this way, the electronic components 12 on both the front and back surfaces of the PCB board 11 are encapsulated.

[0042] Furthermore, such as Figure 3 As shown, multiple electronic components 12 are provided, and the number of electronic components 12 on the front and back surfaces of the PCB board 11 is different. Preferably, the electronic components 12 on the side with a relatively larger number on the PCB board 11 are first encapsulated to form a sealing layer 30, and then the electronic components 12 on the side with a relatively smaller number on the PCB board 11 are encapsulated so that the two sealing layers 30 are sandwiched between the front and back surfaces of the PCB board 11.

[0043] Furthermore, in this embodiment, the limiting member 20 is interference-fitted with the PCB board 11, so that when the PCB board 11 is installed inside the limiting member 20, it can be locked in a position that facilitates glue injection.

[0044] In a preferred embodiment, such as Figure 3 As shown, the maximum thickness of the electronic components 12 on one side surface of the PCB board 11 is H, in mm. The thickness of the sealing layer 30 on the same side is 1.4H to 1.6H. This ensures reliable encapsulation and avoids waste of sealant or excessive thickness of the encapsulated structure, which would occupy too much space.

[0045] Preferably, in this embodiment, the inner wall of the limiting member 20 is provided with a scale, which has a graduation value to show the thickness of the sealing layer 30. This can help the glue injector to observe the amount of glue injected and ensure that the thickness of the formed sealing layer 30 is within the required range.

[0046] In this embodiment, the inner wall of the limiting member 20 is provided with a release layer, and the sealant can contact the release layer, so that the PCBA part 10 can be demolded from the limiting member 20 after the sealing layer 30 is formed. The release layer can be a release agent coated inside the limiting member 20, so that the sealing layer 30 can be separated from the limiting member 20 after the sealant cures to form the sealing layer 30.

[0047] Preferably, the limiting member 20 is made of plastic, such as PC (polycarbonate) or ABS (acrylonitrile-styrene-butadiene copolymer), and the debonding layer is a metal layer, such as a zinc-plated or nickel-plated layer, so as to ensure that the sealant can be smoothly separated from the limiting member 20 after curing to form the sealing layer 30 while reducing costs.

[0048] In other alternative embodiments, the limiting member 20 is made of metal, such as steel, so that the inner wall of the limiting member 20 is made of metal, which also facilitates the separation of the sealing layer 30 from the limiting member 20.

[0049] According to the vehicle-mounted PCBA sealing structure of this utility model, the PCBA component includes a PCB board and electronic components disposed on the PCB board; a limiting member is formed as a frame structure surrounding the circumferential edge of the PCB board, and the inner wall of the limiting member is fitted to the PCB board, such that the inner wall of the limiting member and the PCB board form a glue injection cavity, the depth of which is greater than the height of the electronic components in the thickness direction of the PCB board; sealant is filled into the glue injection cavity to form a sealing layer on the surface of the PCB board, the shape of which is the same as the shape of the PCB board, and the thickness of which is greater than the height of the electronic components, thereby achieving sealing of all electronic components on the PCB board. Effectively prevents dust, moisture, oxides, or corrosive substances from corroding electronic components, thereby extending the service life of PCBA components. It can also protect confidential electronic components. Furthermore, it improves the reliability of electronic components fixed to the PCB board, providing a secure and shock-absorbing effect to prevent components from falling off or being damaged during vibration, ensuring the stability and reliability of PCBA components and extending their service life. The sealant also has insulating properties and increases the heat transfer capacity of electronic components, preventing interference and short circuits between different circuits in the PCBA component, and has a reliable cooling and heat dissipation effect, allowing all electronic components to maintain a normal operating temperature and meet usage requirements.

[0050] The second aspect of this utility model provides a vehicle equipped with an on-board PCBA sealing structure. The sealing performance, heat dissipation effect, shock absorption effect, and insulation performance of the on-board PCBA sealing structure are effectively improved, thereby enhancing the stability and service life of the PCBA components, improving the user's driving experience, and making the vehicle's performance more stable.

[0051] Finally, it should be noted that the above-described embodiments are merely specific implementations of this application, used to illustrate the technical solutions of this application, and not to limit them. The protection scope of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the technical scope disclosed in this application. Such modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be covered within the protection scope of this application. Therefore, the protection scope of this application should be determined by the protection scope of the claims.

Claims

1. A vehicle-mounted PCBA sealing structure, characterized in that, The vehicle-mounted PCBA sealing structure includes: PCBA components include a PCB board and electronic components mounted on the PCB board; The limiting member is formed as a frame structure surrounding the circumferential edge of the PCB board. The inner wall of the limiting member is fitted to the PCB board, so that the inner wall of the limiting member and the PCB board form a glue injection cavity. The depth dimension of the glue injection cavity is greater than the height dimension of the electronic component in the thickness direction of the PCB board. A sealant is filled into the injection cavity to form a sealing layer on the surface of the PCB board. The shape of the sealing layer is the same as that of the PCB board, and the thickness of the sealing layer is greater than the height of the electronic component.

2. The PCBA seal for an in-vehicle application of claim 1, wherein, The inner wall of the limiting component is provided with a scale.

3. The PCBA seal for an in-vehicle application of claim 1, wherein, The electronic components are provided on both the front and back surfaces of the PCB board, the PCB board is located at the middle position in the height direction of the limiting member, and the sealing layer is provided on both the front and back surfaces of the PCB board.

4. The vehicle-mounted PCBA sealing structure according to claim 3, characterized in that, The electronic components are provided in multiple ways, and the number of the electronic components on the front and back surfaces of the PCB board is different.

5. The vehicle-mounted PCBA sealing structure according to claim 1, characterized in that, The inner wall of the limiting member is provided with a degumming layer, and the sealant can come into contact with the degumming layer.

6. The vehicle-mounted PCBA sealing structure according to claim 5, characterized in that, The limiting component is a plastic part, and the degumming layer is a metal layer.

7. The vehicle-mounted PCBA sealing structure according to claim 1, characterized in that, The maximum thickness of the electronic components on one side surface of the PCB board is H, and the thickness of the sealing layer on the same side is 1.4H to 1.6H.

8. The vehicle-mounted PCBA sealing structure according to claim 1, characterized in that, The limiting member is formed as a frame structure surrounded by a plate-like structure, the thickness of which is greater than the thickness of the PCB board.

9. The vehicle-mounted PCBA sealing structure according to claim 1, characterized in that, The limiting component is interference-fitted with the PCB board.

10. A vehicle, characterized in that, Includes the vehicle-mounted PCBA sealing structure as described in any one of claims 1 to 9.

Images