Electronic package
By using a thermally conductive interface material structure in semiconductor packages, which includes graphite film and liquid metal, the problems of liquid metal overflow and bubbles are solved, improving heat dissipation efficiency and package formability, and achieving more efficient heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SILICONWARE PRECISION IND CO LTD
- Filing Date
- 2025-05-09
- Publication Date
- 2026-05-29
AI Technical Summary
In existing semiconductor packaging, liquid metal is prone to bubbles and overflow due to extrusion and heating, which can lead to short circuit risks in electronic components and poor heat transfer efficiency.
It adopts a thermally conductive interface material structure design, which includes graphite film and liquid metal. The size is larger than that of electronic components. The central area covers the components, and the outer area is suspended. Combined with heat sink, it prevents liquid metal overflow and bubble formation, thereby improving heat dissipation efficiency.
It effectively prevents liquid metal overflow and bubbles, improves heat dissipation efficiency, reduces thermal resistance, and enhances the formability and heat dissipation performance of the package.
Smart Images
Figure CN224306323U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a semiconductor device, and more particularly to an electronic package. Background Technology
[0002] As electronic products demand higher functionality and processing speeds, semiconductor chips, as core components of these products, need to have higher density electronic circuits and components. Consequently, semiconductor chips generate a significant amount of heat during operation. Furthermore, the encapsulating colloids used to traditionally cover these semiconductor chips are poor heat transfer materials with a thermal conductivity of only 0.8 W / mk (i.e., poor heat dissipation efficiency). Therefore, if the heat generated by the semiconductor chip cannot be effectively dissipated, it will cause damage to the semiconductor chip and lead to product reliability issues.
[0003] To quickly dissipate heat to the outside, the industry typically incorporates heat sinks in semiconductor packages. These heat sinks are usually attached to the back of the semiconductor chip via thermally conductive materials, such as thermal interface materials (TIMs), so that the heat generated by the semiconductor chip can be dissipated through the thermally conductive materials and the heat sink.
[0004] In order to conduct the heat generated by semiconductor wafers to heat sinks more quickly and effectively, liquid metal has been increasingly used as a thermal interface material in recent years. Its thermal conductivity of up to 80-128 W / mK can improve the conduction efficiency along the path from semiconductor wafers to heat sinks.
[0005] However, the aforementioned semiconductor packages often experience bubbling or even overflow of liquid metal due to the pressure and heat generated by the heat sink and the semiconductor wafer, which can cause short circuits in electronic components located in the component placement area.
[0006] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Utility Model Content
[0007] In view of the various deficiencies of the prior art, this application provides an electronic package, including: a carrier; an electronic component disposed on the carrier; a thermally conductive interface structure disposed on the electronic component, wherein the planar dimension of the thermally conductive interface structure is larger than the planar dimension of the electronic component; and a heat sink attached to the electronic component through the thermally conductive interface structure.
[0008] This application also provides a method for manufacturing an electronic package, comprising: providing a carrier and disposing an electronic component on the carrier; providing a thermally conductive interface structure on the electronic component, wherein the planar dimension of the thermally conductive interface structure is larger than the planar dimension of the electronic component; and attaching a heat sink to the electronic component through the thermally conductive interface structure.
[0009] In the aforementioned electronic package and its manufacturing method, the thermally conductive interface material structure includes an adjacent central region and a peripheral region. The central region covers the electronic component, and the peripheral region is disposed around the central region and protrudes outward from the electronic component.
[0010] In the aforementioned electronic package and its manufacturing method, the thickness of the peripheral region is greater than the thickness of the central region.
[0011] In the aforementioned electronic package and its manufacturing method, the peripheral area does not contact the electronic component.
[0012] In the aforementioned electronic package and its manufacturing method, the planar dimension of the thermally conductive interface material structure is more than 10% larger than the planar dimension of the electronic component.
[0013] In the aforementioned electronic packaging components and their manufacturing methods, the thermally conductive interface material structure comprises various materials. For example, the thermally conductive interface material structure comprises graphite film and liquid metal.
[0014] In the aforementioned electronic package and its manufacturing method, the electronic component has a corresponding active surface and a non-active surface, and the electronic component is placed on the carrier with the active surface and is electrically connected to the carrier.
[0015] In the aforementioned electronic package and its manufacturing method, the heat sink includes a body and a support portion extending outward from the surface of the body. The body is attached to the electronic component through the thermally conductive interface material structure, and the support portion is attached to the carrier through an adhesive layer.
[0016] The implementation of this application mainly provides a thermally conductive interface material structure that includes multiple materials (graphite film and liquid metal), which can simultaneously take into account low thermal resistance and good workability. Furthermore, the planar dimensions of the thermally conductive interface material structure are larger than the planar dimensions of the electronic components, making the thermally conductive interface material structure less prone to overflow and bubble formation, thereby improving heat dissipation efficiency. Attached Figure Description
[0017] Figures 1A to 1D This is a cross-sectional schematic diagram of the electronic package and its manufacturing method according to this application.
[0018] Explanation of reference numerals in the attached figures
[0019] 1 Electronic package
[0020] 11. Bearing components
[0021] 12 Electronic components
[0022] 12a Working surface
[0023] 12b Non-operating surface
[0024] 120 conductive bump
[0025] 13 Thermally conductive interface material structure
[0026] 131 Central Area
[0027] 132 Outer Zone
[0028] 14 Heat sink
[0029] 141 Ontology
[0030] 142 Support section
[0031] 15 Adhesive layer
[0032] 16. Conductive elements. Detailed Implementation
[0033] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.
[0034] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.
[0035] Please see Figures 1A to 1D This is a cross-sectional schematic diagram of the electronic package and its manufacturing method according to this application.
[0036] like Figure 1A As shown, a carrier 11 is provided, and an electronic component 12 is attached to the carrier 11.
[0037] The carrier 11 can be, for example, a substrate with a core layer and a circuit structure, or a coreless circuit structure, which includes a dielectric layer and a circuit layer (such as a redistribution layer). Alternatively, the carrier 11 can also be a lead frame, a silicon interposer, a wafer, or other board with metal routing, and is not limited to the above.
[0038] The electronic component 12 is mounted on the carrier 11 and electrically connected to the circuit layer. The electronic component 12 can be an active component, a passive component, a package structure, or a combination thereof. The active component can be a semiconductor wafer, while the passive component can be, for example, a resistor, capacitor, or inductor. In this embodiment, the electronic component 12 is a semiconductor wafer having opposing active surfaces 12a and non-active surfaces 12b, and the active surface 12a is electrically connected to the carrier 11 via multiple conductive bumps 120 using a flip-chip method.
[0039] like Figure 1B As shown, a thermally conductive interface material (TIM) structure 13 is provided on the non-functional surface 12b of the electronic component 12. The planar dimension of the thermally conductive interface material structure 13 is larger than the planar dimension of the electronic component 12 (for example, more than 10% larger than the planar dimension of the electronic component 12). The thermally conductive interface material structure 13 includes an adjacent central region 131 and a peripheral region 132. The planar dimension of the central region 131 is approximately the same as the planar dimension of the electronic component 12 to cover the electronic component 12. The peripheral region 132 is arranged around the central region 131 and protrudes outward from the electronic component 12.
[0040] In this embodiment, the thermally conductive interface material structure 13 includes only one material, such as indium sheet or other metal sheet, or multiple materials, such as graphite film and liquid metal, to simultaneously achieve low thermal resistance and good workability.
[0041] In one embodiment, the thickness of the peripheral region 132 may be greater than the thickness of the central region 131; in another embodiment, the peripheral region 132 does not contact the electronic component 12.
[0042] like Figure 1C As shown, a heat sink 14 is provided, which includes a body 141 and a support portion 142 extending outward from the surface of the body 141, so that the body 141 of the heat sink 14 is bonded to the electronic component 12 through the thermally conductive interface material structure 13, while the support portion 142 of the heat sink 14 is erected on the carrier member 11 through the adhesive layer 15. The material of the heat sink 14 is, for example, copper.
[0043] like Figure 1D As shown, a plurality of conductive elements 16 are provided on the other side of the carrier 11 opposite to the electronic component 12 to obtain the electronic package 1 of this application. Subsequently, the electronic package 1 can be electrically connected to an external device (e.g., a circuit board) through the plurality of conductive elements 16.
[0044] This application discloses an electronic package 1, comprising: a carrier 11; an electronic component 12 having opposing active surfaces 12a and non-active surfaces 12b, wherein the electronic component 12 is mounted on the carrier 11 via the active surface 12a and is electrically connected to the carrier 11; a thermally conductive interface structure 13 disposed on the electronic component 11, wherein the planar dimension of the thermally conductive interface structure 13 is larger than the planar dimension of the electronic component 12, and the thermally conductive interface structure 13 includes an adjacent central region 131 and a peripheral region 132, the central region 131 covering the electronic component 12, and the peripheral region 132 being disposed around the central region 131 and protruding outward from the electronic component 12; and a heat sink 14, which is attached to the electronic component 12 via the thermally conductive interface structure 13.
[0045] The thermally conductive interface structure 13 combines graphite film and liquid metal, and the planar dimension of the thermally conductive interface structure 13 is more than 10% larger than the planar dimension of the electronic component 12. This creates resistance in the area (peripheral region 132) where the area of the thermally conductive interface structure 13 is increased, preventing the liquid metal from being squeezed out. In addition, the pressurized liquid metal fills the pores on the surface of the thermally conductive interface structure 13 to improve surface wettability, which can effectively reduce thermal resistance.
[0046] The heat sink 14 includes a body 141 and a support portion 142 extending outward from the surface of the body 141, so that the body 141 of the heat sink 14 is connected to the electronic component 12 through the thermally conductive interface material structure 13, while the support portion 142 of the heat sink 14 is attached to the carrier 11 through an adhesive layer 15, so that the heat generated by the electronic component 12 during operation can be dissipated through the thermally conductive interface material structure 13 and the heat sink 14.
[0047] In summary, the electronic package of this application mainly provides a thermally conductive interface material structure comprising multiple materials (graphite film and liquid metal), which can simultaneously achieve low thermal resistance and good workability. Furthermore, the planar dimensions of the thermally conductive interface material structure are larger than the planar dimensions of the electronic component it covers, so that when the heat sink is placed on the electronic component through the thermally conductive interface material structure, the thermally conductive interface material structure is less likely to overflow and form bubbles, thereby improving heat dissipation efficiency.
[0048] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.
Claims
1. An electronic package, characterized in that, include: Load-bearing components; Electronic components are mounted on this carrier. A thermally conductive interface material structure is disposed on the electronic component, wherein the planar dimension of the thermally conductive interface material structure is larger than the planar dimension of the electronic component; as well as The heat sink is attached to the electronic component through the thermally conductive interface material structure.
2. The electronic package as described in claim 1, characterized in that, The thermally conductive interface material structure includes an adjacent central area and a peripheral area. The central area covers the electronic component, and the peripheral area is located around the central area and protrudes outward from the electronic component.
3. The electronic package as described in claim 2, characterized in that, The thickness of the outer region is greater than the thickness of the central region.
4. The electronic package as described in claim 2, characterized in that, The outer area was not in contact with the electronic component.
5. The electronic package as described in claim 1, characterized in that, The planar dimension of the thermally conductive interface material structure is more than 10% larger than the planar dimension of the electronic component.
6. The electronic package as claimed in claim 1, characterized in that, This thermally conductive interface material structure incorporates a variety of materials.
7. The electronic package as claimed in claim 1, characterized in that, The thermally conductive interface material structure comprises graphite film and liquid metal.
8. The electronic package as claimed in claim 1, characterized in that, The electronic component has an opposing active surface and a non-active surface, and the electronic component is placed on the carrier with the active surface and is electrically connected to the carrier.
9. The electronic package as claimed in claim 1, characterized in that, The heat sink includes a body and a support extending outward from the surface of the body. The body is attached to the electronic component through the thermally conductive interface material structure, and the support is attached to the carrier through an adhesive layer.