Wafer transfer equipment and semiconductor processing systems

Abstract

This invention provides a wafer transfer device and a semiconductor processing system. The wafer transfer device includes a carrier stage and a wafer cassette. The wafer cassette includes a wafer cover and a wafer carrier. The wafer carrier is disposed on the carrier stage. The wafer cover has a downward-facing opening and is closable over the wafer carrier. The wafer cover is movable relative to the carrier stage along the Z-axis, allowing it to transition between a closed state and an open state. In the closed state, the wafer cover covers the wafer carrier; in the open state, the wafer cover moves upward to expose the wafer carrier. Therefore, the wafer transfer device of this invention not only improves positioning accuracy and system stability but also helps reduce the cost of the associated transfer robot.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, specifically to a wafer transfer device and a semiconductor processing system having the wafer transfer device. Background Technology

[0002] In semiconductor manufacturing plants, wafers typically need to be efficiently transferred and positioned between different process modules on the production line. Wafer transfer equipment is usually installed in front of the wafer process equipment to place and transfer wafers.

[0003] In related technologies, during the wafer cassette opening process, the height of the wafer cover is often kept constant while the entire support stage is driven to move downwards. However, this downward movement of the support stage causes vibration of the wafer rack, which in turn affects the stability and accuracy of the transfer robot's wafer handling. Furthermore, the downward movement of the support stage means that the position of the wafer relative to the transfer robot also changes synchronously. The transfer robot must maintain the same downward distance and speed as the support stage each time, requiring the transfer robot to have highly precise dynamic adjustment capabilities to compensate for the errors caused by this displacement. This leads to the problems of high cost and low adaptability for transfer robots with highly precise dynamic adjustment capabilities. Utility Model Content

[0004] In view of this, the present invention aims to provide a wafer transfer device and a semiconductor processing system to solve the problems of high cost and low adaptability of the transfer robot that needs to be used in the prior art due to the overall downward movement of the carrier stage.

[0005] This utility model provides a wafer transfer device.

[0006] Another aspect of this invention provides a semiconductor processing system.

[0007] The wafer transfer device of this utility model embodiment includes a carrier stage and a wafer cassette. The wafer cassette includes a wafer cover and a wafer rack. The wafer rack is disposed on the carrier stage. The wafer cover has a downward-facing opening and is closable over the wafer rack. The wafer cover is movable relative to the carrier stage along the Z-axis to switch between a closed state and an open state. In the closed state, the wafer cover covers the wafer rack. In the open state, the wafer cover moves upward so that the wafer rack is exposed outside the wafer cover. It is understood that the wafer cover moves upward so that the height of the carrier stage and the wafer rack does not change during the wafer cassette opening process.

[0008] The wafer transfer device of this utility model controls the wafer cover to move relative to the carrier platform along the Z-axis, so that the wafer cover changes between a closed state and an open state. The purpose of opening the wafer cover is achieved by moving the wafer cover upward, which means that the height of the carrier platform and the wafer rack does not change, and thus the position of the wafer relative to the transfer robot is also fixed. On the one hand, it avoids the shaking problem that occurs during the downward movement of the carrier platform and the wafer rack, which helps to improve the overall stability of the wafer transfer device.

[0009] On the other hand, it also allows the transfer robot for picking up and placing wafers to maintain a certain height of operation. That is, the transfer robot does not need to compensate for the positional changes caused by the movement of the carrier platform, which reduces the required range of movement of the transfer robot in the Z direction, thereby helping to improve the accuracy and adaptability of wafer picking and placement.

[0010] Furthermore, the purpose of opening the box can be achieved by controlling the up and down movement of the wafer cover, without having to coordinate the complex movements of the carrier platform and the transfer robot at the same time. This reduces the complexity and computational burden of path planning, simplifies the design and implementation of motion control algorithms, and helps to reduce the cost of the transfer robot.

[0011] Therefore, the wafer transfer equipment of this utility model not only improves positioning accuracy and system stability, but also helps to reduce the cost of the transfer robot that works with it.

[0012] In one embodiment, the wafer rack includes a rack base and a shelf body disposed on the upper end face of the rack base. The rack base is placed on the support platform, and the shelf body has a plurality of wafer slots for placing wafers. The wafer cover is lockably fastened to the rack base to form a sealed chamber covering the shelf body.

[0013] In one embodiment, the carrier platform includes a support platform and a transfer positioning plate frame disposed on one side of the support platform. The transfer positioning plate frame is used to connect to the housing of the process equipment. The transfer positioning plate frame has a pick-up and place window, which is disposed directly opposite to the wafer rack.

[0014] In one embodiment, the support platform further includes a movable cover and a driving component. The movable cover is fitted over the support platform, the transfer positioning plate frame is disposed on one side of the support platform, the upper end face of the movable cover is connected to the wafer cover, the movable cover has a clearance opening, the shelf body is disposed on the support platform through the clearance opening, and the open end of the wafer cover is lockably connected to the movable cover. The movable cover can slide relative to the transfer positioning plate frame in the Z direction via the driving component.

[0015] In one embodiment, the movable cover includes a sliding base plate and a U-shaped cover plate. The sliding base plate has a clearance opening. The shelf body is mounted on the support platform through the clearance opening. The open end of the wafer cover is lockably connected to the sliding base plate. The sliding base plate and the wafer cover are driven to slide along the Z direction by the driving member. The U-shaped cover plate is fitted outside the support platform, and the side arm of the U-shaped cover plate is slidably engaged with the transfer positioning plate frame. The outer periphery of the sliding base plate is connected to the inner wall surface of the U-shaped cover plate.

[0016] In one embodiment, the support platform further includes a plurality of positioning protrusions disposed on the sliding base plate. The plurality of positioning protrusions are disposed at intervals along the circumference of the clearance opening on the upper surface of the sliding base plate. Each positioning protrusion has a preset distance from the clearance opening. The plurality of positioning protrusions and the sliding base plate form a limiting space, and the wafer cover is placed within the limiting space.

[0017] In one embodiment, the support platform further includes a plurality of locking members disposed on the sliding base plate. The plurality of locking members are disposed spaced apart along the circumferential direction of the clearance opening on the upper surface of the sliding base plate. Each locking member includes a lock housing and a lock tongue. The lock tongue is retractably disposed on the lock housing and can extend out of the lock housing to insert into the wafer cover.

[0018] In one embodiment, the driving component includes a motor and a lead screw, the motor is mounted on the support platform, the lead screw is connected to the output end of the motor, and the sliding base plate is driven by the lead screw to drive the sliding base plate to move along the Z direction; or, the driving component may include a cylinder, the output shaft of the cylinder being connected to the sliding base plate.

[0019] In one embodiment, one of the sliding base plate and the support platform has a guide rail, and the other of the sliding base plate and the support platform has a guide groove extending in the Z direction, and the guide rail slides in the guide groove in the Z direction.

[0020] In one embodiment, the transfer positioning plate frame includes a frame body and a closing window plate. The frame body has the pick-up and place window, and the closing window plate is movably disposed on the pick-up and place window. The closing window plate is movably fitted onto the frame body along the Z direction, and the closing window plate is connected to the movable cover to close and open the pick-up and place window.

[0021] The semiconductor processing system of this utility model includes a transfer robot, a processing device, and a wafer transfer device as described above. The processing device has a process chamber, and both the transfer robot and the processing device are disposed in the process chamber. The transfer robot is capable of gripping and transferring wafers between the process chamber and the wafer cassette. Attached Figure Description

[0022] Figure 1 This is a perspective view of a wafer transfer device according to an embodiment of the present invention.

[0023] Figure 2 This is a side view of a wafer transfer device according to an embodiment of the present invention.

[0024] Figure 3 This is a rear view of the wafer transfer device according to an embodiment of the present invention.

[0025] Figure 4 This is a front view of the wafer transfer device according to an embodiment of the present invention.

[0026] Figure 5 This is a top view of the wafer transfer device according to an embodiment of the present invention.

[0027] Figure 6 yes Figure 5 A cross-sectional view along the AA direction.

[0028] Figure 7 This is a perspective view of the support platform according to an embodiment of the present utility model.

[0029] Explanation of reference numerals in the attached figures:

[0030] 100 wafer transfer devices;

[0031] Support platform 1;

[0032] Support platform 11;

[0033] 12; Frame body 121; Window closing plate 122; Window retrieval and placement 123;

[0034] Movable cover 13; sliding base plate 131; clearance opening 1311;

[0035] U-shaped cover plate 132; observation window 1321; sealing plate 1322;

[0036] Locking component 14; Positioning protrusion 15;

[0037] Drive component 16; Motor 161; Lead screw 162; Guide rail 163;

[0038] 2. Wafer box; 21. Wafer cover; 22. Wafer rack; 221. Shelf body; 222. Detailed Implementation

[0039] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0040] The following is for reference. Figures 1-7 The wafer transfer device 100 and semiconductor processing system of this utility model are described by way of example.

[0041] The wafer transfer device 100 of this embodiment includes a carrier stage 1 and a wafer cassette 2. The wafer cassette 2 includes a wafer cover 21 and a wafer holder 22. The wafer holder 22 is disposed on the carrier stage 1. The wafer cover 21 has a downward opening and is closable over the wafer holder 22. The wafer cover 21 is movable relative to the carrier stage 1 in the Z direction (e.g., ...). Figure 1 The up-down direction shown in the diagram allows the wafer cover 21 to transition between a closed state and an open state. In the closed state, the wafer cover 21 covers the wafer holder 22. In the open state, the wafer cover 21 moves upward so that the wafer holder 22 is exposed outside the wafer cover 21. It is understood that the wafer cover 21 moves upward so that the height of the support stage 1 and the wafer holder 22 does not change during the opening of the wafer cassette 2.

[0042] The wafer transfer device 100 of this utility model controls the wafer cover 21 to move relative to the carrier stage 1 along the Z direction, so that the wafer cover 21 changes between a closed state and an open state. The purpose of opening the box is achieved by moving the wafer cover 21 upward, which means that the height of the carrier stage 1 and the wafer rack 22 does not change, and thus the position of the wafer relative to the transfer robot is also fixed. On the one hand, it avoids the shaking problem that occurs during the downward movement of the carrier stage 1 and the wafer rack 22, which helps to improve the overall stability of the wafer transfer device 100.

[0043] On the other hand, it also allows the transfer robot (not shown) for picking up and placing wafers to be maintained at a certain height, that is, the transfer robot does not need to compensate for the positional changes caused by the movement of the carrier stage 1, which reduces the required range of movement of the transfer robot in the Z direction, thereby helping to improve the accuracy and adaptability of wafer picking and placement.

[0044] Furthermore, the purpose of opening the box can be achieved by controlling the up and down movement of the wafer cover 21, without having to coordinate the complex movements of the support platform 1 and the transfer robot at the same time. This reduces the complexity and computational burden of path planning, simplifies the design and implementation of motion control algorithms, and helps to reduce the cost of the transfer robot.

[0045] Therefore, the wafer transfer device 100 of this utility model not only improves positioning accuracy and system stability, but also helps to reduce the cost of the transfer robot that works with it.

[0046] Optionally, the wafer cover 21 can be made of a high-strength, antistatic transparent material to ensure the safety of the wafer and reduce the risk of electrostatic damage.

[0047] like Figure 1 and Figure 3 As shown, the wafer rack 22 includes a rack base 221 and a shelf body 222 disposed on the upper end surface of the rack base 221. The rack base 221 is placed on the support stage 1. The shelf body 222 has multiple wafer slots for placing wafers. The wafer cover 21 is lockably fastened to the rack base 221 to form a sealed chamber covering the shelf body 222. It can be understood that the opening at the lower part of the wafer cover 21 can be locked and unlocked with the rack base 221 to allow the wafer cover 21 to switch between a closed state and an open state.

[0048] The wafer transfer device 100 of this embodiment divides the wafer rack 22 into a rack base 221 and a storage rack 222 disposed on the upper surface of the rack base 221. The wafer cover 21 is lockably fastened to the rack base 221. When it is necessary to transfer the wafer cassette 2 as a whole, the wafer cover 21 is locked to the rack base 221, and the wafer cover 21 is unlocked from the rack base 221. The wafer cover 21 is then moved upward to expose the multiple wafers on the wafer rack 22. This not only provides a relatively clean space for the wafers but also improves the ease of opening the wafer cassette 2.

[0049] like Figures 1 to 7 As shown, the carrier platform 1 includes a support platform 11 and a transfer positioning plate frame 12 disposed on one side of the support platform 11. The transfer positioning plate frame 12 is used to connect with the housing of the process equipment. The transfer positioning plate frame 12 has a pick-up and put-down window 123, which is directly opposite to the wafer rack 22.

[0050] The wafer transfer device 100 of this embodiment of the utility model divides the carrier stage 1 into a support stage 11 and a transfer positioning plate frame 12 disposed on one side of the support stage 11 (e.g., Figure 1 As shown, the transfer positioning frame 12 is located on the rear side of the support platform 11. When processing different types of wafers, different designs of the support platform 11 and similar designs of the transfer positioning frame 12 are required. Therefore, the transfer positioning frames 12 of different wafer loading equipment dock with the same process equipment housing. By keeping the size of the transfer positioning frame 12 unchanged during production, and only changing the design of the support platform 1 and the wafer box 2 according to different wafers, it is possible to reduce the assembly time of the wafer transfer equipment 100 and the process equipment, and to facilitate the standardized production and processing of the wafer loading equipment.

[0051] Optionally, the process equipment housing has multiple positioning parts on the wall surface where the docking window is opened, and the transfer positioning plate frame 12 has multiple mating parts. The multiple mating parts and multiple positioning parts are connected one-to-one and detachably by connectors.

[0052] Specifically, the loading and positioning plate frame 12 is set on the side of the bearing platform 1 near the process equipment housing. The side plate of the process equipment housing has a docking window, and the loading and unloading window 123 is set opposite to the docking window in the front-back direction.

[0053] like Figure 6 As shown, the support platform 1 also includes a movable cover 13 and a driving component 16. The movable cover 13 is fitted over the support platform 11, and the transfer positioning plate frame 12 is disposed on one side of the support platform 11. The upper end face of the movable cover 13 is connected to the wafer cover 21. The movable cover 13 has a clearance opening 1311. The shelf body 222 is disposed on the support platform 11 through the clearance opening 1311, and the open end of the wafer cover 21 is lockably connected to the movable cover 13. The movable cover 13 can slide relative to the transfer positioning plate frame 12 in the Z direction via the driving component 16. It can be understood that the cross-section of the clearance opening 1311 is larger than the cross-section of the shelf body 222, and the cross-section of the wafer cover 21 is larger than the cross-section of the clearance opening 1311.

[0054] The wafer transfer device 100 of this embodiment of the present invention, by providing a clearance opening 1311 in the sliding base plate 131, allows the shelf body 222 to be mounted on the support platform 11 through the clearance opening 1311, and the open end of the wafer cover 21 is lockably connected to the sliding base plate 131. This allows for the control of the cross-sections of each component to achieve the closing and opening of the wafer cover 21 and the wafer rack 22 without affecting the overall movement stroke. Therefore, the wafer transfer device 100 of this embodiment of the present invention has the advantage of simple structure.

[0055] like Figure 1 and Figure 7 As shown, the movable cover 13 includes a sliding base plate 131 and a U-shaped cover plate 132. The sliding base plate 131 has a clearance opening 1311. The shelf body 222 is mounted on the support platform 11 through the clearance opening 1311. The open end of the wafer cover 21 is lockably connected to the sliding base plate 131. The sliding base plate 131 and the wafer cover 21 are driven to slide along the Z direction by the driving member 16. The U-shaped cover plate 132 is fitted outside the support platform 11, and the side arm of the U-shaped cover plate 132 is slidably engaged with the transfer positioning plate frame 12. The outer periphery of the sliding base plate 131 is connected to the inner wall surface of the U-shaped cover plate 132.

[0056] The wafer transfer device 100 of this embodiment of the present invention, by dividing the movable cover 13 into a sliding base plate 131 and a U-shaped cover plate 132, avoids the direct exposure of the air guide pipes, wires, or drive components 16 under the support platform 11, which would affect the overall aesthetics of the device. Furthermore, by connecting the upper surface of the movable cover 13 to the wafer cover 21, the movable cover 13 can slide relative to the transfer positioning plate frame 12 along the Z-direction. This prevents the wafers inside from being directly exposed when the wafer cover 21 is turned to the open state, thus preventing dust, particulate matter, and other contaminants from adhering to the wafers and affecting wafer processing quality, and helping to maintain a high cleanliness standard in the wafer processing area. Therefore, the wafer transfer device 100 of this embodiment of the present invention further reduces the wafer processing scrap rate.

[0057] Optionally, the U-shaped cover plate 132 is provided with an observation window 1321, and the observation window 1321 is provided with a transparent sealing plate 1322.

[0058] like Figure 1 and Figure 7 As shown, the sliding base plate 131 is provided with a plurality of positioning protrusions 15, which are spaced apart circumferentially along the clearance opening 1311 on the upper end surface of the sliding base plate 131 (for example, Figure 1 On the upper surface shown, each positioning bump 15 has a preset distance from the clearance opening 1311, and the multiple positioning bumps 15 and the sliding base plate 131 form a limiting space, with the wafer cover 21 set up in the limiting space.

[0059] The wafer transfer device 100 of this embodiment of the invention, through a plurality of positioning bumps 15 disposed on the upper end surface of the sliding base plate 131, can limit the position of the wafer cover 21, avoiding the problem of incomplete sealing between the wafer carriers 22 due to misalignment of the wafer cover 21, which would cause dust, particulate matter and other contaminants to adhere to the wafer and affect the wafer processing quality. Therefore, the positioning bumps 15 contribute to improving the wafer processing quality.

[0060] Optionally, the clearance opening 1311 is generally rectangular, and at least one positioning protrusion 15 is provided on each side of the plurality of clearance openings 1311.

[0061] like Figure 1 and Figure 7 As shown, a plurality of locking components 14 are provided on the sliding base plate 131. The plurality of locking components 14 are arranged at intervals along the circumference of the clearance opening 1311 on the upper end surface of the sliding base plate 131. Each locking component 14 includes a lock shell and a lock tongue. The lock tongue is retractably connected to the lock shell and can extend out of the lock shell and be inserted into the wafer cover 21.

[0062] The wafer transfer device 100 of this embodiment of the invention uses a locking member 14 to fix the sliding base plate 131 and the wafer cover 21, preventing the wafer cover 21 from shifting during the movement of the sliding base plate 131. Such shifting could be transmitted to the wafer or its support structure, and the wobbling or unstable movement of the wafer cover 21 would increase friction and thus affect product quality. Therefore, the locking member 14 in the wafer transfer device 100 of this embodiment of the invention helps to improve product quality.

[0063] like Figure 1 and Figure 6 As shown, the driving component 16 includes a motor 161 and a lead screw 162. The motor 161 is mounted on the support platform 11, and the lead screw 162 is connected to the output end of the motor 161. The sliding base plate 131 is driven by the lead screw 162 to drive the sliding base plate 131 to move along the Z direction; or, the driving component 16 may include a cylinder, and the output shaft of the cylinder is connected to the sliding base plate 131.

[0064] like Figure 1 and Figure 6 As shown, the wafer loading device 100 of this utility model divides the driving component 16 into a motor 161 and a lead screw 162. A sliding base plate 131 that achieves lifting and lowering through the lead screw 162 structure is set on the wafer loading device. This not only provides precise and stable operation, but also has the advantages of high reliability, high efficiency and energy saving, and good adaptability.

[0065] This utility model is not limited to this. In other embodiments, the driving component 16 may include a cylinder, and the output shaft of the cylinder is connected to the sliding base plate 131.

[0066] like Figure 1 and Figure 6 As shown, one of the sliding base plate 131 and the support platform 11 has a guide rail 163, and the other of the sliding base plate 131 and the support platform 11 has a guide groove extending in the Z direction. The guide rail 163 slides in the guide groove in the Z direction.

[0067] One of the sliding base plate 131 and the support platform 11 has a guide rail 163, and the other of the sliding base plate 131 and the support platform 11 has a guide groove extending in the Z direction. The guide rail 163 slides in the guide groove in the Z direction.

[0068] The wafer transfer device 100 of this utility model uses the guide groove and guide rail 163 between the sliding base plate 131 and the support platform 11 to limit the movement of the sliding base plate 131 along a predetermined path, preventing offset and tilting caused by lateral force, reducing vibration and shaking of the sliding base plate 131, and ensuring the consistency and reliability of operation.

[0069] Furthermore, the guide rail 163 can be a T-shaped slider, and there can be multiple guide rails 163 and guide grooves, with multiple guide rails 163 slidingly engaged in the guide grooves in a one-to-one correspondence.

[0070] like Figure 1 and Figure 4 As shown, the loading and positioning plate frame 12 includes a frame body 121 and a closing plate 122. The frame body 121 has a pick-up and put-down window 123. The closing plate 122 is openably and closeably disposed on the pick-up and put-down window 123. The closing plate 122 is movably fitted on the frame body 121 along the Z direction, and the closing plate 122 is connected to the movable cover 13 to close and open the pick-up and put-down window 123.

[0071] The wafer transfer device 100 of this utility model embodiment is connected to the movable cover 13 through the window closing plate 122, that is, the mechanical structure realizes the linkage of opening the cover and opening the window, which has the advantage of high reliability of action realization.

[0072] The semiconductor processing system of this utility model embodiment includes a transfer robot, a processing equipment, and a wafer transfer device 100 of any one of the above. The processing equipment has a process chamber. Both the transfer robot and the processing equipment are disposed in the process chamber. The transfer robot can grip the wafer and transfer it between the process chamber and the wafer cassette 2.

[0073] Therefore, the semiconductor processing system of this utility model not only improves positioning accuracy and system stability, but also helps to reduce the cost of the transfer robot that works with it.

[0074] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications or equivalent substitutions made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

[0075] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0076] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0077] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0078] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0079] In this utility model, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0080] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A wafer transfer device, characterized in that, include A carrier stage and a wafer cassette, the wafer cassette including a wafer cover and a wafer rack, the wafer rack being disposed on the carrier stage, the wafer cover having a downward opening, the wafer cover being openable and closable over the wafer rack, and the wafer cover being movable relative to the carrier stage in the Z direction to change between a closed state and an open state, in the closed state the wafer cover covers the wafer rack, and in the open state the wafer cover moves upward so that the wafer rack can be exposed outside the wafer cover.

2. The wafer transfer equipment according to claim 1, characterized in that, The wafer rack includes a rack base and a shelf body disposed on the upper end face of the rack base. The rack base is placed on the support platform. The shelf body has multiple wafer slots for placing wafers. The wafer cover is lockably fastened to the rack base to form a sealed chamber covering the shelf body.

3. The wafer transfer equipment according to claim 2, characterized in that, The carrier platform includes a support platform and a transfer positioning plate frame disposed on one side of the support platform. The transfer positioning plate frame is used to connect with the housing of the process equipment. The transfer positioning plate frame has a pick-up and place window, which is disposed directly opposite to the wafer rack.

4. The wafer transfer equipment according to claim 3, characterized in that, The support platform also includes a movable cover and a driving component. The movable cover is fitted over the support platform. The transfer positioning plate frame is disposed on one side of the support platform. The upper end face of the movable cover is connected to the wafer cover. The movable cover has a clearance opening. The shelf body is disposed on the support platform through the clearance opening. The opening end of the wafer cover is lockably connected to the movable cover. The movable cover can slide relative to the transfer positioning plate frame in the Z direction through the driving component.

5. The wafer transfer equipment according to claim 4, characterized in that, The movable cover includes a sliding base plate and a U-shaped cover plate. The sliding base plate has an clearance opening. The shelf body is mounted on the support platform through the clearance opening. The open end of the wafer cover is lockably connected to the sliding base plate. The sliding base plate and the wafer cover are driven to slide along the Z direction by the driving component. The U-shaped cover plate is fitted over the support platform, and the side arm of the U-shaped cover plate is slidably engaged with the transfer positioning plate frame. The outer periphery of the sliding base plate is connected to the inner wall surface of the U-shaped cover plate.

6. The wafer transfer equipment according to claim 5, characterized in that, The support platform also includes a plurality of positioning protrusions disposed on the sliding base plate. The plurality of positioning protrusions are disposed at intervals along the circumference of the clearance opening on the upper surface of the sliding base plate. Each positioning protrusion has a preset distance from the clearance opening. The plurality of positioning protrusions and the sliding base plate form a limiting space, and the wafer cover is placed within the limiting space. And / or, the support platform further includes a plurality of locking members disposed on the sliding base plate. The plurality of locking members are disposed spaced apart along the circumferential direction of the clearance opening on the upper end surface of the sliding base plate. Each locking member includes a lock housing and a lock tongue. The lock tongue is retractably disposed within the lock housing and can extend out of the lock housing to insert into the wafer cover.

7. The wafer transfer equipment according to claim 5, characterized in that, The driving component includes a motor and a lead screw. The motor is mounted on the support platform, the lead screw is connected to the output end of the motor, and the sliding base plate is driven by the lead screw to drive the sliding base plate to move along the Z direction; or, the driving component includes a cylinder, and the output shaft of the cylinder is connected to the sliding base plate.

8. The wafer transfer equipment according to claim 5, characterized in that, One of the sliding base plate and the support platform has a guide rail, and the other of the sliding base plate and the support platform has a guide groove extending in the Z direction, and the guide rail slides in the guide groove in the Z direction.

9. The wafer transfer equipment according to any one of claims 4-8, characterized in that, The transfer positioning plate frame includes a frame body and a closing window plate. The frame body has the pick-up and place window. The closing window plate is openable and closable on the pick-up and place window. The closing window plate is movable along the Z direction and fits on the frame body. The closing window plate is connected to the movable cover to close and open the pick-up and place window.

10. A semiconductor processing system, characterized in that, The device includes a transfer robot, processing equipment, and wafer transfer equipment as described in any one of claims 1 to 9. The processing equipment has a process chamber, and both the transfer robot and the processing equipment are disposed in the process chamber. The transfer robot is capable of gripping wafers and transferring them between the process chamber and the wafer cassette.

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