Adjustable cutting device for memory stick production

Abstract

The utility model discloses an inner memory bank production technical field, a kind of cutting device for adjustable memory bank production, including cutting die, cutting die includes lower mould and upper die, upper die is hinged in the top of lower mould, the upper surface of lower mould is equipped with placing groove, the memory bank to be cut of outside can be placed in placing groove, upper die can be pressed to the memory bank in placing groove, the middle part of upper die is equipped with let go of slot, the inside of let go of slot is equipped with sliding slot, positioning plate is slidably installed in sliding slot, the side wall of positioning plate is equipped with cutting slot, cutting slot can be oriented and limited to external cutting knife, the upper surface of upper die is provided with limiting plate, the device is positioned by being set in its upper die with the positioning plate of adjustable position, so that it can be adaptively adjusted to the position of its cutting slot according to the model of memory bank, so that the device can be suitable for different models of memory bank cutting, save production cost.

Description

Technical Field

[0001] This utility model relates to the field of memory module manufacturing technology, specifically to a cutting device for adjustable memory module manufacturing. Background Technology

[0002] Memory modules, also known as random access memory, are internal memory that directly exchanges data with the CPU. They are usually used as temporary data storage media for the operating system or other running programs. Multiple memory modules can be made on each PCB board. Therefore, after the memory chips are printed, the PCB board needs to be cut to separate the multiple memory modules. Thus, a cutting device is needed to cut them.

[0003] The existing cutting equipment places the entire PCB board in a special mold and guides and positions the cutting blade through the cutting groove on the top of the mold. However, since the position of the cutting groove on the existing mold is fixed, different models of memory modules need to be cut with different molds, which greatly increases the production cost.

[0004] Therefore, an adjustable cutting device is needed for producing memory modules. Utility Model Content

[0005] The purpose of this invention is to provide an adjustable cutting device for producing memory modules, in order to solve the problem mentioned in the background art that, due to the fixed position of the cutting groove on the existing mold, different models of memory modules need to be cut with different molds, which greatly increases the production cost.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an adjustable memory module cutting device, comprising a cutting mold, the cutting mold comprising a lower mold and an upper mold, the upper mold being hinged above the lower mold, the upper surface of the lower mold having a placement groove, the memory module to be cut being placed in the placement groove, and the upper mold being able to press the memory module in the placement groove;

[0007] The upper mold has a relief groove in the middle, a sliding groove on the inner side of the relief groove, a positioning plate slidably installed in the sliding groove, and a cutting groove on the side wall of the positioning plate, which can guide and limit the external cutting blade.

[0008] The upper surface of the upper mold is provided with a limiting plate, and the upper wall of the limiting plate is provided with a slot, which corresponds to the cutting position of the memory module. The upper wall of the positioning plate is provided with a card plate, the cross-section of which is L-shaped, and the lateral end of the card plate can be inserted into the slot.

[0009] As a preferred embodiment of this utility model, sliding blocks are installed at both ends of the positioning plate, the sliding blocks are slidably installed in the sliding groove, the upper wall of the positioning plate is provided with an installation groove, the card plate is inserted and installed in the installation groove, and the card plate is connected to the installation groove and the card groove by a transition fit.

[0010] As a preferred embodiment of this utility model, the side wall of the upper mold is provided with a through hole, and the upper wall of the lower mold is provided with a threaded hole corresponding to the through hole. A locking bolt is inserted into the through hole and screwed into the threaded hole.

[0011] As a preferred embodiment of this invention, handles are installed on the side walls of both the upper and lower molds.

[0012] As a preferred embodiment of this utility model, rubber pads are fitted to both the inner wall of the placement groove and the lower wall of the upper mold, and the rubber pads can fit against the outer wall of the memory module.

[0013] As a preferred embodiment of this utility model, the upper wall of the upper mold is provided with a connecting groove, and magnetic blocks are installed on both the lower wall of the limiting plate and the inner wall of the connecting groove, and the two magnetic blocks can be attracted and connected to each other.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] This device uses an adjustable positioning plate in its upper mold to adaptively adjust the position of the cutting groove according to the model of the memory module, thus making the device suitable for cutting different models of memory modules and saving production costs.

[0016] In addition, the device is equipped with rubber pads inside the placement slot and below the upper mold to protect the memory modules when they come into contact with each other, preventing damage to the memory modules due to contact friction. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this patent;

[0018] Figure 2 This is a schematic diagram of the cross-sectional structure of the mold portion of this patent;

[0019] Figure 3 for Figure 1 Schematic diagram of the structural cross-section at point A.

[0020] In the diagram: 1 Cutting mold, 2 Placement groove, 3 Clearance groove, 4 Sliding groove, 5 Positioning plate, 6 Cutting groove, 7 Limiting plate, 8 Slot, 9 Slot plate, 10 Sliding block, 11 Lower mold, 12 Upper mold, 13 Mounting groove, 14 Through hole, 15 Threaded hole, 16 Locking bolt, 17 Handle, 18 Rubber pad, 19 Connecting groove, 20 Magnetic block. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-3 This utility model provides a technical solution:

[0023] In this technical solution, an adjustable memory module production cutting device includes a cutting mold 1, which includes a lower mold 11 and an upper mold 12. The upper mold 12 is hinged above the lower mold 11. The upper surface of the lower mold 11 is provided with a placement groove 2, and the memory module to be cut can be placed in the placement groove 2. The upper mold 12 can press the memory module in the placement groove 2.

[0024] The placement slot 2 of the lower mold 11 provides a stable placement space for the memory module. Its shape and size can be designed according to common memory module specifications to ensure that the memory module will not shake when placed. The upper mold 12 is connected to the lower mold 11 by a hinge, which makes it convenient for operators to open the upper mold 12 to put in the memory module. When closed, it can press and fix the memory module, so that the memory module remains stable during the cutting process, avoiding inaccurate cutting dimensions due to position movement and ensuring cutting accuracy.

[0025] The upper mold 12 has a relief groove 3 in the middle, a sliding groove 4 in the inner side of the relief groove 3, a positioning plate 5 in the sliding groove 4, and a cutting groove 6 in the side wall of the positioning plate 5. The cutting groove 6 can guide and limit the external cutting blade.

[0026] The clearance groove 3 provides the necessary space for the cutting blade to work, preventing the upper mold 12 from interfering with the cutting blade;

[0027] The sliding groove 4 and the positioning plate 5 are designed to slide together, allowing the positioning plate 5 to be flexibly adjusted in the clearance groove 3 according to the actual cutting requirements.

[0028] The cutting groove 6 on the side wall of the positioning plate 5 is shaped and sized to match the cutting blade, which can accurately guide the movement trajectory of the cutting blade, limit the swing of the cutting blade, and ensure that the cutting blade cuts the memory stick along the predetermined path, thereby improving the accuracy and consistency of cutting.

[0029] The upper surface of the upper mold 12 is provided with a limiting plate 7. The upper wall of the limiting plate 7 is provided with a slot 8, which corresponds to the cutting position of the memory module. The upper wall of the positioning plate 5 is provided with a card plate 9. The cross section of the card plate 9 is L-shaped, and the horizontal end of the card plate 9 can be inserted into the slot 8.

[0030] In this technical solution, the setting of the limiting plate 7 further clarifies the cutting position of the memory module. The operator can intuitively determine the cutting position through the card slot 8 without additional measurement, which improves work efficiency.

[0031] The cooperation between the card plate 9 and the card slot 8 ensures that the positioning plate 5 can be firmly fixed after the position is adjusted, preventing the positioning plate 5 from shifting during the cutting process, ensuring the accuracy of the cutting position, and thus ensuring that the size of the cut memory module meets the production requirements.

[0032] In some technical solutions, sliding blocks 10 are installed at both ends of the positioning plate 5. The sliding blocks 10 are slidably installed in the sliding groove 4. The upper wall of the positioning plate 5 is provided with an installation groove 13. The clamping plate 9 is inserted and installed in the installation groove 13. The clamping plate 9 and the installation groove 13 and the clamping groove 8 are all transition fit connections.

[0033] In this technical solution, the sliding block 10 is circular. This design can reduce the friction between the positioning plate 5 and the sliding groove 4 when the positioning plate 5 slides, making the sliding of the positioning plate 5 smoother and facilitating the operator to quickly adjust the position of the positioning plate 5.

[0034] The transition fit between the card plate 9 and the mounting slot 13 and the card slot 8 ensures the stability of the card plate 9 during installation, preventing it from easily loosening during the cutting process. It also facilitates the disassembly and installation of the card plate 9 by operators, making it convenient to replace or maintain the card plate 9 when it becomes worn.

[0035] In some technical solutions, the side wall of the upper mold 12 is provided with a through hole 14, and the upper wall of the lower mold 11 is provided with a threaded hole 15 corresponding to the through hole 14. A locking bolt 16 is inserted into the through hole 14 and screwed into the threaded hole 15.

[0036] In this technical solution, after the operator closes the upper mold 12 and presses the memory module, the upper mold 12 and the lower mold 11 can be firmly fixed together by tightening the locking bolt 16, which enhances the overall stability of the cutting mold.

[0037] During the cutting process, even when subjected to the impact of the cutting blade, the upper mold 12 will not easily loosen or spring open, ensuring that the memory module is always in a stable clamping state, thus guaranteeing the safety and smooth progress of the cutting work.

[0038] In some technical solutions, handles 17 are installed on the side walls of both the upper mold 12 and the lower mold 11.

[0039] In some technical solutions, rubber pads 18 are installed on both the inner wall of the placement slot 2 and the lower wall of the upper mold 12, and the rubber pads 18 can be attached to the outer wall of the memory module.

[0040] In this technical solution, the rubber pad 18 has good elasticity and flexibility, which can closely fit the outer wall of the memory module, increase the friction of the memory module, further improve the stability of the memory module in the placement slot 2, and prevent the memory module from sliding during the cutting process.

[0041] Meanwhile, the rubber pad 18 also acts as a buffer, preventing the upper mold 12 from scratching or damaging the surface of the memory module during the pressing process, thus protecting the appearance quality and performance of the memory module and improving the product qualification rate.

[0042] In some technical solutions, the upper wall of the upper mold 12 is provided with a connecting groove 19, and the lower wall of the limiting plate 7 and the inner wall of the connecting groove 19 are both equipped with magnetic blocks 20, and the two magnetic blocks 20 can be attracted and connected to each other.

[0043] In this technical solution, the magnetic block 20 makes the connection between the limiting plate 7 and the upper mold 12 more convenient and quick. Operators can quickly install or remove the limiting plate 7 at any time according to different cutting needs. When it is necessary to replace the memory stick of different specifications for cutting, simply remove the original limiting plate 7 from the connecting groove 19 and then use the magnetic block 20 to fix the corresponding limiting plate 7. No additional tools are required, which improves work efficiency and enhances the versatility and flexibility of the cutting device.

[0044] Working principle: When cutting memory modules, the operator first opens the upper mold 12, flips it upwards using the handle 17, and places the memory module to be cut into the placement slot 2 of the lower mold 11. The rubber pad 18 on the inner wall of the placement slot 2 is used to initially fix the memory module.

[0045] Then, according to the cutting size requirements of the memory module, slide the positioning plate 5 in the clearance groove 3, and adjust the position of the positioning plate 5 by sliding the sliding block 10 in the sliding groove 4 so that the cutting groove 6 on the side wall of the positioning plate 5 is aligned with the predetermined cutting position. Then, insert the horizontal end of the card plate 9 into the card groove 8 on the upper wall of the limiting plate 7 to fix the position of the positioning plate 5.

[0046] Next, the upper mold 12 is closed, and the rubber pad 18 on the lower wall of the upper mold 12 is used to further press and fix the memory module, so that the memory module is in a stable state.

[0047] Then, insert the locking bolt 16 into the through hole 14 on the side wall of the upper mold 12 and screw it into the threaded hole 15 on the upper wall of the lower mold 11 to firmly lock the upper mold 12 and the lower mold 11 together.

[0048] Finally, insert the cutting blade into the cutting groove 6 on the side wall of the positioning plate 5, and cut the memory module along the guide of the cutting groove 6;

[0049] After cutting, loosen the locking bolt 16, open the upper mold 12, and take out the cut memory stick to complete one cutting operation.

[0050] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0051] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A cutting device for producing adjustable memory modules, comprising a cutting die (1), characterized in that: The cutting mold (1) includes a lower mold (11) and an upper mold (12). The upper mold (12) is hinged above the lower mold (11). The upper surface of the lower mold (11) is provided with a placement groove (2). The memory module to be cut can be placed in the placement groove (2). The upper mold (12) can press the memory module in the placement groove (2). The middle part of the upper mold (12) is provided with a relief groove (3). The inner side of the relief groove (3) is provided with a sliding groove (4). The sliding groove (4) slides within the sliding groove (4). The positioning plate (5) is provided with a cutting groove (6) on its side wall. The cutting groove (6) can guide and limit the external cutting blade. The upper surface of the upper mold (12) is provided with a limiting plate (7). The upper wall of the limiting plate (7) is provided with a slot (8). The slot (8) corresponds to the cutting position of the memory stick. The upper wall of the positioning plate (5) is provided with a card plate (9). The cross section of the card plate (9) is L-shaped. The horizontal end of the card plate (9) can be inserted into the slot (8).

2. The adjustable memory module cutting device according to claim 1, characterized in that: Both ends of the positioning plate (5) are equipped with sliding blocks (10), the sliding blocks (10) are slidably installed in the sliding groove (4), the upper wall of the positioning plate (5) is provided with an installation groove (13), the card plate (9) is inserted and installed in the installation groove (13), and the card plate (9) is connected to the installation groove (13) and the card slot (8) with a transition fit.

3. The adjustable memory module cutting device according to claim 1, characterized in that: The upper mold (12) has a through hole (14) on its side wall, and the lower mold (11) has a threaded hole (15) on its upper wall corresponding to the through hole (14). A locking bolt (16) is inserted into the through hole (14) and screwed into the threaded hole (15).

4. The adjustable memory module cutting device according to claim 1, characterized in that: Handles (17) are installed on the side walls of both the upper mold (12) and the lower mold (11).

5. The adjustable memory module cutting device according to claim 1, characterized in that: The inner wall of the placement groove (2) and the lower wall of the upper mold (12) are both fitted with rubber pads (18), and the rubber pads (18) can fit against the outer wall of the memory module.

6. The adjustable memory module cutting device according to claim 1, characterized in that: The upper wall of the upper mold (12) is provided with a connecting groove (19), and the lower wall of the limiting plate (7) and the inner wall of the connecting groove (19) are both equipped with magnetic blocks (20), and the two magnetic blocks (20) can be attracted and connected to each other.

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