Transistor mounting structure, circuit board assembly and power module

Abstract

The utility model is applicable to the field of photovoltaic inverters, and provides a transistor structure, which comprises an upper cover plate and a lower cover plate, at least one mounting boss and at least one clamping part are formed at the top of the upper cover plate, a plurality of clamping parts are arranged at intervals along the edge of the mounting boss, the mounting boss is used for increasing the distance between a circuit board and the upper cover plate, and the lower cover plate is used for increasing the distance between the circuit board and the lower cover plate. The buckle is used for buckling the circuit board, a plurality of placing grooves are formed in the side, away from the upper cover plate, of the lower cover plate, each placing groove is matched with one transistor, buckling parts which are oppositely arranged are formed on the two side edges of each placing groove, the placing grooves are used for placing the transistors, and the buckling parts are used for buckling the transistors. A certain height is formed between the circuit board and the upper cover plate through the mounting boss, so that the creepage distance between the circuit board and the bolt is increased; the lower cover plate is provided with the plurality of placing grooves for placing the plurality of transistors, so that the power density of the transistor mounting structure is improved, and the transistor mounting structure has the characteristics of high power density and sufficient creepage distance.

Description

Technical Field

[0001] This utility model belongs to the field of photovoltaic inverters, and in particular relates to a transistor structure, circuit board assembly and power module. Background Technology

[0002] Power semiconductor devices include transistors and heat sinks. Generally, transistors and heat sinks are mounted by using bolts to fix the housing to the heat sink, and the housing is used to fix the transistor to the heat sink. The housing is used to indirectly fix the transistor and the heat sink.

[0003] However, this mounting method requires one bolt for each transistor, and multiple bolts are needed to secure multiple transistors. This reduces the power density of power semiconductor devices and results in insufficient creepage distances for power semiconductor devices. This not only affects the performance of low-power semiconductor devices but also allows for potential-induced degradation of power semiconductor devices, which is detrimental to user applications.

[0004] Therefore, there is an urgent need for a new type of transistor mounting structure and power module that can improve the power density of power semiconductor devices while increasing the safety creepage distance of power semiconductor devices. Utility Model Content

[0005] This invention provides a transistor mounting structure, a circuit board assembly, and a power module, aiming to solve the technical problems of low power density and insufficient creepage distance in existing power semiconductor devices.

[0006] This utility model is implemented as follows: a transistor mounting structure, comprising:

[0007] The top of the top cover has at least one mounting boss and at least one engaging portion, and a plurality of engaging portions are spaced apart along the edge of the mounting boss. The mounting boss is used to increase the distance between the circuit board and the top cover, and the latch is used to engage the circuit board.

[0008] A lower cover plate is adapted to the upper cover plate. A plurality of placement slots are formed on the side of the lower cover plate away from the upper cover plate. Each placement slot is adapted to a transistor. Oppositely arranged fastening portions are formed on both sides of the placement slot. The placement slot is used to place the transistor, and the fastening portions are used to fasten the transistor.

[0009] Furthermore, the upper cover plate has at least one engaging groove on its side, and the lower cover plate has a locking block on its side that matches the engaging groove. The engaging groove and the locking block engage to fasten the upper cover plate and the lower cover plate together; or

[0010] The upper cover plate has at least one locking block on its side, and the lower cover plate has a locking groove on its side that matches the locking block. The locking groove engages with the locking block to fasten the upper cover plate and the lower cover plate together.

[0011] Furthermore, the mounting boss has a first screw hole that penetrates the upper cover plate, and the lower cover plate has a second screw hole that matches the first screw hole.

[0012] Furthermore, a receiving groove is formed at the edge of the lower cover plate away from the upper cover plate, and a wire outlet groove is formed on the lower cover plate. The wire outlet groove is connected to the receiving groove. The receiving groove is used to place the temperature measuring plate, and the wire outlet groove is used to lead out the wires of the temperature measuring plate. The temperature measuring plate is used to attach to the transistor and to export the temperature of the transistor through the wires.

[0013] Furthermore, a protrusion is formed in the placement groove, which, when the transistor mounting structure is mounted on a heat sink, serves to hold the transistor so that the transistor is attached to the surface of the heat sink.

[0014] Furthermore, the transistor mounting structure includes a pressure plate, and the lower cover plate has an accommodating space on the side near the upper cover plate. The pressure plate is disposed in the accommodating space, and a third screw hole is formed on the pressure plate that is adapted to the first screw hole and the second screw hole. A bolt passes through the third screw hole to provide pressure to the pressure plate to compress the lower cover plate, so that the transistor is attached to the surface of the heat sink.

[0015] Furthermore, the pressure plate is L-shaped, the placement grooves are all located on one side of the lower cover plate, and a support plate is formed downward on the other side of the lower cover plate. The support plate is hollow, and the pressure plate is at least partially located in the support groove, and the pressure plate abuts against the support groove. The pressure plate is inclined from the third screw hole toward the placement groove.

[0016] Furthermore, the pressure plate is H-shaped, the placement groove is located on opposite sides of the lower cover plate, and the placement grooves on both sides are correspondingly arranged. The pressure plate is inclined from the third screw hole toward the placement groove.

[0017] This utility model embodiment also provides a circuit board assembly, including:

[0018] At least one transistor;

[0019] Circuit boards; and

[0020] In the transistor mounting structure described above, the transistor is connected to the circuit board via the transistor mounting structure.

[0021] This utility model embodiment also provides a power module, including:

[0022] heat sink;

[0023] Ceramic substrates; and

[0024] A circuit board assembly, wherein the circuit board assembly is connected to the heat sink via the ceramic substrate.

[0025] The beneficial effects achieved by this utility model are:

[0026] The transistor mounting structure of this utility model uses mounting bosses to create a certain height between the circuit board and the upper cover plate, increasing the creepage distance between the circuit board and the bolts; the snap-fit ​​part secures the circuit board to the upper cover plate, preventing the circuit board from loosening and improving the stability of the transistor mounting structure; multiple placement slots are provided on the lower cover plate to hold multiple transistors, increasing the power density of the transistor mounting structure; and the snap-fit ​​part fixes the transistors to the lower cover plate, preventing the transistors from falling off the lower cover plate. In other words, the transistor mounting structure of this utility model has the characteristics of high stability, good fixing effect, high power density, and sufficient creepage distance, making it convenient for users. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the transistor mounting structure provided in an embodiment of the present invention;

[0028] Figure 2 This is an exploded view of the transistor mounting structure provided in an embodiment of the present invention;

[0029] Figure 3 This is a schematic diagram of the transistor mounting structure provided in an embodiment of the present invention;

[0030] Figure 4 This is another schematic diagram of the transistor mounting structure provided in this embodiment of the utility model;

[0031] Figure 5 This is another schematic diagram of the transistor mounting structure provided in this embodiment of the utility model;

[0032] Figure 6 This is an exploded view of the transistor mounting structure provided in an embodiment of the present invention;

[0033] Figure 7 This is a schematic diagram of the circuit board assembly provided in an embodiment of the present utility model;

[0034] Figure 8 This is another structural schematic diagram of the circuit board assembly provided in this embodiment of the utility model;

[0035] Figure 9 This is a schematic diagram of the power module provided in an embodiment of the present invention.

[0036] Explanation of key component symbols:

[0037] Transistor mounting structure 100, upper cover plate 10, mounting boss 101, first screw hole 102, engaging part 103, engaging groove 104, lower cover plate 20, placement groove 201, protrusion 202, fastening part 203, locking block 204, receiving groove 205, wire outlet groove 206, temperature measuring plate 207, second screw hole 208, receiving space 209, support plate 210, support groove 211, pressure plate 30, third screw hole 301.

[0038] Circuit board assembly 200, transistor 2001,

[0039] Power module 300, ceramic substrate 3001, heat sink 3002. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model. Furthermore, it should be understood that the specific embodiments described herein are merely for explaining this utility model and are not intended to limit this utility model.

[0041] In the description of this utility model, it should be understood that the orientation or positional relationship indicated in the description of direction and positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this utility model and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0043] The following disclosure provides numerous different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0044] The transistor mounting structure of this utility model uses mounting bosses to create a certain height between the circuit board and the upper cover plate, increasing the creepage distance between the circuit board and the bolts; the snap-fit ​​part secures the circuit board to the upper cover plate, preventing the circuit board from loosening and improving the stability of the transistor mounting structure; multiple placement slots are provided on the lower cover plate to hold multiple transistors, increasing the power density of the transistor mounting structure; and the snap-fit ​​part fixes the transistors to the lower cover plate, preventing the transistors from falling off the lower cover plate. In other words, the transistor mounting structure of this utility model has the characteristics of high stability, good fixing effect, high power density, and sufficient creepage distance, making it convenient for users.

[0045] Example 1

[0046] Please see Figures 1 to 6 A transistor mounting structure 100 according to this embodiment includes:

[0047] The top cover plate 10 has at least one mounting boss 101 and at least one engaging portion 103 formed on its top. A plurality of engaging portions 103 are spaced apart along the edge of the mounting boss 101. The mounting boss 101 is used to increase the distance between the circuit board and the top cover plate 10, and the latch is used to fasten the circuit board.

[0048] The lower cover plate 20 is adapted to the upper cover plate 10. A plurality of placement slots 201 are formed on the side of the lower cover plate 20 away from the upper cover plate 10. Each placement slot 201 is adapted to a transistor 2001. The two sides of the placement slot 201 are formed with oppositely arranged fastening parts 203. The placement slot 201 is used to place the transistor 2001, and the fastening parts 203 are used to fasten the transistor 2001.

[0049] Specifically, the mounting boss 101 is cylindrical and hollow. A first screw hole 102 is formed in the middle of the mounting boss 101. When the circuit board is placed on the mounting boss 101 through the first screw hole 102, the pressure plate 30 between the upper cover plate 10 and the lower cover plate 20 is pressed down by the bolts, so that the pressure plate 30 presses down on the lower cover plate 20, and then the lower cover plate 20 presses down on the transistor 2001, so that the transistor 2001 is pressed on the ceramic substrate 3001. This allows the ceramic substrate 3001 to be pressed more stably on the heat sink 3002, which helps to improve the stability of the transistor mounting structure 100 and improve the heat dissipation effect of the transistor mounting structure 100.

[0050] There are two mounting bosses 101, which are arranged at intervals. This helps to improve the connection stability between the circuit board and the upper cover plate 10, and makes the upper cover plate 10 and the circuit board arranged in parallel.

[0051] Furthermore, at least one engaging portion 103 is formed on the top of the upper cover plate 10. More specifically, the at least one engaging portion 103 includes two engaging portions 103, three engaging portions 103, four engaging portions 103, etc.

[0052] In this embodiment, there are two engaging portions 103, which are arranged around the mounting boss 101 and opposite to each other, and the height of the engaging portions 103 is higher than the height of the mounting boss 101. In other embodiments, the number of engaging portions 103 can be designed according to actual conditions, and is not limited here.

[0053] In this embodiment, there are multiple placement slots 201, and each placement slot 201 is fixed with a transistor 2001. With this configuration, each transistor mounting structure 100 can be configured with multiple transistors 2001, thereby improving power density. This not only results in higher efficiency and lower losses, but also facilitates the miniaturization design of the transistor mounting structure 100, optimizes costs, and is beneficial for large-scale production.

[0054] Preferably, the bottom of the lower cover plate 20 includes multiple sets of mutually spaced fixing plates. Two adjacent fixing plates define a placement groove 201. The two adjacent fixing plates are parallel, and the distance between the two adjacent fixing plates is adapted to the width of the transistor 2001, which facilitates the installation of the transistor 2001. The fastening part 203 is located on the outside of the fixing plate and is formed by extending from the fastening part toward the transistor 2001, so that the fastening part 203 is integrally formed with the fixing plate, resulting in high structural stability.

[0055] In this embodiment, two fastening parts 203 are formed in each placement slot 201, and the two fastening parts 203 are correspondingly arranged, that is, in two adjacent fixing plates, each fixing plate has a fastening part 203. This facilitates the insertion of the transistor 2001. Of course, in other embodiments, each fixing plate can be provided with multiple fastening parts 203, which improves the stability of fastening and prevents the transistor 2001 from falling out of the placement slot 201 by mistake.

[0056] The transistor mounting structure 100 of this invention first fixes the transistor 2001 to the lower cover plate 20 via the fastening part 203 of the lower cover plate 20. Then, the pressure plate 30 is placed on the lower cover plate 20. Next, the upper cover plate 10 and the lower cover plate 20 are assembled. Then, bolts are driven in through the first screw hole 102, and the pressure plate 30 is pressed down so that the pressure plate 30 squeezes the lower cover plate 20. Then, the circuit board is fixed to the upper cover plate 10 via the mounting boss 101 and the engaging part 103. Thus, when the circuit board assembly 200 is mounted on the ceramic substrate 3001, the pressure plate 30 provides a squeezing force to the transistor 2001 through the lower cover plate 20, thereby squeezing the ceramic substrate 3001 so that the ceramic substrate 3001 and the heat sink 3002 fit more tightly. Furthermore, since the pressure plate 30 is located between the upper cover plate 10 and the lower cover plate 20, the creepage distance from the transistor 2001 to the pressure plate 30 and the bolt is sufficient. The setting of the fastening part 203 improves the stability of the transistor 2001, making it less likely to fall off when the circuit board is flipped to solder the transistor 2001. The setting of the mounting boss 101 and the fastening part 103 not only enables the circuit board to achieve a stable connection with the upper cover plate 10, but also increases the distance between the circuit board and the upper cover plate 10, thereby increasing the creepage distance from the circuit board to the bolt. In other words, the transistor mounting structure 100 of this utility model has the characteristics of high stability, good fixing effect, high power density and sufficient creepage distance, and the structure is simple.

[0057] Specifically, the lower cover plate 20 is made of an elastic material.

[0058] In this embodiment, the elastic material is nylon plastic, which makes the lower cover plate 20 durable and tough, extends the service life of the lower cover plate 20, and can produce a certain deformation. Of course, in other embodiments, other materials can also be used, which are not limited here.

[0059] Example 2

[0060] Please see Figure 2 and Figure 6 In this embodiment, the upper cover plate 10 has at least one engaging groove 104 on its side, and the lower cover plate 20 has a locking block 204 adapted to the engaging groove 104 on its side. The engaging groove 104 and the locking block 204 engage to fasten the upper cover plate 10 and the lower cover plate 20; or

[0061] The upper cover plate 10 has at least one locking block 204 on its side, and the lower cover plate 20 has a locking groove 104 adapted to the locking block 204 on its side. The locking groove 104 engages with the locking block 204 to engage the upper cover plate 10 and the lower cover plate 20.

[0062] The upper cover plate 10 and the lower cover plate 20 can be detachably connected by the locking groove 104 and the locking block 204, which makes it convenient for users to maintain them and the structure is simple.

[0063] In this embodiment, the upper cover plate 10 has four engaging slots 104 on its side, and the lower cover plate 20 has four locking blocks 204 that are adapted to the engaging slots 104 on its side. In other embodiments, the upper cover plate 10 may also have two engaging slots 104 and two locking blocks 204 on its side, and the lower cover plate 20 may also have two engaging slots 104 and two locking blocks 204 on its side, with the engaging slots 104 and locking blocks 204 being adapted to each other.

[0064] Of course, in other embodiments, the upper cover plate 10 and the lower cover plate 20 can also be detachably connected in other ways. The specific design can be made according to the actual situation and is not limited here.

[0065] Example 3

[0066] Please see Figure 3 and Figure 5 In this embodiment, a receiving groove 205 is formed on the edge of the lower cover plate 20 away from the upper cover plate 10, and a wire outlet groove 206 is formed on the lower cover plate 20. The wire outlet groove 206 is connected to the receiving groove 205. The receiving groove 205 is used to place the temperature measuring plate 207, and the wire outlet groove 206 is used to lead out the wires of the temperature measuring plate 207. The temperature measuring plate 207 is used to attach to the transistor 2001 and to conduct the temperature of the transistor 2001 through the wires.

[0067] In this embodiment, the temperature measuring plate 207 is rectangular and is attached to two transistors 2001 respectively. The temperature of the transistors 2001 is detected by the temperature measuring plate 207, which is beneficial to the operation of the circuit board assembly 200.

[0068] Of course, in other embodiments, the temperature measuring plate 207 may also be in other shapes, such as a racetrack shape, which is not limited here.

[0069] The cable outlet 206 is located at the front end of the lower cover plate 20, which facilitates the lead-out of the wires of the temperature measuring plate 207.

[0070] Specifically, a positioning post is provided in the receiving groove 205, and a positioning hole adapted to the positioning post is formed on the temperature measuring plate 207. The precise positioning of the temperature measuring plate 207 is achieved through the positioning post and the positioning hole. The structure is simple and easy to implement.

[0071] Example 4

[0072] Please continue reading. Figure 3 and Figure 5 In this embodiment, a protrusion 202 is formed in the placement groove 201. When the transistor mounting structure 100 is mounted on the heat sink 3002, the protrusion 202 is used to hold the transistor 2001 so that the transistor 2001 is attached to the surface of the heat sink 3002.

[0073] In this embodiment, the protrusion 202 protrudes from the surface of the placement groove 201. When the transistor 2001 is installed in the placement groove 201, the protrusion 202 abuts against the transistor 2001 so that the lower surface of the transistor 2001 protrudes from the placement groove 201. With this configuration, when the transistor mounting structure 100 is installed on the ceramic substrate 3001, the lower surface of the transistor 2001 can fit against the ceramic substrate 3001, which is beneficial for the ceramic substrate 3001 to dissipate heat from the transistor 2001.

[0074] Of course, in other embodiments, the protrusion 202 can be replaced with an elastic element, which can avoid the situation where the transistor 2001 is damaged due to rigid contact between the transistor 2001 and the protrusion 202.

[0075] In this embodiment, the protrusion 202 is a rectangular block. In other embodiments, the protrusion 202 may also be other shapes, which are not limited here.

[0076] Example 5

[0077] Please see Figure 2 and Figure 6 The transistor mounting structure 100 of this embodiment includes a pressure plate 30, a mounting boss 101 having a first screw hole 102 that penetrates the upper cover plate 10, a lower cover plate 20 having a second screw hole 208 that matches the first screw hole 102, a receiving space 209 being formed on the side of the lower cover plate 20 near the upper cover plate 10, a pressure plate 30 being disposed in the receiving space 209, a third screw hole 301 being formed on the pressure plate 30 that matches the first screw hole 102 and the second screw hole 208, and a bolt passing through the third screw hole 301 to provide pressure to the pressure plate 30 to compress the lower cover plate 20, so that the transistor 2001 is attached to the surface of the heat sink 3002.

[0078] In this embodiment, the centers of the first screw hole 102, the second screw hole 208, and the third screw hole 301 are on the same axis, so that no eccentricity will occur when using bolts for fixing.

[0079] Specifically, the size of the pressure plate 30 is adapted to the size of the accommodating space 209. That is to say, the rotation of the pressure plate 30 is restricted by the accommodating space 209. The structure is simple and easy to implement.

[0080] Furthermore, the bolts pass through the first screw hole 102, the second screw hole 208, and the third screw hole 301 in sequence to fix the transistor mounting structure 100 to the heat sink 3002. When the bolts are tightened, they apply a force to the pressure plate 30 in the direction of bolt movement, that is, the bolts apply a force to the pressure plate 30 in the direction of the lower cover plate 20. The pressure plate 30 is squeezed and at the same time, it applies a force to the lower cover plate 20, causing the bottom surface of the lower cover plate 20 to deform in the direction of the transistor 2001, so as to squeeze the transistor 2001, thereby making the transistor 2001 tightly attached to the heat sink 3002 and enhancing the heat dissipation effect.

[0081] In this embodiment, the pressure plate 30 is made of metal and is elastic, which can avoid extending the service life of the pressure plate 30.

[0082] Example 6

[0083] Please see Figures 1 to 3 In this embodiment, the pressure plate 30 is L-shaped, and the placement grooves 201 are all located on one side of the lower cover plate 20. A support plate 210 is formed downward on the other side of the lower cover plate 20. The support plate 210 is hollow. The pressure plate 30 is at least partially located in the support groove 211, and the pressure plate 30 abuts against the support groove 211. The pressure plate 30 is inclined from the third screw hole 301 toward the placement groove 201.

[0084] With this configuration, when the bolt applies a force to the pressure plate 30 in the direction of the lower cover plate 20, since the pressure plate 30 is "L" shaped and is inclined from the third screw hole 301 toward the placement groove 201, a larger compressive force can be generated, so that the lower cover plate 20 can be more firmly attached to the ceramic substrate 3001, achieving better heat dissipation.

[0085] In this embodiment, four transistors 2001 are arranged side by side on one side of the lower cover plate 20, and there are two accommodating spaces 209. There are also two pressure plates 30, each pressure plate 30 having a third screw hole 301. The side of each pressure plate 30 near the transistor 2001 is divided into two sub-pressure plates, each sub-pressure plate being located directly above a transistor 2001. This arrangement ensures that when the bolt applies a force to the pressure plate 30 toward the lower cover plate 20, the force on each sub-pressure plate is more uniform, which is beneficial for compressing the transistor 2001.

[0086] Of course, in other embodiments, there may be one pressure plate 30, or it may not be set as two sub-pressure plates. The specific design can be made according to the actual situation, and no limitation is made here.

[0087] Example 7

[0088] Please see Figures 4 to 6 In this embodiment, the pressure plate 30 is "H" shaped, and the placement groove 201 is located on opposite sides of the lower cover plate 20, and the placement grooves 201 on both sides are correspondingly arranged. The pressure plate 30 is inclined from the third screw hole 301 toward the placement groove 201.

[0089] In this embodiment, the placement groove 201 is located on both sides of the lower cover plate 20, and the third screw hole 301 is located in the middle of the pressure plate 30. The pressure plate 30 is inclined from the third screw hole 301 toward the placement groove 201. With this arrangement, the transistors 2001 on both sides of the lower cover plate 20 can be provided with compressive force by a single "H"-shaped pressure plate 30, eliminating the need for two "L"-shaped pressure plates 30. This improves the structural stability of the pressure plate 30 and simplifies the structure.

[0090] Example 8

[0091] Please see Figure 7 and Figure 8 This embodiment also provides a circuit board assembly 200, including:

[0092] At least one transistor 2001;

[0093] Circuit board (shown in the figure); and

[0094] In the aforementioned transistor mounting structure 100, transistor 2001 is connected to the circuit board via transistor mounting structure 100.

[0095] In this embodiment, the number of transistors 2001 is four or eight. When the number of transistors 2001 is four, the number of mounting slots is four and they are arranged side by side on one side of the lower cover plate 20. When the number of transistors 2001 is eight, four transistors 2001 are arranged side by side on both sides of the mounting slots. That is to say, the transistor mounting structure 100 can accommodate four transistors 2001 or eight transistors 2001, thereby improving the power density of the circuit board assembly 200.

[0096] The transistor mounting structure 100 uses mounting bosses 101 to create a certain height between the circuit board and the upper cover plate 10, increasing the creepage distance between the circuit board and the bolts; the engaging part 103 secures the circuit board to the upper cover plate 10, preventing the circuit board from loosening and improving the stability of the transistor mounting structure 100; multiple placement slots 201 on the lower cover plate 20 are provided for placing multiple transistors 2001, increasing the power density of the transistor mounting structure 100; the engaging part 203 secures the transistors 2001 to the lower cover plate 20, preventing the transistors 2001 from falling off the lower cover plate 20. In other words, the transistor mounting structure 100 of this utility model has the characteristics of high stability, good fixing effect, high power density, and sufficient creepage distance, making it convenient for users.

[0097] Example 9

[0098] Please see Figure 9 This embodiment also provides a power module 300, including:

[0099] Radiator 3002;

[0100] Ceramic substrate 3001; and

[0101] The circuit board assembly 200 is connected to the heat sink 3002 via a ceramic substrate 3001.

[0102] In this embodiment, the power module 300 is a photovoltaic inverter. The current passing through the photovoltaic inverter is relatively large, and the transistor 2001 generates a lot of heat. Therefore, it needs to be used together with the ceramic substrate 3001 and the heat sink 3002.

[0103] The combination of heat sink 3002 and ceramic substrate 3001 has advantages such as high-efficiency heat conduction, electrical isolation, and CTE matching. Therefore, the ceramic substrate 3001 and heat sink 3002 can quickly dissipate heat from the transistor 2001. The structure is simple and easy to implement.

[0104] The transistor mounting structure 100 uses mounting bosses 101 to create a certain height between the circuit board and the upper cover plate 10, increasing the creepage distance between the circuit board and the bolts; the engaging part 103 secures the circuit board to the upper cover plate 10, preventing the circuit board from loosening and improving the stability of the transistor mounting structure 100; multiple placement slots 201 on the lower cover plate 20 are provided for placing multiple transistors 2001, increasing the power density of the transistor mounting structure 100; the engaging part 203 secures the transistors 2001 to the lower cover plate 20, preventing the transistors 2001 from falling off the lower cover plate 20. In other words, the transistor mounting structure 100 of this utility model has the characteristics of high stability, good fixing effect, high power density, and sufficient creepage distance, making it convenient for users.

[0105] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A transistor mounting structure, characterized in that, include: The top of the top cover has at least one mounting boss and at least one engaging portion, and a plurality of engaging portions are spaced apart along the edge of the mounting boss. The mounting boss is used to increase the distance between the circuit board and the top cover, and the latch is used to engage the circuit board. A lower cover plate is adapted to the upper cover plate. A plurality of placement slots are formed on the side of the lower cover plate away from the upper cover plate. Each placement slot is adapted to a transistor. Oppositely arranged fastening portions are formed on both sides of the placement slot. The placement slot is used to place the transistor, and the fastening portions are used to fasten the transistor.

2. The transistor mounting structure as described in claim 1, characterized in that, The upper cover plate has at least one engaging groove on its side, and the lower cover plate has a locking block on its side that matches the engaging groove. The engaging groove and the locking block engage to fasten the upper cover plate and the lower cover plate together; or The upper cover plate has at least one locking block on its side, and the lower cover plate has a locking groove on its side that matches the locking block. The locking groove engages with the locking block to fasten the upper cover plate and the lower cover plate together.

3. The transistor mounting structure as described in claim 1, characterized in that, The mounting boss has a first screw hole that penetrates the upper cover plate, and the lower cover plate has a second screw hole that matches the first screw hole.

4. The transistor mounting structure as described in claim 1, characterized in that, A receiving groove is formed on the edge of the lower cover plate away from the upper cover plate, and a wire outlet groove is formed on the lower cover plate. The wire outlet groove is connected to the receiving groove. The receiving groove is used to place the temperature measuring plate, and the wire outlet groove is used to lead out the wires of the temperature measuring plate. The temperature measuring plate is used to attach to the transistor and to export the temperature of the transistor through the wires.

5. The transistor mounting structure as described in claim 1, characterized in that, The placement groove has a protrusion formed therein. When the transistor mounting structure is installed on a heat sink, the protrusion is used to hold the transistor so that the transistor is attached to the surface of the heat sink.

6. The transistor mounting structure as described in claim 1, characterized in that, The transistor mounting structure includes a pressure plate. A receiving space is formed on the side of the lower cover plate near the upper cover plate. The pressure plate is disposed in the receiving space. A third screw hole is formed on the pressure plate to match the first screw hole and the second screw hole. A bolt passes through the third screw hole to provide pressure to the pressure plate to compress the lower cover plate, so that the transistor is attached to the surface of the heat sink.

7. The transistor mounting structure as described in claim 6, characterized in that, The pressure plate is L-shaped, and the placement slots are all located on one side of the lower cover plate. A support plate is formed downward on the other side of the lower cover plate. The support plate is hollow. The pressure plate is at least partially located in the support slot, and the pressure plate abuts against the support slot. The pressure plate is inclined from the third screw hole toward the placement slot.

8. The transistor mounting structure as described in claim 6, characterized in that, The pressure plate is H-shaped, and the placement grooves are located on opposite sides of the lower cover plate, with the placement grooves on both sides corresponding to each other. The pressure plate is inclined from the third screw hole toward the placement groove.

9. A circuit board assembly, characterized in that, include: At least one transistor; Circuit board; as well as The transistor mounting structure according to any one of claims 1 to 8, wherein the transistor is connected to the circuit board via the transistor mounting structure.

10. A power module, characterized in that, include: heat sink; Ceramic substrate; as well as The circuit board assembly of claim 9, wherein the circuit board assembly is connected to the heat sink via the ceramic substrate.

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