Heat sinks and electronic devices using them

Abstract

This utility model discloses a heat sink and an electronic device using the same. The electronic device includes a circuit board, a first heat dissipation structure, and a second heat dissipation structure. The first heat dissipation structure is disposed on the circuit board and includes a first base and a first electronic component. The first base has opposing first and second surfaces, and the first electronic component is disposed on the first base and electrically connected to the circuit board. The second heat dissipation structure is disposed on the circuit board and includes a second base and a second electronic component. The second base has opposing third and fourth surfaces. The second electronic component is disposed on the second base and electrically connected to the circuit board. A channel is formed between the second and third surfaces, extending in one direction.

Description

Technical Field

[0001] This utility model relates to a heat sink and an electronic device using the same. Background Technology

[0002] Conventional electronic devices include at least one electronic component. The operation of electronic components inevitably generates heat; therefore, how to dissipate this heat is one of the goals pursued by those in this technical field. Utility Model Content

[0003] An embodiment of this utility model discloses an electronic device. The electronic device includes a circuit board, a first heat dissipation structure, and a second heat dissipation structure. The first heat dissipation structure is disposed on the circuit board and includes a first base and a first electronic component. The first base has a first surface and a second surface facing each other. The first electronic component is disposed on the first base and electrically connected to the circuit board. The second heat dissipation structure is disposed on the circuit board and includes a second base and a second electronic component. The second base has a third surface and a fourth surface facing each other. The second electronic component is disposed on the second base and electrically connected to the circuit board. A channel is formed between the second surface and the third surface, and the channel extends along a first direction.

[0004] In one example, the first base and the second base do not overlap in a second direction different from the first direction, the first electronic component is disposed on the first surface, and the second electronic component is disposed on the third surface.

[0005] In one example, a first height is provided between the first base and a surface of the circuit board, and a second height is provided between the second base and the surface of the circuit board, wherein the first height is less than the second height.

[0006] In one example, the first base and the second base overlap at least partially in a second direction different from the first direction, the first electronic component is disposed on the first surface, the second electronic component is disposed on the fourth surface, and the first electronic component and the second electronic component overlap at least partially in the second direction.

[0007] In one example, the electronic device further includes a spacer. The spacer corresponds to a channel disposed between the first base and the second base.

[0008] In one example, a portion of the first base is in direct contact with a portion of the second base.

[0009] In one example, the first heat dissipation structure further includes an extension connected to the first base, at least a portion of which is located above the first electronic component.

[0010] In one example, the channel has a width in a second direction different from the first direction, and the first base has a first thickness in the second direction, wherein the ratio of the first thickness to the width is between 0.75 and 5.

[0011] In one example, the electronic device further includes a plug disposed between the first heat dissipation structure and the second heat dissipation structure.

[0012] In one example, the first insert has an angle with either the first base or the second base.

[0013] In one example, the electronic device further includes a connector. The connector connects the first base and the second base, wherein the first base, the second base, and the connector are integrally formed.

[0014] In one example, the first electronic component is disposed on the first surface, and the ratio of the surface area of ​​the first electronic component covering the first surface to the surface area of ​​the first surface is less than or equal to 50%.

[0015] In one example, the electronic device further includes a first convection device that is thermally coupled to the channel.

[0016] In one example, the electronic device further includes a second convection device, with the first and second convection devices arranged side by side, and a channel correspondingly located between the first and second convection devices.

[0017] Another embodiment of this utility model provides a heat sink. The heat sink includes a first vertical member and a horizontal member. The first vertical member has a channel and a first side surface and a second side surface opposite to each other, wherein the channel is located between the first side surface and the second side surface. The horizontal member connects to the first vertical member.

[0018] In one example, the first straight element has a third side and a fourth side, with the channel extending from the third side to the fourth side.

[0019] In one example, the first straight member includes a first sub-straight portion and a second sub-straight portion. The first sub-straight portion has a first side surface. The second sub-straight portion has a second side surface. The first sub-straight portion and the second sub-straight portion are separately configured, and a channel is formed between the first sub-straight portion and the second sub-straight portion.

[0020] In one example, the heat sink further includes a spacer. The spacer is disposed between the first sub-vertical portion and the second sub-vertical portion to form a channel.

[0021] In one example, the first sub-vertical portion has a fifth side opposite to the first side, and the heat sink further includes a spacer. The spacer is disposed on the fifth side and protrudes relative to the fifth side.

[0022] In one example, the first vertical part and the spacer are integrally formed.

[0023] In one example, the first sub-vertical portion has a recess that is recessed relative to the first side surface and corresponds in position to the spacer.

[0024] In one example, the transverse member has an upper surface, and the heat sink further includes a second vertical member. The second vertical member is connected to the upper surface of the transverse member and protrudes relative to the upper surface.

[0025] In one example, the first linear element has a thickness, and the width of the channel is no greater than the thickness.

[0026] In one example, the first vertical component and the second vertical component are integrally formed structures.

[0027] Another embodiment of this utility model provides an electronic device. The electronic device includes the aforementioned heat sink, convection device, and electronic components. The convection device and the heat sink are arranged in a straight line. The electronic components are disposed on a first side or a second side.

[0028] In one example, the electronic components are not located within the channel.

[0029] In one example, the first linear element has a first end face near the convection device and a second end face away from the convection device, with the channel extending from the first end face to the second end face.

[0030] Another embodiment of this utility model provides a heat sink. The heat sink includes a vertical member and a horizontal member. The horizontal member is connected to the vertical member. A channel is formed between the vertical member and the horizontal member.

[0031] In one example, the vertical component and the horizontal component are integrally formed.

[0032] In one example, the heat sink further includes an electronic component. The electronic component is disposed on the transverse member and located within the channel.

[0033] Another embodiment of this utility model provides an electronic device. The electronic device includes a circuit board and at least two of the aforementioned convection devices. The convection devices are disposed on the circuit board. The lateral members of one of the two heat sinks are different in height from the lateral members of the other of the two heat sinks.

[0034] To provide a better understanding of the above and other aspects of this utility model, specific embodiments are described below in conjunction with the accompanying drawings: Attached Figure Description

[0035] Figure 1 Figure 1 A schematic diagram of a heat sink according to an embodiment of the present invention is shown.

[0036] Figure 2A A schematic diagram of a heat sink according to another embodiment of the present invention is shown.

[0037] Figure 2B Draw Figure 2A An exploded view of the radiator.

[0038] Figure 3 Draw Figure 2A The front view of the heat sink as seen along the +X axis.

[0039] Figure 4A Draw Figure 3 A cross-sectional view of the radiator along direction 4A-4A'.

[0040] Figure 4B Draw Figure 3 A cross-sectional view of the radiator along direction 4B-4B'.

[0041] Figure 4C Draw Figure 3 A cross-sectional view of the radiator along the direction 4C-4C'.

[0042] Figure 4D Draw Figure 3 A cross-sectional view of the heat sink along the direction 4D-4D'.

[0043] Figure 4E Draw Figure 3 A cross-sectional view of the radiator along the direction 4E-4E'.

[0044] Figure 5A A schematic diagram of a heat sink according to another embodiment of the present invention is shown;

[0045] Figure 5B Draw Figure 5A An exploded view of the radiator.

[0046] Figure 6 Draw Figure 5A The front view of the heat sink as seen along the +X axis.

[0047] Figure 7A Draw Figure 6 A cross-sectional view of the radiator along direction 7A-7A'.

[0048] Figure 7B Draw Figure 6 A cross-sectional view of the radiator along direction 7B-7B'.

[0049] Figure 7C Draw Figure 6 A cross-sectional view of the radiator along the direction 7C-7C'.

[0050] Figure 8A A schematic diagram of a radiator 400 according to another embodiment of the present invention is shown.

[0051] Figure 8B Draw Figure 8AAn exploded view of the radiator.

[0052] Figure 9 Draw Figure 8A The front view of the heat sink as seen along the +X axis.

[0053] Figure 10A Draw Figure 9 A cross-sectional view of the radiator along direction 10A-10A'.

[0054] Figure 10B Draw Figure 9 A cross-sectional view of the radiator along the direction 10B-10B'.

[0055] Figure 10C Draw Figure 9 A cross-sectional view of the radiator along the direction 10C-10C'.

[0056] Figure 10D Draw Figure 9 A cross-sectional view of the radiator along the direction 10D-10D'.

[0057] Figure 11 A schematic diagram of a heat sink according to another embodiment of the present invention is shown.

[0058] Figure 12 Draw Figure 11 The front view of the heat sink as seen along the +X axis.

[0059] Figure 13 Draw Figure 12 A cross-sectional view of the radiator along direction 13-13'.

[0060] Figure 14 A schematic diagram of a heat sink according to another embodiment of the present invention is shown.

[0061] Figure 15A A schematic diagram of a heat sink according to another embodiment of the present invention is shown.

[0062] Figure 15B Draw Figure 15A An exploded view of the radiator.

[0063] Figure 16 Draw Figure 15A The front view of the heat sink as seen along the +X axis.

[0064] Figure 17A Draw Figure 16 A cross-sectional view of the radiator along direction 17A-17A'.

[0065] Figure 17B Draw Figure 16 A cross-sectional view of the radiator along direction 17B-17B'.

[0066] Figure 18A A schematic diagram of a heat sink according to another embodiment of the present invention is shown.

[0067] Figure 18B Draw Figure 18A An exploded view of the radiator.

[0068] Figure 19 Draw Figure 18A The front view of the heat sink as seen along the +X axis.

[0069] Figure 20A Draw Figure 19 A cross-sectional view of the radiator along the direction 20A-20A'.

[0070] Figure 20B Draw Figure 19 A cross-sectional view of the radiator along the direction 20B-20B'.

[0071] Figures 21A-21C Schematic diagrams of an electronic device 1 according to an embodiment of the present invention are shown from different perspectives.

[0072] Figure 22A A schematic diagram of an electronic device according to an embodiment of the present invention is shown.

[0073] Figure 22B Draw Figure 22A An exploded view of the electronic device.

[0074] Figures 23A-23B Figure 22A Schematic diagrams of the electronic device from different perspectives.

[0075] Figure 24A Draw Figure 23A A cross-sectional view of the electronic device along direction 24A-24A'.

[0076] Figure 24B Draw Figure 23A A cross-sectional view of the electronic device along direction 24B-24B'.

[0077] Figure 25 A schematic diagram of a heat sink according to another embodiment of the present invention is shown.

[0078] Figure 26A and 26B Draw Figure 25 Exploded views of the heat sink from different perspectives.

[0079] In the attached figures, the following labels are used:

[0080] 1,2: Electronic devices;

[0081] 10: First electronic component;

[0082] 20: Second electronic component;

[0083] 11,21: Circuit board;

[0084] 12: Convection device;

[0085] 12a: Export;

[0086] 100, 200, 300, 400, 500, 600, 700, 800, 900A, 900B, 900C, 1000, 1100: Radiator;

[0087] 100C, 200C, 300C, 400C, 500C, 700C, 800C, 900BC, 900C1, 1000C, 1100C: Channels;

[0088] 110,210,310,410,510,710,810,910,1010: Vertical components;

[0089] 110s1,210s1,310s1,410s1,510s1,710s1,810s1: First side view;

[0090] 110s², 210s², 310s², 410s², 510s², 710s², 810s²: Second side surface;

[0091] 111,211,311,411,511,711,811,911: First sub-direction;

[0092] 112,212,312,412,512,712,812,912,912: Second sub-direction;

[0093] 120, 220, 320, 420, 520, 720, 820, 1020: Horizontal components;

[0094] 121,221A,221B,421A,421B,711,821: First sub-horizontal part;

[0095] 122,222A,222B,722,822: Second sub-horizontal part;

[0096] 130: First fastener;

[0097] 140: Second fastener;

[0098] 210s3, 310s3, 410s3, 510s3, 710s3, 810s3, 910s3: Third side;

[0099] 210s4, 310s4, 410s4, 510s4, 710s4, 810s4, 910s4: Fourth side;

[0100] 210s5,310s5,410s5,510s5,710s5,710s6: Fifth side view;

[0101] 210s6, 310s6, 410s6, 510s6, 710s6, 810s6: Sixth side;

[0102] 211a: First fixing hole;

[0103] 211a1: First hole;

[0104] 211a2: Second hole;

[0105] 211b, 212b, 1010b: Bottom surface;

[0106] 212a: Second fixing hole;

[0107] 250, 350, 450, 550, 750: Spacers;

[0108] 251: Spacing section;

[0109] 252: First protrusion;

[0110] 2521: Connecting segment;

[0111] 2522: Limiting segment;

[0112] 253: Second protrusion;

[0113] 260: Insert;

[0114] 261: Ontology;

[0115] 262: Insert;

[0116] 311r, 411r, 511r: concave part;

[0117] 350s: Contact surface;

[0118] 421Aa, 421Ba: First through hole;

[0119] 821u: Top surface;

[0120] 821b: Lower surface;

[0121] 830: Second vertical component;

[0122] 1020b: Lower surface;

[0123] 1020u: Top surface;

[0124] 1110: First heat dissipation structure;

[0125] 1111: First base;

[0126] 1120: Second heat dissipation structure;

[0127] 1121: Second base;

[0128] 1111s1: First page;

[0129] 1111s2: Second side;

[0130] 1121s1: Third side;

[0131] 1121s2: Fourth page;

[0132] H1: First altitude;

[0133] H2: Second altitude;

[0134] G: Airflow;

[0135] t1, t2: thickness;

[0136] W1, W2, W3, W4, W5, W6, W7, W8, W10, W11: Width;

[0137] X, Y, Z: Axes. Detailed Implementation

[0138] Please refer to Figure 1 The diagram illustrates a heat sink 100 according to an embodiment of the present invention.

[0139] like Figure 1 As shown, the heat sink 100 includes a first vertical member 110, a horizontal member 120, a first fixing member 130, and a second fixing member 140. The first vertical member 110 has a channel 100C and opposing first side surfaces 110s1 and 110s2, wherein the channel 100C is located between the first side surfaces 110s1 and 110s2. The horizontal member 120 connects to the first vertical member 110. In this embodiment, the channel 100C of the first vertical member 110 allows an airflow to pass through to dissipate heat from the first electronic component 10 and the second electronic component 20. The channel 100C can increase the surface area of ​​the heat sink 100, allowing more heat absorbed by the heat sink 100 to convect through the sidewalls of the channel 100C into the channel 100C.

[0140] The term "vertical" as used herein refers, for example, to a direction parallel to the Z-axis, while "lateral" refers, for example, to a direction parallel to the X-axis. The Z-axis is, for example, the direction in which the heatsink 100 is inserted into a circuit board (not shown) or the direction perpendicular to it, while the X-axis is substantially perpendicular to the Z-axis, for example, in a horizontal direction. In another embodiment, the "vertical" direction may form an acute angle with the Z-axis, and the "lateral" direction may form an acute angle with the X-axis, wherein the acute angle may be greater than 0 degrees but less than 3 degrees, or may be larger. In another embodiment, the angle between the "vertical" and "lateral" directions may be between 80 degrees (including endpoint values) and 100 degrees (including endpoint values), for example, 90 degrees. The "vertical" and "lateral" directions in this embodiment are not limited to being perpendicular to each other.

[0141] In addition, channel 100C has a width W1, which is, for example, a dimension parallel to the X-axis. The width W1 is, for example, between 0.5 mm and 4.0 mm, but may also be larger or smaller.

[0142] like Figure 1 As shown, the first straight member 110 is, for example, a multi-piece structure. For instance, the first straight member 110 includes a first sub-straight portion 111 and a second sub-straight portion 112. The first sub-straight portion 111 has a first side surface 110s1, and the second sub-straight portion 112 has a second side surface 110s2. The first sub-straight portion 111 and the second sub-straight portion 112 are separable, and a channel 100C is provided between them. In one embodiment, the first sub-straight portion 111 and the second sub-straight portion 112 can be formed individually and then assembled together using techniques such as snap-fitting, welding, bonding, screwing, or a combination thereof. In another embodiment, the first sub-straight portion 111 and the second sub-straight portion 112 can be an integrally formed structure, and the channel 100C is, for example, a through hole in an integrally formed structure. Furthermore, the first sub-vertical portion 111 and the second sub-vertical portion 112 may be equal or different in length (e.g., along the Z-axis).

[0143] like Figure 1 As shown, when the heat sink 100 is disposed on a circuit board, the first sub-vertical portion 111 and / or the second sub-vertical portion 112 can be inserted into the circuit board, or the first sub-vertical portion 111 and / or the second sub-vertical portion 112 can abut against a surface of the circuit board. When the first sub-vertical portion 111 and / or the second sub-vertical portion 112 is inserted into the circuit board, the first sub-vertical portion 111 and / or the second sub-vertical portion 112 may or may not protrude from the bottom surface of the circuit board.

[0144] In one embodiment, the aforementioned width W1 is, for example, not greater than the thickness of the vertical member 110 or the horizontal member 120. For example, the width W1 is not greater than the thickness t1 of the first sub-vertical portion 111, the thickness t2 of the second sub-vertical portion 112, the thickness t3 of the first sub-horizontal portion 121, or the thickness t4 of the second sub-horizontal portion 122. In another embodiment, the width W1 may be greater than the thickness t1 of the first sub-vertical portion 111, the thickness t2 of the second sub-vertical portion 112, the thickness t3 of the first sub-horizontal portion 121, or the thickness t4 of the second sub-horizontal portion 122. In one embodiment, the ratio of the aforementioned thickness (any one of t1 to t4) to the width W1 of the channel 100C may be, for example, between 0.75 and 5, but may also be larger or smaller. In one embodiment, the ratio of the thickness t1 of the first sub-vertical portion 111 to the width W1 of the channel 100C may be, for example, between 0.75 and 5, or the ratio of the thickness t2 of the second sub-vertical portion 112 to the width W1 of the channel 100C may be, for example, between 0.75 and 5. Due to the channel's size design, the airflow velocity through the channel 100C is high, increasing thermal convection efficiency. In one embodiment, one of the thicknesses t1 and t2 is, for example, between 1.5 mm and 4 mm. In one combination, the thickness (t1 or t2) is, for example, 1.5 mm, and the width W1 is, for example, 1 mm. In another combination, the thickness (t1 or t2) is, for example, 1.5 mm, and the width W1 is, for example, 2 mm. In other combinations, the thickness (t1 or t2) is, for example, 4 mm, and the width W1 is, for example, 3 mm. The thickness and width of the heat sink in other embodiments of this invention have the same or similar characteristics, and will not be described further here.

[0145] like Figure 1 As shown, the lateral member 120 includes at least one first sub-lateral portion 121 and at least one second sub-lateral portion 122. The first sub-lateral portion 121 may connect to the first sub-vertical portion 111 of the first vertical member 110. For example, the first sub-lateral portion 121 may connect to the first side surface 110s1 of the first sub-vertical portion 111 of the first vertical member 110 and protrude relative to the first side surface 110s1. The second sub-lateral portion 122 may connect to the second sub-vertical portion 112 of the first vertical member 110. For example, the second sub-lateral portion 122 may connect to the second side surface 110s2 of the second sub-vertical portion 112 of the first vertical member 110 and protrude relative to the second side surface 110s2. In this embodiment, the first sub-lateral portion 121 and the second sub-lateral portion 122 extend in opposite directions. However, in another embodiment, the first sub-lateral portion 121 and the second sub-lateral portion 122 may extend in the same direction (e.g., +X-axis or -X-axis).

[0146] like Figure 1As shown, the first electronic component 10 and / or the second electronic component 20 are, for example, heat sources in an electronic device. In one embodiment, the first electronic component 10 and / or the second electronic component 20 may individually be a metal-oxide-semiconductor field-effect transistor, a metal-oxide-semiconductor field-effect transistor (MOSFET), a magnetic component, a rectifier, a capacitor, a connector, a slot, a resistor, a chip, and / or an inductor.

[0147] like Figure 1 As shown, the first electronic component 10 and the second electronic component 20 can be disposed in the first straight member 110. For example, the first electronic component 10 is disposed in the first sub-straight portion 111 of the first straight member 110, and the second electronic component 20 is disposed in the second sub-straight portion 112 of the first straight member 110. The first electronic component 10 can be disposed in the first side 110s1, and the second electronic component 20 can be disposed in the second side 110s2. In this embodiment, the first electronic component 10 and / or the second electronic component 20 may not be disposed in the channel 100C. The first fixing member 130 can pass through the first electronic component 10, the first sub-straight portion 111 of the first straight member 110, the second sub-straight portion 112 of the first straight member 110, and the second electronic component 20, and is fixed to the second fixing member 140, so that the first sub-straight portion 111 and the second sub-straight portion 112 can be constrained between the first fixing member 130 and the second fixing member 140. In one embodiment, the first electronic component 10 and the second electronic component 20 may also be sub-components of the heat sink 100.

[0148] In one embodiment, the first fastener 130 is, for example, a bolt, while the second fastener 140 is, for example, a nut.

[0149] In summary, the heat sink 100 includes a first heat dissipation structure and a second heat dissipation structure. The first heat dissipation structure includes a first base (corresponding to the first sub-vertical portion 111) and a first electronic component 10, while the second heat dissipation structure includes a second base (corresponding to the second sub-vertical portion 112) and a second electronic component 20. The first base has opposing first surfaces (corresponding to the first side surface 110s1) and second surfaces, and the first electronic component 10 is disposed on the first base and electrically connected to a circuit board (not shown). The second base has opposing third surfaces and fourth surfaces (corresponding to the second side surface 110s2), and the second electronic component 20 is disposed on the second base and electrically connected to a circuit board (not shown). A channel 100C is provided between the second surface and the third surface, and the channel 100C can extend along the Y-axis. In one embodiment, the first base and the second base at least partially overlap on the X-axis, which is different from the Y-axis. A first electronic component 10 is disposed on a first surface, and a second electronic component 20 is disposed on a fourth surface, with the first electronic component 10 and the second electronic component 20 at least partially overlapping on the X-axis. In one embodiment, the first heat dissipation structure further includes at least one first extension (corresponding to the first sub-lateral portion 121) connected to the first base, with at least a portion of the first extension located above the first electronic component 10. Similarly, the second heat dissipation structure further includes at least one second extension (corresponding to the second sub-lateral portion 122) connected to the second base, with at least a portion of the second extension located above the second electronic component 20. In one embodiment, the channel 100C has a width W1 on the X-axis, which is different from the Y-axis, and the first base has a thickness t1 on the X-axis, wherein the ratio of thickness t1 to width W1 can be between 0.75 and 5. Similarly, the second base has a thickness on the X-axis, wherein the ratio of thickness to width W1 can be between 0.75 and 5.

[0150] Please refer to Figures 2A-4E , Figure 2A A schematic diagram of a heat sink 200 according to another embodiment of the present invention is shown. Figure 2B Draw Figure 2A Exploded view of the radiator 200. Figure 3 Draw Figure 2A The front view of the radiator 200 viewed along the +X axis. Figure 4A Draw Figure 3 A cross-sectional view of the radiator 200 along direction 4A-4A'. Figure 4B Draw Figure 3 A cross-sectional view of the radiator 200 along direction 4B-4B'. Figure 4C Draw Figure 3 A cross-sectional view of the radiator 200 along the direction 4C-4C'. Figure 4D Draw Figure 3 A cross-sectional view of the heat sink 200 along the direction 4D-4D', and Figure 4E Draw Figure 3A cross-sectional view of the radiator 200 along the direction 4E-4E'.

[0151] like Figure 2A and Figure 2B As shown, the heat sink 200 includes a first linear member 210, a transverse member 220, at least one first fixing member 130, at least one second fixing member 140, at least one spacer 250, and at least one insertion member 260. The first linear member 210 has a channel 200C and opposing first side surfaces 210s1 and 210s2, wherein the channel 200C is located between the first side surfaces 210s1 and 210s2. The transverse member 220 connects to the first linear member 210. In this embodiment, the channel 200C of the first linear member 210 allows an airflow to pass through to dissipate the heat generated by the first electronic component 10 and the second electronic component 20. The channel 200C can increase the surface area of ​​the heat sink 200, allowing more heat absorbed by the heat sink 200 to convect through the sidewalls of the channel 200C into the channel 200C.

[0152] like Figures 2A-2B As shown, the first straight member 210 is, for example, a multi-piece structure. For instance, the first straight member 210 includes a first sub-straight portion 211 and a second sub-straight portion 212. The first sub-straight portion 211 has a first side surface 210s1, and the second sub-straight portion 212 has a second side surface 210s2. The first sub-straight portion 211 and the second sub-straight portion 212 are separably configured, and a channel 200C is provided between the first sub-straight portion 211 and the second sub-straight portion 212. In one embodiment, the first sub-straight portion 211 and the second sub-straight portion 212 can be formed individually and then assembled together using techniques such as snap-fitting, welding, bonding, screwing, or a combination thereof. In another embodiment, the first sub-straight portion 211 and the second sub-straight portion 212 can be an integrally formed structure, and the channel 200C is, for example, a through hole in an integrally formed structure. Furthermore, the first sub-vertical portion 211 and the second sub-vertical portion 212 may be equal or different in length (e.g., along the Z-axis).

[0153] like Figure 2A and Figure 4CAs shown, channel 200C has a width W2, which is, for example, a dimension parallel to the X-axis. The width W2 has a dimension range similar to the aforementioned width W1, which will not be described again here. Furthermore, the first straight member 210 has opposing third side (or first end face) 210s3 and fourth side 210s4 (or second end face). In this embodiment, the first sub-straight portion 211 of the first straight member 210 has the aforementioned third side 210s3 and fourth side 210s4, which are adjacent to the first side 210s1. In another embodiment, the second sub-straight portion 212 of the first straight member 210 has the aforementioned third side 210s3 and fourth side 210s4, which are adjacent to the second side 210s2. Channel 200C may extend from the third side 210s3 to the fourth side 210s4. In one embodiment, when the heat sink 200 is disposed on the circuit board (not shown) of the electronic device, one of the third side 210s3 and the fourth side 210s4 of the first straight member 110 may face and / or be adjacent to the convection device of the electronic device, thereby reducing the flow resistance of the airflow generated by the convection device through the channel 200C.

[0154] like Figures 2A-2B As shown, the transverse member 220 includes at least one first sub-transverse portion (e.g., first sub-transverse portions 221A and 221B) and at least one second sub-transverse portion (e.g., second sub-transverse portions 222A and 222B). The first sub-transverse portions 221A and 221B can be connected to the first sub-vertical portion 211 of the first vertical member 210. For example, the first sub-transverse portions 221A and 221B can be connected to the first side surface 210s1 of the first sub-vertical portion 211 of the first vertical member 210 and protrude relative to the first side surface 210s1. The second sub-transverse portions 222A and 222B can be connected to the second sub-vertical portion 212 of the first vertical member 210. For example, the second sub-transverse portions 222A and 222B can be connected to the second side surface 210s2 of the second sub-vertical portion 212 of the first vertical member 210 and protrude relative to the second side surface 210s2. In this embodiment, the first sub-lateral portions 221A and 221B and the second sub-lateral portions 222A and 222B extend in opposite directions. However, in another embodiment, the first sub-lateral portions 221A and 221B and the second sub-lateral portions 222A and 222B may extend in the same direction (e.g., +X-axis or -X-axis). In other embodiments, the sub-lateral portions may extend along an extension direction, which may be parallel to the X-axis, or parallel to the XY plane but with an angle greater than 0 with respect to the X-axis. In other embodiments, the two extension directions of all sub-lateral portions may be the same or different.

[0155] like Figure 2AAs shown, a space is provided between the first sub-lateral portion 221A and the second sub-lateral portion 221B. The extending direction of this space is approximately the same as the extending direction of the channel 200C, allowing airflow to pass through and dissipate the heat generated by the first electronic component 10 and the second electronic component 20. Similarly, a space is provided between the first sub-lateral portions 222A and 222B. The extending direction of this space is approximately the same as the extending direction of the channel 200C, allowing airflow to pass through and dissipate the heat generated by the first electronic component 10 and the second electronic component 20.

[0156] like Figures 2A-2B As shown, the first sub-lateral portions 221A and 221B are not positioned at the same height. For example, the height of the first sub-lateral portion 221A along the Z-axis is lower than that of the first sub-lateral portion 221B. By adding sub-lateral portions at different heights, the surface area of ​​the lateral member can be increased, allowing more of the heat sink 200's suction capacity to be transferred to the external environment through convection of the lateral member. Similarly, the second sub-lateral portions 222A and 222B are not positioned at the same height, and the resulting technical benefits are similar to those of the first sub-lateral portions 221A and 221B, which will not be described further here.

[0157] like Figure 4D and Figure 4E As shown, the first sub-lateral portions 221A and 221B may be staggered along the Y-axis and / or the first sub-lateral portions 221A and 221B may not overlap at all along the Z-axis. In another embodiment, the first sub-lateral portions 221A and 221B may partially overlap along the Z-axis. Similarly, the second sub-lateral portions 222A and 222B may be staggered along the Y-axis and / or the second sub-lateral portions 222A and 222B may not overlap at all along the Z-axis. In another embodiment, the second sub-lateral portions 222A and 222B may partially overlap along the Z-axis.

[0158] like Figures 4A-4C As shown, the first sub-lateral portion and the second sub-lateral portion may be different in length. For example, the second sub-lateral portions 222A and 222B have a longer length along the X-axis than the first sub-lateral portions 221A and 221B. In another embodiment, the first sub-lateral portion and the second sub-lateral portion may be equal in length. Furthermore, the lengths of two of a plurality of first sub-lateral portions may be equal or different, and / or the lengths of two of a plurality of second sub-lateral portions may be equal or different.

[0159] In one embodiment, the first sub-lateral portions 221A and 221B and the first sub-vertical portion 211 are, for example, integrally formed structures, and / or the second sub-lateral portions 222A and 222B and the second sub-vertical portion 212 are, for example, integrally formed structures. In terms of manufacturing process, a sheet metal can be bent, stamped, or subjected to a combination of these processes to form an integral structure including the first sub-lateral portions 221A and 221B and the first sub-vertical portion 211. Similarly, a sheet metal can be bent, stamped, or subjected to a combination of these processes to form an integral structure including the second sub-lateral portions 222A and 222B and the second sub-vertical portion 212. Compared to aluminum extrusion heat sinks, the heat sink 200 of this embodiment is lighter (e.g., at least 30% lighter) and / or has lower manufacturing costs (e.g., at least 25% lower costs).

[0160] In summary, as long as the heat dissipation surface area of ​​the radiator 200 can be increased, the present utility model embodiment does not limit the structure, size and / or quantity of the first straight member 210 and / or the transverse member 220, nor does it limit the structure, size and / or quantity of these sub-straight portions of the first straight member 210 and / or these sub-transverse portions of the transverse member 220.

[0161] like Figure 2A and Figure 4C As shown, the first electronic component 10 and the second electronic component 20 can be disposed in the first straight member 210. For example, the first electronic component 10 is disposed in the first sub-straight portion 211 of the first straight member 210, and the second electronic component 20 is disposed in the second sub-straight portion 212 of the first straight member 210. The first fixing member 130 can pass through the first electronic component 10, the first sub-straight portion 211 of the first straight member 210, the second sub-straight portion 212 of the first straight member 210, and the second electronic component 20, and is fixed to the second fixing member 140, so that the first sub-straight portion 211 and the second sub-straight portion 212 can be constrained between the first fixing member 130 and the second fixing member 140.

[0162] like Figure 3 and Figure 4A As shown, the first electronic component 10 includes at least one pin 10A, which protrudes relative to the bottom surface 211b of the first sub-vertical portion 211. When the heat sink 200 is disposed on a circuit board (not shown), the pin 10A can be inserted into the circuit board. Similarly, the second electronic component 20 includes at least one pin 20A, which protrudes relative to the bottom surface 212b of the second sub-vertical portion 212. When the heat sink 200 is disposed on a circuit board (not shown), the pin 20A can be inserted into the circuit board.

[0163] like Figure 2AAs shown, the first electronic component 10 is disposed on the first side surface 210s1, and the ratio of the surface area of ​​the first electronic component 10 covering the first side surface 210s1 (e.g., the contact or overlap area between the first electronic component 10 and the first side surface 210s1) to the surface area of ​​the first side surface 210s1 can be less than or equal to 50%, for example, between 25% and 40%. Other embodiments of the heat sink of this utility model have the same or similar features, which will not be described again below.

[0164] like Figure 4C As shown, a spacer 250 can be disposed between a first side surface 210s1 and a second side surface 210s2 to form a channel 200C. For example, the spacer 250 is disposed between a first sub-vertical portion 211 and a second sub-vertical portion 222 to space out the channel 200C. The spacer 250 includes a spacer portion 251, at least one first protrusion 252, and at least one second protrusion 253. The first protrusion 252 and the second protrusion 253 are respectively disposed on opposite sides of the spacer portion 251. The first sub-vertical portion 211 has a fifth side surface 210s5, and the second sub-vertical portion 212 has a sixth side surface 210s6, wherein the fifth side surface 210s5 and the sixth side surface 210s6 face each other. The spacer portion 251 can be located between the fifth side surface 210s5 of the first sub-vertical portion 211 and the sixth side surface 210s6 of the second sub-vertical portion 212. For example, the spacer 251 can be clamped between the fifth side 210s5 and the sixth side 210s6.

[0165] like Figure 4C As shown, the first sub-vertical portion 211 has at least one first fixing hole 211a, and the second sub-vertical portion 212 has at least one second fixing hole 212a. A first protrusion 252 is located within the first fixing hole 211a of the first sub-vertical portion 211. In an embodiment, at least a portion of the first protrusion 252 is located within the first fixing hole 211a. In one embodiment, the first protrusion 252 is similar in shape to the first fixing hole 211a. The first protrusion 252 includes a connecting section 2521 and a limiting section 2522, wherein the connecting section 252 connects the limiting section 2522 and the spacer portion 251. The first fixing hole 211a includes a communicating first hole portion 211a1 and a second hole portion 211a2, the first hole portion 211a1 extending from the fifth side surface 210s5 towards the first side surface 210s1, and the second hole portion 211a2 extending from the first side surface 210s1 towards the fifth side surface 210s5. The connecting segment 2521 is located in the first hole portion 211a1, while the limiting segment 2522 is located in the second hole portion 211a2. In an embodiment, the limiting segment 2522 has an outer diameter larger than that of the first hole portion 211a1 (e.g., along the Z-axis) to prevent the spacer portion 251 from disengaging from the first sub-linear portion 211 along the +X-axis.

[0166] In another embodiment, when the spacer 250 is combined with the first sub-vertical portion 211, the first protrusion 252 and the first fixing hole 211a can be tightly fitted, loosely fitted, or transitionally fitted.

[0167] Similarly, the second sub-vertical portion 212 has at least one second fixing hole 212a, and the second protrusion 253 can be fixed in the second fixing hole 212a of the second sub-vertical portion 222. At least a portion of the second protrusion 253 is located within the second fixing hole 212a. When the spacer 250 is combined with the second sub-vertical portion 212, the second protrusion 253 is tightly fitted with the second fixing hole 212a, so the spacer 250 and the second sub-vertical portion 212 are not easily separated. In one embodiment, the second protrusion 253 and the second fixing hole 212a are similar in shape. The second protrusion 253 has the same or similar structural features as the aforementioned first protrusion 252, and / or the second fixing hole 212a has the same or similar structural features as the aforementioned first fixing hole 211a, which will not be described again here. When the spacer 250 is combined with the second sub-vertical portion 212, the second protrusion 253 and the second fixing hole 212a can be tightly fitted, loosely fitted, or transitionally fitted.

[0168] like Figure 4C As shown, the insert 260 can be disposed within the channel 200C and protrudes relative to the bottom surface of the straight member 210. The insert 260 can be inserted onto the circuit board to stabilize the relative position between the heat sink and the circuit board, facilitating subsequent soldering or riveting processes. Furthermore, the insert 260 can be pre-fixed to the first sub-straight portion 211 or the second sub-straight portion 212. As shown in Figures 2B and 3, the insert 260 includes a connected body 261 and a pin 262. The body 261 is located within the channel 200C, while the pin 262 protrudes relative to the bottom surface 211b of the first sub-straight portion 211. When the heat sink 200 is disposed on a circuit board (not shown), the pin 262 can be inserted onto the circuit board.

[0169] In summary, the heat sink 200 includes a first heat dissipation structure and a second heat dissipation structure. The first heat dissipation structure includes a first base (corresponding to the first sub-vertical portion 211) and a first electronic component 10, while the second heat dissipation structure includes a second base (corresponding to the second sub-vertical portion 212) and a second electronic component 20. The first base has opposing first surfaces (corresponding to the first side surface 210s1) and second surfaces (corresponding to the fifth side surface 210s5), and the first electronic component 10 is disposed on the first base and electrically connected to a circuit board (not shown). The second base has opposing third surfaces (corresponding to the sixth side surface 210s6) and fourth surfaces (corresponding to the second side surface 210s2), and the second electronic component 20 is disposed on the second base and electrically connected to a circuit board (not shown). A channel 200C is provided between the second and third surfaces, and the channel 200C can extend along the Y-axis. In one embodiment, the first base and the second base at least partially overlap on the X-axis, which is different from the Y-axis. A first electronic component 10 is disposed on a first surface, and a second electronic component 20 is disposed on a fourth surface, with the first electronic component 10 and the second electronic component 20 at least partially overlapping on the X-axis. In one embodiment, the first heat dissipation structure further includes at least one first extension (corresponding to the first sub-lateral portions 221A and 221B) connected to the first base, with at least a portion of the first extension located above the first electronic component 10. Similarly, the second heat dissipation structure further includes at least one second extension (corresponding to the second sub-lateral portions 222A and 222B) connected to the second base, with at least a portion of the second extension located above the second electronic component 20. In one embodiment, the channel 200C has a width W2 on the X-axis, which is different from the Y-axis, and the first base has a thickness on the X-axis, wherein the ratio of the thickness to the width W2 can be between 0.75 and 5. Similarly, the second base has a thickness along the X-axis, wherein the ratio of thickness to width W2 can be between 0.75 and 5. In one embodiment, the insert 260 is disposed between the first heat dissipation structure and the second heat dissipation structure and is used for inserting into a circuit board (not shown).

[0170] Please refer to Figures 5A-7C , Figure 5A A schematic diagram of a radiator 300 according to another embodiment of the present invention is shown. Figure 5B Draw Figure 5A Exploded view of the radiator 300. Figure 6 Draw Figure 5A The front view of the radiator 300 viewed along the +X axis. Figure 7A Draw Figure 6 A cross-sectional view of the radiator 300 along direction 7A-7A'. Figure 7B Draw Figure 6 A cross-sectional view of the radiator 300 along direction 7B-7B', and Figure 7C Draw Figure 6 A cross-sectional view of the radiator 300 along the direction 7C-7C'.

[0171] like Figure 5A and Figure 5B As shown, the heat sink 300 includes a first vertical member 310, a horizontal member 320, at least one first fixing member 130, at least one second fixing member 140, and at least one spacer 350. The first vertical member 310 has a channel 300C and opposing first side surfaces 310s1 and 310s2, wherein the channel 300C is located between the first side surfaces 310s1 and 310s2. The horizontal member 320 connects to the first vertical member 310. In this embodiment, the channel 300C of the first vertical member 310 allows an airflow to pass through to dissipate heat from the first electronic component 10 and the second electronic component 20. The channel 300C can increase the surface area of ​​the heat sink 300, allowing more heat energy from the heat sink 300 to convect through the sidewalls of the channel 300C into the channel 300C.

[0172] like Figure 7C As shown, the spacer 350 has an abutting surface 350s that abuts against the sixth side surface 310s6 of the second sub-vertical portion 312. The abutting surface 350s is, for example, a plane, but it can also be a curved surface or a combination of a plane and a curved surface. The abutting surface 350s can abut against the sixth side surface 310s6 of the second sub-vertical portion 312 in the form of a point, a line, or a surface.

[0173] As shown in Figures 5A-5B, the first linear member 310 is, for example, a multi-piece structure. For instance, the first linear member 310 includes a first sub-linear portion 311 and a second sub-linear portion 312. The first sub-linear portion 311 has a first side surface 310s1, and the second sub-linear portion 312 has a second side surface 310s2. The first sub-linear portion 311 and the second sub-linear portion 312 partially abut against each other, while the non-abutting portions may be spaced apart by the channel 300C. In one embodiment, the first sub-linear portion 311 and the second sub-linear portion 312 may be formed individually and then assembled together using techniques such as snap-fitting, welding, bonding, screwing, or a combination thereof. In another embodiment, the first sub-linear portion 311 and the second sub-linear portion 312 may be an integrally formed structure, and the channel 300C may be, for example, a through hole of an integrally formed structure. Furthermore, the first sub-linear portion 311 and the second sub-linear portion 312 may be equal or different in length (e.g., along the Z-axis).

[0174] like Figure 6 and Figure 7CAs shown, channel 300C has a width W3, which is, for example, a dimension parallel to the X-axis. Width W3 has the same dimensional range as the aforementioned width W1, and will not be described again here. Furthermore, the first straight member 310 has opposing third side 310s3 and fourth side 310s4. In this embodiment, the first sub-straight portion 311 of the first straight member 310 has the aforementioned third side 310s3 and fourth side 310s4, which are adjacent to the first side 310s1. In another embodiment, the second sub-straight portion 312 of the first straight member 310 has the aforementioned third side 310s3 and fourth side 310s4, which are adjacent to the second side 310s2. Channel 300C may extend from the third side 310s3 to the fourth side 310s4.

[0175] like Figures 5A-5B As shown, the transverse member 320 includes at least one first sub-transverse portion (e.g., first sub-transverse portions 221A and 221B) and a second sub-transverse portion (e.g., second sub-transverse portions 222A and 222B). The first sub-transverse portions 221A and 221B can be connected to the first sub-vertical portion 311 of the first vertical member 310. For example, the first sub-transverse portions 221A and 221B can be connected to the first side surface 310s1 of the first sub-vertical portion 311 of the first vertical member 310 and protrude relative to the first side surface 310s1. The second sub-transverse portions 222A and 222B can be connected to the second sub-vertical portion 312 of the first vertical member 310. For example, the second sub-transverse portions 222A and 222B can be connected to the second side surface 310s2 of the second sub-vertical portion 312 of the first vertical member 310 and protrude relative to the second side surface 310s2. In this embodiment, the first sub-lateral portions 221A and 221B and the second sub-lateral portions 222A and 222B extend in opposite directions. However, in another embodiment, the first sub-lateral portions 221A and 221B and the second sub-lateral portions 222A and 222B may extend in the same direction (e.g., +X axis or -X axis).

[0176] like Figure 5A and Figure 7C As shown, the first electronic component 10 and the second electronic component 20 can be disposed in the first straight member 310. For example, the first electronic component 10 is disposed in the first sub-straight portion 311 of the first straight member 310, and the second electronic component 20 is disposed in the second sub-straight portion 312 of the first straight member 310. The first fixing member 130 can pass through the first electronic component 10, the first sub-straight portion 311 of the first straight member 310, the second sub-straight portion 312 of the first straight member 310, and the second electronic component 20, and is fixed to the second fixing member 140, so that the first sub-straight portion 311 and the second sub-straight portion 312 can be constrained between the first fixing member 130 and the second fixing member 140.

[0177] like Figure 7CAs shown, a spacer 350 can be disposed between a first side surface 310s1 and a second side surface 310s2 to form a channel 300C. For example, the spacer 350 is disposed between a first sub-vertical portion 311 and a second sub-vertical portion 312 to space out a channel 200C. The first sub-vertical portion 311 has a fifth side surface 310s5, and the second sub-vertical portion 312 has a sixth side surface 310s6, wherein the fifth side surface 310s5 and the sixth side surface 310s6 face each other. The spacer 350 is disposed on the fifth side surface 310s5 and protrudes relative to the fifth side surface 310s5. The spacer 350 can abut against the sixth side surface 310s6 to form the channel 300C. In addition, the first sub-vertical portion 311 has a recess 311r, wherein the recess 311r is recessed relative to the first side surface 310s1 and corresponds in position to the spacer 350. For example, the recess 311r and the spacer 350 at least partially overlap along the X-axis.

[0178] Structurally, the first sub-vertical portion 311 and the spacer 350 are, for example, integrally formed. In terms of manufacturing process, a sheet metal can be bent, stamped, or subjected to a combination of these processes to form an integral structure including the first sub-vertical portion 311 and the spacer 350. In other embodiments, the first sub-vertical portion 311 and the spacer 350 are, for example, two separate parts. For instance, the first sub-vertical portion 311 and the spacer 350 can be formed individually and then assembled together using techniques such as snap-fitting, welding, bonding, screwing, or a combination thereof.

[0179] In another embodiment, the spacer 350 may also be disposed on the second sub-vertical portion 312, and / or the second sub-vertical portion 312 and the spacer 350 may be integrally formed, for example.

[0180] In summary, the heat sink 300 includes a first heat dissipation structure and a second heat dissipation structure. The first heat dissipation structure includes a first base (corresponding to the first sub-vertical portion 311) and a first electronic component 10, while the second heat dissipation structure includes a second base (corresponding to the second sub-vertical portion 312) and a second electronic component 20. The first base has a first surface (corresponding to the first side surface 310s1) and a second surface (corresponding to the fifth side surface 310s5) facing each other, and the first electronic component 10 is disposed on the first base and electrically connected to a circuit board (not shown). The second base has a third surface (corresponding to the sixth side surface 310s6) and a fourth surface (corresponding to the second side surface 310s2), and the second electronic component 20 is disposed on the second base and electrically connected to a circuit board (not shown). A channel 300C is provided between the second surface and the third surface, and the channel 300C can extend along the Y-axis. In one embodiment, the first base and the second base at least partially overlap on an X-axis different from the Y-axis. A first electronic component 10 is disposed on a first surface, and a second electronic component 20 is disposed on a fourth surface, with the first electronic component 10 and the second electronic component 20 at least partially overlapping on the X-axis. In one embodiment, the first heat dissipation structure further includes at least one first extension (corresponding to first sub-lateral portions 221A and 221B) connected to the first base, with at least a portion of the first extension located above the first electronic component 10. Similarly, the second heat dissipation structure further includes at least one second extension (corresponding to second sub-lateral portions 222A and 222B) connected to the second base, with at least a portion of the second extension located above the second electronic component 20. In one embodiment, the spacer 350 is disposed between the first base and the second base corresponding to the channel 300C. In one embodiment, a portion of the first base directly contacts a portion of the second base; for example, when the spacer 350 is part of the first base, the first base directly contacts a portion of the second base via the spacer 350. In one embodiment, channel 300C has a width W3 on the X-axis, which is different from the Y-axis, and the first base has a thickness on the X-axis, wherein the ratio of the thickness to the width W3 can be between 0.75 and 5. Similarly, the second base has a thickness on the X-axis, wherein the ratio of the thickness to the width W3 can be between 0.75 and 5.

[0181] Please refer to Figures 8A-10D , Figure 8A A schematic diagram of a radiator 400 according to another embodiment of the present invention is shown. Figure 8B Draw Figure 8A Exploded view of the radiator 400. Figure 9 Draw Figure 8A The front view of the radiator 400 viewed along the +X axis. Figure 10A Draw Figure 9 A cross-sectional view of the radiator 400 along direction 10A-10A'. Figure 10B Draw Figure 9A cross-sectional view of the radiator 400 along direction 10B-10B'. Figure 10C Draw Figure 9 A cross-sectional view of the radiator 400 along the direction 10C-10C', and Figure 10D Draw Figure 9 A cross-sectional view of the radiator 400 along the direction 10D-10D'.

[0182] like Figure 8A and Figure 8B As shown, the heat sink 400 includes a first vertical member 410, a horizontal member 420, at least one first fixing member 130, at least one second fixing member 140, and at least one spacer 450. The first vertical member 410 has a channel 400C and opposing first side surfaces 410s1 and 410s2, wherein the channel 400C is located between the first side surfaces 410s1 and 410s2. The horizontal member 420 connects to the first vertical member 410. In this embodiment, the channel 400C of the first vertical member 410 allows an airflow to pass through to dissipate the heat generated by the first electronic component 10 and the second electronic component 20. The channel 400C can increase the surface area of ​​the heat sink 400, allowing more heat from the heat sink 400 to convect through the sidewalls of the channel 400C into the channel 400C.

[0183] like Figures 8A-8B As shown, the first linear member 410 is, for example, a multi-piece structure. For instance, the first linear member 410 includes a first sub-linear portion 411 and a second sub-linear portion 412. The first sub-linear portion 411 has a first side surface 410s1, and the second sub-linear portion 412 has a second side surface 410s2. The first sub-linear portion 411 and the second sub-linear portion 412 partially abut against each other, while the non-abutting portions may be spaced apart from the channel 400C. In one embodiment, the first sub-linear portion 411 and the second sub-linear portion 412 may be formed individually and then assembled together using techniques such as snap-fitting, welding, bonding, screwing, or a combination thereof. In another embodiment, the first sub-linear portion 411 and the second sub-linear portion 412 may be an integrally formed structure, and the channel 400C may be, for example, a through hole of an integrally formed structure. Furthermore, the first sub-linear portion 411 and the second sub-linear portion 412 may be equal or different in length (e.g., along the Z-axis).

[0184] like Figure 8B and Figure 10CAs shown, channel 400C has a width W4, which is, for example, a dimension parallel to the X-axis. Width W4 has the same dimensional range as the aforementioned width W1, and will not be described again here. Furthermore, the first straight member 410 has opposing third side 410s3 and fourth side 410s4. In this embodiment, the first sub-straight portion 411 of the first straight member 410 has the aforementioned third side 410s3 and fourth side 410s4, which are adjacent to the first side 410s1. In another embodiment, the second sub-straight portion 412 of the first straight member 410 has the aforementioned third side 410s3 and fourth side 410s4, which are adjacent to the second side 410s2. Channel 400C may extend from the third side 410s3 to the fourth side 410s4.

[0185] like Figures 8A-8B As shown, the transverse member 420 includes at least one first sub-transverse portion (e.g., first sub-transverse portions 421A and 421B) and a second sub-transverse portion (e.g., second sub-transverse portions 222A and 222B). The first sub-transverse portions 421A and 421B can be connected to the first sub-vertical portion 411 of the first vertical member 410. For example, the first sub-transverse portions 421A and 421B can be connected to the first side surface 410s1 of the first sub-vertical portion 411 of the first vertical member 410 and protrude relative to the first side surface 410s1, while the second sub-transverse portions 222A and 222B can be connected to the second sub-vertical portion 412 of the first vertical member 410. For example, the second sub-transverse portions 222A and 222B can be connected to the second side surface 410s2 of the second sub-vertical portion 412 of the first vertical member 410 and protrude relative to the second side surface 410s2. In this embodiment, the first sub-lateral portions 421A and 421B and the second sub-lateral portions 222A and 222B extend in opposite directions. However, in another embodiment, the first sub-lateral portions 421A and 421B and the second sub-lateral portions 222A and 222B may extend in the same direction (e.g., +X axis or -X axis).

[0186] like Figure 8A As shown, a space is separated between the first sub-lateral portions 421A and 421B. The extension direction of this space is approximately the same as the extension direction of the channel 400C, allowing airflow to pass through in order to dissipate the heat generated by the first electronic component 10 and the second electronic component 20.

[0187] like Figure 10A and Figure 10DAs shown, at least one of the first sub-lateral portions 421A has a first through hole 421Aa, which can penetrate the solid material of the first sub-lateral portion 421A along the Z-axis. The first through hole 421Aa can increase the surface area of ​​the lateral member 420 and increase the heat dissipation efficiency of the heat sink 400. In addition, the first through hole 421Aa can also provide a heat dissipation channel, allowing an airflow to pass through. Similarly, at least one of the first sub-lateral portions 421B has a first through hole 421Ba, which can penetrate the solid material of the first sub-lateral portion 421B along the Z-axis. The first through hole 421Ba can increase the surface area of ​​the lateral member 420 and increase the heat dissipation efficiency of the heat sink 400.

[0188] In another embodiment, at least one of the second sub-lateral portions 222A and 222B of the heat sink 400 has a second through hole, which has the same or similar structural features as the first through hole of the first sub-lateral portion, and will not be described in detail here.

[0189] like Figure 8A and Figure 10C As shown, the first electronic component 10 and the second electronic component 20 can be disposed in the first straight member 410. For example, the first electronic component 10 is disposed in the first sub-straight portion 411 of the first straight member 410, and the second electronic component 20 is disposed in the second sub-straight portion 412 of the first straight member 410. The first fixing member 130 can pass through the first electronic component 10, the first sub-straight portion 411 of the first straight member 410, the second sub-straight portion 412 of the first straight member 410, and the second electronic component 20, and is fixed to the second fixing member 140, so that the first sub-straight portion 411 and the second sub-straight portion 412 can be constrained between the first fixing member 130 and the second fixing member 140.

[0190] like Figure 10C As shown, a spacer 450 can be disposed between a first side surface 410s1 and a second side surface 410s2 to form a channel 400C. For example, the spacer 450 is disposed between a first sub-vertical portion 411 and a second sub-vertical portion 412 to space out the channel 400C. For example, the first sub-vertical portion 411 has a fifth side surface 410s5, and the second sub-vertical portion 412 has a sixth side surface 410s6, wherein the fifth side surface 410s5 and the sixth side surface 410s6 face each other. The spacer 450 is disposed on the fifth side surface 410s5 and protrudes relative to the fifth side surface 410s5. The spacer 450 can abut against the sixth side surface 410s6 to form the channel 400C. In addition, the first sub-vertical portion 411 has a recess 411r, wherein the recess 411r is recessed relative to the first side surface 410s1 and corresponds in position to the spacer 450. For example, the recess 411r and the spacer 450 overlap along the X-axis.

[0191] like Figure 10CAs shown, the spacer 450 has an abutting surface 450s that abuts against the sixth side surface 410s6 of the second sub-vertical portion 412. The abutting surface 450s is, for example, a plane, but it can also be a curved surface or a combination of a plane and a curved surface. The abutting surface 450s can abut against the sixth side surface 410s6 of the second sub-vertical portion 412 in the form of a point, a line, or a surface.

[0192] Structurally, the first sub-vertical portion 411 and the spacer 450 are, for example, integrally formed. In terms of manufacturing process, a sheet metal can be bent, stamped, or subjected to a combination of these processes to form an integral structure including the first sub-vertical portion 411 and the spacer 450. In other embodiments, the first sub-vertical portion 411 and the spacer 450 are, for example, two separate parts. For instance, the first sub-vertical portion 411 and the spacer 450 can be formed individually and then assembled together using techniques such as snap-fitting, welding, bonding, screwing, or a combination thereof.

[0193] In another embodiment, the spacer 450 may also be disposed on the second sub-vertical portion 412, and / or the second sub-vertical portion 412 and the spacer 450 may be integrally formed, for example.

[0194] In summary, the heat sink 400 includes a first heat dissipation structure and a second heat dissipation structure. The first heat dissipation structure includes a first base (corresponding to the first sub-vertical portion 411) and a first electronic component 10, while the second heat dissipation structure includes a second base (corresponding to the second sub-vertical portion 412) and a second electronic component 20. The first base has opposing first surfaces (corresponding to the first side surface 410s1) and second surfaces (corresponding to the fifth side surface 410s5), and the first electronic component 10 is disposed on the first base and electrically connected to a circuit board (not shown). The second base has opposing third surfaces (corresponding to the sixth side surface 410s6) and fourth surfaces (corresponding to the second side surface 410s2), and the second electronic component 20 is disposed on the second base and electrically connected to a circuit board (not shown). A channel 400C is provided between the second and third surfaces, and the channel 400C can extend along the Y-axis. In one embodiment, the first base and the second base at least partially overlap on an X-axis different from the Y-axis. A first electronic component 10 is disposed on a first surface, and a second electronic component 20 is disposed on a fourth surface, with the first electronic component 10 and the second electronic component 20 at least partially overlapping on the X-axis. In one embodiment, the first heat dissipation structure further includes at least one first extension (corresponding to first sub-lateral portions 421A and 421B) connected to the first base, with at least a portion of the first extension located above the first electronic component 10. Similarly, the second heat dissipation structure further includes at least one second extension (corresponding to second sub-lateral portions 222A and 222B) connected to the second base, with at least a portion of the second extension located above the second electronic component 20. In one embodiment, a spacer 450 is disposed between the first base and the second base corresponding to a channel 400C. In one embodiment, a portion of the first base directly contacts a portion of the second base; for example, when the spacer 450 is part of the first base, the first base directly contacts a portion of the second base via the spacer 450. In one embodiment, channel 400C has a width W4 on the X-axis, which is different from the Y-axis, and the first base has a thickness on the X-axis, wherein the ratio of the thickness to the width W4 can be between 0.75 and 5. Similarly, the second base has a thickness on the X-axis, wherein the ratio of the thickness to the width W4 can be between 0.75 and 5.

[0195] Please refer to Figures 11-13 , Figure 11 A schematic diagram of a radiator 500 according to another embodiment of the present invention is shown. Figure 12 Draw Figure 11 The front view of the radiator 500 viewed along the +X axis, and Figure 13 Draw Figure 12 A cross-sectional view of the radiator 500 along direction 13-13'.

[0196] like Figure 11As shown, the heat sink 400 includes a first linear member 510, a transverse member 420, at least one first fixing member 130, at least one second fixing member 140, and at least one spacer 550. The first linear member 510 has a channel 500C and opposing first side surfaces 510s1 and 510s2, wherein the channel 500C is located between the first side surfaces 510s1 and 510s2. The transverse member 420 connects to the first linear member 510. In this embodiment, the channel 500C of the first linear member 510 allows an airflow to pass through, dissipating heat from the first electronic component 10 and the second electronic component 20. The channel 500C can increase the surface area of ​​the heat sink 500, allowing more heat from the heat sink 500 to convect through the sidewalls of the channel 500C into the channel 500C.

[0197] like Figure 11 and Figure 13 As shown, the first linear member 510 is, for example, a multi-piece structure. For instance, the first linear member 510 includes a first sub-linear portion 511 and a second sub-linear portion 512. The first sub-linear portion 511 has a first side surface 510s1, and the second sub-linear portion 512 has a second side surface 510s2. The first sub-linear portion 511 and the second sub-linear portion 512 partially abut against each other, while the non-abutting portions may be spaced apart from the channel 500C. In one embodiment, the first sub-linear portion 511 and the second sub-linear portion 512 may be formed individually and then assembled together using techniques such as snap-fitting, welding, bonding, screwing, or a combination thereof. In another embodiment, the first sub-linear portion 511 and the second sub-linear portion 512 may be an integrally formed structure, and the channel 500C may be, for example, a through hole of an integrally formed structure. Furthermore, the first sub-linear portion 511 and the second sub-linear portion 512 may be equal or different in length (e.g., along the Z-axis).

[0198] like Figure 11 and Figure 13 As shown, channel 500C has a width W5, and width W4 is, for example, a dimension parallel to the X-axis. Width W5 has the same dimensional range as the aforementioned width W1, and will not be described again here. Furthermore, the first straight member 510 has opposing third side 510s3 and fourth side 510s4. In this embodiment, the first sub-straight portion 511 of the first straight member 510 has the aforementioned third side 510s3 and fourth side 510s4, which are adjacent to the first side 510s1. In another embodiment, the second sub-straight portion 512 of the first straight member 510 has the aforementioned third side 510s3 and fourth side 510s4, which are adjacent to the second side 510s2. Channel 500C may extend from the third side 510s3 to the fourth side 510s4.

[0199] like Figure 13As shown, a spacer 550 can be disposed between a first side surface 510s1 and a second side surface 510s2 to form a channel 500C. For example, the spacer 550 is disposed between a first sub-vertical portion 511 and a second sub-vertical portion 512 to space out the channel 500C. For example, the first sub-vertical portion 511 has a fifth side surface 510s5, and the second sub-vertical portion 512 has a sixth side surface 510s6, wherein the fifth side surface 510s5 and the sixth side surface 510s6 face each other. The spacer 550 is disposed on the fifth side surface 510s5 and protrudes relative to the fifth side surface 510s5. The spacer 550 can abut against the sixth side surface 510s6 to form the channel 500C. In addition, the first sub-vertical portion 511 has a recess 511r, wherein the recess 511r is recessed relative to the first side surface 510s1 and corresponds in position to the spacer 550. For example, the recess 511r and the spacer 550 overlap along the X-axis.

[0200] The spacer 550 in this embodiment has similar or identical technical features to the aforementioned spacer 450 (e.g., geometric structure, connection relationship with surrounding components, manufacturing method, material, etc.), which will not be repeated here. Unlike the aforementioned heat sink 400, the number of spacers 550 in the heat sink 500 is different from the number of spacers 450 in the heat sink 400.

[0201] In summary, the heat sink 500 includes a first heat dissipation structure and a second heat dissipation structure. The first heat dissipation structure includes a first base (corresponding to the first sub-vertical portion 511) and a first electronic component 10, while the second heat dissipation structure includes a second base (corresponding to the second sub-vertical portion 512) and a second electronic component 20. The first base has opposing first surfaces (corresponding to the first side surface 510s1) and second surfaces (corresponding to the fifth side surface 510s5), and the first electronic component 10 is disposed on the first base and electrically connected to a circuit board (not shown). The second base has opposing third surfaces (corresponding to the sixth side surface 510s6) and fourth surfaces (corresponding to the second side surface 510s2), and the second electronic component 20 is disposed on the second base and electrically connected to a circuit board (not shown). A channel 500C is provided between the second and third surfaces, and the channel 500C can extend along the Y-axis. In one embodiment, the first base and the second base at least partially overlap on the X-axis, which is different from the Y-axis. A first electronic component 10 is disposed on a first surface, and a second electronic component 20 is disposed on a fourth surface, with the first electronic component 10 and the second electronic component 20 at least partially overlapping on the X-axis. In one embodiment, the first heat dissipation structure further includes at least one first extension (corresponding to first sub-lateral portions 421A and 421B) connected to the first base, with at least a portion of the first extension located above the first electronic component 10. Similarly, the second heat dissipation structure further includes at least one second extension (corresponding to second sub-lateral portions 222A and 222B) connected to the second base, with at least a portion of the second extension located above the second electronic component 20. In one embodiment, the spacer 550 is disposed between the first base and the second base corresponding to the channel 500C. In one embodiment, a portion of the first base directly contacts a portion of the second base; for example, when the spacer 550 is part of the first base, the first base directly contacts a portion of the second base via the spacer 550. In one embodiment, channel 500C has a width W5 on the X-axis, which is different from the Y-axis, and the first base has a thickness on the X-axis, wherein the ratio of the thickness to the width W5 can be between 0.75 and 5. Similarly, the second base has a thickness on the X-axis, wherein the ratio of the thickness to the width W5 can be between 0.75 and 5.

[0202] Please refer to Figure 14 The diagram illustrates a heat sink 600 according to another embodiment of the present invention. The heat sink 600 includes a first vertical member 310, a horizontal member 220, at least one first fixing member 130, at least one second fixing member 140, and at least one spacer 350. The heat sink 600 has the same or similar technical features as the aforementioned heat sink 300, with at least one difference in that the number of spacers 350 in the heat sink 600 is less. For example, the heat sink 600 may have only one spacer 350. However, the embodiments of the present invention do not limit the number of spacers; it may be one, two, or more.

[0203] Please refer to Figures 15A-17B , Figure 15A A schematic diagram of a radiator 700 according to another embodiment of the present invention is shown. Figure 15B Draw Figure 15A Exploded view of the 700 heatsink. Figure 16 Draw Figure 15A The front view of the 700 heatsink viewed along the +X axis. Figure 17A Draw Figure 16 A cross-sectional view of the radiator 700 along direction 17A-17A', and Figure 17B Draw Figure 16 A cross-sectional view of the radiator 700 along direction 17B-17B'.

[0204] like Figure 15A and Figure 15B As shown, the heat sink 700 includes a first vertical member 710, a horizontal member 720, at least one first fixing member 130, at least one second fixing member 140, and at least one spacer 750. The first vertical member 710 has a channel 700C and opposing first side surfaces 710s1 and 710s2, wherein the channel 700C is located between the first side surfaces 710s1 and 710s2. The horizontal member 720 connects to the first vertical member 710. In this embodiment, the channel 700C of the first vertical member 710 allows an airflow to pass through to dissipate heat from the first electronic component 10 and the second electronic component 20. The channel 700C can increase the surface area of ​​the heat sink 700, allowing more heat from the heat sink 700 to convect through the sidewalls of the channel 700C into the channel 700C.

[0205] like Figure 15A and Figure 15BAs shown, the first straight member 710 is, for example, a multi-piece structure. For instance, the first straight member 710 includes a first sub-straight portion 711 and a second sub-straight portion 712. The first sub-straight portion 711 has a first side surface 710s1, and the second sub-straight portion 712 has a second side surface 710s2. The first sub-straight portion 711 and the second sub-straight portion 712 are separate from each other and are indirectly connected by a spacer 750. In another embodiment, the spacer 750 may be pre-configured on one of the first sub-straight portion 711 and the second sub-straight portion 712. In other embodiments, one of the first sub-straight portion 711 and the second sub-straight portion 712 and the spacer 750 may be integrally formed. In one embodiment, the first sub-straight portion 711 and the second sub-straight portion 712 may be formed individually and then assembled together using techniques such as snap-fitting, welding, bonding, screwing, or a combination thereof. In another embodiment, the first sub-vertical portion 711 and the second sub-vertical portion 712 may be integrally formed structures, and the channel 700C may be, for example, a through hole of an integrally formed structure. Furthermore, the first sub-vertical portion 711 and the second sub-vertical portion 712 may be equal or different in length (e.g., along the Z-axis).

[0206] like Figure 15B and Figure 17B As shown, channel 700C has a width W7, which is, for example, a dimension parallel to the X-axis. Width W7 has the same dimensional range as the aforementioned width W1, and will not be described again here. Furthermore, the first straight member 710 has opposing third side surface 710s3 and fourth side surface 710s4. In this embodiment, the first sub-straight portion 711 of the first straight member 710 has the aforementioned third side surface 710s3 and fourth side surface 710s4, which is adjacent to the first side surface 710s1. In another embodiment, the second sub-straight portion 712 of the first straight member 710 has the aforementioned third side surface 710s3 and fourth side surface 710s4, which is adjacent to the second side surface 710s2. Channel 700C may extend from the third side surface 710s3 to the fourth side surface 710s4.

[0207] like Figures 15A-15BAs shown, the lateral member 720 includes at least one first sub-lateral portion 721 and a second sub-lateral portion 722. The first sub-lateral portion 721 may connect to the first sub-vertical portion 711 of the first vertical member 710. For example, the first sub-lateral portion 721 may connect to the first side surface 710s1 of the first sub-vertical portion 711 of the first vertical member 710 and protrude relative to the first side surface 710s1. The second sub-lateral portion 722 may connect to the second sub-vertical portion 712 of the first vertical member 710. For example, the second sub-lateral portion 722 may connect to the second side surface 710s2 of the second sub-vertical portion 712 of the first vertical member 710 and protrude relative to the second side surface 710s2. In this embodiment, the first sub-lateral portion 721 and the second sub-lateral portion 722 extend in opposite directions. However, in another embodiment, the first sub-lateral portion 721 and the second sub-lateral portion 722 may extend in the same direction (e.g., +X-axis or -X-axis).

[0208] like Figure 15A As shown, a space is provided between two adjacent first sub-lateral portions 721. The extending direction of this space is approximately the same as the extending direction of the channel 700C, allowing airflow to pass through and dissipate the heat generated by the first electronic component 10 and the second electronic component 20. Similarly, a space is provided between two adjacent second sub-lateral portions 722. The extending direction of this space is approximately the same as the extending direction of the channel 700C, allowing airflow to pass through and dissipate the heat generated by the first electronic component 10 and the second electronic component 20.

[0209] like Figure 15A and Figure 17A As shown, at least one of the first sub-lateral portions 721 and the second sub-lateral portions 722 is a complete structure, for example, without any through holes. In another embodiment, at least one of the first sub-lateral portions 721 and the second sub-lateral portions 722 may have through holes, wherein the through holes can penetrate the solid material of the sub-lateral portion along the Z-axis, and the through holes can increase the surface area of ​​the lateral member 720, thereby increasing the heat dissipation efficiency of the heat sink 700. In addition, the aforementioned through holes can also provide a heat dissipation channel, allowing an airflow to pass through.

[0210] like Figure 15A and Figure 17A As shown, the first electronic component 10 and the second electronic component 20 can be disposed in the first straight member 710. For example, the first electronic component 10 is disposed in the first sub-straight portion 711 of the first straight member 710, and the second electronic component 20 is disposed in the second sub-straight portion 712 of the first straight member 710. The first fixing member 130 can pass through the first electronic component 10, the first sub-straight portion 711 of the first straight member 710, the second sub-straight portion 712 of the first straight member 710, and the second electronic component 20, and is fixed to the second fixing member 140, so that the first sub-straight portion 711 and the second sub-straight portion 712 can be constrained between the first fixing member 130 and the second fixing member 140.

[0211] like Figure 17A As shown, a spacer 750 can be disposed between a first side surface 710s1 and a second side surface 710s2 to form a channel 700C. For example, the spacer 750 is disposed between a first sub-vertical portion 711 and a second sub-vertical portion 712 to space out the channel 700C. For example, the first sub-vertical portion 711 has a fifth side surface 710s5, and the second sub-vertical portion 712 has a sixth side surface 710s6, wherein the fifth side surface 710s5 and the sixth side surface 710s6 face each other. The spacer 750 can be disposed between the fifth side surface 710s5 and the sixth side surface 710s6, and is sandwiched between the fifth side surface 710s5 and the sixth side surface 710s6. In one embodiment, the spacer 750 is, for example, a gasket. In terms of material, the spacer 750 can be made of materials such as rubber, plastic, or metal.

[0212] In summary, the heat sink 700 includes a first heat dissipation structure and a second heat dissipation structure. The first heat dissipation structure includes a first base (corresponding to the first sub-vertical portion 711) and a first electronic component 10, while the second heat dissipation structure includes a second base (corresponding to the second sub-vertical portion 712) and a second electronic component 20. The first base has opposing first surfaces (corresponding to the first side surface 710s1) and second surfaces (corresponding to the fifth side surface 710s5), and the first electronic component 10 is disposed on the first base and electrically connected to a circuit board (not shown). The second base has opposing third surfaces (corresponding to the sixth side surface 710s6) and fourth surfaces (corresponding to the second side surface 710s2), and the second electronic component 20 is disposed on the second base and electrically connected to a circuit board (not shown). A channel 700C is provided between the second and third surfaces, and the channel 700C can extend along the Y-axis. In one embodiment, the first base and the second base at least partially overlap on the X-axis, which is different from the Y-axis. A first electronic component 10 is disposed on a first surface, and a second electronic component 20 is disposed on a fourth surface, with the first electronic component 10 and the second electronic component 20 at least partially overlapping on the X-axis. In one embodiment, the first heat dissipation structure further includes at least one first extension (corresponding to the first sub-lateral portion 721) connected to the first base, with at least a portion of the first extension located above the first electronic component 10. Similarly, the second heat dissipation structure further includes at least one second extension (corresponding to the second sub-lateral portion 722) connected to the second base, with at least a portion of the second extension located above the second electronic component 20. In one embodiment, the spacer 750 is disposed between the first base and the second base corresponding to the channel 700C. In one embodiment, the channel 700C has a width W7 on the X-axis, which is different from the Y-axis, and the first base has a thickness on the X-axis, wherein the ratio of the thickness to the width W7 can be between 0.75 and 5. Similarly, the second base has a thickness on the X-axis, wherein the ratio of the thickness to the width W7 can be between 0.75 and 5.

[0213] Please refer to Figures 18A-20B , Figure 18A A schematic diagram of a radiator 800 according to another embodiment of the present invention is shown. Figure 18B Draw Figure 18A Exploded view of the 800 heatsink. Figure 19 Draw Figure 18A The front view of the radiator 800 as viewed along the +X axis. Figure 20A Draw Figure 19 A cross-sectional view of the radiator 800 along direction 20A-20A', and Figure 20B Draw Figure 19 A cross-sectional view of the radiator 800 along direction 20B-20B'.

[0214] like Figure 18A and Figure 18B As shown, the heat sink 800 includes a first vertical member 810, a horizontal member 820, at least one second vertical member 830, at least one first fixing member 130, at least one second fixing member 140, and at least one spacer 750. The first vertical member 810 has a channel 800C and opposing first side surfaces 810s1 and 810s2, wherein the channel 800C is located between the first side surfaces 810s1 and 810s2. The horizontal member 820 connects to the first vertical member 810. In this embodiment, the channel 800C of the first vertical member 810 allows an airflow to pass through to dissipate the heat generated by the first electronic component 10 and the second electronic component 20. The channel 800C can increase the surface area of ​​the heat sink 800, allowing more heat generated by the heat sink 800 to convect through the sidewalls of the channel 800C into the channel 800C.

[0215] like Figure 18A and Figure 18B As shown, the first straight member 810 is, for example, a multi-piece structure. For instance, the first straight member 810 includes a first sub-straight portion 811 and a second sub-straight portion 812. The first sub-straight portion 811 has a first side surface 810s1, and the second sub-straight portion 812 has a second side surface 810s2. The first sub-straight portion 811 and the second sub-straight portion 812 are separate from each other and are indirectly connected by a spacer 750. In another embodiment, the spacer 750 may be pre-configured on one of the first sub-straight portion 811 and the second sub-straight portion 812. In other embodiments, one of the first sub-straight portion 811 and the second sub-straight portion 812 and the spacer 750 may be integrally formed. In one embodiment, the first sub-straight portion 811 and the second sub-straight portion 812 may be formed individually and then assembled together. In another embodiment, the first sub-vertical portion 811 and the second sub-vertical portion 812 may be integrally formed structures, and the channel 800C may be, for example, a through hole of an integrally formed structure.

[0216] like Figure 18B and Figure 20A As shown, channel 800C has a width W8, which is, for example, a dimension parallel to the X-axis. The width W8 has the same dimensional range as the aforementioned width W1, and will not be described again here. Furthermore, the first straight member 810 has opposing third side 810s3 and fourth side 810s4. In this embodiment, the first sub-straight portion 811 of the first straight member 810 has the aforementioned third side 810s3 and fourth side 810s4, which are adjacent to the first side 810s1. In another embodiment, the second sub-straight portion 812 of the first straight member 810 has the aforementioned third side 810s3 and fourth side 810s4, which are adjacent to the second side 810s2. Channel 800C may extend from the third side 810s3 to the fourth side 810s4. Furthermore, the first sub-straight portion 811 and the second sub-straight portion 812 may be equal or different in length (e.g., along the Z-axis).

[0217] like Figures 18A-18B As shown, the lateral member 820 includes a first sub-lateral portion 821 and a second sub-lateral portion 822. The first sub-lateral portion 821 can be connected to the first sub-vertical portion 811 of the vertical member 810. For example, the first sub-lateral portion 821 can be connected to the first side surface 810s1 of the first sub-vertical portion 811 of the vertical member 810 and protrude relative to the first side surface 810s1. The second sub-lateral portion 822 can be connected to the second sub-vertical portion 812 of the first vertical member 810. For example, the second sub-lateral portion 822 can be connected to the second side surface 810s2 of the second sub-vertical portion 812 of the first vertical member 810 and protrude relative to the second side surface 810s2. In this embodiment, the first sub-lateral portion 821 and the second sub-lateral portion 822 extend in opposite directions. However, in another embodiment, the first sub-lateral portion 821 and the second sub-lateral portion 822 can extend in the same direction (e.g., +X-axis or -X-axis).

[0218] like Figure 18A and 20A As shown, the second vertical member 830 can be connected to the horizontal member 820. For example, the second vertical member 830 can be connected to the upper surface 821u of the first sub-horizontal portion 821 of the horizontal member 820 and protrude relative to the upper surface 821u. For example, the second vertical member 830 extends along the Z-axis, or extends in a direction that forms an acute angle with the Z-axis, such as between + / - 10 degrees. The number of second vertical members 830 can be multiple, but it can also be one. The second vertical member 830 can increase the surface area of ​​the heat sink 800 to increase the heat dissipation efficiency. In another embodiment, the second vertical member 830 can be connected to the lower surface 821b of the first sub-horizontal portion 821 of the horizontal member 820 and protrude relative to the lower surface 821b.

[0219] like Figure 18AAs shown, a space is separated between two adjacent second straight members 830. The extension direction of this space is approximately the same as the extension direction of the channel 800C, allowing airflow to pass through in order to dissipate the heat generated by the first electronic component 10 and the second electronic component 20.

[0220] like Figure 18A and Figure 20A As shown, the first electronic component 10 and the second electronic component 20 can be disposed in the first straight member 810. For example, the first electronic component 10 is disposed in the first sub-straight portion 811 of the straight member 810, and the second electronic component 20 is disposed in the second sub-straight portion 812 of the straight member 810. The first fixing member 130 can pass through the first electronic component 10, the first sub-straight portion 811 of the straight member 810, the second sub-straight portion 812 of the straight member 810, and the second electronic component 20, and is fixed to the second fixing member 140, so that the first sub-straight portion 811 and the second sub-straight portion 812 can be constrained between the first fixing member 130 and the second fixing member 140.

[0221] like Figure 20A and Figure 20B As shown, a spacer 750 can be disposed between a first side surface 810s1 and a second side surface 810s2 to form a channel 800C. For example, the spacer 750 is disposed between a first sub-vertical portion 811 and a second sub-vertical portion 812 to space out the channel 800C. For example, the first sub-vertical portion 811 has a fifth side surface 810s5, and the second sub-vertical portion 812 has a sixth side surface 810s6, wherein the fifth side surface 810s5 and the sixth side surface 810s6 face each other. The spacer 750 is disposed on the fifth side surface 810s5 and protrudes relative to the fifth side surface 810s5. The spacer 750 can abut against the sixth side surface 810s6 to form the channel 800C. In this embodiment, the first sub-lateral portion 821 and the second sub-lateral portion 822 extend in opposite directions, respectively. However, in another embodiment, the first sub-lateral portion 821 and the second sub-lateral portion 822 may extend in the same direction (e.g., the +X axis or the -X axis).

[0222] In summary, the heat sink 800 includes a first heat dissipation structure and a second heat dissipation structure. The first heat dissipation structure includes a first base (corresponding to the first sub-vertical portion 811) and a first electronic component 10, while the second heat dissipation structure includes a second base (corresponding to the second sub-vertical portion 812) and a second electronic component 20. The first base has opposing first surfaces (corresponding to the first side surface 810s1) and second surfaces (corresponding to the fifth side surface 810s5), and the first electronic component 10 is disposed on the first base and electrically connected to a circuit board (not shown). The second base has opposing third surfaces (corresponding to the sixth side surface 810s6) and fourth surfaces (corresponding to the second side surface 810s2), and the second electronic component 20 is disposed on the second base and electrically connected to a circuit board (not shown). A channel 800C is provided between the second and third surfaces, and the channel 800C can extend along the Y-axis. In one embodiment, the first base and the second base at least partially overlap on the X-axis, which is different from the Y-axis. A first electronic component 10 is disposed on a first surface, and a second electronic component 20 is disposed on a fourth surface, with the first electronic component 10 and the second electronic component 20 at least partially overlapping on the X-axis. In one embodiment, the first heat dissipation structure further includes at least one first extension (corresponding to the first sub-lateral portion 821 and the second vertical member 830), which is directly or indirectly connected to the first base, with at least a portion of the first extension located above the first electronic component 10. Similarly, the second heat dissipation structure further includes at least one second extension (corresponding to the second sub-lateral portion 822), which is connected to the second base, with at least a portion of the second extension located above the second electronic component 20. In one embodiment, the spacer 750 is disposed between the first base and the second base corresponding to the channel 800C. In one embodiment, the channel 800C has a width W8 on the X-axis, which is different from the Y-axis, and the first base has a thickness on the X-axis, wherein the ratio of the thickness to the width W8 can be between 0.75 and 5. Similarly, the second base has a thickness on the X-axis, wherein the ratio of the thickness to the width W8 can be between 0.75 and 5.

[0223] Please refer to Figures 21A-21C , Figures 21A-21C Schematic diagrams of an electronic device 1 according to an embodiment of the present invention are shown from different perspectives.

[0224] like Figures 21A-21CAs shown, the electronic device 1 includes at least one heat sink 900A-900C, at least one circuit board 11, and at least one convection device 12. Any of the heat sinks 900A-900C may include, or be replaced by, the technical features of any of the aforementioned heat sinks 100-800. The convection device 12 is, for example, a fan, other types of convection devices, or forced convection devices. The convection device 12 is disposed adjacent to and electrically connected to the circuit board 11, and is controlled by the circuit board 11. The convection device 12 has an outlet 12a, and the convection device 12 can generate an airflow G flowing outward from the outlet 12a. The heat sinks 900A-900C may be disposed in the flow path of the airflow G. For example, the heat sinks 900A-900C may be arranged in a straight line, for example, along the Y-axis. In another embodiment, two of the heat sinks 900A-900C may be offset along the X-axis. In other embodiments, the two regions of the heat sinks 900A to 900C projected onto the XZ plane may at least partially overlap, or not overlap at all.

[0225] like Figures 21A-21C As shown, convection device 12 can be thermally coupled to a channel (not shown) of at least one of the heat sinks 900A to 900C. In this embodiment, convection device 12 is disposed on the side of the heat sink. In another embodiment, convection device 12 can be disposed above or directly above the heat sink.

[0226] like Figure 21B As shown, the radiator 900B has the same or similar structure as one of the aforementioned radiators 100 to 800, with at least one difference in that the straight member 910 of the radiator 900B is a one-piece molded structure. For example, the straight member 910 of the radiator 900B includes a first sub-straight portion (or first base) 911, a second sub-straight portion (or second base) 912, and at least one connecting portion 913, wherein the connecting portion 913, the first sub-straight portion 911, and the second sub-straight portion 912 can be a one-piece molded structure. Furthermore, at least one channel 900C is formed between the connecting portion 913, the first sub-straight portion 911, and the second sub-straight portion 912, and the channel 900C extends from the third side surface (or first end surface) 910s3 of the straight member 910 to the fourth side surface (or second end surface) 910s4.

[0227] like Figure 21A and Figure 21BAs shown, the two convection current collectors 12 are arranged side by side (e.g., along the X-axis), and the channel 900C1 of the heat sink 900C (having a structure similar to or the same as one of the aforementioned channels 100C to 800C and 1000C) can be located between the two convection current collectors 12. In detail, due to the structural design of the heat sink 900C, even if the channel 900C1 of the heat sink 900C is not directly opposite the outlet 12a of either of the two convection current collectors 12, the expected heat dissipation efficiency can still be achieved.

[0228] Please refer to Figures 22A-24B , Figure 22A A schematic diagram of an electronic device 2 according to an embodiment of the present invention is shown. Figure 22B Draw Figure 22A An exploded view of electronic device 2, shown in figures 23A-23B. Figure 22A Schematic diagrams of electronic device 2 from different perspectives, and Figure 24A Draw Figure 23A A cross-sectional view of electronic device 2 along direction 24A-24A', and Figure 24B Draw Figure 23A A cross-sectional view of electronic device 2 along direction 24B-24B'.

[0229] like Figure 22A and Figure 22B As shown, the electronic device 2 includes a circuit board 21 and at least one heat sink 1000. The heat sink 1000 is disposed on the circuit board 21. The heat sink 1000 includes a first vertical member 1010, a horizontal member 1020, at least one first fixing member 130, at least one second fixing member 140, and at least one insertion member 260. A channel 1000C is formed between the first vertical member 1010 and the horizontal member 1020, and a first electronic component 10 is disposed in the channel 1000C. The horizontal member 1020 is connected to the first vertical member 1010. In this embodiment, the channel 1000C allows an airflow to pass through to dissipate the heat generated by the first electronic component 10 and the second electronic component 20. The channel 1000C can increase the surface area of ​​the heat sink 1000, allowing more heat absorbed by the heat sink 1000 to convect through the sidewalls of the channel 1000C into the channel 1000C.

[0230] like Figures 22A-24BAs shown, compared to the first straight member in the aforementioned embodiment, the first straight member 1010 in this embodiment is, for example, a single-piece structure. The insertion member 260 and the corresponding first straight member 1010 have an included angle, for example, an angle other than 180 degrees. In other words, the insertion member 260 of the heat sink 1000 in this embodiment is not in a straight line with the first straight member 1010. The insertion member 260 can be pre-configured on the first straight member 1010 and protrudes relative to the bottom surface 1010b of the first straight member 1010. For example, the insertion member 260 includes a connected body 261 and a pin 262, the body 261 being connected to the first straight member 1010, and the pin 262 protruding relative to the bottom surface 1010b of the first straight member 1010. When the heat sink 1000 is mounted on the circuit board 21, the bottom surface 1010b of the first linear member 1010 abuts against the circuit board 21, and the pin 262 can be inserted into the circuit board 21. The first electronic component 10 includes at least one pin 11, and when the heat sink 1000 is mounted on the circuit board 21, the pin 11 of the first electronic component 10 is also inserted into the circuit board 21. Thus, the first linear member 1010 and the first electronic component 10 form two support points for stable mounting on the circuit board 21.

[0231] like Figure 24A As shown, the horizontal member 1020 of one of the two heat sinks 1000 differs in height (e.g., along the Z-axis) from the horizontal member 1020 of the other heat sink 1000. Each heat sink 1000's horizontal member 1020 has opposing upper surfaces 1020u and lower surfaces 1020b, and the upper surfaces 1020u of one of the two heat sinks 1000 and the other heat sink 1000 are positioned differently along the Z-axis. Specifically, the horizontal members 1020 of one of the two heat sinks 1000 and the other heat sink 1000 have a channel 1000C along the Z-axis, which allows airflow and increases heat dissipation efficiency. In other words, in this embodiment, at least two heat sinks 1000 utilize the height difference to form at least one thermal convection space, thereby increasing heat dissipation efficiency.

[0232] like Figures 22A-24B As shown, one of the two heat sinks 1000s has a first height H1 between its transverse member 1020 and a surface 21u of the circuit board 21, while the other of the two heat sinks 1000s has a second height H2 between its transverse member 1020 and the surface 21u of the circuit board 21. The first height H1 and the second height H2 are different, for example, the first height H1 is smaller than the second height H2.

[0233] In summary, the heat sink 1000 includes a first heat dissipation structure and a second heat dissipation structure. The first heat dissipation structure includes a first base (corresponding to the horizontal member 1020 of one of the two heat sinks 1000) and a first electronic component 10. The second heat dissipation structure includes a second base (corresponding to the horizontal member 1020 of the other of the two heat sinks 1000) and a second electronic component 20. The first base has a first surface (corresponding to the upper surface 1020u of the horizontal member 1020 of one of the two heat sinks 1000) and a second surface (corresponding to the lower surface 1020b of the horizontal member 1020 of the other of the two heat sinks 1000). The first electronic component 10 is disposed on the first base and electrically connected to a circuit board (not shown). The second base has opposing third surfaces (corresponding to the upper surface 1020u of the transverse member 1020 of the other of the two heat sinks 1000) and fourth surfaces (corresponding to the upper surface 1020u of the transverse member 1020 of the other of the two heat sinks 1000), and a second electronic component 20 is disposed on the second base and electrically connected to a circuit board (not shown). A channel 1000C is provided between the second and third surfaces, and the channel 1000C can extend along the Z-axis. In one embodiment, the first base and the second base at least partially overlap in the Z-axis, the first electronic component 10 is disposed on the second surface of one of the two heat sinks 1000, the second electronic component 20 is disposed on the fourth surface of the other of the two heat sinks 1000, and the first electronic component 10 and the second electronic component 20 at least partially overlap in the Z-axis. In one embodiment, the first heat dissipation structure further includes at least one first extension (corresponding to the first vertical member 1010 of one of the two heat sinks 1000), which is directly or indirectly connected to the first base, and at least a portion of the first extension is located on the side of the first electronic component 10. Similarly, the second heat dissipation structure further includes at least one second extension (corresponding to the first vertical member 1010 of the other of the two heat sinks 1000), which is connected to the second base, and at least a portion of the second extension is located on the side of the second electronic component 20. In one embodiment, the channel 1000C has a width W10 on the Z-axis, and the first base has a thickness t1 on the Z-axis, wherein the ratio of thickness t1 to width W10 can be between 0.75 and 5. Similarly, the second base has a thickness t2 on the Z-axis, wherein the ratio of thickness t2 to width W10 can be between 0.75 and 5.

[0234] Please refer to Figures 25-26B , Figure 25 A schematic diagram of a heat sink 1100 according to another embodiment of the present invention is shown. Figure 26A and Figure 26B Draw Figure 25 Exploded views of the 1100 heatsink from different perspectives.

[0235] like Figures 25-26BAs shown, the heat sink 1100 includes a first heat dissipation structure 1110, a second heat dissipation structure 1120, at least one first fixing member 130, at least one second fixing member 140, and at least one spacer 750. When the heat sink 1100 is disposed on a circuit board (not shown), the first heat dissipation structure 1110 and the second heat dissipation structure 1120 can be disposed on the circuit board. The first heat dissipation structure 1110 includes a first base 1111 and at least one first electronic component 10. The first base 1111 has opposing first surfaces 1111s1 and second surfaces 1111s2. The first electronic component 10 is disposed on the first base and electrically connected to the circuit board. The second heat dissipation structure 1120 includes a second base 1121 and at least one second electronic component 20. The second base 1121 has opposing third surfaces 1121s1 and fourth surfaces 1121s2. The second electronic component 20 is disposed on the second base and electrically connected to the circuit board. There is a channel 1100C between the second surface 1111s2 and the third surface 1121s1, and the channel 1100C extends along the Y-axis.

[0236] like Figures 25-26B As shown, the first base 1111 and the second base 1121 at least partially overlap on the X-axis, which is different from the Y-axis. A first electronic component 10 is disposed on the first surface 1111s1, and a second electronic component 20 is disposed on the fourth surface 1121s2, with the first electronic component 10 and the second electronic component 20 at least partially overlapping on the X-axis. In one embodiment, a spacer 750 is disposed between the first base 1111 and the second base 1121, corresponding to a channel 1100C. In one embodiment, the channel 1100C has a width W11 on the X-axis, which is different from the Y-axis, and the first base has a thickness t1 on the X-axis, wherein the ratio of thickness t1 to width W11 can be between 0.75 and 5. Similarly, the second base 1121 has a thickness t2 on the X-axis, wherein the ratio of thickness t2 to width W11 can be between 0.75 and 5.

[0237] In summary, this utility model provides a heat sink and an electronic device using the same. The heat sink includes at least one linear member and one transverse member, the transverse member being connected to the linear member. The linear member has at least one channel, or at least one channel is formed between the linear member and the transverse member. In one embodiment, at least one electronic component may be disposed on the linear member and / or the transverse member. In one embodiment, the linear member includes at least one first sub-linear portion and at least one second sub-linear portion, the lengths of the first sub-linear portion and the second sub-linear portion along the Z-axis may be different or equal. The transverse member includes at least one first sub-transverse portion and at least one second sub-transverse portion, wherein the first sub-transverse portion is connected to the first sub-linear portion, and the second sub-transverse portion is connected to the second sub-linear portion, and the first sub-transverse portion and the second sub-transverse portion may extend in two different directions (e.g., two opposite directions) or in the same direction. In one embodiment, the first sub-transverse portion and / or the second sub-transverse portion may extend in a direction that forms an acute angle with the X-axis. In one example, in a heat sink, an airflow passage can be formed between two vertical sections, an airflow passage can be formed between two horizontal sections, an airflow passage can be formed between a horizontal section and a vertical section, and / or an airflow passage can be formed between a vertical member and a horizontal member. In another example, at least one airflow passage can be formed between at least two horizontal members of at least two heat sinks to increase heat dissipation efficiency. Furthermore, the vertical members (or vertical sections) and / or horizontal members (or horizontal sections) in the embodiments herein are made of, for example, metal or other materials with good thermal conductivity, such as copper, aluminum, iron, or alloys thereof. In terms of manufacturing process, the two directly connected components in the heat sinks of the embodiments herein can be manufactured by, for example, bending, stamping, or a combination thereof. Compared to aluminum extrusion heat sinks, the heat sinks of the embodiments of this invention are lighter (e.g., at least 30% lighter) and / or have lower manufacturing costs (e.g., at least 25% lower costs). Furthermore, the ratio of the thickness of the heat sink (e.g., the thickness of the sub-vertical portion or the thickness of the sub-lateral portion) to the width of the channel between the two sub-vertical portions can be, for example, between 0.75 and 5, but can also be larger or smaller. Due to the channel size design, the airflow velocity through the channel is high, which can increase the thermal convection efficiency.

[0238] In another embodiment, the heat sink may include a first heat dissipation structure and a second heat dissipation structure. The first heat dissipation structure includes a first base and at least one first electronic component, the first electronic component being disposed on the first base. The first base may include one of the aforementioned first sub-vertical portion and first sub-lateral portion. The second heat dissipation structure includes a second base and at least one second electronic component, the second electronic component being disposed on the second base. The second base may include one of the aforementioned second sub-vertical portion and second sub-lateral portion. A channel may be formed between the first base and the second base to allow airflow through the channel for heat dissipation.

[0239] In summary, although the present invention has been disclosed above with reference to embodiments, it is not intended to limit the present invention. Those skilled in the art to which this invention pertains can make various modifications and refinements without departing from the spirit and scope of the present invention, and these modifications and refinements are not limited to the embodiments of the present invention, but are still within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the appended claims.

Claims

1. An electronic device, characterized by comprising: include: A circuit board; A first heat dissipation structure is disposed on the circuit board and includes: A first base having a first face and a second face opposite to each other; and A first electronic component is disposed on the first base and electrically connected to the circuit board; and A second heat dissipation structure is disposed on the circuit board and includes: A second base having opposing third and fourth surfaces; and A second electronic component is disposed on the second base and electrically connected to the circuit board; There is a channel between the second surface and the third surface, and the channel extends along a first direction. 2.The electronic device of claim 1, wherein, The first base and the second base do not overlap in a direction other than the first direction, the first electronic component is disposed on the first surface, and the second electronic component is disposed on the third surface. 3.The electronic device of claim 2, wherein, The first base has a first height between itself and a surface of the circuit board, and the second base has a second height between itself and the surface of the circuit board, wherein the first height is less than the second height.

4. The electronic device as claimed in claim 1, characterized in that, The first base and the second base overlap at least partially in a second direction different from the first direction. The first electronic component is disposed on the first surface, the second electronic component is disposed on the fourth surface, and the first electronic component and the second electronic component overlap at least partially in the second direction.

5. The electronic device as claimed in claim 4, characterized in that, It further includes a spacer, which is disposed between the first base and the second base corresponding to the channel.

6. The electronic device as claimed in claim 4, characterized in that, A portion of the first base is in direct contact with a portion of the second base.

7. The electronic device as claimed in claim 4, characterized in that, The first heat dissipation structure further includes an extension that is connected to the first base, and at least a portion of the extension is located above the first electronic component.

8. The electronic device as claimed in claim 1, characterized in that, The channel has a width in a second direction different from the first direction, and the first base has a first thickness in the second direction, wherein the ratio of the first thickness to the width is between 0.75 and 5.

9. The electronic device as claimed in claim 1, characterized in that, It further includes an insert, which is disposed between the first heat dissipation structure and the second heat dissipation structure.

10. The electronic device as claimed in claim 9, characterized in that, The insertion member has an angle with the first base or the second base.

11. The electronic device as claimed in claim 1, characterized in that, It further includes a connecting portion that connects the first base and the second base, wherein the first base, the second base and the connecting portion are integrally formed.

12. The electronic device as claimed in any one of claims 1 to 11, characterized in that, The first electronic component is disposed on the first surface, and the ratio of the surface area of ​​the first electronic component covering the first surface to the surface area of ​​the first surface is less than or equal to 50%.

13. The electronic device as claimed in any one of claims 1 to 11, characterized in that, It further includes a first convection device thermally coupled to the channel.

14. The electronic device as claimed in claim 13, characterized in that, It also includes a second convection device, with the first convection device and the second convection device arranged side by side, and the channel being located between the first convection device and the second convection device.

15. A radiator, characterized in that, include: A first straight member having a channel and opposing first and second sides, wherein the channel is located between the first and second sides; as well as A horizontal component connects to the first vertical component.

16. The radiator as claimed in claim 15, characterized in that, The first straight member further has a third side and a fourth side opposite to each other, and the channel extends from the third side to the fourth side.

17. The radiator as claimed in claim 15, characterized in that, The first straight member includes: A first sub-section, having the first side surface; and A second sub-section, having the second side surface; The first sub-vertical portion and the second sub-vertical portion are configured separately, and the channel is provided between the first sub-vertical portion and the second sub-vertical portion.

18. The radiator as claimed in claim 17, characterized in that, Including: A spacer is disposed between the first sub-vertical portion and the second sub-vertical portion to form the channel.

19. The radiator as claimed in claim 17, characterized in that, The first sub-direction has a fifth side opposite to the first side, and the heat sink further includes: A spacer is disposed on the fifth side and protrudes relative to the fifth side.

20. The radiator as claimed in claim 19, characterized in that, The first sub-vertical part is integrally formed with the spacer.

21. The radiator as claimed in claim 19, characterized in that, The first sub-direction has a recess that is recessed relative to the first side surface and corresponds in position to the spacer.

22. The radiator as claimed in claim 15, characterized in that, The transverse member has an upper surface, and the heat sink further includes: A second vertical member is connected to the upper surface of the horizontal member and protrudes relative to the upper surface.

23. The radiator as described in claim 15, characterized in that, The first straight member has a thickness, and the width of the channel is not greater than the thickness.

24. The radiator as claimed in claim 22, characterized in that, The first vertical component and the second vertical component are integrally formed.

25. An electronic device, characterized in that, include: A radiator as described in any one of claims 15 to 24; A pair of flowmeters are arranged in a straight line with the heat sink; as well as An electronic component is disposed on the first side or the second side.

26. The electronic device as claimed in claim 25, characterized in that, The electronic components are not located within the channel.

27. The electronic device as claimed in claim 25, characterized in that, The first straight member has a first end face near the convection device and a second end face away from the convection device, and the channel extends from the first end face to the second end face.

28. A radiator, characterized in that, include: Continuing towards the item; as well as A horizontal component connects to the vertical component; A channel is formed between the vertical member and the horizontal member.

29. The radiator as claimed in claim 28, characterized in that, The vertical component and the horizontal component are integrally formed.

30. The radiator as claimed in claim 28, characterized in that, Including: An electronic component is disposed on the transverse member and located within the channel.

31. An electronic device, characterized in that, include: A circuit board; as well as The heat sink as described in any one of claims 28 to 30 is disposed on the circuit board; The horizontal member of one of the two heat sinks is different in height from the horizontal member of the other of the two heat sinks.

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