Coil package module and circuit board structure having coil package module

Abstract

The utility model provides a kind of coil packaging module and the circuit board structure with coil packaging module, the coil packaging module includes a coil and a packaging body, the coil has a winding part, the winding part is equipped with at least two outgoing line end, the packaging body completely covers the coil to form a coil shell, and make the two outgoing line end exposed outside the packaging body to form reserved electrical contact point. By the above structure, the coil is first packaged and the exposed electrical contact point is reserved, and the surface adhesion technology is used to be welded with circuit board in patch mode, so that the efficiency and yield of product assembly can be greatly improved, and the production cost is effectively reduced.

Description

Technical Field

[0001] This utility model relates to a coil used in a fan motor, and more particularly to a coil packaging module and a circuit board structure having the coil packaging module. Background Technology

[0002] Currently, most fan motor coils are encapsulated using polyurethane (PU) or epoxy resin. The encapsulated material completely covers and cures the coil, protecting the coil winding assembly and effectively preventing moisture intrusion, reducing wear and the risk of detachment due to vibration, thus extending the product's lifespan. As fans are trending towards smaller and thinner designs, and moving from traditional single-phase axial motors to radial motors, the production and assembly of single-phase radial motors involves first placing the motor coil on the circuit board and then encapsulating it. This method is not only inefficient, difficult, and has a low yield rate, but it is also unfavorable for mass production.

[0003] Therefore, it is necessary to propose an innovative coil coating structure and its manufacturing method to effectively solve the problems of low efficiency, high difficulty, and unfavorable mass production caused by the current motor coil coating structure and manufacturing method. Utility Model Content

[0004] Therefore, in order to effectively solve the above problems, the purpose of this utility model is to provide a coil encapsulation module and a circuit board structure with a coil encapsulation module, so as to improve the problems of low efficiency, high difficulty and unfavorable mass production caused by the conventional motor coil encapsulation structure and its manufacturing method.

[0005] To achieve the above objectives, the present invention provides a coil packaging module, comprising: a coil having a winding portion having at least two lead-out terminals; and a packaging body that fully covers the coil to form a coil shell, such that the two lead-out terminals of the coil are exposed outside the packaging body, forming reserved electrical contacts for electrical connection with a circuit board.

[0006] The encapsulation is a package of colloid.

[0007] The encapsulated material is an insulating material selected from plastics, epoxy resins, or other moldable polymers.

[0008] The two output terminals are surface-mount pins, which facilitate soldering to the circuit board using surface-mount technology.

[0009] The winding part has a flat spiral structure.

[0010] The coil housing includes a top wall, a bottom wall, and a side wall. The top wall and the bottom wall are arranged vertically opposite each other. The side wall connects the top wall and the bottom wall. The two lead-out ends extend and protrude from the bottom wall or the side wall.

[0011] The coil housing includes a top wall, a bottom wall, and a side wall. The top wall and the bottom wall are arranged vertically opposite each other. The side wall connects the top wall and the bottom wall. The side wall includes two opposing side surfaces, which are respectively arranged corresponding to the two lead-out ends. The outline of each side surface is the same as the end outline of each lead-out end.

[0012] To achieve the above objectives, the present invention provides a circuit board structure with a coil encapsulation module, comprising: a circuit board substrate; and at least one coil encapsulation module disposed on the circuit board substrate. The coil encapsulation module includes: a coil having a winding portion having at least two lead-out terminals; and an encapsulation body covering the coil to form a coil shell, wherein the two lead-out terminals are exposed outside the encapsulation body and electrically connected to the circuit board substrate.

[0013] The encapsulation is a gel, which is an insulating material selected from plastics, epoxy resins, or other moldable polymers.

[0014] This invention first encapsulates or coats the coil with exposed electrical contacts to form a surface-mount-like encapsulation or coating structure. This encapsulation or coating structure is similar to common electronic packaging components. Therefore, surface mount technology (SMT) can be used to solder this encapsulation or coating structure onto the circuit board in a surface-mount manner. This can greatly improve the efficiency of product assembly and simplify the manufacturing process, thus effectively reducing production costs. Attached Figure Description

[0015] Figure 1 This is a three-dimensional schematic diagram of the coil packaging module of this utility model;

[0016] Figure 2 for Figure 1 A three-dimensional schematic diagram of the coil packaging module from another angle;

[0017] Figure 3 for Figure 1 A cross-sectional schematic diagram of the coil packaging module;

[0018] Figure 4 This is a three-dimensional schematic diagram of another coil packaging module of this utility model;

[0019] Figure 5 for Figure 4 A cross-sectional schematic diagram of the coil packaging module;

[0020] Figure 6This is a side view of the circuit board structure with a coil packaging module according to this utility model;

[0021] Figure 7 This is a three-dimensional schematic diagram of another coil packaging module of this utility model;

[0022] Figure 8 for Figure 7 A three-dimensional schematic diagram of the coil packaging module from another angle;

[0023] Figure 9 This is a three-dimensional schematic diagram of another coil packaging module of this utility model;

[0024] Figure 10 for Figure 9 A three-dimensional schematic diagram of the coil packaging module from another angle;

[0025] Figure 11 This is a schematic flowchart illustrating the manufacturing method of the circuit board structure with coil packaging module according to this utility model.

[0026] Explanation of reference numerals in the attached drawings: Coil encapsulation module 1; Coil 11; Winding part 111; Lead end 112; Encapsulation body 12; Coil shell 121; Top wall 1211; Bottom wall 1212; Side wall 1213; Side surface 1214; Circuit board 2; Circuit board structure 3; Manufacturing method of circuit board structure 4; Coil supply step 41; Coil encapsulation step 42; Coil connection step 43; Coil encapsulation module 5; Lead end 51; Encapsulation body 52; Coil shell 521; Top wall 5211; Bottom wall 5212; Side wall 5213; Radial surface 5214; Fan-shaped bottom surface 5215; Top surface 5216; Width W. Detailed Implementation

[0027] The above-mentioned objectives of this utility model and its structural and functional characteristics will be described with reference to the preferred embodiments shown in the accompanying drawings.

[0028] Please also refer to Figures 1 to 3 As shown, the present invention provides a coil packaging module 1, which includes: a coil 11 having a winding portion 111, the winding portion 111 having at least two lead-out terminals 112; and a package 12 for covering the coil 11 to form a coil shell 121, wherein the two lead-out terminals 112 are exposed outside the package 12 to form reserved electrical contacts for electrical connection with a circuit board (not shown).

[0029] In this embodiment, the encapsulation 12 is an encapsulated material. This encapsulation is an insulating material selected from plastics, epoxy resins, or other moldable polymers. However, it is not limited to this; the encapsulation 12 can also be made of other insulating materials, such as ceramics. Furthermore, the exposed two leads 112 serve as surface-mount leads to facilitate soldering to the circuit board using surface mount technology (SMT). Moreover, the winding portion 111 can be a flat helical structure, but it is not limited to this; the winding portion 111 can also be a helical structure of other shapes.

[0030] In this embodiment, the coil housing 121 includes a top wall 1211, a bottom wall 1212, and a side wall 1213. The top wall 1211 and the bottom wall 1212 are arranged vertically opposite each other, and the side wall 1213 connects the top wall 1211 and the bottom wall 1212. The two lead-out terminals 112 extend and protrude from the bottom wall 1212 or the side wall 1213 and are arranged along the diagonal of the bottom wall 1212, thus achieving a stable structural configuration. It is worth mentioning that each lead-out terminal 112 is a generally square or geometrically shaped contact point to facilitate soldering to the pads on the circuit board (not shown). Furthermore, the positions of the two lead-out terminals 112 can be in any of the other four directions besides being located along the diagonal of the bottom wall 1212, namely, the front, back, left, and right sides of the coil housing 121, that is, the four faces surrounding the side wall 1213 of the coil housing 121. In other words, this utility model does not limit the position of the two output terminals 112, and the position of the two output terminals 112 can be defined according to actual needs.

[0031] It is understood that in this embodiment, the coil housing 121 is in the form of a square or other geometric structure. This square structure may include a rectangular body and a square body to match the square shape formed by the winding portion 111. It has cut edges at two opposite corners of the square structure to form two parallel and opposite side surfaces 1214. Each side surface 1214 may also be referred to as a pair of diagonal cut surfaces. Therefore, the sidewall 1213 includes two parallel and opposite side surfaces 1214. The two side surfaces 1214 are respectively provided corresponding to the two lead-out ends 112. The width W of each side surface 1214 is slightly greater than or equal to the width of each lead-out end 112. The outline of each side surface 1214 is the same as the end outline of each lead-out end 112. Therefore, when the output terminal 112 is a square contact, the width W of the side 1214 will be slightly greater than or equal to the width of the square contact, and the outline of the side 1214 is the same as the end outline of the square contact. This allows each output terminal 112 to be properly protected by the coil housing 121 without forming an excessively large coil housing 121, thus avoiding a waste of space.

[0032] Furthermore, to reduce the space occupied by the aforementioned coil encapsulation module 1, the two lead-out terminals 112 extending from the bottom wall 1212 or the side wall 1213 can be designed to be located directly on the bottom wall 1212. Please also refer to... Figures 4 to 5 As shown, this utility model provides another coil packaging module, whose coil housing 121 also includes a top wall 1211, a bottom wall 1212 and a side wall 1213. The top wall 1211 and the bottom wall 1212 are arranged vertically opposite each other, and the side wall 1213 connects the top wall 1211 and the bottom wall 1212. The difference between this coil packaging module and the above-mentioned coil packaging module 1 is that the two lead-out terminals 112 are located on the bottom wall 1212 and on the diagonal of the bottom wall 1212. Since the two lead-out terminals 112 are located on the bottom wall 1212, the space wastage caused by the lead-out terminals 112 can be effectively reduced.

[0033] Similarly, the sidewall 1213 also includes two parallel side surfaces 1214 arranged opposite to each other, which can also be referred to as two diagonal sectional surfaces. The two side surfaces 1214 are respectively arranged corresponding to the two lead-out ends 112. The width W of each side surface 1214 is slightly greater than or equal to the width of each lead-out end 112. The outline of each side surface 1214 is the same as the end outline of each lead-out end 112, so that each lead-out end 112 can be properly protected by the outer outline of the coil housing 121.

[0034] It is worth mentioning that, in addition to protecting the cable outlet 112, the side surface 1214 also serves to indicate the location of the cable outlet 112. Please refer to [link / reference needed]. Figure 4 As shown, from this angle, only the side panel 1214 is visible, but the outgoing cable terminal 112 is not. Please refer to [link / reference]. Figure 5 As shown, both the side panel 1214 and the cable outlet 112 can only be seen from another angle. Since, as we know from the above embodiments, the cable outlet 112 is positioned close to the side panel 1214, although from... Figure 4 Only the side 1214 is visible, but it actually indicates the location of the outlet terminal 112, which is at the junction of the side 1214 and the bottom wall 1212. In other words, the side 1214 has the function of indicating the location of the outlet terminal 112.

[0035] Please see Figure 6As shown, this utility model also provides a circuit board structure 3 with a coil encapsulation module, comprising: a circuit board 2; and at least one coil encapsulation module 1 disposed on the circuit board 2. The coil encapsulation module 1 includes: a coil (not shown) having a winding portion (not shown) with at least two lead-out terminals 112; and an encapsulation body 12 covering the coil to form a coil shell 121, wherein the two lead-out terminals 112 are exposed outside the encapsulation body 12 and are electrically connected to the circuit board 2.

[0036] In this embodiment, the encapsulation body 12 is an encapsulation material, which is an insulating material selected from plastics, epoxy resins, or other moldable polymer materials. Furthermore, the coil housing 121 of the coil encapsulation module 1 includes a top wall 1211, a bottom wall 1212, and a side wall 1213. The top wall 1211 and the bottom wall 1212 are arranged vertically opposite each other. A product number mark can be formed on the top wall 1211, and the plane of the top wall 1211 can be absorbed. Therefore, the planar top wall 1211 can be used as an absorbent surface or a product number mark surface.

[0037] Please also refer to Figures 7 to 8 As shown, this utility model also provides a coil encapsulation module 5, which includes: a coil (not shown) having a winding portion (not shown) with at least two lead-out terminals 51; and an encapsulation body 52 covering the coil to form a coil shell 521, wherein the two lead-out terminals 51 are exposed outside the encapsulation body 52, forming reserved electrical contacts. The coil shell 521 of this coil encapsulation module 5 has a fan-shaped structure to match the fan-shaped shape formed by the winding portion. The coil shell 521 includes a top wall 5211, a bottom wall 5212, and a side wall 5213, wherein the side wall 5213 includes two radial surfaces 5214, a fan-shaped bottom surface 5215, and a top surface 5216 disposed opposite to each other, and the two lead-out terminals 51 protrude from the fan-shaped bottom surface 5215 and are respectively located on both sides of the fan-shaped bottom surface 5215. However, it is not limited to this, please also refer to Figures 9 to 10 As shown, the two lead-out ends 51 of this invention can also be configured to protrude from the top surface 5216 and be located on both sides of the top surface 5216. In other words, this invention does not limit the shape of the coil housing 521 to be square like the coil housing 121 described above; it can also be other geometric shapes. Furthermore, the positions of the two lead-out ends 51 can be protruding from the fan-shaped bottom surface 5215, protruding from the top surface 5216, or protruding from the two radial surfaces 5214 respectively. Therefore, this invention does not limit the position of the lead-out ends 51; they can be in any direction without definition. However, this is not a limitation. Another option is that the coil housing 521 of the package 12 can also be circular. In other words, the package 12 of this invention can be of any shape and is not limited here.

[0038] Please see Figure 11 As shown, this utility model also provides a method 4 for manufacturing a circuit board structure with a coil encapsulation module, which includes: a coil providing step 41, providing a coil and having a winding portion and forming at least two lead-out terminals on the winding portion; a coil encapsulation step 42, covering the coil with an encapsulation body to form a coil shell, and exposing the two lead-out terminals outside the encapsulation body to form a coil encapsulation module; and a coil connecting step 43, soldering the two lead-out terminals of the coil encapsulation module to a circuit board substrate by surface mount technology to form a circuit board structure with a coil encapsulation module.

[0039] Specifically, the encapsulation body in coil encapsulation step 42 is a coating, which is an insulating material selected from plastics, epoxy resins, or other moldable polymer materials. In this embodiment, a single coil is first encapsulated and then glued onto the PCB board. The gluing method can be surface mount technology (SMT), which allows for automated processing and significantly improves product assembly efficiency.

[0040] In summary, this invention encapsulates or coats the coil with exposed leads to form a surface-mount-like encapsulation or coating structure. The motor coil can then be assembled using surface mount technology (SMT), significantly improving assembly efficiency. This process is comparable to that of PCB motors, increases inductance, and simplifies manufacturing, thus effectively reducing production costs. Furthermore, the placement of electronic components is unrestricted, eliminating the dead zone problem inherent in single-phase motors. Therefore, the three-phase radial coil motor developed in this invention, along with the improved coil manufacturing process, possesses all of these advantages.

[0041] The present invention has been described in detail above. However, the above description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made based on the present invention should still fall within the patent coverage of the present invention.

Claims

1. A coil packaging module, characterized in that, Include: A coil having a winding portion having at least two lead-out terminals; and A package is provided to enclose the coil to form a coil housing, and at least two lead-out terminals are exposed outside the package to form reserved electrical contacts for electrical connection with a circuit board.

2. The coil packaging module as described in claim 1, characterized in that: The encapsulation is a package of colloid.

3. The coil packaging module as described in claim 2, characterized in that: The encapsulated material is an insulating material selected from plastics or epoxy resins.

4. The coil packaging module as described in claim 1, characterized in that: At least two of the output terminals are surface-mount pins to facilitate soldering to the circuit board using surface-mount technology.

5. The coil packaging module as described in claim 1, characterized in that: The winding part has a flat spiral structure.

6. The coil packaging module as described in claim 1, characterized in that: The coil housing includes a top wall, a bottom wall, and a side wall. The top wall and the bottom wall are arranged vertically opposite each other. The side wall connects the top wall and the bottom wall. The at least two lead-out ends extend and protrude from the bottom wall or the side wall.

7. The coil packaging module as described in claim 1, characterized in that: The coil housing includes a top wall, a bottom wall and a side wall. The top wall and the bottom wall are arranged vertically opposite each other. The side wall connects the top wall and the bottom wall. The at least two lead-out terminals are located on the bottom wall.

8. The coil packaging module as described in claim 1, characterized in that: The coil housing includes a top wall, a bottom wall, and a side wall. The top wall and the bottom wall are arranged vertically opposite each other. The side wall connects the top wall and the bottom wall. The side wall includes two opposing side surfaces, which are respectively arranged corresponding to the at least two lead-out ends. The outline of each side surface is the same as the end outline of each lead-out end.

9. A circuit board structure with a coil packaging module, characterized in that, Include: A circuit board; and At least one coil packaging module is disposed on the circuit board, and the coil packaging module further includes: A coil having a winding portion having at least two lead-out terminals; and A package encapsulates the coil to form a coil housing, and the at least two lead terminals are exposed outside the package and electrically connected to the circuit board.

10. The circuit board structure as described in claim 9, characterized in that: The encapsulation is a gel, which is an insulating material selected from plastics or epoxy resins.

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