heat dissipating device
By designing separate capillary structures and support columns in the heat dissipation device, the problem of poor cooling fluid flow efficiency is solved, resulting in more efficient heat dissipation and improved mechanical strength.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DELTA ELECTRONICS INC(CN)
- Filing Date
- 2025-05-29
- Publication Date
- 2026-05-29
AI Technical Summary
The poor flow efficiency of cooling fluid in existing heat dissipation devices leads to a decrease in heat dissipation effect, especially due to the unexpected flow diversion problem caused by capillary structure.
By setting up an upper plate, a lower plate, and heat pipes in the heat dissipation device, and designing separate capillary structures on their surfaces and inner walls, and setting support columns between the upper and lower plates, a accommodating space is formed to guide the flow of cooling fluid and avoid unexpected flow of cooling fluid between different capillary structures.
It improves the flow efficiency of the cooling fluid, ensures that the main and secondary circulations do not interfere with each other, enhances heat dissipation efficiency, and strengthens the mechanical strength and fluid circulation stability of the heat dissipation device.
Smart Images
Figure CN224306142U_ABST
Abstract
Description
Technical Field
[0001] This application relates to heat dissipation devices, and more particularly to a heat dissipation device having a capillary structure. Background Technology
[0002] As the power of electronic devices increases, the heat generated during operation also rises significantly. To effectively dissipate heat, heat dissipation devices are installed on these devices, using cooling fluid within the devices to transfer heat to the outside. However, when the flow efficiency of the cooling fluid is poor (e.g., unintended flow diversion occurs), the heat dissipation effect of the device is affected. Therefore, while existing heat dissipation devices have gradually met their intended uses, they are not perfect in every aspect. How to achieve excellent flow efficiency for the cooling fluid within these devices has become a pressing issue. Utility Model Content
[0003] According to some embodiments, a heat dissipation device is provided, including a lower plate, an upper plate, a heat pipe, and a cooling fluid. The lower plate has a first surface and a first capillary structure located on the first surface. The upper plate is disposed on the lower plate and has a second surface and a second capillary structure located on the second surface, wherein the second surface and the first surface are opposite to each other. The heat pipe is disposed on the upper plate and has an inner wall and a third capillary structure located on the inner wall, wherein the second capillary structure and the third capillary structure are spaced apart, and the lower plate, the upper plate, and the heat pipe together form a receiving space. The cooling fluid is disposed in the receiving space.
[0004] In one embodiment, a support column is further included, wherein the support column is disposed between the lower plate and the upper plate and contacts the first capillary structure and the second capillary structure.
[0005] In one embodiment, the projection of the support column onto the lower plate does not overlap with the projection of the heat pipe onto the lower plate.
[0006] In one embodiment, the support post contacts the heat pipe.
[0007] In one embodiment, the support column includes a porous structure.
[0008] In one embodiment, the support column further includes a solid column, and the porous structure surrounds the solid column.
[0009] In one embodiment, the third capillary structure has a groove portion and a roughened portion, and the roughened portion is located between the groove portion and the upper plate.
[0010] In one embodiment, in a vertical direction, the height of the third capillary structure is lower than or equal to the height of the second surface.
[0011] In one embodiment, the upper plate has a main plate and an extension that extends from the main plate and contacts an outer wall of the heat pipe.
[0012] In one embodiment, the heat pipe has a main pipe and a bend that extends from the main pipe and contacts the second surface of the upper plate.
[0013] In one embodiment, the distance is between 1 mm and 9 mm.
[0014] The heat dissipation device of this application can be applied to various electronic devices. To make the features and advantages of this application more apparent and understandable, various embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0015] The following detailed description, accompanied by accompanying drawings, will provide a better understanding of the embodiments of this application. It is worth noting that, according to industry standard practice, some features may not be drawn to scale. In fact, for clarity of description, the dimensions of different features may be increased or decreased.
[0016] Figure 1 This is a schematic diagram of a heat dissipation device according to some embodiments of this application.
[0017] Figure 2 yes Figure 1 Enlarged cross-sectional view of region A in the image.
[0018] Figure 3 This is a schematic diagram showing a fluid path according to some embodiments of this application.
[0019] Figure 4 yes Figure 1 Another enlarged cross-sectional view of region A in the image.
[0020] Figure 5 yes Figure 1 Another enlarged cross-sectional view of region A in the image.
[0021] Figure 6 yes Figure 1 Another enlarged cross-sectional view of region A in the image.
[0022] Figure 7 yes Figure 1 Another enlarged cross-sectional view of region A in the image.
[0023] Figure 8 yes Figure 1 Another enlarged cross-sectional view of region A in the image.
[0024] Figure 9 yes Figure 1 Another enlarged cross-sectional view of region A in the image.
[0025] Explanation of reference numerals in the attached figures
[0026] 1: Heat dissipation device
[0027] 10: Lower board,
[0028] 10A: First surface,
[0029] 10B: First capillary structure,
[0030] 20: On the board,
[0031] 200: Motherboard,
[0032] 201: Extension Section
[0033] 20A: Second surface
[0034] 20B: Second capillary structure,
[0035] 30: Heat pipes
[0036] 300: Supervisor,
[0037] 301: Bending section
[0038] 30A: Inner wall,
[0039] 30B: Third capillary structure,
[0040] 30B1: Groove section,
[0041] 30B2: Roughened section,
[0042] 30C: Outer wall,
[0043] 40: Cooling fluid
[0044] 50: Support column
[0045] 500: Porous structure,
[0046] 501: Solid column
[0047] A: Region
[0048] AR1~AR5: Arrows,
[0049] AS: Storage space
[0050] D: Distance. Detailed Implementation
[0051] The following provides many different embodiments or examples for implementing the provided apparatus. Specific examples of the components and their configurations are described below to simplify the embodiments of this application, and are not intended to limit this application. For example, if the description mentions that a first component is formed on a second component, it may include embodiments where the first and second components are in direct contact, or embodiments where an additional component is formed between the first and second components, so that the first and second components are not in direct contact. Furthermore, component symbols and / or characters may be repeated in different embodiments or examples in this application. Such repetition is for brevity and clarity, and is not intended to indicate a relationship between the different embodiments and / or examples discussed.
[0052] In some embodiments of this application, terms such as "setup," "connection," and similar terms, unless specifically defined, may refer to two components in direct contact, or to two components not in direct contact, with an additional connecting component located between the two structures. Terms such as "setup" and "connection" may also include cases where both structures are movable or both structures are fixed.
[0053] In addition, the terms "first," "second," and similar terms mentioned in this specification or the claims are used to name different components or to distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of components, nor to limit the manufacturing order or the order of installation of components.
[0054] In this text, the terms "approximately," "about," and "substantially" generally indicate that a given value or range is within 10%, 5%, 3%, 2%, 1%, or 0.5%. The given quantities are approximate, meaning that the terms "approximately," "about," or "substantially" are implied even without specific mention. The phrase "the range is between the first and second values" indicates that the range includes the first value, the second value, and other values in between. Furthermore, any two values or directions used for comparison may have a certain degree of error. If the first value equals the second value, it implies an error of approximately 10%, 5%, 3%, 2%, 1%, or 0.5% between them. If the first direction is perpendicular to the second direction, the angle between the first and second directions may be between 80 and 100 degrees. If the first direction is parallel to the second direction, then the angle between the first direction and the second direction can be between 0 degrees and 10 degrees.
[0055] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art. It is understood that such terms, as defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the background or context of this application, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in the embodiments of this application.
[0056] It should be understood that, for clarity, some components of the apparatus are omitted in the drawings, and only some components are schematically shown. In some embodiments, additional components may be added to the apparatus described below. In other embodiments, some components of the apparatus described below may be replaced or omitted. It should be understood that, in some embodiments, additional operating steps may be provided before, during, and / or after the method of manufacturing the apparatus. In some embodiments, some operating steps may be replaced or omitted, and the order of some operating steps is interchangeable.
[0057] Taking a heat dissipation device with heat pipes as an example, it typically includes a heat sink, heat pipes, and cooling fluid. Specifically, the heat sink is attached to the electronic device (e.g., a server) to which heat is to be dissipated, the heat pipes are disposed on the heat sink and communicate with the cooling fluid inside the heat sink, and the cooling fluid is disposed within both. When the cooling fluid in the heat sink absorbs the heat generated by the electronic device, the cooling fluid vaporizes and flows upward along the center of the heat pipe. Then, when the cooling fluid reaches the top of the heat pipe, the cooling fluid liquefies and flows back into the heat sink along the inner wall of the heat pipe (e.g., see reference...). Figure 3 (The path shown). In this way, a specific loop path is formed.
[0058] To ensure the directional return of cooling fluid to the heat sink, capillary structures are typically incorporated into the inner walls of heat pipes and heat sinks to control the flow direction of the cooling fluid through capillary action. However, existing capillary structures can cause unintended diversion of the cooling fluid, leading to a decrease in heat dissipation efficiency. Therefore, this application provides a heat dissipation device that addresses at least some of the aforementioned problems by adjusting the specific configuration of the capillary structures.
[0059] Reference Figure 1 and Figure 2 . Figure 1 This is a schematic diagram of a heat dissipation device according to some embodiments of this application. Figure 2 yes Figure 1The figure shows an enlarged cross-sectional view of region A. As shown, the heat dissipation device 1 includes a lower plate 10, an upper plate 20, heat pipes 30, and cooling fluid 40. In some embodiments, the number of heat pipes 30 can be multiple, and they can be arranged in a matrix on the upper plate 20. To make this application clearer and easier to understand, the following is a detailed description of each component and its possible configurations.
[0060] like Figure 2 As shown, the lower plate 10 is used to attach a device for heat dissipation, such as a server. Specifically, the lower plate 10 has a first surface 10A and a first capillary structure 10B located on the first surface 10A. The first capillary structure 10B is used to guide the flow direction of the cooling fluid 40 in a liquid state. In some embodiments, the first capillary structure 10B may include mesh structures, grooves structures, porous structures, micropillar structures, stacked structures, honeycomb structures, other suitable capillary structures, or combinations thereof, but this application is not limited thereto. In some embodiments, the first capillary structure 10B can be formed on the lower plate 10 by methods such as powder sintering, chemical etching, physical etching, 3D printing, other suitable methods, or combinations thereof, but this application is not limited thereto. In some embodiments, the first capillary structure 10B directs the cooling fluid 40 to the location of the heat pipe 30 (e.g., Figure 2 (at the center), but this application is not limited thereto.
[0061] like Figure 2 As shown, an upper plate 20 is disposed on a lower plate 10 and is used to form a heat sink together with the lower plate 10. Specifically, the upper plate 20 has a second surface 20A and a second capillary structure 20B located on the second surface 20A, wherein the second surface 20A is opposite to the first surface 10A. In other words, the first surface 10A and the second surface 20A are the inner surfaces (or inner walls) of the heat sink. Similar to the first capillary structure 10B, the second capillary structure 20B is used to guide the flow direction of the cooling fluid 40 in liquid state. For example, the second capillary structure 20B may include a mesh structure, a channel structure, a porous structure, a micropillar structure, a stack, a honeycomb structure, other suitable capillary structures or combinations thereof, but this application is not limited thereto. In some embodiments, the second capillary structure 20B may be formed on the upper plate 20 by methods such as powder sintering, chemical etching, physical etching, 3D printing, other suitable methods or combinations thereof, but this application is not limited thereto. In some embodiments, the second capillary structure 20B directs the cooling fluid 40 to the location of the heat pipe 30 (e.g., Figure 2(at the center), but this application is not limited thereto.
[0062] In some embodiments, the upper plate 20 and the lower plate 10 may be combined by adhesive, fitting, snapping, magnetic attraction, other suitable methods or combinations thereof, but this application is not limited thereto. In some embodiments, the upper plate 20 and the lower plate 10 are detachably connected to facilitate subsequent maintenance or replacement of components, but this application is not limited thereto. In other embodiments, the upper plate 20 and the lower plate 10 may also be fixedly connected to maintain a high degree of sealing between them. In some embodiments, the material of the upper plate 20 may be the same as the material of the lower plate 10, but this application is not limited thereto. In some embodiments, the second capillary structure 20B of the upper plate 20 and the first capillary structure 10B of the lower plate 10 may be different types of capillary structures to control the flow rate of the cooling fluid 40 in the upper plate 20 and the lower plate 10.
[0063] like Figure 2 As shown, a heat pipe 30 is disposed on an upper plate 20 and has an inner wall 30A and a third capillary structure 30B located on the inner wall 30A. Similar to the first capillary structure 10B or the second capillary structure 20B, the third capillary structure 30B is used to guide the flow direction of the cooling fluid 40 in a liquid state. Specifically, the third capillary structure 30B directs the cooling fluid 40 from one end of the heat pipe 30 away from the upper plate 20 to one end adjacent to the upper plate 20. In some embodiments, the third capillary structure 30B may include a mesh structure, a channel structure, a porous structure, a micropillar structure, a stack, a honeycomb structure, other suitable capillary structures, or combinations thereof, but this application is not limited thereto. In some embodiments, the third capillary structure 30B may be formed on the heat pipe 30 by methods such as powder sintering, chemical etching, physical etching, 3D printing, other suitable methods, or combinations thereof, but this application is not limited thereto. In some embodiments, the third capillary structure 30B of the heat pipe 30 and the first capillary structure 10B of the lower plate 10 or the second capillary structure 20B of the upper plate 20 may be different types of capillary structures to control the flow rate of the cooling fluid 40 in the lower plate 10, the upper plate 20 and the heat pipe 30 respectively.
[0064] It is worth mentioning that in the heat dissipation device 1 of this application, the second capillary structure 20B of the upper plate 20 needs to be separated from the third capillary structure 30B of the heat pipe 30 by a distance D. In this way, the cooling fluid 40, when moving downward along the third capillary structure 30B, is prevented from dripping directly onto the lower plate 10, but instead is absorbed by the second capillary structure 20B of the upper plate 20. The detailed circulation process can be found below.
[0065] In some embodiments, the heat pipe 30 contacts the upper plate 20 but not the lower plate 10. Specifically, the upper plate 20 has a main plate 200 and an extension 201, which extends from the main plate 200 and bends along the normal direction of the main plate 200 to contact the outer wall 30C of the heat pipe 30. In some embodiments, in a top view, the extension 201 forms an opening around the heat pipe 30, which is then embedded in the opening. On the other hand, the heat pipe 30 has a main pipe 300 and a bend 301, which extends from the main pipe 300 and bends along the extension direction of the upper plate 20 to contact the second surface 20A of the upper plate 20. In other words, in this application, the heat pipe 30 is fixed to the upper plate 20 of the heat sink but does not extend to the lower plate 10 of the heat sink. In some embodiments, a third capillary structure 30B extends from the main pipe 300 of the heat pipe 30 to a portion of the bend 301. In this configuration, the height of the third capillary structure 30B in the vertical direction can be slightly lower than or approximately equal to the height of the second surface 20A. This increases the overall area of the third capillary structure 30B, thereby increasing the range of flow that can be conducted.
[0066] In some embodiments, the upper plate 20 and the heat pipe 30 may be combined by adhesive, fitting, snapping, magnetic attraction, other suitable methods, or combinations thereof, but this application is not limited thereto. In some embodiments, the upper plate 20 and the heat pipe 30 are detachably connected to facilitate subsequent maintenance or replacement of components, but this application is not limited thereto. In other embodiments, the upper plate 20 and the heat pipe 30 may also be fixedly connected to maintain a high degree of sealing between them.
[0067] like Figure 2 As shown, the lower plate 10, upper plate 20, and heat pipe 30 together form a receiving space AS, and cooling fluid 40 is disposed in the receiving space AS. The cooling fluid 40 can flow within this receiving space AS to transfer heat energy from the lower plate 10 to the top of the heat pipe 30 (i.e., the end away from the lower plate 10). In some embodiments, the cooling fluid 40 may have a low saturated vapor pressure or a low boiling point to facilitate conversion between liquid and gaseous states. For example, the cooling fluid 40 may include water, ethanol, fluorocarbon liquids, water-ethylene glycol mixtures, organic liquids, other suitable coolants, or combinations thereof, but this application is not limited to these.
[0068] Refer to together Figure 3This is a schematic diagram illustrating the fluid path according to some embodiments of this application. It is worth noting that the fluid path and circulation process described in the figures and below are merely for clarity and understanding of this application and are not intended to limit the scope of this application. Specifically, the circulation process of the cooling fluid 40 may include the following steps: at the position of the lower plate 10, the liquid cooling fluid 40 absorbs heat energy from the lower plate 10 and transforms into a gaseous state; the gaseous cooling fluid 40 rises upward along the accommodating space AS in the heat pipe 30 (e.g., in the direction indicated by arrow AR1); at the top position of the heat pipe 30, the gaseous cooling fluid 40 releases heat energy to the outside and transforms into a liquid state; the liquid cooling fluid 40 flows downward along the third capillary structure 30B in the heat pipe 30 (e.g., in the direction indicated by arrow AR2); and at the tail end of the third capillary structure 30B, the liquid cooling fluid 40 drips onto the lower plate 10, completing one cycle. In some embodiments, the above-described cycle may be referred to as the main cycle. For example, approximately 90% or more of the heat is transferred to the outside via the above-described pathway. Alternatively, approximately 90% of the cooling fluid 40 is circulated via the aforementioned pathway.
[0069] In addition, the circulation process of the cooling fluid 40 may further include the following steps: at the position of the lower plate 10, the liquid cooling fluid 40 absorbs the heat energy of the lower plate 10 and turns into a gaseous state; the gaseous cooling fluid 40 rises upward along the accommodating space AS between the lower plate 10 and the upper plate 20 (e.g., in the direction indicated by arrow AR3); at the position of the upper plate 20, the gaseous cooling fluid 40 releases heat energy to the outside and turns into a liquid state; the liquid cooling fluid 40 drips back onto the lower plate 10 (e.g., in the direction indicated by arrow AR4), completing one cycle. In some embodiments, the above-described cycle may be referred to as a secondary cycle. For example, approximately 5% or more of the heat is transferred to the outside via the above-described pathway. Alternatively, approximately 5% of the cooling fluid 40 circulates via the above-described pathway.
[0070] As described above, a distance D between the second capillary structure 20B and the third capillary structure 30B is necessary to prevent the two cycles from interfering with each other. When the distance D between the second capillary structure 20B and the third capillary structure 30B is too small or nonexistent, the cooling fluid 40 flowing downwards from the third capillary structure 30B may flow unintended towards the second capillary structure 20B (e.g., in the direction indicated by arrow AR5). This may lead to a decrease in the efficiency of the main cycle, thus hindering heat dissipation efficiency. Conversely, when the distance D between the second capillary structure 20B and the third capillary structure 30B is too large, the total area of the capillary structures available for guiding flow may decrease, thus hindering the flow of the cooling fluid 40. In some embodiments, the distance D may be between 1 mm and 9 mm, but this application is not limited to this. For example, the distance D may be 1 mm, 3 mm, 5 mm, 7 mm, 9 mm, or any value or range between the above values.
[0071] Reference Figure 4 , it is Figure 1 Another enlarged cross-sectional view of region A in the figure. As shown in the figure, with Figure 2 The difference between the embodiments is that, Figure 4 The heat dissipation device 1 of the embodiment further includes a support column 50. Specifically, the support column 50 is disposed between the lower plate 10 and the upper plate 20, and contacts the first capillary structure 10B and the second capillary structure 20B. The support column 50 can be used to improve the mechanical strength of the heat dissipation plate and to guide the cooling fluid 40 of the upper plate 20 to the lower plate 10. For example, the material of the support column 50 may include porous materials, such as porous ceramic materials, porous metal powder materials, activated carbon, other suitable materials, or combinations thereof, but this application is not limited thereto. With the support column 50 provided, the cooling fluid 40 of the upper plate 20 can flow sequentially through the second capillary structure 20B, the support column 50, and the first capillary structure 10B back to the center of the lower plate 10 (i.e., the position corresponding to the heat pipe 30), so that more cooling fluid 40 can participate in the main circulation (i.e., the circulation between the lower plate 10 and the heat pipe 30). Of course, this application is not limited thereto. In some cases, the support column 50 can also enhance the circulation efficiency of the secondary circulation (i.e., the circulation between the upper plate 20 and the heat pipe 30).
[0072] In some embodiments, the projection of the support column 50 onto the lower plate 10 does not overlap with, or at least partially overlaps with, the projection of the heat pipe 30 onto the lower plate 10. In other words, the support column 50 is not located directly below the heat pipe 30 or is only located diagonally below the heat pipe 30. In this way, there is more space directly below the heat pipe 30 for the cooling fluid 40 to vaporize or drip.
[0073] Reference Figure 5 , it is Figure 1Another enlarged cross-sectional view of region A in the figure. As shown in the figure, with Figure 4 The difference between the embodiments is that, Figure 5 The support column 50 of the embodiment includes a porous structure 500 and a solid column 501, with the porous structure 500 surrounding the solid column 501. The solid column 501 can be used to further improve the mechanical strength of the heat sink, while the porous structure 500 can be used to further guide the cooling fluid 40 of the upper plate 20 to the lower plate 10. For example, the porous structure 500 may include the porous material described above, while the solid column 501 may include a metallic material, a ceramic material, other suitable materials, or combinations thereof, but this application is not limited thereto. In some embodiments, the solid column 501 may extend to directly contact the upper plate 20 and the lower plate 10, but this application is not limited thereto. In some embodiments, the solid column 501 may directly contact either the upper plate 20 or the lower plate 10 without contacting the other.
[0074] Reference Figure 6 , it is Figure 1 Another enlarged cross-sectional view of region A in the figure. As shown in the figure, with Figure 5 The difference between the embodiments is that, Figure 6 The third capillary structure 30B of the embodiment has a groove portion 30B1 and a roughened portion 30B2, with the roughened portion 30B2 located between the groove portion 30B1 and the upper plate 20. Specifically, the groove portion 30B1 includes a plurality of elongated grooves, resulting in a higher flow velocity of the cooling fluid 40 at this location. For example, the liquid cooling fluid 40 may converge into droplets at the location of the groove portion 30B1 and move rapidly toward the upper plate 20. On the other hand, the roughened portion 30B2 includes mesh-like grooves or circular protrusions, resulting in a lower flow velocity of the cooling fluid 40 at this location. For example, the liquid cooling fluid 40 may form a thin film at the location of the roughened portion 30B2 and move slowly toward the upper plate 20. With the above configuration, the liquid cooling fluid 40 will not form a large droplet shape near the upper plate 20, thereby hindering the movement of the gaseous cooling fluid 40.
[0075] In some embodiments, the roughened portion 30B2, having a mesh structure or circular protrusions, can be selected as needed. For example, when a lower flow rate of the cooling fluid 40 is required, a roughened portion 30B2 with mesh grooves can be selected. Conversely, when a lower flow rate of the cooling fluid 40 is required, a roughened portion 30B2 with circular protrusions can be selected. However, this application is not limited to this. In other embodiments, the roughened portion 30B2 can also include both elongated grooves and mesh grooves (or circular protrusions) to further control the flow rate of the cooling fluid 40 at this location.
[0076] Reference Figures 7 to 9 , it is Figure 1Further enlarged cross-sectional views of region A are shown. As illustrated, the support column 50 of this application can be installed at different locations as needed. Figure 7 For example, the support column 50 simultaneously contacts the heat pipe 30 and the upper plate 20. Figure 8 For example, the support column 50 contacts the heat pipe 30. Figure 9 For example, one support column 50 contacts the heat pipe 30, while the other support column 50 contacts the upper plate 20. In other words, in this application, the specific number and position of the support columns 50 can be adjusted according to needs, and are not limited to the specific methods described above.
[0077] In summary, this application provides a heat dissipation device. Specifically, the second capillary structure of the upper plate of the heat dissipation device is separated from the third capillary structure of the heat pipe by a distance. In this way, the main circulation and secondary circulation of the cooling fluid do not interfere with each other, thereby effectively solving some problems of the prior art. In addition, this application further enhances the circulation efficiency of the main circulation and / or secondary circulation by providing support columns.
[0078] Several embodiments have been summarized above to enable those skilled in the art to better understand the viewpoints of the embodiments of this application. Those skilled in the art should understand that other processes and structures can be designed or modified based on the embodiments of this application to achieve the same purpose and / or advantages as the embodiments described herein. Those skilled in the art should also understand that such equivalent processes and structures do not depart from the spirit and scope of this application, and that various changes, substitutions, and replacements can be made without departing from the spirit and scope of this application.
Claims
1. A heat dissipation device, characterized in that, include: A plate having a first surface and a first capillary structure located on the first surface; An upper plate is disposed on the lower plate and has a second surface and a second capillary structure located on the second surface, wherein the second surface and the first surface are opposite to each other; A heat pipe is disposed on the upper plate and has an inner wall and a third capillary structure located on the inner wall, wherein the second capillary structure and the third capillary structure are separated by a distance, and the lower plate, the upper plate, and the heat pipe together form an accommodating space; and A cooling fluid is provided in the accommodating space.
2. The heat dissipation device according to claim 1, characterized in that, It also includes a support column, which is disposed between the lower plate and the upper plate and contacts the first capillary structure and the second capillary structure.
3. The heat dissipation device according to claim 2, characterized in that, The projection of the support column onto the lower plate does not overlap with the projection of the heat pipe onto the lower plate.
4. The heat dissipation device according to claim 2, characterized in that, The support column contacts the heat pipe.
5. The heat dissipation device according to claim 2, characterized in that, The support column includes a porous structure.
6. The heat dissipation device according to claim 5, characterized in that, The support column also includes a solid column, and the porous structure surrounds the solid column.
7. The heat dissipation device according to claim 2, characterized in that, The third capillary structure has a groove portion and a roughened portion, with the roughened portion located between the groove portion and the upper plate.
8. The heat dissipation device according to claim 1, characterized in that, In a vertical direction, the height of the third capillary structure is lower than or equal to the height of the second surface.
9. The heat dissipation device according to claim 1, characterized in that, The upper plate has a main plate and an extension that extends from the main plate and contacts an outer wall of the heat pipe.
10. The heat dissipation device according to claim 1, characterized in that, The heat pipe has a main pipe and a bend that extends from the main pipe and contacts the second surface of the upper plate.
11. The heat dissipation device according to claim 1, characterized in that, This distance is between 1mm and 9mm.