Air-cooling heat dissipation device

By designing a sealed structure and an organized airflow path, the problems of dust accumulation, high noise, low heat exchange efficiency, and poor module expansion capability of air-cooled heat dissipation devices are solved, achieving efficient and stable heat dissipation, which is suitable for high-performance equipment.

CN224290470UActive Publication Date: 2026-05-26NANTONG JINGYUAN CLOUD COMPUTING TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
NANTONG JINGYUAN CLOUD COMPUTING TECHNOLOGY CO LTD
Filing Date
2025-08-13
Publication Date
2026-05-26

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Abstract

The utility model provides an air cooling heat dissipation device, and belongs to the technical field of heat dissipation. The device comprises a heat conduction pipe and heat dissipation fins arranged on the heat conduction pipe, the heat conduction pipe and the heat dissipation fins are jointly arranged in a closed box body in a closed mode, the box body is provided with an air inlet and an air outlet, the air outlet is connected with an air source through a guide pipe, and the air source is an axial flow fan. The heat conduction pipe is of a snakelike structure and penetrates through a plurality of heat dissipation fins arranged in parallel, and airflow flows in the direction of the fins in parallel. The heat conduction pipe comprises a first exchange pipe and a second exchange pipe which are used for inflow and outflow of a heating medium respectively and are in airtight connection with the wall of the box body. The air source can comprise a plurality of axial flow fans connected in series, the air inlets and the air outlets between the box bodies can be connected in series, the box bodies can be arranged in a stacked mode, and the heat conduction pipes in the different box bodies can be connected in series. The utility model has the advantages of compact structure, good dustproof effect, high heat exchange efficiency, modular expansion and the like, and is suitable for heat dissipation application of high-performance electronic equipment.
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Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, specifically to the structural design of an air-cooled heat dissipation device, which can be applied to equipment or systems that require heat exchange through forced air cooling, such as heat dissipation modules for electronic devices, power devices, mechanical components, etc. Background Technology

[0002] Air cooling technology is widely used in heat-intensive applications such as electronic devices, servers, and new energy power control modules. Its basic structure typically includes a fan, heat pipes, and heat sink fins. In existing technologies, air cooling devices generally adopt an open structure, with the fan directly blowing air onto the exposed heat sink fins. This structure presents several technical problems: First, because the heat sink fins are exposed to the air for extended periods, dust easily accumulates, increasing thermal resistance and severely impacting cooling efficiency and stability. Second, to provide sufficient airflow, traditional devices typically use large fans, which not only occupy space and limit the compactness of the device structure but also easily generate significant noise due to structural resonance, especially noticeable when multiple fans are operating. Furthermore, traditional fans are limited by speed and noise control, making it difficult to further increase airflow and pressure, thus limiting cooling efficiency. On the other hand, the heat exchange process in existing radiators is generally insufficient, with uncontrolled airflow paths, easily forming hotspots in some areas, leading to low heat exchange efficiency. Moreover, in most structures, one fan can only correspond to one cooling module, failing to achieve shared and coordinated airflow resources, resulting in low overall system energy efficiency and space utilization. In summary, existing air-cooled heat dissipation systems have certain limitations in terms of structure, efficiency, and adaptability, and there is an urgent need for an improved solution that is compact, has controllable airflow, is highly efficient in heat dissipation, and is easy to modularly expand. Summary of the Invention

[0003] The present invention aims to overcome the problems of large fan size, easy dust accumulation, high noise, low heat exchange efficiency and poor module expansion capability in existing air-cooled heat dissipation systems, and to provide an air-cooled heat dissipation device with compact structure, sufficient heat exchange, high efficiency and easy modular expansion.

[0004] To achieve the above objectives, this invention provides an air-cooled heat dissipation device, including a heat pipe and heat dissipation fins disposed on the heat pipe. The heat pipe and heat dissipation fins are enclosed in a sealed housing, which has an air inlet and an air outlet. The air outlet is connected to an air source, namely an axial flow fan, via a duct. By sealing the heat dissipation components inside the housing, external dust is prevented from directly adhering to the heat dissipation fins, keeping the heat exchange surface clean and effectively improving heat dissipation efficiency under long-term use. Simultaneously, the sealed structure effectively controls the airflow path, improving airflow penetration and heat exchange efficiency. Furthermore, a filter cotton is placed upstream of the fan to purify the air and reduce the possibility of dust accumulation.

[0005] Furthermore, the heat pipe adopts a serpentine structure and is connected to multiple parallel heat dissipation fins. After entering the housing, the airflow flows parallel to the fin direction, forming an organized laminar flow path, thereby enhancing the heat exchange effect between the heat dissipation fins. The serpentine heat pipe includes a first exchange pipe and a second exchange pipe. The first exchange pipe is used for the inflow of heat medium, and the second exchange pipe is used for the outflow of heat medium. Both pass through the outer wall of the housing and form an airtight connection with the housing to prevent air leakage and ensure that the airflow is concentrated and fully applied to the heat dissipation area.

[0006] To enhance cooling capacity, the air source can be configured as multiple axial flow fans connected in series to increase air pressure and flow rate, thereby adapting to multi-stage or high heat flux operating environments. Furthermore, the air-cooled heat dissipation device can be composed of multiple boxes connected in series, with the air inlet and outlet of each box interconnected to form a continuous air duct; the multiple boxes can also be arranged in a stacked structure to expand the heat dissipation area in vertical space. To further improve overall heat exchange efficiency, the heat pipes inside different boxes can also be connected in series to achieve continuous conduction of the heat medium.

[0007] Through the above structural design, the air-cooled heat dissipation device provided by the present invention has the advantages of being sealed and dustproof, having high efficiency in heat conduction, controllable flow field, low noise, and being stackable and expandable. It is particularly suitable for electronic or industrial equipment with high requirements for heat dissipation efficiency, stability, and size. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the overall structure of the air-cooled heat dissipation device according to an embodiment of the present invention.

[0009] Figure 2 for Figure 1 The exploded view of the air-cooled heat dissipation device shown in the diagram illustrates the heat dissipation fins and heat pipe assembly inside the sealed box.

[0010] Figure 3 This is a schematic diagram of the structure of multiple heat dissipation units stacked and connected in series in an embodiment of the present invention.

[0011] Figure 4 This is a schematic diagram of the airflow path in an embodiment of the present invention, illustrating the airflow direction and heat exchange process driven by an axial flow fan. Detailed Implementation

[0012] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings, which are intended to help understand the structure and technical solutions of the present invention, but do not limit the scope of protection of the present invention.

[0013] like Figures 1 to 4As shown, the present invention provides an air-cooled heat dissipation device, including a housing 100, which includes at least one air inlet 101 and one air outlet 102. Air flows into the housing 100 through the air inlet 101, exchanges heat with the surface of the heat dissipation fins 106, and then flows out through the air outlet 102, thereby carrying away heat. The air outlet 102 is connected to an external air source 300 through a duct 200, which is preferably an axial flow fan 301, to form a forced airflow circulation in the system and improve heat dissipation efficiency.

[0014] Furthermore, the box 100 can be manufactured in one piece using metal materials, such as aluminum alloy or stainless steel plate, and encapsulated by stamping, welding or screwing, which has both good structural strength and excellent thermal conductivity.

[0015] like Figure 2 and Figure 3 The box 100 shown includes a heat pipe 103 and heat dissipation fins 106 disposed on the heat pipe 103. The heat pipe 103 and the heat dissipation fins 106 are enclosed together in a sealed box 100, which constitutes an independent and closed heat exchange cavity, and its interior is used to form an organized airflow path to achieve efficient heat exchange.

[0016] like Figure 2 As further shown, the heat pipe 103 preferably has a serpentine structure, laid laterally inside the housing 100, and sequentially passing through multiple parallel heat dissipation fins 106. This structure not only increases the heat conduction area but also allows heat to be evenly transferred to each fin area, improving the overall heat exchange capacity. A heat transfer medium, typically a liquid or gaseous heat-conducting fluid, flows inside the heat pipe 103. One end of the heat pipe 103 is a first exchange pipe 104 for the inflow of the heat transfer medium, and the other end is a second exchange pipe 105 for the outflow of the heat transfer medium. The first exchange pipe 104 and the second exchange pipe 105 respectively exit from one side of the housing 100 and form an airtight connection with the wall of the housing 100 through welding or a sealing ring, ensuring no air leakage and maintaining the airtightness of the heat exchange cavity.

[0017] Furthermore, the heat dissipation fins 106 are preferably sheet-like metal structures, arranged parallel to each other along the airflow direction A inside the housing 100. Multiple heat dissipation fins 106 are evenly spaced and are in close contact with or welded to the heat pipes 103, forming a highly efficient thermal coupling structure. Each heat dissipation fin 106 has a certain height and width, typically a rectangular or corrugated sheet structure, to increase the surface area and improve air convection heat transfer efficiency.

[0018] To further improve heat dissipation performance, the heat dissipation fins 106 can be formed by stamping or bending. Optionally, turbulence holes, protrusions, or fin-like turbulence structures 107 can be formed on their surface to break the airflow boundary layer and improve the heat exchange coefficient. In some embodiments, the heat dissipation fins 106 can adopt a corrugated or serrated edge design to enhance airflow disturbance and turbulence intensity, thereby improving the heat exchange efficiency between air and fins.

[0019] The heat dissipation fins 106 are preferably made of high thermal conductivity metals, such as aluminum or copper, and their surfaces can be anodized, coated with a black heat-resistant coating, or micronized to enhance radiative heat transfer and delay corrosion. In terms of size design, the fin thickness is generally 0.2–1.0 mm, and the length and height are matched to the dimensions of the housing 100 to ensure that air can pass evenly through all the fin gaps, forming a sufficient airflow channel for heat exchange.

[0020] Multiple fins 106 can be fixed to the housing 100 by means of fixed guide rails, slots or welding to ensure that they do not shake or fall off under the action of airflow, thereby improving the vibration resistance and working stability of the overall structure.

[0021] like Figure 3 and Figure 4 As shown, to enhance heat dissipation, the air source 300 in this embodiment may further include multiple axial flow fans 301 arranged in series. By increasing the air pressure and air volume, the airflow can travel through a longer path or more modules. Furthermore, it includes multiple axial flow fans 301 arranged in series, which are sequentially arranged along the airflow direction and connected to the air inlets 101 of multiple heat dissipation boxes 100 through air ducts or connecting pipes 304 to form a continuous high-pressure airflow channel.

[0022] The axial fan 301 operates in series, which has a higher static pressure capacity than traditional parallel fans. It can ensure that the air maintains a sufficient flow rate after passing through multiple sealed boxes 100 and multiple heat dissipation fins 106, thereby achieving efficient heat exchange in long-path, high-impedance environments.

[0023] Furthermore, the axial flow fan 301 preferably adopts a speed-adjustable motor 302 drive structure, which can dynamically adjust the speed according to the heat dissipation load, reducing energy consumption and noise. In some embodiments, the fan is equipped with a temperature control feedback module or linked with the server / power system main control chip, automatically adjusting the wind speed according to real-time temperature or operating power, thereby achieving intelligent control. Multiple fans can be connected by a sealed duct to prevent leakage and ensure airflow continuity;

[0024] Furthermore, an air filter 108 can be installed at the air inlet 104 of the air source 300 to prevent dust and impurities from entering the sealed cavity with the airflow, thereby avoiding dust accumulation on the fins from the source and maintaining long-term high-efficiency heat exchange performance.

[0025] Furthermore, the air filtration device 108 can adopt a detachable structural design, including a mounting frame, a filter screen, and a locking or snap-on assembly. The filter screen can be a multi-layer composite structure made of non-woven fabric, metal mesh, polyester fiber, foam coating material, etc., and can be configured as a coarse, medium, or high-efficiency filtration unit depending on the usage environment.

[0026] For ease of maintenance, the filter device 108 can be quickly disassembled and replaced via quick-release slots or a magnetic structure, facilitating regular cleaning or replacement of the filter element. In some embodiments, a differential pressure sensor or a clogging indicator can also be integrated into the filter to alert maintenance personnel whether the filter is clogged or needs replacement, enabling intelligent operation and maintenance.

[0027] By setting up an air filter device 108, airborne particles are effectively prevented from entering the heat dissipation system, significantly improving the reliability and service life of the heat dissipation system.

[0028] Furthermore, referring to Figure 3 and Figure 4 As shown, to adapt to high power density scenarios, the present invention may further include multiple of the aforementioned housing units 100. The air inlets 101 and outlets 102 of the multiple housing units 100 can be connected in series via conduits 200 to form a segmented, continuous air duct structure, thereby constituting a modular heat dissipation system. The multiple housing units 100 can be arranged in a stacked manner, for example, layered in the vertical direction, to save space. Each housing unit 100 is equipped with heat pipes 103 and fins 106, and the heat pipes 103 within different housing units 100 can be further connected in series via pipelines to form a continuous heat transfer medium loop, achieving unified thermal management at the system level.

[0029] In addition, such as Figure 4 As shown, the arrangement direction of the multiple heat dissipation fins 106 inside the box 100 is preferably parallel to the airflow direction of the air inlet 101. Combined with the stable airflow formed by the axial flow fan 301, higher heat exchange efficiency can be achieved, the turbulence zone can be reduced, and the wind energy utilization rate can be improved.

[0030] The air-cooled heat dissipation device in this embodiment effectively solves the problems of dust accumulation and blockage, insufficient air pressure, resonance noise, low heat exchange efficiency and poor structural scalability in traditional air-cooled heat dissipation through its sealed structure packaging, serpentine heat pipe 103 design, axial flow fan 301 drive and modular stacking. It is suitable for high-performance servers, new energy equipment, power electronic systems and other occasions that require efficient and stable heat dissipation.

Claims

1. A wind-cooled heat dissipation device, comprising: The heat pipe and the heat dissipation fins disposed on the heat pipe are characterized in that, The heat pipe and heat dissipation fins are enclosed in a sealed box, which includes an air inlet and an air outlet. The air outlet is connected to an air source via a duct; The air source is an axial flow fan.

2. The air-cooled heat sink of claim 1, wherein The heat pipe has a serpentine structure and is connected to a plurality of fins arranged in parallel to each other.

3. The air-cooled heat sink of claim 2, wherein The airflow direction of the air inlet is parallel to the extension direction of the plurality of parallel fins.

4. The air-cooled heat sink of claim 3, wherein The serpentine structure includes a first exchange pipe and a second exchange pipe. The first exchange pipe is used for the inflow of heat medium, and the second exchange pipe is used for the outflow of heat medium. The first exchange pipe and the second exchange pipe pass through the wall of the box body and form an airtight connection with the box body wall.

5. The air-cooled heat dissipation device according to claim 4, characterized in that, The air source includes multiple axial flow fans connected in series.

6. The air-cooled heat dissipation device according to claim 5, characterized in that, It includes multiple boxes, and the air inlets and outlets of the multiple boxes are connected in series.

7. The air-cooled heat dissipation device according to claim 6, characterized in that, The multiple boxes are stacked together.

8. The air-cooled heat dissipation device according to claim 7, characterized in that, The heat-conducting pipes are installed in each of the multiple boxes, and the heat-conducting pipes in different boxes are connected in series.

9. The air-cooled heat dissipation device according to claim 7, characterized in that, The air inlet of the air source is equipped with a filter device.