Wafer cutting machine

Abstract

The utility model relates to wafer processing technical field especially, relates to a wafer cutting machine. The utility model provides a wafer cutting machine, including square through frame, marble base, marble stand, marble crossbeam, laser light path, Z axle, mounting panel, cutting head, connecting block and connecting wire etc., be equipped with marble base on square through frame, marble base rear side symmetry is equipped with marble stand, marble stand top between being equipped with marble crossbeam, be equipped with laser light path on marble crossbeam, marble crossbeam front side is equipped with mounting panel, and the front side mounting of mounting panel has Z axle, and the output end of Z axle is connected with connecting block, and the middle part mounting of connecting block has cutting head, and connecting block and laser light path are connected through connecting wire, still include the right side of connecting block is equipped with visual system. Through the unique visual system that camera one, camera two and camera three constitute, effectively promoted the flexibility and adaptability of cutting machine in the cutting of residual piece.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a wafer dicing machine. Background Technology

[0002] In the current wafer fabrication field, laser cutting technology, as an advanced processing method, has been widely applied. Laser cutting machines, with their high precision, non-contact processing, and high flexibility, have demonstrated unique advantages in the wafer cutting process. However, although existing laser cutting machines can meet some of the basic requirements for wafer cutting, a series of significant shortcomings have still been exposed in practical applications.

[0003] First, most laser cutting machines still need improvement in terms of cutting precision and the stability of cutting quality. With the rapid development of the semiconductor industry, wafer sizes are constantly shrinking and integration levels are continuously increasing, leading to increasingly stringent requirements for cutting precision. However, existing equipment often struggles to achieve ideal cutting results when dealing with diverse processing requirements, especially when handling wafers of different sizes and in different states, where significant fluctuations in cutting precision affect the overall product quality.

[0004] Secondly, many laser cutting machines lack effective solutions when facing complex processing situations such as wafer fragment cutting. Due to the irregularity and complexity of wafer fragments, wafer fragment cutting places high demands on the flexibility and adaptability of the cutting machine. However, existing equipment often struggles to accurately identify and handle these fragments, resulting in low processing efficiency, low yield, and increased production and time costs.

[0005] Furthermore, some laser cutting machines also have significant shortcomings in terms of automation and compatibility. With the continuous development of automation technology, fully automated cutting processes have become a trend in the wafer fabrication industry. However, existing equipment still faces many difficulties in achieving fully automated cutting, with limited adaptability to wafers of different sizes, failing to meet the diverse needs of actual production. This not only restricts further improvements in production efficiency and economic benefits but also brings many inconveniences to enterprise production management and operations.

[0006] Therefore, we need to provide a wafer dicing machine. Utility Model Content

[0007] To overcome the shortcomings of existing equipment, which often struggles to accurately identify and process these fragments, resulting in low processing efficiency, this utility model provides a wafer dicing machine.

[0008] A wafer dicing machine includes a square tube frame, a marble base, marble columns, a marble beam, a laser optical path, a Z-axis, a mounting plate, a dicing head, a connecting block, and connecting wires. The square tube frame is equipped with a marble base, marble columns are symmetrically arranged on the left and right sides of the rear of the marble base, and a marble beam is arranged between the tops of the marble columns. A laser optical path is arranged on the marble beam. A mounting plate is arranged on the front side of the marble beam, and a Z-axis is mounted on the front side of the mounting plate. The output end of the Z-axis is connected to a connecting block, and a dicing head is mounted in the middle of the connecting block. The connecting block is connected to the laser optical path through connecting wires. A vision system is also provided on the right side of the connecting block.

[0009] Furthermore, the vision system includes camera one, camera two, and camera three. Camera one is mounted on the right side of the connecting block, camera two is mounted on the front side of the connecting block, and camera three is mounted on the top of the cutting head.

[0010] Furthermore, it also includes a Y-axis, an X-axis, and a rotation axis. The Y-axis is mounted on the top of the marble base, the X-axis is slidably mounted on the Y-axis, and the rotation axis is slidably mounted on the X-axis.

[0011] Furthermore, it also includes fixtures, inner ring suction cups, and outer ring suction cups. Four fixtures are installed on the outer side of the upper part of the rotating shaft, and each fixture is equipped with an inner ring suction cup and an outer ring suction cup.

[0012] Furthermore, it also includes a rangefinder, which is installed on the lower left front side of the connecting block.

[0013] Furthermore, the camera is coaxial with the cutting head.

[0014] The beneficial effects and significant advancements of this utility model are as follows:

[0015] This invention utilizes a unique vision system comprised of camera one, camera two, and camera three to accurately identify and process these fragments, significantly enhancing the flexibility and adaptability of the cutting machine. Addressing the irregularity and complexity of wafer fragments during scrap cutting, this design enables the cutting machine to more accurately locate the cutting target and effectively handle wafer fragments of various irregular shapes, thereby improving the accuracy and efficiency of cutting. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0017] Figure 2 This is a three-dimensional structural diagram of the laser optical path, Z-axis, and cutting head components of this utility model.

[0018] Figure 3 This is a three-dimensional structural diagram of the camera components, including camera one, camera two, and camera three, of this utility model.

[0019] Figure 4 This is a three-dimensional structural diagram of the cutting head, connecting block, and rangefinder components of this utility model.

[0020] Figure 5 This is a three-dimensional structural diagram of the X-axis, rotary axis, and fixture components of this utility model.

[0021] Figure 6 This is a three-dimensional structural diagram of the fixture, inner ring suction cup, and outer ring suction cup of this utility model.

[0022] In the attached diagram, the following labels are used: 1: square tube frame, 2: marble base, 3: marble column, 4: marble beam, 5: laser beam path, 6: Y-axis, 7: X-axis, 8: rotation axis, 9: Z-axis, 91: mounting plate, 10: cutting head, 101: connecting block, 11: camera one, 12: camera two, 13: camera three, 14: rangefinder, 141: connecting wire, 15: fixture, 16: inner ring suction cup, 17: outer ring suction cup. Detailed Implementation

[0023] First, it should be noted that in different described embodiments, the same components are given the same reference numerals or the same component names. The disclosure contained throughout this specification can be applied semantically to the same components having the same reference numerals or the same component names. The location descriptions selected in the specification, such as upper, lower, lateral, etc., also refer to the directly described and illustrated figures and are semantically applied to the new location when the location changes.

[0024] Example: A wafer dicing machine, please see below. Figures 1 to 6As shown, the system includes a square tube frame 1, a marble base 2, marble columns 3, a marble beam 4, a laser beam 5, a Y-axis 6, an X-axis 7, a rotation axis 8, a Z-axis 9, a mounting plate 91, a cutting head 10, a connecting block 101, a camera 11, a camera 2 12, a camera 3 13, a rangefinder 14, connecting wires 141, a fixture 15, an inner suction cup 16, and an outer suction cup 17. The marble base 2 is connected to the top of the square tube frame 1. Marble columns 3 are symmetrically connected to the left and right sides of the rear of the marble base 2. A marble beam 4 is horizontally connected between the tops of the marble columns 3. A laser beam 5 is installed on the top left side of the marble beam 4. The laser beam 5 provides a transmission channel for laser cutting. A Y-axis 6 is installed at the top center of the marble base 2. An X-axis 7 is slidably installed on the Y-axis 6, and a rotation axis 8 is slidably installed on the X-axis 7. A mounting plate 91 is connected to the front side of the marble beam 4, and a Z-axis 9 is installed on the front side of the mounting plate 91. A connecting block 101 is connected to the output end of the Z-axis 9. The rear side of the connecting block 101 is slidably connected to the mounting plate 91. A cutting head 10 is installed in the middle of the connecting block 101, and a camera 11 is installed on the right side of the connecting block 101. The camera 11 is used to capture the product outline. By scanning the product with the camera, the outline information of the product is obtained and accurate outline data is generated. This data plays a key role in calculating the cutting path, especially in the complex process of fragment cutting. In complex working conditions, the cutting path can be accurately planned. Camera 11 is located to the right of the cutting head 10. Camera 212 is installed in front of the connecting block 101. Camera 212 is used to capture the product's mark points. Through the identification and analysis of the mark points, the product can be accurately positioned to ensure the accuracy of the cutting position. Camera 212 is located in front of the cutting head 10. Camera 313 is installed on top of the cutting head 10. Camera 313 is coaxial with the cutting head 10 and is used to capture the cutting path. During the cutting process, the cutting path and cutting position can be observed in real time. Once a deviation is detected, it can be corrected in real time to ensure high precision and high quality of cutting. Camera 313 is installed on the lower left front side of the connecting block 101. A rangefinder 14 is provided, and the laser optical path 5 is connected to the cutting head 10 via a connecting wire 141. The rangefinder 14 can achieve a fully automatic focusing function 5. Four fixtures 15 are evenly spaced along the circumference on the outer side of the upper part of the rotating shaft 8. Each fixture 15 consists of an inner ring suction cup 16 and an outer ring suction cup 17. The inner ring suction cup 16 and the outer ring suction cup 17 are used to adsorb the wafer products to be processed. Each fixture 15 is equipped with an inner ring suction cup 16 and an outer ring suction cup 17. The inner ring suction cup 16 is located inside the outer ring suction cup 17. It can automatically scan and process any product of 4-inch, 6-inch, and 8-inch sizes, whether it is a complete wafer or a defective fragment, thereby improving the compatibility and applicability of the equipment.

[0025] When using a wafer dicing machine, first place it in a stable working area and ensure that all components are securely connected. Next, check that the laser path 5, camera 11, camera 2 12, camera 3 13, and rangefinder 14 are in normal working condition, and confirm that the connecting wires 141 of these devices are not loose or incorrectly connected.

[0026] Select the appropriate fixture 15 according to the size of the wafer to be processed, and ensure that the inner ring suction cup 16 and outer ring suction cup 17 on the fixture 15 are clean and free of foreign objects to ensure good adsorption effect. Then, carefully place the wafer product to be processed in the fixture 15 on the rotating shaft 8, and ensure that the wafer is tightly adsorbed by the inner ring suction cup 16 and outer ring suction cup 17 to prevent movement during the cutting process.

[0027] After activating the wafer dicing machine's adsorption system and ensuring the wafer remains stable, pre-dicing preparations begin. Camera 11 scans the wafer's contour to obtain precise contour data. This data will serve as a crucial basis for calculating the dicing path. Next, Camera 2 (12) captures images of the mark points on the wafer. By identifying and analyzing these mark points, precise wafer positioning is achieved, ensuring accurate dicing.

[0028] Based on the results of contour scanning and mark point recognition, the wafer dicing machine automatically generates a precise dicing path. At this time, the rangefinder 14 detects the height of the wafer and, in conjunction with the contour data, further adjusts and optimizes the dicing path.

[0029] Once everything is ready, the cutting head 10 is activated. The laser is transmitted to the cutting head 10 through the laser optical path 5 and begins cutting according to the planned path. During the cutting process, camera 3 13 will capture real-time images of the cutting path and position to monitor the cutting progress and accuracy. If any deviation is detected, the wafer dicing machine will immediately perform real-time correction to ensure high precision and high quality cutting.

[0030] After dicing is complete, shut down the dicing head 10 and the adsorption system. Then, carefully remove the processed wafer from the fixture 15 and proceed with subsequent processing or inspection.

[0031] The above is the complete process for using a wafer dicing machine, ensuring the accuracy and safety of the dicing process. Finally, clean the fixture 15, inner suction cup 16, and outer suction cup 17 for the next use.

[0032] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A wafer dicing machine, comprising a square tube frame (1), a marble base (2), marble columns (3), a marble beam (4), a laser path (5), a Z-axis (9), a mounting plate (91), a dicing head (10), a connecting block (101), and a connecting wire (141), wherein the square tube frame (1) is provided with a marble base (2), marble columns (3) are symmetrically arranged on the left and right sides of the rear side of the marble base (2), a marble beam (4) is provided between the tops of the marble columns (3), a laser path (5) is provided on the marble beam (4), a mounting plate (91) is provided on the front side of the marble beam (4), a Z-axis (9) is installed on the front side of the mounting plate (91), a connecting block (101) is connected to the output end of the Z-axis (9), a dicing head (10) is installed in the middle of the connecting block (101), and the connecting block (101) is connected to the laser path (5) through the connecting wire (141), characterized in that: It also includes a vision system on the right side of the connecting block (101).

2. The wafer dicing machine as described in claim 1, characterized in that: The vision system includes camera one (11), camera two (12) and camera three (13). Camera one (11) is installed on the right side of the connecting block (101), camera two (12) is installed on the front side of the connecting block (101), and camera three (13) is installed on the top of the cutting head (10).

3. A wafer dicing machine as described in claim 2, characterized in that: It also includes a Y-axis (6), an X-axis (7) and a rotation axis (8). The Y-axis (6) is mounted on the top of the marble base (2), the X-axis (7) is slidably mounted on the Y-axis (6), and the rotation axis (8) is slidably mounted on the X-axis (7).

4. A wafer dicing machine as described in claim 2, characterized in that: It also includes a fixture (15), an inner ring suction cup (16) and an outer ring suction cup (17). Four fixtures (15) are installed on the outer side of the upper part of the rotating shaft (8), and an inner ring suction cup (16) and an outer ring suction cup (17) are installed on each fixture (15).

5. A wafer dicing machine as described in claim 3, characterized in that: It also includes a rangefinder (14), which is installed on the lower left front side of the connecting block (101).

6. A wafer dicing machine as described in claim 4, characterized in that: Camera 3 (13) is coaxial with the cutting head (10).

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