Wafer photoresist removing jig and wafer photoresist removing equipment
By using a dual-head wafer stripping fixture, multiple brush heads from the first and second stripping brush holders simultaneously remove residual adhesive from both the front and back sides of the wafer, solving the problems of low efficiency and poor stripping effect in existing technologies and achieving a highly efficient stripping effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FOREHOPE SEMICONDUCTOR (NINGBO) CO LTD
- Filing Date
- 2025-05-29
- Publication Date
- 2026-05-26
AI Technical Summary
Existing wafer resist removal fixtures are inefficient and have poor resist removal effects, failing to effectively remove residual resist from the wafer edges, leading to contamination of the electroplating chamber in subsequent processes.
The wafer stripping fixture with a dual-head structure includes a first stripping brush holder and a second stripping brush holder, which are arranged opposite each other to form an assembly ring groove. Multiple first and second brush heads are respectively provided for removing residual adhesive from the front and back sides of the wafer.
It improves the efficiency and effectiveness of adhesive removal, effectively removing residual adhesive from the wafer edges and preventing contamination of the electroplating chamber.
Smart Images
Figure CN224290563U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of wafer resist removal technology, specifically to a wafer resist removal fixture and a wafer resist removal device. Background Technology
[0002] With the rapid development of the semiconductor industry, a dielectric layer is coated on the wafer surface during the wafer coating process. Before the subsequent electroplating process forms the wiring layer, the adhesive on the wafer edges needs to be removed to facilitate the formation of electroplated leads. If the adhesive adhering to the wafer edges is not removed, it will fall into the equipment during subsequent processes, contaminating the electroplating chamber and leading to wiring layer failure.
[0003] Existing wafer resist removal fixtures mostly use single-head resist removal brushes, which require removing resist from the front, back, and sides of the wafer separately, resulting in low efficiency and poor resist removal effect. Utility Model Content
[0004] The purpose of this invention is to provide a wafer de-adhesive fixture and a wafer de-adhesive device that can effectively remove residual adhesive from the edges of wafers. Furthermore, the device employs a dual-head structure, resulting in higher efficiency and better de-adhesive removal.
[0005] The embodiments of this utility model are implemented as follows:
[0006] In one aspect, this utility model provides a wafer stripping fixture, including a first stripping brush holder and a second stripping brush holder. The first stripping brush holder and the second stripping brush holder are disposed opposite to each other, and an assembly ring groove for accommodating the wafer edge is formed between the first stripping brush holder and the second stripping brush holder. A plurality of first brush heads are disposed on the side of the first stripping brush holder near the second stripping brush holder, and a plurality of second brush heads are disposed on the side of the second stripping brush holder near the first stripping brush holder. Both the first brush heads and the second brush heads are disposed in the assembly ring groove and are configured to remove residual adhesive from the wafer edge.
[0007] In an optional embodiment, the first adhesive removal brush holder is disposed above the second adhesive removal brush holder. The first adhesive removal brush holder includes a first base and a first conical platform. The first conical platform is disposed on the bottom side of the first base and protrudes toward the second adhesive removal brush holder. The sidewall of the first conical platform is configured to form the sidewall of the assembly ring groove. A plurality of the first brush heads are disposed on the sidewall of the first conical platform.
[0008] In an optional embodiment, the protrusion height of the first brush head relative to the first base is less than the protrusion height of the first conical platform relative to the first base.
[0009] In an optional embodiment, the second adhesive removal brush holder includes a second base and a second conical platform. The second conical platform is disposed on the top side of the second base and protrudes toward the first conical platform. The sidewall of the second conical platform is configured to form the sidewall of the assembly ring groove. A plurality of second brush heads are disposed on the sidewall of the second conical platform.
[0010] In an optional embodiment, the protrusion height of the second brush head relative to the second base is less than the protrusion height of the second conical platform relative to the first base.
[0011] In an optional embodiment, the surface of the first conical platform abuts against the surface of the second conical platform, and the plurality of first brush heads and the plurality of second brush heads correspond one-to-one and are spaced apart.
[0012] In an optional embodiment, both the first base and the second base are frustum-shaped and are concentrically arranged.
[0013] In an optional embodiment, the top side of the first base is provided with a first mounting hole, which is configured to assemble a first rotating shaft of an external machine tool, and the bottom side of the second base is provided with a second mounting hole, which is configured to assemble a second rotating shaft of an external machine tool.
[0014] In an optional embodiment, both the first mounting hole and the second mounting hole are spline-shaped.
[0015] In another aspect, this utility model provides a wafer desmearing device, including a machine base and the aforementioned wafer desmearing fixture. The machine base is provided with a first rotating shaft and a second rotating shaft. The first rotating shaft is connected to the first desmearing brush holder, and the second rotating shaft is connected to the second desmearing brush holder.
[0016] The beneficial effects of this utility model embodiment include:
[0017] The wafer stripping fixture and apparatus provided in this embodiment employ a first stripping brush holder and a second stripping brush holder arranged opposite to each other, with an assembly ring groove formed between the first and second stripping brush holders to accommodate the wafer edge. The first stripping brush holder has multiple first brush heads on the side near the second stripping brush holder, and the second stripping brush holder has multiple second brush heads on the side near the first stripping brush holder. Both the first and second brush heads are disposed within the assembly ring groove and configured to remove residual adhesive from the wafer edge. Compared to the prior art, this embodiment employs a dual-head design, utilizing both the first and second brush heads simultaneously to remove adhesive from the wafer edge, effectively removing residual adhesive with higher efficiency and better stripping results. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 A schematic diagram of the wafer resist removal fixture provided in an embodiment of this utility model from a first-view perspective;
[0020] Figure 2 A schematic diagram of the wafer resist removal fixture provided in an embodiment of this utility model from a second perspective;
[0021] Figure 3 An exploded structural diagram of the wafer resist removal fixture provided in an embodiment of this utility model;
[0022] Figure 4 This is a schematic diagram of the assembly structure of the wafer resist removal fixture provided in an embodiment of the present invention.
[0023] icon:
[0024] 100 - Wafer desmearing fixture; 110 - First desmearing brush holder; 111 - First base; 112 - First conical stage; 113 - First mounting hole; 120 - Second desmearing brush holder; 121 - Second base; 122 - Second conical stage; 130 - Assembly ring groove; 140 - First brush head; 150 - Second brush head; 200 - Wafer. Detailed Implementation
[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0026] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0027] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0028] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0029] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0030] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0031] As disclosed in the background section, existing wafer stripping fixtures mostly use a single-head stripping brush, where a single brush head removes the adhesive from the front edge, back edge, and side of the wafer separately. However, a single brush head cannot remove adhesive from both the front and back sides simultaneously, so it is necessary to remove adhesive from at least both sides of the front and back sides. This is inefficient and cannot remove adhesive simultaneously, resulting in poor removal quality.
[0032] Furthermore, existing technologies have included solutions that groove the brush head to accommodate the wafer edge. However, these grooving solutions primarily rely on the groove walls for adhesive removal, without a separate brush head design, resulting in poor adhesive removal performance.
[0033] To address the aforementioned issues, this embodiment provides a novel wafer resist stripping fixture and wafer resist stripping equipment. The specific structure and working principle of the wafer resist stripping fixture and wafer resist stripping equipment will be described in detail below.
[0034] See Figures 1 to 4 This utility model provides a wafer adhesive removal fixture 100, which can effectively remove residual adhesive from the edge of the wafer 200. It adopts a double-head structure, which is more efficient and has a better adhesive removal effect.
[0035] The wafer de-adhesive fixture 100 provided in this embodiment of the present invention includes a first de-adhesive brush holder 110 and a second de-adhesive brush holder 120. The first de-adhesive brush holder 110 and the second de-adhesive brush holder 120 are disposed opposite to each other, and an assembly ring groove 130 for accommodating the edge of the wafer 200 is formed between the first de-adhesive brush holder 110 and the second de-adhesive brush holder 120. A plurality of first brush heads 140 are disposed on the side of the first de-adhesive brush holder 110 near the second de-adhesive brush holder 120, and a plurality of second brush heads 150 are disposed on the side of the second de-adhesive brush holder 120 near the first de-adhesive brush holder 110. The first brush heads 140 and the second brush heads 150 are both disposed in the assembly ring groove 130 and are configured to remove residual adhesive from the edge of the wafer 200.
[0036] It should be noted that in this embodiment, both the first brush head 140 and the second brush head 150 are sponge brush heads. The first brush head 140 can clean the front edge of the wafer 200, and the second brush head 150 can clean the back edge of the wafer 200, thereby simultaneously removing adhesive from both sides of the wafer 200's surface edges, greatly improving the adhesive removal efficiency. Furthermore, the dual-head structure allows for the application of relative downward pressure during cleaning, resulting in a tighter fit between the brush head and the wafer 200 surface, leading to better adhesive removal and effectively removing residual adhesive from the edges of the wafer 200.
[0037] It is worth noting that the first adhesive removal brush holder 110 and the second adhesive removal brush holder 120 are detachably connected to the first and second rotating shafts on the external machine. The first adhesive removal brush holder 110 rotates under the drive of the first rotating shaft, and the second adhesive removal brush holder 120 rotates under the drive of the second rotating shaft, thereby driving multiple first brush heads 140 and second brush heads 150 to clean the edge of the wafer 200.
[0038] In some embodiments, a first adhesive removal brush holder 110 is disposed above a second adhesive removal brush holder 120. The first adhesive removal brush holder 110 includes a first base and a first conical platform 112. The first conical platform 112 is disposed on the bottom side of the first base and protrudes toward the second adhesive removal brush holder 120. The sidewall of the first conical platform 112 is configured to form the sidewall of the mounting annular groove 130. A plurality of first brush heads 140 are disposed on the sidewall of the first conical platform 112. Specifically, the plurality of first brush heads 140 all extend downward and are evenly distributed on the sidewall of the first conical platform 112, while the first base rotates under the drive of the first rotating shaft, thereby enabling the plurality of first brush heads 140 to rotate around the center of the first conical platform 112.
[0039] Furthermore, the protrusion height of the first brush head 140 relative to the first base is less than the protrusion height of the first conical stage 112 relative to the first base. Specifically, the lower protrusion height of the first brush head 140 relative to the first conical stage 112 allows the first brush head 140 to retract inward relative to the first conical stage 112, thus enabling the first conical stage 112 to stop the wafer 200 in the horizontal direction. Consequently, the first brush head 140 can only clean the edges of the wafer 200, ensuring effective cleaning.
[0040] In some embodiments, the second adhesive removal brush holder 120 includes a second base 121 and a second conical platform 122. The second conical platform 122 is disposed on the top side of the second base 121 and protrudes toward the first conical platform 112. The sidewall of the second conical platform 122 is configured to form the sidewall of the mounting annular groove 130. A plurality of second brush heads 150 are disposed on the sidewall of the second conical platform 122. Specifically, the plurality of second brush heads 150 all extend upward and are evenly distributed on the sidewall of the second conical platform 122, while the second base 121 rotates under the drive of the second rotating shaft, thereby enabling the plurality of second brush heads 150 to rotate around the center of the second conical platform 122.
[0041] Furthermore, the protrusion height of the second brush head 150 relative to the second base 121 is less than the protrusion height of the second conical stage 122 relative to the first base. Specifically, the lower protrusion height of the second brush head 150 relative to the second conical stage 122 allows the second brush head 150 to retract relative to the second conical stage 122, thus enabling the second conical stage 122 to stop the wafer 200 in the horizontal direction. Consequently, the second brush head 150 can only clean the edges of the wafer 200, ensuring effective cleaning.
[0042] In some embodiments, the platform of the first conical stage 112 abuts against the platform of the second conical stage 122, and a plurality of first brush heads 140 and a plurality of second brush heads 150 are arranged in a one-to-one correspondence and at intervals. Specifically, the bottom platform of the first conical stage 112 abuts against the top surface of the second conical stage 122, thereby forming a gap of a fixed width between the first brush heads 140 and the second brush heads 150, and the gap width is slightly smaller than the thickness of the wafer 200, thereby ensuring that the first brush heads 140 and the second brush heads 150 can fit tightly against the surface of the wafer 200 to achieve cleaning.
[0043] Of course, in other preferred embodiments of this invention, the first conical stage 112 and the second conical stage 122 can also be clearance-fitted, and the gap width between the two parts can be adjusted under the control of the machine tool. This design allows the gap width between the first brush head 140 and the second brush head 150 to be adjustable, making it suitable for wafers 200 of different thicknesses and thus more versatile.
[0044] In some embodiments, both the first base and the second base 121 are frustum-shaped and concentrically arranged. The first base and the second base 121 have the same dimensions and are concentrically arranged, which facilitates the correspondence between the first brush head 140 and the second brush head 150. This allows the downward pressure applied to both sides of the wafer 200 to be relatively opposite, ensuring that the first brush head 140 and the second brush head 150 can tightly adhere to the surface of the wafer 200, guaranteeing effective cleaning. Furthermore, the frustum-shaped design of the first base and the second base 121 also facilitates their independent rotation, avoiding the risk of external interference.
[0045] In some embodiments, a first mounting hole 113 is provided on the top side of the first base 111, which is configured to mount a first rotating shaft (not shown) of an external machine tool. A second mounting hole is provided on the bottom side of the second base 121, which is configured to mount a second rotating shaft (not shown) of the external machine tool. Specifically, the first rotating shaft is detachably mounted in the first mounting hole 113, thereby facilitating the replacement of the first adhesive removal brush holder 110 after the first brush head 140 wears. The second rotating shaft is detachably mounted in the second mounting hole, thereby facilitating the replacement of the second adhesive removal brush holder 120 after the second brush head 150 wears. The first mounting hole 113 and the second mounting hole correspond to each other and are concentrically arranged.
[0046] Furthermore, both the first mounting hole 113 and the second mounting hole are splined holes. Specifically, by setting the first mounting hole 113 and the second mounting hole as splined holes, and by also using corresponding splines on the first and second rotating shafts, the transmission effect can be guaranteed and slippage can be avoided.
[0047] This utility model embodiment also provides a wafer 200 resist removal device, including a machine base and the aforementioned wafer resist removal fixture 100. The wafer resist removal fixture 100 includes a first resist removal brush holder 110 and a second resist removal brush holder 120. The first resist removal brush holder 110 and the second resist removal brush holder 120 are arranged opposite to each other, and an assembly ring groove 130 for accommodating the edge of the wafer 200 is formed between the first resist removal brush holder 110 and the second resist removal brush holder 120. A plurality of first brush heads 140 are arranged on the side of the first resist removal brush holder 110 near the second resist removal brush holder 120, and a plurality of second brush heads 150 are arranged on the side of the second resist removal brush holder 120 near the first resist removal brush holder 110. The first brush heads 140 and the second brush heads 150 are both disposed in the assembly ring groove 130 and are configured to remove residual resist from the edge of the wafer 200. The machine is equipped with a first rotating shaft and a second rotating shaft. The first rotating shaft is connected to the first adhesive removal brush holder 110, and the second rotating shaft is connected to the second adhesive removal brush holder 120.
[0048] In summary, the wafer stripping fixture 100 and apparatus provided in this embodiment employ a first stripping brush holder 110 and a second stripping brush holder 120 arranged opposite to each other, with an assembly ring groove 130 formed between the first stripping brush holder 110 and the second stripping brush holder 120 for accommodating the edge of the wafer 200. The first stripping brush holder 110 has a plurality of first brush heads 140 on the side near the second stripping brush holder 120, and the second stripping brush holder 120 has a plurality of second brush heads 150 on the side near the first stripping brush holder 110. Both the first brush heads 140 and the second brush heads 150 are disposed within the assembly ring groove 130 and configured to remove residual adhesive from the edge of the wafer 200. Compared to the prior art, this embodiment employs a dual-head design, utilizing the first brush head 140 and the second brush head 150 simultaneously to remove adhesive from the edge of the wafer 200, effectively removing residual adhesive from the edge of the wafer 200 with higher efficiency and better stripping effect.
[0049] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A wafer de-bonding jig, characterized by, The device includes a first adhesive removal brush holder and a second adhesive removal brush holder, which are disposed opposite to each other. An assembly ring groove for accommodating the edge of a wafer is formed between the first adhesive removal brush holder and the second adhesive removal brush holder. A plurality of first brush heads are disposed on the side of the first adhesive removal brush holder near the second adhesive removal brush holder, and a plurality of second brush heads are disposed on the side of the second adhesive removal brush holder near the first adhesive removal brush holder. Both the first brush heads and the second brush heads are disposed in the assembly ring groove and are configured to remove residual adhesive from the edge of the wafer.
2. The wafer de-bonding jig of claim 1, wherein, The first adhesive removal brush holder is disposed above the second adhesive removal brush holder. The first adhesive removal brush holder includes a first base and a first conical platform. The first conical platform is disposed on the bottom side of the first base and protrudes toward the second adhesive removal brush holder. The side wall of the first conical platform is configured to form the side wall of the assembly ring groove. A plurality of the first brush heads are disposed on the side wall of the first conical platform.
3. The wafer de-bonding jig of claim 2, wherein, The protrusion height of the first brush head relative to the first base is less than the protrusion height of the first conical platform relative to the first base.
4. The wafer de-bonding jig of claim 2, wherein, The second adhesive removal brush holder includes a second base and a second conical platform. The second conical platform is disposed on the top side of the second base and protrudes toward the first conical platform. The sidewall of the second conical platform is configured to form the sidewall of the assembly ring groove. A plurality of second brush heads are disposed on the sidewall of the second conical platform.
5. The wafer de-bonding jig of claim 4, wherein, The protrusion height of the second brush head relative to the second base is less than the protrusion height of the second conical platform relative to the first base.
6. The wafer de-bonding jig of claim 4, wherein, The surface of the first conical platform abuts against the surface of the second conical platform, and the multiple first brush heads and multiple second brush heads are arranged in a one-to-one correspondence and at intervals.
7. The wafer de-bonding jig of claim 4, wherein, Both the first base and the second base are frustum-shaped and are concentrically arranged.
8. The wafer de-bonding jig of claim 4, wherein, The first base has a first mounting hole on its top side, which is configured to assemble a first rotating shaft of an external machine tool. The second base has a second mounting hole on its bottom side, which is configured to assemble a second rotating shaft of an external machine tool.
9. The wafer resist removal fixture according to claim 8, characterized in that, Both the first mounting hole and the second mounting hole are spline-shaped.
10. A wafer resist stripping device, characterized in that, The device includes a machine and a wafer stripping fixture as described in any one of claims 1-9. The machine is provided with a first rotating shaft and a second rotating shaft, the first rotating shaft being connected to a first stripping brush holder and the second rotating shaft being connected to a second stripping brush holder.