Heat dissipation module, control module and smart device

Abstract

This utility model discloses a heat dissipation module, a control module, and an intelligent device, including a housing and a heat dissipation assembly. The heat dissipation assembly includes a base plate, a first fin group, and a second fin group. The base plate is used to connect a heat source and is connected to the housing to enclose a fluid channel with an inlet and an outlet. The first fin group and the second fin group are both connected to the base plate and are located within the fluid channel. In the extension direction of the fluid channel, the inlet, the first fin group, the second fin group, and the outlet are arranged sequentially. The heat dissipation efficiency of the first fin group is less than that of the second fin group. In this utility model, by setting the heat dissipation efficiency of the upstream first fin group to be less than that of the downstream second fin group, it is beneficial to make the temperature of the cooling medium upstream and the temperature of the cooling medium downstream tend to be the same (i.e., reduce the temperature difference between them), thereby improving the temperature uniformity of the heat dissipation module.

Description

Technical Field

[0001] This utility model relates to the field of chip thermal management technology, and in particular to a heat dissipation module, a control module, and an intelligent device. Background Technology

[0002] Array-type AI chips (such as NPU Neural Processing Unit / ASIC Application-Specific Integrated Circuit) are dedicated hardware designed for artificial intelligence computing scenarios. Their core is to achieve large-scale parallel processing capabilities through arrayed computing units.

[0003] To improve heat dissipation, array-type AI chips are usually used in conjunction with corresponding heat dissipation modules. These modules have fluid channels, and during operation, a cooling medium is introduced into the fluid channels. As the cooling medium flows through the fluid channels, it can carry away the heat generated by the chip.

[0004] However, in the flow path of the cooling medium, the upstream chip is cooled first, which makes the temperature of the downstream cooling medium higher than that of the upstream cooling medium. This reduces the cooling effect on the downstream chip, resulting in poor temperature uniformity of the heat dissipation module. Consequently, the hot and cold environments of chips in different locations are different, reducing the chip's performance. Utility Model Content

[0005] This utility model provides a heat dissipation module, a control module, and an intelligent device, aiming to solve the problem of poor temperature uniformity in existing heat dissipation modules.

[0006] This utility model provides a heat dissipation module, including a housing and a heat dissipation assembly; the heat dissipation assembly includes a base plate, a first fin group, and a second fin group; the base plate is used to connect a heat source, and the base plate is connected to the housing to enclose and form a fluid channel with an inlet and an outlet; the first fin group and the second fin group are both connected to the base plate and are both located within the fluid channel; in the extending direction of the fluid channel, the inlet, the first fin group, the second fin group, and the outlet are arranged sequentially; the heat dissipation efficiency of the first fin group is less than that of the second fin group.

[0007] Optionally, the first fin group includes a plurality of first fins, and the second fin group includes a plurality of second fins; the number of first fins is less than the number of second fins.

[0008] Optionally, in the first direction, a plurality of first fins are arranged at intervals, and a plurality of second fins are arranged at intervals; the first direction intersects the extension direction of the fluid channel; the spacing between adjacent first fins is greater than the spacing between adjacent second fins.

[0009] Optionally, in the extension direction of the fluid channel, the first fin group and the second fin group are spaced apart; and / or, in the first direction, a plurality of first fins are arranged at equal intervals, and a plurality of second fins are arranged at equal intervals; and / or, the thermal conductivity of the first fin is less than that of the second fin; the first fin is an aluminum fin, and the second fin is a copper fin.

[0010] Optionally, the first fin group further includes a plurality of first limiting units, the first limiting units being used to limit the spacing between two adjacent first fins; the first limiting units correspond one-to-one with the first fins, and the first limiting units are connected to the first fins corresponding to them; in the first direction, the first limiting unit is located on one side of the first fin corresponding to it, and the arrangement direction of the corresponding first limiting units and the first fins is the same.

[0011] Optionally, the first limiting unit includes two limiting plates, which are respectively connected to the two ends of the first fin in the second direction; the first direction, the second direction, and the extension direction of the fluid channel are perpendicular to each other; in the first direction, one of the two adjacent limiting plates is provided with a first buckle, and the other is provided with a first locking hole, and the first buckle is fastened in the first locking hole; and / or, the first fin and the two limiting plates connected thereto are an integral structure; and / or, the two limiting plates are a first plate and a second plate, respectively; in the second direction, the surface of the first plate facing away from the second plate abuts against the bottom plate, and the surface of the second plate facing away from the first plate abuts against the outer shell.

[0012] Optionally, the housing includes a surrounding plate and an end cap; the surrounding plate is connected to the bottom plate, and the surrounding plate and the bottom plate enclose a first hole; the end cap is connected to one end of the surrounding plate and is opposite to the first hole; the end cap has a second hole, which penetrates the end cap along the extension direction of the fluid channel; the first hole and the second hole communicate to form the fluid channel, the end of the first hole away from the end cap forms the output port, and the end of the second hole away from the surrounding plate forms the input port; the first fin group and the second fin group are both located in the first hole and spaced apart from the end cap; the heat dissipation module also includes a fan, which is connected to the end cap and is used to blow air from the input port into the fluid channel.

[0013] Optionally, the base plate has a first mounting area and a second mounting area, the first fin group is connected to the first mounting area, and the second fin group is connected to the second mounting area; the heat dissipation assembly further includes a heat-conducting element, the heat-conducting element is disposed on the base plate, a portion of the heat-conducting element is located in the first mounting area, and another portion of the heat-conducting element is located in the second mounting area; the heat-conducting element is used to realize heat exchange between the first mounting area and the second mounting area.

[0014] This utility model embodiment also provides a control module, including a chip module and a heat dissipation module as described in any one of the above; the chip module is connected to the base plate.

[0015] This utility model embodiment also provides an intelligent device, including the control module described above.

[0016] In the heat dissipation module, control module, and smart device provided in this utility model embodiment, by setting the heat dissipation efficiency of the first fin group located upstream to be less than that of the second fin group located downstream, it is beneficial to make the temperature of the cooling medium located upstream and the temperature of the cooling medium located downstream tend to be the same (i.e., reduce the temperature difference between the two), thereby improving the temperature uniformity of the heat dissipation module. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a heat dissipation module provided in an embodiment of the present invention;

[0019] Figure 2 This is an exploded view of a heat dissipation module provided in an embodiment of this utility model;

[0020] Figure 3 This is a schematic diagram of the outer shell of a heat dissipation module provided in one embodiment of the present invention;

[0021] Figure 4 This is a schematic diagram of the structure of the first fin group of the heat dissipation module provided in an embodiment of the present invention;

[0022] Figure 5 This is a schematic diagram of the structure of the second fin group of the heat dissipation module provided in an embodiment of the present invention;

[0023] Figure 6This is a schematic diagram of the structure of the first heat sink of the heat dissipation module provided in an embodiment of the present invention;

[0024] Figure 7 This is a schematic diagram of the structure of a control module provided in one embodiment of the present invention;

[0025] Figure 8 This is a schematic diagram of the structure of a chip module provided in one embodiment of the present invention.

[0026] Instruction manual illustrations and reference numerals:

[0027] 10. Heat dissipation module; 20. Chip module; 201. Substrate; 202. Chip;

[0028] 1. Outer shell; 11. Enclosure; 111. First mounting plate; 112. Second mounting plate; 113. Third mounting plate; 12. End cap;

[0029] 2. Heat dissipation components;

[0030] 21. Base plate; 211. Mounting slot;

[0031] 22. First fin assembly; 221. First fin; 222. First limiting unit; 223. Limiting plate;

[0032] 23. Second fin group; 231. Second fin;

[0033] 24. Thermal conductive components;

[0034] 3. Fluid channels;

[0035] 4. Fan. Detailed Implementation

[0036] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0037] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0038] like Figures 1 to 3As shown, in one embodiment, a heat dissipation module 10 includes a housing 1 and a heat dissipation component 2; the heat dissipation component 2 includes a base plate 21, a first fin group 22, and a second fin group 23; the base plate 21 is connected to the housing 1 to enclose and form a fluid channel 3 with an inlet and an outlet; the first fin group 22 and the second fin group 23 are both connected to the base plate 21 and are both located within the fluid channel 3; in the extending direction of the fluid channel 3, the inlet, the first fin group 22, the second fin group 23, and the outlet are arranged sequentially; the heat dissipation efficiency of the first fin group 22 is less than that of the second fin group 23.

[0039] In use, the base plate 21 can be connected to the target object (i.e., the heat source), and the heat from the target object can be transferred through the base plate 21 to the first fin group 22 and the second fin group 23. Additionally, cooling medium can be introduced into the fluid channel 3 from the inlet; then, the cooling medium flows along the extension direction of the fluid channel 3 towards the outlet. During this process, the cooling medium passes sequentially through the first fin group 22 and the second fin group 23 to exchange heat with them, thereby carrying away the heat from the first fin group 22 and the second fin group 23.

[0040] It should be understood that during the use of the heat dissipation module 10, the first fin group 22 is located upstream of the fluid channel 3, and the second fin group 23 is located downstream of the fluid channel 3.

[0041] In this embodiment, by setting the heat dissipation efficiency of the first fin group 22 to be less than that of the second fin group 23, the poor heat exchange effect between the heat dissipation module 10 caused by the high temperature of the downstream cooling medium in the prior art can be compensated. This helps to make the temperature of the upstream cooling medium and the downstream cooling medium more similar (i.e., reduce the temperature difference between them) and improve the temperature uniformity of the heat dissipation module 10.

[0042] In one embodiment, the fluid channel 3 extends in a straight line. Figure 2 In the example shown, the fluid channel 3 extends parallel to the X-axis.

[0043] like Figure 4 and Figure 5 As shown, in one embodiment, the first fin group 22 includes a plurality of first fins 221, and the second fin group 23 includes a plurality of second fins 231; wherein both the first fins 221 and the second fins 231 are connected to the base plate 21, and the number of first fins 221 is less than the number of second fins 231. By reducing the number of first fins 221, the heat dissipation efficiency of the first fin group 22 can be reduced, thereby making the heat dissipation efficiency of the first fin group 22 less than that of the second fin group 23. Here, "a plurality of" means two or more, and the meaning of the term "a plurality of" is the same in all embodiments.

[0044] In addition, both the first fin 221 and the second fin 231 are metal parts.

[0045] like Figure 4 As shown, in one embodiment, in a first direction, a plurality of first fins 221 are arranged at intervals in sequence, and a plurality of second fins 231 are also arranged at intervals in sequence; the spacing between adjacent first fins 221 is greater than the spacing between adjacent second fins 231; the first direction intersects with the extension direction of the fluid channel 3.

[0046] This configuration allows the number of first fins 221 to be less than the number of second fins 231 within the same space. Moreover, during use, the cooling medium can flow through the gaps between adjacent first fins 221 and adjacent second fins 231, facilitating heat exchange between the two heat dissipation modules 10 and the cooling medium.

[0047] The phrase “the distance between adjacent first fins 221 is greater than the distance between adjacent second fins 231” can mean that the minimum spacing between adjacent first fins 221 is greater than the maximum spacing between adjacent second fins 231.

[0048] In one embodiment, the first direction is perpendicular to the extending direction of the fluid channel 3, wherein, in Figure 4 Of the directions shown, the first direction is parallel to the Y-axis.

[0049] In one embodiment, the surfaces of two adjacent first fins 221 that are close to each other are parallel. Specifically, the two adjacent first fins 221 are defined as fin A and fin B, respectively. In the first direction, the surface of fin A that is close to fin B is surface A, and the surface of fin B that is close to fin A is surface B. The parallelism of the surfaces of two adjacent first fins 221 means that surface A and surface B are parallel.

[0050] In one embodiment, both surface A and surface B can be planar. Of course, in other embodiments, surface A and surface B can also be curved surfaces, etc.

[0051] In one embodiment, in the first direction, both opposite surfaces of the first fin 221 are planar. In this case, the first fin 221 has a flat plate structure, such as a rectangular plate (i.e., a cuboid structure). Of course, the first fin 221 can also be a circular plate (i.e., a cylindrical structure) or a plate with other cross-sectional shapes. In addition, the shape and structure of each first fin 221 can be the same.

[0052] In other embodiments, surfaces A and B may not be parallel. In this case, the distance between fin A and fin B may refer to the minimum distance, maximum distance, or average distance between surfaces A and B.

[0053] In one embodiment, in a first direction, a plurality of first fins 221 are arranged at equal intervals, that is, the spacing between adjacent first fins 221 is the same. This makes the production and processing of the first fin group 22 more convenient.

[0054] In one embodiment, the surfaces of two adjacent second fins 231 that are close to each other are parallel. Specifically, the two adjacent second fins 231 are defined as fin C and fin D, respectively. In the first direction, the surface of fin C that is close to fin D is the C surface, and the surface of fin D that is close to fin C is the D surface. The parallelism of the surfaces of two adjacent second fins 231 means that the C surface and the D surface are parallel.

[0055] In one embodiment, both surface C and surface D can be planar. Of course, in other embodiments, surface C and surface D can also be curved surfaces, etc.

[0056] In one embodiment, in the first direction, both opposite surfaces of each second fin 231 are planar, and the second fin 231 has a flat plate structure, such as a rectangular plate (i.e., a cuboid structure). Of course, the second fin 231 can also be a circular plate (i.e., a cylindrical structure) or a plate with other cross-sectional shapes. In addition, the shape and structure of each first fin 221 can be the same.

[0057] In other embodiments, surfaces C and D may not be parallel. In this case, the distance between fin C and fin D may refer to the minimum distance, maximum distance, or average distance between surfaces C and D.

[0058] In one embodiment, in the first direction, a plurality of second fins 231 are arranged at equal intervals, that is, the spacing between adjacent second fins 231 is the same. This makes the production and processing of the second fin group 23 more convenient.

[0059] In one embodiment, the first fin 221 and the second fin 231 can have the same shape and size. For example, when they are both rectangular plates, they have the same length, width, and thickness. Their length direction, width direction, and thickness direction are the same. Their length direction can be parallel to the X-axis, their thickness direction can be parallel to the Y-axis, and their width direction can be parallel to the Z-axis (see below).

[0060] In one embodiment, when the first fin 221 is a flat plate, its surface in the first direction (e.g., surface A and surface B) intersects the first direction, and the two can be perpendicular or not perpendicular. When the second fin 231 is a flat plate, its surface in the first direction (e.g., surface C and surface D) intersects the first direction, and the two can be perpendicular or not perpendicular.

[0061] In one embodiment, the spacing between two adjacent first fins 221 can be 2.5 mm, and the spacing between two adjacent second fins 231 can be 1.5 mm.

[0062] In one embodiment, the first fin group 22 and the second fin group 23 are spaced apart along the extension direction of the fluid channel 3. The interval between the first fin group 22 and the second fin group 23 in the extension direction of the fluid channel 3 is defined as a transition zone, the gap between adjacent first fins 221 is defined as a first cooling zone, and the gap between adjacent second fins 231 is defined as a second cooling zone. When the cooling medium passes through each of the first cooling zones, it first collects in the transition zone and then enters each of the second cooling zones from the transition zone. This allows the cooling medium passing through the first fin group 22 to be more evenly distributed to each of the second cooling zones, improving the cooling effect and temperature uniformity of the heat dissipation module 10.

[0063] like Figure 6 As shown, in one embodiment, the first fin group 22 further includes a plurality of first limiting units 222, which are used to limit the spacing between two adjacent first fins 221; the first limiting units 222 correspond one-to-one with the first fins 221, and the first limiting units 222 are connected to their corresponding first fins 221. During assembly, it is easier to make the spacing between adjacent first fins 221 meet the requirements, thereby facilitating the assembly of the first fin group 22.

[0064] In one embodiment, in the first direction, the first limiting unit 222 is located on one side of the corresponding first fin 221, and the corresponding first limiting unit 222 and first fin 221 are arranged in the same direction. This facilitates the manufacturing and processing of the first fin 221 and the first limiting unit 222.

[0065] In addition, the first fin 221 and the first limiting unit 222 can be an integral structure.

[0066] like Figure 6 As shown, in one embodiment, the first limiting unit 222 includes two limiting plates 223, which are respectively connected to the two ends of the corresponding first fin 221 in the second direction; wherein the first direction, the second direction, and the extension direction of the fluid channel 3 intersect each other. This can improve the limiting effect on the distance between two adjacent first fins 221.

[0067] In this embodiment, the first limiting unit 222 and the corresponding first fin 221 form a U-shaped heat sink (the heat sink is positioned as the first heat sink). In the first direction, the opening side of each first heat sink (i.e. the side of the limiting plate 223 away from the first fin 221) faces the same side.

[0068] In one embodiment, the first direction, the second direction, and the extending direction of the fluid channel 3 are perpendicular to each other, wherein... Figure 6 Of the directions shown, the second direction is parallel to the Z-axis. In a scenario, the extension direction of fluid channel 3 can be front-to-back. The first direction can be left-to-right, and the second direction can be up-to-down.

[0069] After assembly, in the first direction, the two outermost heat sinks are heat sink A and heat sink B, respectively. In the first direction, the surface of the first limiting unit 222 of heat sink A, which is away from its first fin 221, can abut against the outer shell 1. After assembly, the first fin 221 of heat sink A, its two limiting plates 223, and the outer shell 1 form a cooling space.

[0070] In addition, in the first direction, the surface of the first fin 221 of the heat sink B that is away from its first limiting unit 222 may be in contact with the outer casing 1.

[0071] In one embodiment, the limiting plate 223 can be a metal plate, and the first fin 221 and the two limiting plates 223 connecting it are an integral structure. During production, the opposite ends of a flat plate can be bent using a bending process to obtain the first heat sink.

[0072] In one embodiment, the two limiting plates 223 of a first limiting unit 222 are a first plate and a second plate, respectively; in a second direction, the surface of the first plate facing away from the second plate abuts against the bottom plate 21, and the surface of the second plate facing away from the first plate abuts against the outer shell 1. The first plate is located below the second plate, and the bottom plate 21 is located below the first plate.

[0073] In production, the first plate and the base plate 21 can be welded together. Since the first fin 221 is relatively thin, welding the first plate to the base plate 21 can make the first fin 221 more firmly connected to the base plate 21 than welding the first fin 221 to the base plate 21.

[0074] In one embodiment, in the first direction, one of two adjacent limiting plates 223 is provided with a first buckle, and the other is provided with a first locking hole, with the first buckle fastened into the first locking hole. During production, the first heat sinks can be fastened together to form a first fin group 22, and then the first fin group 22 can be welded onto the base plate 21.

[0075] The first buckle is a protruding structure on the limiting plate 223, which can be formed by stamping the limiting plate 223.

[0076] In one embodiment, the second fin group 23 further includes a plurality of second limiting units, which are used to limit the spacing between two adjacent second fins 231. Each second limiting unit corresponds to a second fin 231 and is connected to its corresponding second fin 231. This makes it easier to ensure that the spacing between adjacent second fins 231 meets the requirements during assembly, thereby facilitating the assembly of the second fin group 23.

[0077] In one embodiment, in the first direction, the second limiting unit is located on one side of the corresponding second fin 231, and the corresponding second limiting unit and the second fin 231 are arranged in the same direction. This facilitates the manufacturing and processing of the second fin 231 and the second limiting unit.

[0078] In addition, the second fin 231 and the second limiting unit can be an integral structure.

[0079] In one embodiment, the second limiting unit includes two positioning plates, which are respectively connected to the two ends of the corresponding second fin 231 in a second direction. This can improve the limiting effect on the distance between two adjacent second fins 231.

[0080] In this embodiment, the second limiting unit and the corresponding second fin 231 form a U-shaped heat sink (the heat sink is positioned as the second heat sink). In the first direction, the opening side of each second heat sink (i.e. the side of the positioning plate away from the second fin 231) faces the same side.

[0081] After assembly, in the first direction, the two outermost second heat sinks are heat sink C and heat sink D, respectively. In the first direction, the surface of the second limiting unit of heat sink C facing away from its second fin 231 can abut against the outer shell 1. After assembly, the second fin 231 of heat sink C, its two positioning plates, and the outer shell 1 form a cooling space.

[0082] In addition, in the first direction, the surface of the second fin 231 of the heat sink D that is away from its second limiting unit may be in contact with the outer casing 1.

[0083] In one embodiment, the positioning plate can be a metal plate, and the second fin 231 and the two positioning plates connecting it are an integral structure. During production, the opposite ends of a flat plate can be bent using a bending process to obtain the second heat sink.

[0084] In one embodiment, the two positioning plates of a second limiting unit are a third plate and a fourth plate, respectively; in a second direction, the surface of the third plate facing away from the fourth plate abuts against the bottom plate 21, and the surface of the fourth plate facing away from the third plate abuts against the outer shell 1. The first plate is located below the second plate, and the bottom plate 21 is located below the first plate.

[0085] In production, the third plate can be welded together with the base plate 21. Since the second fin 231 is thinner, welding the third plate to the base plate 21 makes the second fin 231 more firmly connected to the base plate 21 than welding the second fin 231 to the base plate 21.

[0086] In one embodiment, in the first direction, one of two adjacent positioning plates is provided with a second buckle, and the other is provided with a second locking hole, with the second buckle fastened into the second locking hole. During production, the second heat sinks can be fastened together to form a second fin assembly, and then the second fin assembly can be welded onto the base plate 21.

[0087] The second buckle is a protruding structure on the positioning plate, which can be formed by stamping the positioning plate.

[0088] In one embodiment, the thermal conductivity of the first fin 221 is less than that of the second fin 231; this arrangement also makes it easier to make the heat dissipation efficiency of the first fin group 22 less than that of the second fin group 23.

[0089] In one embodiment, the first fin 221 is an aluminum fin and the second fin 231 is a copper fin.

[0090] like Figure 2 and Figure 3 As shown, in one embodiment, the base plate 21 can be a metal plate, and the surface of the base plate 21 facing away from the fluid channel 3 is used to connect a heat source. Alternatively, the base plate 21 can be a flat plate, which can be a cuboid structure.

[0091] In one embodiment, the base plate 21 has a first mounting area and a second mounting area. A first fin group 22 is connected to the first mounting area, and a second fin group 23 is connected to the second mounting area. The heat dissipation assembly 2 further includes a heat-conducting element 24, which is disposed on the base plate 21. A portion of the heat-conducting element 24 is located in the first mounting area, and another portion is located in the second mounting area. The heat-conducting element 24 is used to realize heat exchange between the first mounting area and the second mounting area. The heat-conducting element 24 can transfer the downstream temperature to the upstream temperature, thereby improving the temperature uniformity performance of the heat dissipation module 10.

[0092] In one embodiment, the heat-conducting element 24 may be a heat pipe or a graphite rod, etc.

[0093] like Figure 2 As shown, in one embodiment, the base plate 21 has a mounting groove 211 on the surface near the fluid channel 3, and the heat-conducting element 24 is disposed in the mounting groove 211.

[0094] like Figure 2 As shown, in one embodiment, the heat-conducting element 24 is provided in multiple forms and is arranged at intervals along the first direction.

[0095] like Figure 3 As shown, in one embodiment, the outer casing 1 includes a surrounding plate 11 and an end cap 12; the surrounding plate 11 is connected to the bottom plate 21, and the surrounding plate 11 and the bottom plate 21 enclose each other to form a first hole; the end cap 12 is connected to one end of the surrounding plate 11 and is opposite to the first hole; the end cap 12 is provided with a second hole, and the second hole penetrates the end cap 12 along the extension direction of the fluid channel 3; the first hole and the second hole communicate to form the fluid channel 3, the end of the first hole away from the end cap 12 forms an output port, and the end of the second hole away from the surrounding plate 11 forms an input port.

[0096] The enclosure and the base plate 21 are connected to form a shell. The first hole is a through hole that extends through the shell along the extension direction of the fluid channel 3. The end cap 12 is connected to one end of the shell. The first hole forms an outlet on the surface of the shell opposite to the end cap 12, and the second hole forms an inlet on the surface of the end cap 12 opposite to the shell.

[0097] Additionally, the end cap 12 is connected to one end of the surrounding plate 11 in the extending direction of the fluid channel 3. The first hole and the second hole can be coaxial.

[0098] In one embodiment, the first hole is a square hole. In this case, the housing can have a cuboid structure.

[0099] In one embodiment, the second hole can be a circular hole, and the end cap 12 can be a cuboid structure.

[0100] In addition, the first fin group 22 and the second fin group 23 are both located in the first hole and spaced apart from the end cap 12. The gap between the first fin group 22 and the end cap 12 is defined as the distribution area. After the external cooling medium enters the fluid channel 3 from the inlet, it will first enter the distribution area and then enter the first cooling zone. This allows the cooling medium to be distributed more evenly to each first cooling zone.

[0101] In one embodiment, the cooling medium is gas. In this case, the heat dissipation module 10 also includes a fan 4, which is connected to the end cover 12 and is used to blow air from the inlet into the fluid channel 3.

[0102] Of course, in other embodiments, fan 4 can be replaced by an air source such as an air pump. Furthermore, in other embodiments, the cooling medium can also be a liquid.

[0103] In one embodiment, the outer casing 1 and the base plate 21 are detachably connected, for example, they can be connected together by bolts or other fasteners. Of course, in other embodiments, the outer casing 1 and the base plate 21 can also be non-detachably connected, for example, they can be welded together.

[0104] In addition, such as Figure 3As shown, the shell can be a cuboid structure. In this case, the bottom plate 21 is a flat plate, and the surrounding plate 11 is a U-shaped structure. The surrounding plate 11 includes a first mounting plate 111, a second mounting plate 112, and a third mounting plate 113. The first mounting plate 111, the second mounting plate 112, and the third mounting plate 113 are all rectangular plates (i.e., cuboid structures). The first mounting plate 111 and the second mounting plate 112 are respectively disposed at both ends of the third mounting plate 113, and the three form a U-shaped structure. The end of the first mounting plate 111 facing away from the third mounting plate 113 is connected to one end of the bottom plate 21, and the end of the second mounting plate 112 facing away from the third mounting plate 113 is connected to the other end of the bottom plate 21.

[0105] In addition, the limiting plate 223 of the heat sink A can abut against the first mounting plate 111, the first fin 221 of the heat sink B can be attached to the second mounting plate 112, the surface of the first plate of the first limiting unit 222 facing away from its second plate can abut against the base plate 21, and the surface of the second plate of the limiting unit facing away from its first plate can abut against the third mounting plate 113.

[0106] The positioning plate of the heat sink C can abut against the first mounting plate 111, the second fin 231 of the heat sink D can be attached to the second mounting plate 112, the surface of the third plate of the second limiting unit facing away from its fourth plate can abut against the base plate 21, and the surface of the fourth plate of the limiting unit facing away from its third plate can abut against the third mounting plate 113.

[0107] like Figure 7 and Figure 8 As shown, this embodiment of the present invention also provides a control module, which includes a chip module 20 and a heat dissipation module 10 as described in any of the above embodiments; the chip module 20 is connected to the base plate 21. The chip module 20 is the heat source, and the heat dissipation module 10 is used to dissipate heat from the chip module 20.

[0108] like Figure 8 As shown, the chip module 20 includes a substrate 201 and multiple chips 202 (such as AI chips). These chips 202 are all disposed on the substrate 201, which can be arranged in an array on the substrate 201. The substrate 201 can be a PCB (rigid circuit board). During operation, the heat generated by the chips 202 can be transferred to the base plate 21, then to the first fin group 22 and the second fin group 23, and finally carried away by the cooling medium flowing into the fluid channel 3.

[0109] In one embodiment, the side of the chip 202 facing away from the substrate 201 is connected to the base plate 21. Specifically, it is connected to the surface of the base plate 21 facing away from the fluid channel 3. In addition, a thermally conductive medium is provided between the substrate 201 and the housing 1, and between the chip 202 and the housing 1. The thermally conductive medium can be silicone or the like.

[0110] This utility model embodiment also provides an intelligent device, which includes the control module described in any of the above embodiments. The intelligent device can be a car, a computer, or an aircraft, etc.

[0111] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0112] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be included within the protection scope of this utility model.

Claims

1. A heat dissipation module, characterized in that, Including the casing and heat dissipation components; The heat dissipation assembly includes a base plate, a first fin group, and a second fin group; The base plate is used to connect a heat source, and the base plate is connected to the outer shell to enclose and form a fluid channel with an inlet and an outlet. Both the first fin group and the second fin group are connected to the base plate and are located within the fluid channel; In the extending direction of the fluid channel, the inlet, the first fin group, the second fin group, and the outlet are arranged in sequence; The heat dissipation efficiency of the first fin group is less than that of the second fin group.

2. The heat dissipation module according to claim 1, characterized in that, The first fin group includes a plurality of first fins, and the second fin group includes a plurality of second fins; the number of first fins is less than the number of second fins.

3. The heat dissipation module according to claim 2, characterized in that, In a first direction, a plurality of first fins are arranged at intervals in sequence, and a plurality of second fins are arranged at intervals in sequence; the first direction intersects with the extension direction of the fluid channel; The spacing between adjacent first fins is greater than the spacing between adjacent second fins.

4. The heat dissipation module according to claim 3, characterized in that, In the extending direction of the fluid channel, the first fin group and the second fin group are spaced apart; and / or, In the first direction, a plurality of first fins are arranged at equal intervals, and a plurality of second fins are arranged at equal intervals; and / or, The thermal conductivity of the first fin is less than that of the second fin; the first fin is an aluminum fin, and the second fin is a copper fin.

5. The heat dissipation module according to claim 3, characterized in that, The first fin group further includes a plurality of first limiting units, which are used to limit the spacing between two adjacent first fins; The first limiting unit corresponds one-to-one with the first fin, and the first limiting unit is connected to the first fin corresponding to it; In the first direction, the first limiting unit is located on one side of the first fin corresponding to it, and the arrangement direction of the corresponding first limiting unit and the first fin is the same.

6. The heat dissipation module according to claim 5, characterized in that, The first limiting unit includes two limiting plates, which are respectively connected to the two ends of the first fin in the second direction; the first direction, the second direction and the extension direction of the fluid channel are perpendicular to each other; In the first direction, one of the two adjacent limiting plates is provided with a first buckle and the other is provided with a first locking hole, and the first buckle is fastened in the first locking hole; and / or, the first fin and the two limiting plates connected thereto are an integral structure; and / or, the two limiting plates are a first plate and a second plate, respectively. In the second direction, the surface of the first plate facing away from the second plate abuts against the bottom plate, and the surface of the second plate facing away from the first plate abuts against the outer shell.

7. The heat dissipation module according to claim 1, characterized in that, The outer casing includes a perimeter panel and end caps; The surrounding panel is connected to the bottom plate, and the surrounding panel and the bottom plate together form a first hole; The end cap is connected to one end of the enclosure and is opposite to the first hole; The end cap is provided with a second hole, which penetrates the end cap along the extension direction of the fluid channel; The first hole and the second hole communicate to form the fluid channel. The end of the first hole away from the end cap forms the output port, and the end of the second hole away from the surrounding plate forms the input port. Both the first fin group and the second fin group are located within the first hole and are spaced apart from the end cap; The heat dissipation module also includes a fan connected to the end cover for blowing air from the inlet into the fluid channel.

8. The heat dissipation module according to claim 1, characterized in that, The base plate has a first mounting area and a second mounting area, the first fin group is connected to the first mounting area, and the second fin group is connected to the second mounting area; The heat dissipation assembly further includes a heat-conducting element, which is disposed on the base plate. A portion of the heat-conducting element is located in the first mounting area, and another portion of the heat-conducting element is located in the second mounting area. The heat-conducting component is used to achieve heat exchange between the first mounting area and the second mounting area.

9. A control module, characterized in that, Includes a chip module and a heat dissipation module as described in any one of claims 1 to 8; The chip module is connected to the base plate.

10. A smart device, characterized in that, Includes the control module as described in claim 9.

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