Wafer hot air blowing type heating device
The wafer hot air heating device solves the problem of wafer film bulging and retraction through a heating rotation mechanism and angle limiting components, achieving efficient heating and precise angle control, adapting to wafers of different sizes, improving product quality and reducing usage costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU DELPHI LASER
- Filing Date
- 2025-05-06
- Publication Date
- 2026-05-29
AI Technical Summary
After wafer expansion, the film protrusions need to retract to a fixed position to prevent grain movement. Existing heating devices have difficulty effectively controlling the heating temperature and rotation angle, leading to quality problems.
The wafer hot air heating device includes a heating rotation mechanism, a heating substrate, a hot air gun, and an angle limiting component. The hot air gun provides a heating temperature of 200-300 degrees Celsius, and the rotation mechanism and indexing pins adapt to 8/12-inch wafers. The angle limiting component prevents excessive angles and achieves precise heating.
It achieves efficient heating, adapts to different wafer sizes, reduces costs, improves product quality, prevents excessive angle rotation, and ensures the accuracy and stability of the heating process.
Smart Images
Figure CN224306243U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a wafer hot air heating device. Background Technology
[0002] With the development of the semiconductor industry, especially the miniaturization of die size and the trend towards high integration and miniaturization in semiconductor packaging, many high-requirement packaging processes have begun to use stealth dicing. This involves completely separating the wafer or chip with the film attached along predetermined lines to obtain individual units. To avoid quality issues such as burrs during dicing and to ensure the required spacing between the dies in the wafer, the film will bulge to a certain height after wafer expansion. Heating is then used to retract the bulging film, fixing the separated dies in their required positions and preventing them from shifting due to film retraction after unloading. To solve these problems, a heating device is needed after wafer expansion. Utility Model Content
[0003] To solve the above-mentioned technical problems, the purpose of this utility model is to provide a wafer hot air heating device.
[0004] To achieve the above objectives, the present invention adopts the following technical solution:
[0005] A wafer hot air heating device includes a heating rotation mechanism, on which a base connecting plate is connected. A left heating rotation connecting plate and a right heating rotation connecting plate are connected to the left and right sides of the base connecting plate, respectively. A first heating mechanism and a second heating mechanism with the same structure are connected to the left heating rotation connecting plate and the right heating rotation connecting plate, respectively.
[0006] The first heating mechanism includes a heating base plate, a heat-expanding upright plate connected to one side of the heating base plate, a guide rail support plate connected to the inner side of the heat-expanding upright plate, a guide rail connected to the guide rail support plate, a slider connected to the guide rail, a movable heating component connected to the slider, a heating window opposite to the heating component opened on the bottom surface of the heating base plate, an upright plate connected to the other side of the heating base plate, a heating cylinder connected to the inner side of the upright plate, a drive shaft of the heating cylinder connected to a heating push plate, a rotating connecting plate rotatably connected to the heating base plate by shoulder screws, one side of the rotating connecting plate being connected to a heating baffle for opening and / or closing the heating window, and the other end of the rotating connecting plate being connected to the heating push plate.
[0007] Preferably, in the wafer hot air heating device, a heating cover is attached to the heating substrate, and each side of the heating cover has evenly arranged ventilation holes.
[0008] Preferably, in the wafer hot air heating device, a limiting groove for limiting the movement of the heating baffle is formed on the bottom surface of the heating substrate, and the heating window is located in the limiting groove.
[0009] Preferably, in the wafer hot air heating device, the heating window has two heating windows, one of which is an 8-inch heating window and the other is a 12-inch heating window.
[0010] Preferably, in the wafer hot air heating device, the heating assembly includes a heating movable plate, which is L-shaped and connected to a slider on one side. A square heat insulation plate is connected to the other side of the L-shaped heating movable plate. A hot air gun is connected inside the square heat insulation plate. A temperature sensor is connected to the upper end of the hot air gun via an adapter. The heating end of the hot air gun is opposite to the heating window. A heat sink is connected to the outside of the heat insulation plate. A dividing pin fixing plate is connected to the heating movable plate, and a dividing pin is connected to the dividing pin fixing plate. A movable window is provided on the hot air expansion plate, and a fixing positioning piece connected and fixed to the dividing pin is connected to the movable window.
[0011] Preferably, in the wafer hot air heating device, a sensor support plate is connected to the heat expansion plate, and two position sensors are connected to the sensor support plate for sensing the position of the heating moving plate. One position sensor is coaxial with the 8-inch heating window, and the other position sensor is coaxial with the 12-inch heating window.
[0012] Preferably, in the wafer hot air heating device, there are two fixing and positioning plates, one of which is coaxial with the 8-inch heating window, and the other is coaxial with the 12-inch heating window.
[0013] Preferably, in the wafer hot air heating device, the heating rotation mechanism includes a rotating support plate. A bearing mounting seat is connected to one side of the rotating support plate. A bearing is connected inside the bearing mounting seat. A fixed rotating shaft passes through the bearing. The lower end of the fixed rotating shaft is connected to the rotating substrate via a shaft clip. A first synchronous pulley is connected to the upper end of the fixed rotating shaft. A motor mounting bracket is connected to the other side of the bearing mounting seat. A reducer is connected to the motor mounting bracket. The reducer is connected to the motor. The rotating shaft of the reducer passes through the motor mounting bracket and is connected to a second synchronous pulley. A synchronous belt connects the second synchronous pulley and the first synchronous pulley. An angle limiting component is connected to the bearing mounting seat.
[0014] Preferably, in the wafer hot air heating device, the angle limiting component includes a first sensor fixing bracket and a second sensor fixing bracket. The first sensor fixing bracket and the second sensor fixing bracket are connected to a bearing fixing seat at intervals and opposite to each other. A sensor is connected to both the first sensor fixing bracket and the second sensor fixing bracket. A fixing screw is connected to the bearing fixing seat located between the first sensor fixing bracket and the second sensor fixing bracket. A sensor plate fixing plate is rotatably connected to the fixing screw. A sensor plate that cooperates with the sensor is connected to the sensor fixing plate. A limiting block for rotating the sensor plate fixing plate is connected to the rotating base plate.
[0015] Preferably, in the wafer hot air heating device, a reset torsion spring for resetting the induction plate fixing plate is connected to the fixing screw.
[0016] By means of the above solution, this utility model has at least the following advantages:
[0017] 1. This utility model can provide a suitable heating temperature, reaching 200-300 degrees Celsius. The airflow is blown down through the hot air gun, the heating area is large, the rotating mechanism can rotate quickly, and the heat shrinking efficiency is high.
[0018] 2. This utility model can be compatible with 8 / 12-inch wafers by adjusting the indexing pin, which has strong applicability and can effectively reduce the cost of use.
[0019] 3. This utility model uses an angle limiting component to monitor the angle, which can prevent excessive angle rotation during the heating process and improve product quality.
[0020] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description
[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of the structure of this utility model;
[0023] Figure 2 This is a schematic diagram of the internal structure of the first heating mechanism of this utility model;
[0024] Figure 3 yes Figure 2 Another structural diagram from another perspective;
[0025] Figure 4 yes Figure 2 A structural diagram from another perspective;
[0026] Figure 5 This is a schematic diagram of the heating and rotating mechanism of this utility model. Detailed Implementation
[0027] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0028] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0029] like Figures 1 to 5 As shown, a wafer hot air heating device includes a heating rotation mechanism 2, a base connecting plate 3 connected to the heating rotation mechanism 2, a left heating rotation connecting plate 4 and a right heating rotation connecting plate 5 connected to the left and right sides of the base connecting plate 3, and a first heating mechanism 1 and a second heating mechanism 6 with the same structure connected to the left heating rotation connecting plate 4 and the right heating rotation connecting plate 5, respectively.
[0030] The structure for product heating in this utility model is as follows, which enables rapid heating of the product:
[0031] The first heating mechanism 1 includes a heating base plate 101. A heat expansion plate 102 is connected to one side of the heating base plate 101. A guide rail support plate 103 is connected to the inner side of the heat expansion plate 102. A guide rail 104 is connected to the guide rail support plate 103. A slider 105 is connected to the guide rail 104. A movable heating component 106 is connected to the slider 105. A heating window 107 opposite to the heating component 106 is opened on the bottom surface of the heating base plate 101. A vertical plate 108 is connected to the other side of the heating base plate 101. A heating cylinder 109 is connected to the inner side of the vertical plate 108. The drive shaft of the heating cylinder 109 is connected to a heating push plate 110. A rotating connecting plate 111 is rotatably connected to the heating base plate 101 by a shoulder screw. One side of the rotating connecting plate 111 is connected to a heating baffle 112 for opening and / or closing the heating window. The other end of the rotating connecting plate 111 is connected to the heating push plate 110.
[0032] The heating assembly 106 includes a heating movable plate 10601, which is L-shaped and connected to a slider on one side. A square heat insulation plate 10602 is connected to the other side of the L-shaped heating movable plate 10601. A hot air gun 10603 is connected inside the square heat insulation plate 10602. A temperature sensor 10604 is connected to the upper end of the hot air gun 10603 via an adapter 10607. The heating end of the hot air gun 10603 is opposite to the heating window. A heat sink 10605 is connected to the outside of the heat insulation plate 10602. A dividing pin fixing plate 10606 is connected to the heating moving plate 10601. A dividing pin 10608 is connected to the dividing pin fixing plate 10606. A moving window 10609 is opened on the heat expansion plate 102. A fixing positioning piece 10610 connected and fixed to the dividing pin 10608 is connected to the moving window 10609.
[0033] Furthermore, a heating cover 113 is attached to the heating substrate 101. Each side of the heating cover 113 has evenly arranged ventilation holes, which can realize temperature control of the hot air gun so that it can provide a suitable heating temperature, reaching 200-300 degrees.
[0034] Furthermore, a limiting groove for limiting the movement of the heating baffle is provided on the bottom surface of the heating substrate 101, and the heating window 107 is located in the limiting groove, so that the heating baffle can move stably within the specified limiting groove when it is in motion.
[0035] Furthermore, the heating window 107 has two heating windows, one of which is 8 inches and the other is 12 inches. This allows for the processing of different sizes, thereby reducing operating costs.
[0036] To ensure the moving heating plate can stably and accurately move the heating gun to the corresponding size, the specific positioning structure is as follows:
[0037] Firstly
[0038] A sensor support plate 114 is connected to the heat expansion plate 102. Two position sensors 115 are connected to the sensor support plate 114 for sensing the position of the heating moving plate 10601. One position sensor 115 is on the same axis as the 8-inch heating window, and the other position sensor 115 is on the same axis as the 12-inch heating window.
[0039] Secondly
[0040] Two fixed positioning pieces 10610 are provided, one of which is coaxial with the 8-inch heating window, and the other is coaxial with the 12-inch heating window.
[0041] The location of the heating gun can be achieved through the two methods described above, or a combination of both methods can be used simultaneously.
[0042] It can drive the first heating mechanism 1 and the second heating mechanism 6 to rotate, and the specific structure is as follows:
[0043] The heating rotation mechanism 2 includes a rotating support plate 201. A bearing mounting seat 202 is connected to one side of the rotating support plate 201. A bearing 203 is connected inside the bearing mounting seat 202. A fixed rotating shaft 204 passes through the bearing 203. The lower end of the fixed rotating shaft 204 is connected to the rotating base plate 205 via a shaft clip. A first synchronous pulley 206 is connected to the upper end of the fixed rotating shaft 204. A motor mounting bracket 207 is connected to the other side of the bearing mounting seat 202. A reducer 208 is connected to the motor mounting bracket 207. The reducer 208 is connected to the motor 209. The rotating shaft of the reducer 208 passes through the motor mounting bracket 207 and is connected to a second synchronous pulley 210. A synchronous belt 211 is connected between the second synchronous pulley 210 and the first synchronous pulley 206. An angle limiting component 212 is connected to the bearing mounting seat 202.
[0044] Meanwhile, angle monitoring can be achieved. Its structure is as follows: the angle limiting component 212 includes a first sensor fixing bracket 213 and a second sensor fixing bracket 214. The first sensor fixing bracket 213 and the second sensor fixing bracket 214 are connected to the bearing fixing seat 202 at intervals and opposite to each other. Sensors 215 are connected to both the first sensor fixing bracket 213 and the second sensor fixing bracket 214. A fixing screw 216 is connected to the bearing fixing seat 202 located between the first sensor fixing bracket 213 and the second sensor fixing bracket 214. A sensor plate fixing plate 217 is rotatably connected to the fixing screw 216. A sensor plate 218 that senses and cooperates with the sensor 215 is connected to the sensor plate fixing plate 217. A limiting block 219 for rotating the sensor plate fixing plate 217 is connected to the rotating base plate 205. A reset torsion spring 220 for resetting the sensor plate fixing plate 217 is connected to the fixing screw 216.
[0045] Two limit blocks 219 are provided, and their positions can match the sensor 215. That is, after the limit block rotates to contact the sensor plate fixing plate, the sensor plate 218 contacts the corresponding sensor, thereby realizing the control of the rotating substrate (stopping the rotation of the rotating substrate). Then the motor works in reverse, causing the rotating substrate to rotate in the opposite direction, and driving the other limit block to move in the opposite direction and touch the sensor plate fixing plate, so that the sensor plate 218 contacts the other sensor, realizing the reverse stop movement. This repeated movement heats the product.
[0046] The working principle of this utility model is as follows:
[0047] Rotation:
[0048] The motor in the heating rotating shaft mechanism starts working, driving the second synchronous pulley to rotate. The second synchronous pulley drives the first synchronous pulley to rotate via a synchronous belt. The first synchronous pulley drives the fixed rotating shaft to rotate. The fixed rotating shaft drives the rotating base plate connected to the shaft clip to rotate. The rotating base plate drives the first heating mechanism and the second heating mechanism on it to rotate.
[0049] heating:
[0050] At the same time, the hot air guns in the first heating mechanism and the second heating mechanism are turned on. Before this, the cylinders in the first heating mechanism and the second heating mechanism push the rotating connecting plate through the heating push plate. The rotation of the rotating connecting plate will drive the heating baffle to move away, so that the heating window is exposed and the hot air gun is aligned with the heating window (i.e., 8-inch steel ring and / or 12-inch steel ring). At this time, the hot air gun heats the raised film and causes it to retract.
[0051] During the heating process described above, the position of the hot air gun is determined by indexing pins and position sensors to match different wafer sizes.
[0052] In the heating and rotating mechanism, the limiting block on the rotating base plate is driven to contact the sensing plate fixing plate by the rotation of the rotating base plate, so that the sensing plate repeatedly senses and contacts the sensors on both sides to determine the corresponding rotation angle, so as to achieve precise angle control.
[0053] This invention provides a suitable heating temperature, reaching 200-300 degrees Celsius. Airflow is delivered through a hot air gun, resulting in a large heating area. The rotating mechanism allows for rapid rotation and high heat shrinkage efficiency. It is compatible with 8 / 12-inch wafers by adjusting the indexing pins, offering broad applicability and effectively reducing operating costs. An angle limiting component monitors the angle, preventing excessive rotation during heating and improving product quality.
[0054] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0055] In the description of this application, it should be noted that the terms "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0056] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or vertical, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0057] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0058] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.
Claims
1. A wafer hot air heating device, characterized in that: It includes a heating rotation mechanism (2), on which a base connecting plate (3) is connected. A left heating rotation connecting plate (4) and a right heating rotation connecting plate (5) are connected to the left and right sides of the base connecting plate (3), respectively. A first heating mechanism (1) and a second heating mechanism (6) with the same structure are connected to the left heating rotation connecting plate (4) and the right heating rotation connecting plate (5), respectively. The first heating mechanism (1) includes a heating base plate (101), a heat expansion plate (102) is connected to one side of the heating base plate (101), a guide rail support plate (103) is connected to the inner side of the heat expansion plate (102), a guide rail (104) is connected to the guide rail support plate (103), a slider (105) is connected to the guide rail (104), a movable heating component (106) is connected to the slider (105), and a heating window (106) opposite to the heating component (106) is opened on the bottom surface of the heating base plate (101). 07), a vertical plate (108) is connected to the other side of the heating base plate (101), a heating cylinder (109) is connected to the inner side of the vertical plate (108), the drive shaft of the heating cylinder (109) is connected to the heating push plate (110), a rotating connecting plate (111) is rotatably connected to the heating base plate (101) by a shoulder screw, one side of the rotating connecting plate (111) is connected to a heating baffle (112) for opening and / or closing the heating window, and the other end of the rotating connecting plate (111) is connected to the heating push plate (110).
2. The wafer hot air heating device according to claim 1, characterized in that: The heating substrate (101) is covered with a heating cover (113), and each side of the heating cover (113) is provided with evenly arranged ventilation holes.
3. The wafer hot air heating device according to claim 1, characterized in that: The bottom surface of the heating substrate (101) is provided with a limiting groove for limiting the movement of the heating baffle, and the heating window (107) is located in the limiting groove.
4. The wafer hot air heating device according to claim 1, characterized in that: The heating window (107) has two heating windows, one of which is an 8-inch heating window and the other is a 12-inch heating window.
5. The wafer hot air heating device according to claim 1, characterized in that: The heating assembly (106) includes a heating movable plate (10601), which is L-shaped and connected to a slider on one side. A square heat insulation plate (10602) is connected to the other side of the L-shaped heating movable plate (10601). A hot air gun (10603) is connected inside the square heat insulation plate (10602). A temperature sensor (10604) is connected to the upper end of the hot air gun (10603) via an adapter (10607). The heating end of (10603) is opposite to the heating window. A heat sink (10605) is connected to the outside of the heat insulation plate (10602). A dividing pin fixing plate (10606) is connected to the heating moving plate (10601). A dividing pin (10608) is connected to the dividing pin fixing plate (10606). A moving window (10609) is opened on the heat expansion plate (102). A fixing positioning piece (10610) is connected to the moving window (10609) and fixed to the dividing pin (10608).
6. The wafer hot air heating device according to claim 1, characterized in that: A sensor support plate (114) is connected to the heat expansion plate (102). Two position sensors (115) are connected to the sensor support plate (114) for sensing the position of the heating moving plate (10601). One position sensor (115) is on the same axis as the 8-inch heating window, and the other position sensor (115) is on the same axis as the 12-inch heating window.
7. The wafer hot air heating device according to claim 5, characterized in that: Two fixed positioning pieces (10610) are provided, one of which is coaxial with the 8-inch heating window, and the other is coaxial with the 12-inch heating window.
8. The wafer hot air heating device according to claim 1, characterized in that: The heating rotation mechanism (2) includes a rotating support plate (201), a bearing fixing seat (202) connected to one side of the rotating support plate (201), a bearing (203) connected inside the bearing fixing seat (202), a fixed rotating shaft (204) passing through the bearing (203), the lower end of the fixed rotating shaft (204) being connected to the rotating base plate (205) via a shaft clamp, and a first synchronous pulley (206) connected to the upper end of the fixed rotating shaft (204). On the other side, a motor mounting bracket (207) is connected, and a reducer (208) is connected to the motor mounting bracket (207). The reducer (208) is connected to the motor (209). The shaft of the reducer (208) passes through the motor mounting bracket (207) and is connected to the second synchronous pulley (210). A synchronous belt (211) is connected between the second synchronous pulley (210) and the first synchronous pulley (206). An angle limiting component (212) is connected to the bearing mounting seat (202).
9. The wafer hot air heating device according to claim 8, characterized in that: The angle limiting assembly (212) includes a first sensor fixing bracket (213) and a second sensor fixing bracket (214). The first sensor fixing bracket (213) and the second sensor fixing bracket (214) are connected to the bearing fixing seat (202) at intervals and opposite to each other. Sensors (215) are connected to both the first sensor fixing bracket (213) and the second sensor fixing bracket (214). A fixing screw (216) is connected to the bearing fixing seat (202) located between the first sensor fixing bracket (213) and the second sensor fixing bracket (214). A sensor plate fixing plate (217) is rotatably connected to the fixing screw (216). A sensor plate (218) that senses and cooperates with the sensor (215) is connected to the sensor plate fixing plate (217). A limiting block (219) for rotating the sensor plate fixing plate (217) is connected to the rotating base plate (205).
10. The wafer hot air heating device according to claim 9, characterized in that: A reset torsion spring (220) for resetting the sensor plate fixing plate (217) is connected to the fixing screw (216).